CN108289386A - A kind of printed wiring board anti-welding printing method - Google Patents
A kind of printed wiring board anti-welding printing method Download PDFInfo
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- CN108289386A CN108289386A CN201711487515.9A CN201711487515A CN108289386A CN 108289386 A CN108289386 A CN 108289386A CN 201711487515 A CN201711487515 A CN 201711487515A CN 108289386 A CN108289386 A CN 108289386A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of printed wiring board anti-welding printing methods, include the following steps：Anti- pre-welding treatment, anti-welding printing, anti-welding exposure, welding masking developing.The present invention passes through to anti-pre-welding treatment, anti-welding printing, anti-welding exposure, parameter optimizes in each process such as welding masking developing, obtain optimized parameter data, operation is bitten by halftone, and ink is applied to plate face or plug in hole as required, form high-performance soldermask layer, ensure plate face and the external world, there is good insulating properties between circuit and circuit, and aesthetic appeal, prevent short circuit phenomenon occur when welding electronic component, meet high integration, demand of the small size electronic component to high integration circuit, simultaneously, meet electronic product to the precision of wiring board and the demand of complexity, conducive to the fast development of electronic product.
Description
Technical field
The present invention relates to printed wiring board field more particularly to a kind of printed wiring board anti-welding printing methods.
Background technology
The manufacture craft of printed wiring board (PCB) includes anti-welding process and text printout process.The purpose of anti-welding process
It is to form soldermask layer in conducting wire, for protecting conducting wire and external insulation, prevents from generating when welding electronic component short
Road.
With the development of electronics industry, the integrated level of electronic component is higher and higher, and volume is smaller and smaller, and universal
Using the encapsulation of BGA types.Therefore, the circuit of PCB will be smaller and smaller, and the number of plies is more and more.It reduces line width and line-spacing is to try to
Using limited area, it is to utilize space to increase the number of plies.2-3mil or smaller when the circuit mainstream of the wiring board in future.
Since electronic component is higher and higher to the line requirements on wiring board, if the soldermask layer formed in the circuit board reaches
Less than requiring, the fast development of electronic product will necessarily be constrained.
And conventionally, as processing step and the improper reason of parameter setting, are formed anti-welding by anti-welding printing
Layer performance is difficult to reach requirement, and poor insulativity between plate face and the external world, circuit and circuit is also easy to produce short circuit when welding electronic component
Phenomenon.
Invention content
Against the above deficiency, the purpose of the present invention is to provide a kind of novel printed wiring board anti-welding printing method, shapes
At high-performance soldermask layer, ensures there is good insulating properties, and aesthetic appeal between plate face and the external world, circuit and circuit, prevent
There is short circuit phenomenon when welding electronic component, meets high integration, small size electronic component to the need of high integration circuit
It asks, meanwhile, meet electronic product to the precision of wiring board and the demand of complexity, is conducive to the fast development of electronic product.
Used technical solution is the present invention in order to achieve the above objectives：
A kind of printed wiring board anti-welding printing method, which is characterized in that include the following steps：
(1) anti-pre-welding treatment
(2) anti-welding printing
(2.1) frame web plate, scraper：With non-dust cloth be stained with anti-plain boiled water by web plate both sides it is clean after, web plate is put into board
On, lock screw, and institute's frame web plate is made to be adjusted to 3-8mm with table surface height；By copper coin to be printed to net dress pin nails, with double
Face glue is fixed；By scraper screw locking, it is adjusted to position corresponding with web plate figure；
(2.2) plate is taken：Held by both hands edges of boards, vertically take out from frame, and check whether plate face aoxidizes glue stain；
(2.3) PIN is hung：First the lower left corner is fixed, plate will be in 45° angle, directly be put after the holes the pin alignment pin nails in the upper left corner
Plate avoids scratching circuit；
(2.4) block edges of boards：Web plate redundance is sealed net lower curtate by pressing board feature size with gummed paper, and ensures wiring board
All covering ink, short side respectively retain 1.5-2.5mm dew copper to the outer long side of form wire；
(2.5) it falls oily：Test paper three is opened on web plate underlay, and 1/3 amount of a tank ink is poured under scraper；
(2.6) insert rack：Both hands take edges of boards to be inserted into frame, big plate-laying partition insert rack；
(3) anti-welding exposure
(3.1) it aligns：Plate is gently placed on aligning platform by both hands by edges of boards, must check that plate face non-oxidation and stamp-pad ink are bad；
With the hands finger takes any two of the film diagonal respectively again, hangs over the film according to pin nails position and is aligned on corresponding hole；So
Afterwards, pin nails are gently pinned into extension tightly with hand, confirmed to no offset；
(3.2) it is switched on：General supply is opened, then is on switch and enters man-machine interface, voltage is waited for cross lighting after 500v；
(3.5) it exposes
(3.5.1) covers exposure machine table top, presses exposure machine " vacuumizing key " and starts to vacuumize；
(3.5.2) after pressure vacuum gauge is shown in 85kpa~100kpa, held by both hands scraper is on table top, from edges of boards
Whole plate catches up with gas, held by both hands scraper to catch up with gas back and forth at 30 °~45° angle back and forth before and after starting；
(3.5.3) presses blue " entrance " key of exposure machine, and table top enters to light exposure automatically；
(3.6) plate is taken：By the plate exposed, level is picked up from glass table top；
(3.7) film/insert rack is torn：The film is torn up from plate face, and the plate exposed is subjected to insert rack；
(3.8) it shuts down：Exposure lamp source is first closed, turns off system after waiting for 5-8min, finally closes general supply；
(4) welding masking developing
(4.1) after exposing and tearing the film, 15-20min is stood；
(4.2) match liquid
(4.2.1) opens adding trough running water switch and adds water 1000-2100L；
(4.2.2) claims 10-20kg sodium carbonate to pour into stirring 5-10min in adding trough, is slowly added to mixed liquor after dissolving
In development cylinder；
(4.3) it is switched on：All control buttons of developing are opened, liquid medicine is allowed circulated sprinkling and to be heated in development cylinder；
(4.4) plate is put：When putting plate, dual platen element is face-down, and welding is face-up, and single sided board welding resistance is face-up；
(4.5) develop：With the developing powder of 3.8-4.8m/min, temperature, 1.0-2.5kg/cm at 28-32 DEG C2It is aobvious
Under shadow pressure, development operation is completed；
(4.6) it cleans：After development, first cleaned with the clear water flow of 8-10L/min, then with 1.2-2.5kg/cm2Hydraulic pressure
Overflow is washed；
(4.7) it dries：After cleaning, dried with 40-60 DEG C of temperature.
As a further improvement on the present invention, the step (1) includes the following steps：
(1.1) plate is put：Both hands wearing gloves, both hands take plate, and intersect and put plate, and 5-6cm spacing is kept between plate and plate,
Lamination when preventing brushing, and be delivered on pretreating machine；
(1.2) overflow is washed before：Start pretreating machine, in 1.5-2.0kg/cm2Overflow washing pressure under, to plate face into
Row washing 2-5min, next station is delivered to the conveying speed of 2.0-4.0m/min；
(1.3) nog plate：Polish-brush is carried out to plate face by the polish-brush that 10-20mm wide and front and back brush are 500 mesh, keeps plate face
The polishing scratch of generation is delivered to next station within the scope of 10-20mm, with the conveying speed of 2.0-4.0m/min；
(1.4) overflow is washed in：In 1.5-2.0kg/cm2Overflow washing pressure under, washing 3-6min is carried out to plate face,
It is delivered to next station with the conveying speed of 2.0-4.0m/min；
(1.5) pickling：With the pickling concentration of 3-5%, 1.5-3.0kg/cm2Pickling pressure pickling 1-3min, with 2.0-
The conveying speed of 4.0m/min is delivered to next station；
(1.6) overflow is washed afterwards：In 1.5-2.0kg/cm2Overflow washing pressure under, washing 5-6min is carried out to plate face,
It is delivered to next station with the conveying speed of 2.0-4.0m/min；
(1.7) it dries：Plate face is dried with 80-90 DEG C of temperature, completes anti-pre-welding treatment.
As a further improvement on the present invention, further comprising the steps of：
(5) anti-welding return is washed
(5.1) slot allocation：Clear water 250-350L is filled in round-trip washing trough, sodium hydroxide solution is slowly added to return in washing trough,
Until it is 8-12% to return chemical concentration in washing trough, heater is opened, is heated with 70-90 DEG C of temperature；
(5.2) it returns and washes：It will need to return the plate washed to be inserted into bubble grillage every a lattice slot, placement, which is returned in washing trough, impregnates, then is put into
It impregnates in clear water cylinder, is finally rinsed well with hydraulic giant；
(5.3) it cleans：Return the plate after washing developing machine excessively need to clean up in 25-30min.
As a further improvement on the present invention, the step (5.2) includes the following steps：
Plate after (5.2.1) exposure, which returns, to be washed：5-10min is impregnated, the time carries plate to impregnating in clear water cylinder after, proposes to use
Hydraulic giant is rinsed well, is returned and is washed not more than 3 times；
Plate after (5.2.2) is baked afterwards is returned and is washed：Opening returns ultrasonic wave in washing trough, impregnates 90-100min, the time arrive after just by plate
It carries to impregnating in clear water cylinder, proposition is rinsed well with hydraulic giant, is returned and is washed not more than 2 times.
As a further improvement on the present invention, further include that ink opens oily step before oil in the step (2.5)
Suddenly：
Curing agent is poured into ink host agent and is mixed by (2.5.1), while the diluent of 5-10ml/kg is added dropwise, and receipts ink is used in combination
Knife is stirred 8-15min；
After (2.5.2) is stirred evenly, then ink poured into blender, opens stirring electromechanical source, blender is with 30-
The mixing speed of 60rpm is stirred, and is alarmed after stirring 10-15min, and automatic stirring switch is turned off；
(2.5.3) stand 15-60min after, then open viscosmeter level be put into ink rotate 25-35s after read, obtain
Ink viscosity, wherein the viscosity of one-step print ink is 120-180dpa.s, and the viscosity of secondary printing ink is 60-
100dpa.s。
As a further improvement on the present invention, further comprising the steps of between the step (3.2) and step (3.5)：
(3.3) exposure machine is cleaned
(3.3.1) is stained with wipes of alcohol exposure machine glass table top with dust-free paper, wheat draws dirty point/ink, often exposes five in production process
Frame must all use binding dust rumble primary to Mai La and glass table top binding dust, often expose 50 frames and stop and carefully clean a upper and lower frames with alcohol
Wheat draws and table top, avoids wheat from pulling on after rubbish/ink causes development and reveals copper；
(3.3.2) binding dust rumble access times are that upper and lower frames exposure is replaced once when amounting to 200PNL.
As a further improvement on the present invention, further comprising the steps of between the step (3.3) and step (3.5)：
(3.4) exposure guide rule is done：
(3.4.1) takes and has aligned but exposure guide rule is put among plate and the film by unexposed plate or exposure guide rule personality board；
(3.4.2) setting exposure energy parameter is exposed；
It tears after the film stands 10-20min and develops after (3.4.3) exposure；
The lattice number that plate face sees never development to dew copper after (3.4.4) development is exposure guide rule.
As a further improvement on the present invention, further include pre-baked step before step (3)：
A, plate is put：Wiring board after anti-welding printing is put among oven, and wiring board direction down wind is placed；
B, it toasts：Roasting the temperature inside the box is raised to 72-78 DEG C by room temperature within the time less than 5min, and toasts 5-30min.
Beneficial effects of the present invention are：By to each works such as anti-pre-welding treatment, anti-welding printing, anti-welding exposure, welding masking developings
Parameter optimizes in sequence, obtains optimized parameter data, by halftone bite operation ink is applied to as required plate face or
It fills in in hole, forms high-performance soldermask layer, ensure there is good insulating properties between plate face and the external world, circuit and circuit, and beautiful
Aspect prevents short circuit phenomenon occur when welding electronic component, meets high integration, small size electronic component to highly integrated
The demand of circuit is spent, meanwhile, meet electronic product to the precision of wiring board and the demand of complexity, is conducive to electronic product
It is fast-developing.
Above-mentioned is the general introduction of inventive technique scheme, and below in conjunction with specific implementation mode, the present invention will be further described.
Specific implementation mode
Further to illustrate the present invention to reach the technological means and effect that predetermined purpose is taken, below in conjunction with preferable
The specific implementation mode of the present invention is described in detail in embodiment.
Embodiment one：
The present embodiment provides a kind of printed wiring board anti-welding printing methods, include the following steps：
(1) anti-pre-welding treatment
(1.1) plate is put：Both hands wearing gloves, both hands take plate, and intersect and put plate, and 5cm spacing is kept between plate and plate, prevent
Only lamination when brushing, and be delivered on pretreating machine；
(1.2) overflow is washed before：Start pretreating machine, in 1.5kg/cm2Overflow washing pressure under, to plate face carry out water
2min is washed, next station is delivered to the conveying speed of 2.0m/min；
(1.3) nog plate：Polish-brush is carried out to plate face by the polish-brush that 10mm wide and front and back brush are 500 mesh, plate face is kept to generate
Polishing scratch within the scope of 10mm, next station is delivered to the conveying speed of 2.0m/min；
(1.4) overflow is washed in：In 1.5kg/cm2Overflow washing pressure under, washing 3min is carried out to plate face, with
The conveying speed of 2.0m/min is delivered to next station；
(1.5) pickling：With 3% pickling concentration, 1.5kg/cm2Pickling pressure pickling 1min, with the defeated of 2.0m/min
Speed is sent to be delivered to next station；
(1.6) overflow is washed afterwards：In 1.5kg/cm2Overflow washing pressure under, washing 5min is carried out to plate face, with
The conveying speed of 2.0m/min is delivered to next station；
(1.7) it dries：Plate face is dried with 80 DEG C of temperature, completes anti-pre-welding treatment；
(2) anti-welding printing
(2.1) frame web plate, scraper：With non-dust cloth be stained with anti-plain boiled water by web plate both sides it is clean after, web plate is put into board
On, lock screw, and institute's frame web plate is made to be adjusted to 3mm with table surface height；By copper coin to be printed to net dress pin nails, use is two-sided
Glue is fixed；By scraper screw locking, it is adjusted to position corresponding with web plate figure；
(2.2) plate is taken：Held by both hands edges of boards, vertically take out from frame, and check whether plate face aoxidizes glue stain；
(2.3) PIN is hung：First the lower left corner is fixed, plate will be in 45° angle, directly be put after the holes the pin alignment pin nails in the upper left corner
Plate avoids scratching circuit；
(2.4) block edges of boards：Web plate redundance is sealed net lower curtate by pressing board feature size with gummed paper, and ensures wiring board
All covering ink, short side respectively retain 1.5mm dew copper to the outer long side of form wire；
(2.5) it falls oily：Test paper three is opened on web plate underlay, and 1/3 amount of a tank ink is poured under scraper；
(2.6) insert rack：Both hands take edges of boards to be inserted into frame, big plate-laying partition insert rack；
(3) anti-welding exposure
(3.1) it aligns：Plate is gently placed on aligning platform by both hands by edges of boards, must check that plate face non-oxidation and stamp-pad ink are bad；
With the hands finger takes any two of the film diagonal respectively again, hangs over the film according to pin nails position and is aligned on corresponding hole；So
Afterwards, pin nails are gently pinned into extension tightly with hand, confirmed to no offset；
(3.2) it is switched on：General supply is opened, then is on switch and enters man-machine interface, voltage is waited for cross lighting after 500v；
(3.5) it exposes
(3.5.1) covers exposure machine table top, presses exposure machine " vacuumizing key " and starts to vacuumize；
(3.5.2) after pressure vacuum gauge is shown in 85kpa, held by both hands scraper on table top, from edges of boards it is front and back
Whole plate catches up with gas, held by both hands scraper to catch up with gas back and forth at 30 ° of angles back and forth；
(3.5.3) presses blue " entrance " key of exposure machine, and table top enters to light exposure automatically；
(3.6) plate is taken：By the plate exposed, level is picked up from glass table top；
(3.7) film/insert rack is torn：The film is torn up from plate face, and the plate exposed is subjected to insert rack；
(3.8) it shuts down：Exposure lamp source is first closed, turns off system after waiting for 5min, finally closes general supply；
(4) welding masking developing
(4.1) after exposing and tearing the film, 15min is stood；
(4.2) match liquid
(4.2.1) opens adding trough running water switch and adds water 1000L；
(4.2.2) claims 10kg sodium carbonate to pour into stirring 5min in adding trough, and mixed liquor is slowly added to development cylinder after dissolving
In；
(4.3) it is switched on：All control buttons of developing are opened, liquid medicine is allowed circulated sprinkling and to be heated in development cylinder；
(4.4) plate is put：When putting plate, dual platen element is face-down, and welding is face-up, and single sided board welding resistance is face-up；
(4.5) develop：With the developing powder of 3.8m/min, temperature, 1.0kg/cm at 28 DEG C2Developer pressure under, it is complete
At development operation；
(4.6) it cleans：After development, first cleaned with the clear water flow of 8L/min, then with 1.2kg/cm2Hydraulic pressure overflow water
It washes；
(4.7) it dries：After cleaning, dried with 40 DEG C of temperature.
Embodiment two：
The present embodiment provides a kind of printed wiring board anti-welding printing methods, include the following steps：
(1) anti-pre-welding treatment
(1.1) plate is put：Both hands wearing gloves, both hands take plate, and intersect and put plate, and 6cm spacing is kept between plate and plate, prevent
Only lamination when brushing, and be delivered on pretreating machine；
(1.2) overflow is washed before：Start pretreating machine, in 2.0kg/cm2Overflow washing pressure under, to plate face carry out water
5min is washed, next station is delivered to the conveying speed of 4.0m/min；
(1.3) nog plate：Polish-brush is carried out to plate face by the polish-brush that 20mm wide and front and back brush are 500 mesh, plate face is kept to generate
Polishing scratch within the scope of 20mm, next station is delivered to the conveying speed of 4.0m/min；
(1.4) overflow is washed in：In 2.0kg/cm2Overflow washing pressure under, washing 6min is carried out to plate face, with
The conveying speed of 4.0m/min is delivered to next station；
(1.5) pickling：With 5% pickling concentration, 3.0kg/cm2Pickling pressure pickling 3min, with the defeated of 4.0m/min
Speed is sent to be delivered to next station；
(1.6) overflow is washed afterwards：In 2.0kg/cm2Overflow washing pressure under, washing 6min is carried out to plate face, with
The conveying speed of 4.0m/min is delivered to next station；
(1.7) it dries：Plate face is dried with 90 DEG C of temperature, completes anti-pre-welding treatment.
(2) anti-welding printing
(2.1) frame web plate, scraper：With non-dust cloth be stained with anti-plain boiled water by web plate both sides it is clean after, web plate is put into board
On, lock screw, and institute's frame web plate is made to be adjusted to 8mm with table surface height；By copper coin to be printed to net dress pin nails, use is two-sided
Glue is fixed；By scraper screw locking, it is adjusted to position corresponding with web plate figure；
(2.2) plate is taken：Held by both hands edges of boards, vertically take out from frame, and check whether plate face aoxidizes glue stain；
(2.3) PIN is hung：First the lower left corner is fixed, plate will be in 45° angle, directly be put after the holes the pin alignment pin nails in the upper left corner
Plate avoids scratching circuit；
(2.4) block edges of boards：Web plate redundance is sealed net lower curtate by pressing board feature size with gummed paper, and ensures wiring board
All covering ink, short side respectively retain 2.5mm dew copper to the outer long side of form wire；
(2.5) it falls oily：Test paper three is opened on web plate underlay, and 1/3 amount of a tank ink is poured under scraper；
(2.6) insert rack：Both hands take edges of boards to be inserted into frame, big plate-laying partition insert rack；
(3) anti-welding exposure
(3.1) it aligns：Plate is gently placed on aligning platform by both hands by edges of boards, must check that plate face non-oxidation and stamp-pad ink are bad；
With the hands finger takes any two of the film diagonal respectively again, hangs over the film according to pin nails position and is aligned on corresponding hole；So
Afterwards, pin nails are gently pinned into extension tightly with hand, confirmed to no offset；
(3.2) it is switched on：General supply is opened, then is on switch and enters man-machine interface, voltage is waited for cross lighting after 500v；
(3.5) it exposes
(3.5.1) covers exposure machine table top, presses exposure machine " vacuumizing key " and starts to vacuumize；
(3.5.2) after pressure vacuum gauge is shown in 100kpa, held by both hands scraper on table top, from edges of boards it is front and back
Whole plate catches up with gas, held by both hands scraper angle at 45 ° to catch up with gas back and forth back and forth；
(3.5.3) presses blue " entrance " key of exposure machine, and table top enters to light exposure automatically；
(3.6) plate is taken：By the plate exposed, level is picked up from glass table top；
(3.7) film/insert rack is torn：The film is torn up from plate face, and the plate exposed is subjected to insert rack；
(3.8) it shuts down：Exposure lamp source is first closed, turns off system after waiting for 8min, finally closes general supply；
(4) welding masking developing
(4.1) after exposing and tearing the film, 20min is stood；
(4.2) match liquid
(4.2.1) opens adding trough running water switch and adds water 2100L；
(4.2.2) claims 20kg sodium carbonate to pour into stirring 10min in adding trough, and mixed liquor is slowly added to development cylinder after dissolving
In；
(4.3) it is switched on：All control buttons of developing are opened, liquid medicine is allowed circulated sprinkling and to be heated in development cylinder；
(4.4) plate is put：When putting plate, dual platen element is face-down, and welding is face-up, and single sided board welding resistance is face-up；
(4.5) develop：With the developing powder of 4.8m/min, temperature, 2.5kg/cm at 32 DEG C2Developer pressure under, it is complete
At development operation；
(4.6) it cleans：After development, first cleaned with the clear water flow of 10L/min, then with 2.5kg/cm2Hydraulic pressure overflow water
It washes；
(4.7) it dries：After cleaning, dried with 60 DEG C of temperature.
Embodiment three：
The present embodiment provides a kind of printed wiring board anti-welding printing methods, include the following steps：
(1) anti-pre-welding treatment
(1.1) plate is put：Both hands wearing gloves, both hands take plate, and intersect and put plate, and 5.5cm spacing is kept between plate and plate,
Lamination when preventing brushing, and be delivered on pretreating machine；
(1.2) overflow is washed before：Start pretreating machine, in 1.7kg/cm2Overflow washing pressure under, to plate face carry out water
3.5min is washed, next station is delivered to the conveying speed of 3.0m/min；
(1.3) nog plate：Polish-brush is carried out to plate face by the polish-brush that 15mm wide and front and back brush are 500 mesh, plate face is kept to generate
Polishing scratch within the scope of 15mm, next station is delivered to the conveying speed of 3.0m/min；
(1.4) overflow is washed in：In 1.7kg/cm2Overflow washing pressure under, washing 4.5min is carried out to plate face, with
The conveying speed of 3.0m/min is delivered to next station；
(1.5) pickling：With 4% pickling concentration, 1.7kg/cm2Pickling pressure pickling 2min, with the defeated of 3.0m/min
Speed is sent to be delivered to next station；
(1.6) overflow is washed afterwards：In 1.7kg/cm2Overflow washing pressure under, washing 5.5min is carried out to plate face, with
The conveying speed of 3.0m/min is delivered to next station；
(1.7) it dries：Plate face is dried with 85 DEG C of temperature, completes anti-pre-welding treatment.
(2) anti-welding printing
(2.1) frame web plate, scraper：With non-dust cloth be stained with anti-plain boiled water by web plate both sides it is clean after, web plate is put into board
On, lock screw, and institute's frame web plate is made to be adjusted to 6mm with table surface height；By copper coin to be printed to net dress pin nails, use is two-sided
Glue is fixed；By scraper screw locking, it is adjusted to position corresponding with web plate figure；
(2.2) plate is taken：Held by both hands edges of boards, vertically take out from frame, and check whether plate face aoxidizes glue stain；
(2.3) PIN is hung：First the lower left corner is fixed, plate will be in 45° angle, directly be put after the holes the pin alignment pin nails in the upper left corner
Plate avoids scratching circuit；
(2.4) block edges of boards：Web plate redundance is sealed net lower curtate by pressing board feature size with gummed paper, and ensures wiring board
All covering ink, short side respectively retain 2mm dew copper to the outer long side of form wire；
(2.5) it falls oily：Test paper three is opened on web plate underlay, and 1/3 amount of a tank ink is poured under scraper；
(2.6) insert rack：Both hands take edges of boards to be inserted into frame, big plate-laying partition insert rack；
(3) anti-welding exposure
(3.1) it aligns：Plate is gently placed on aligning platform by both hands by edges of boards, must check that plate face non-oxidation and stamp-pad ink are bad；
With the hands finger takes any two of the film diagonal respectively again, hangs over the film according to pin nails position and is aligned on corresponding hole；So
Afterwards, pin nails are gently pinned into extension tightly with hand, confirmed to no offset；
(3.2) it is switched on：General supply is opened, then is on switch and enters man-machine interface, voltage is waited for cross lighting after 500v；
(3.5) it exposes
(3.5.1) covers exposure machine table top, presses exposure machine " vacuumizing key " and starts to vacuumize；
(3.5.2) after pressure vacuum gauge is shown in 92kpa, held by both hands scraper on table top, from edges of boards it is front and back
Whole plate catches up with gas, held by both hands scraper to catch up with gas back and forth at 37 ° of angles back and forth；
(3.5.3) presses blue " entrance " key of exposure machine, and table top enters to light exposure automatically；
(3.6) plate is taken：By the plate exposed, level is picked up from glass table top；
(3.7) film/insert rack is torn：The film is torn up from plate face, and the plate exposed is subjected to insert rack；
(3.8) it shuts down：Exposure lamp source is first closed, turns off system after waiting for 6min, finally closes general supply；
(4) welding masking developing
(4.1) after exposing and tearing the film, 17min is stood；
(4.2) match liquid
(4.2.1) opens adding trough running water switch and adds water 1550L；
(4.2.2) claims 15kg sodium carbonate to pour into stirring 7min in adding trough, and mixed liquor is slowly added to development cylinder after dissolving
In；
(4.3) it is switched on：All control buttons of developing are opened, liquid medicine is allowed circulated sprinkling and to be heated in development cylinder；
(4.4) plate is put：When putting plate, dual platen element is face-down, and welding is face-up, and single sided board welding resistance is face-up；
(4.5) develop：With the developing powder of 4.3m/min, temperature, 1.7kg/cm at 30 DEG C2Developer pressure under, it is complete
At development operation；
(4.6) it cleans：After development, first cleaned with the clear water flow of 9L/min, then with 1.8kg/cm2Hydraulic pressure overflow water
It washes；
(4.7) it dries：After cleaning, dried with 50 DEG C of temperature.
The printed wiring board anti-welding printing method that the embodiment of the present invention one to embodiment three provides, by each process
Parameter optimize, obtain optimized parameter data, operation is bitten by halftone, ink is applied to plate face or plug as required
In in hole, while ensureing there is good insulating properties and aesthetic appeal between plate face and the external world, circuit and circuit.
By anti-welding pretreatment procedure, plate face oil stain, foreign matter and oxide layer are disposed, is roughened copper face, to improve ink and plate
The binding force in face.
By anti-exposure process, under ultraviolet light, photoinitiator absorbs luminous energy, resolves into free radical, free radical is again
Cause photo polymerization monomer and carry out polymerisation, forms the macromolecular structure insoluble in dilute alkaline soln after reaction.
By developing procedure, solder mask that is unexposed, being not required to reservation and the cleaning of alkali sodium hydroxide solution reaction are removed
It goes, image required for exposing.
Example IV：
The present embodiment and embodiment one to embodiment three the difference is that, it is further comprising the steps of：
(5) anti-welding return is washed
(5.1) slot allocation：Clear water 250L is filled in round-trip washing trough, sodium hydroxide solution is slowly added to return in washing trough, until
It is 8% to return chemical concentration in washing trough, opens heater, is heated with 70 DEG C of temperature；
(5.2) it returns and washes：It will need to return the plate washed to be inserted into bubble grillage every a lattice slot, placement, which is returned in washing trough, impregnates, then is put into
It impregnates in clear water cylinder, is finally rinsed well with hydraulic giant；
(5.3) it cleans：Return the plate after washing developing machine excessively need to clean up in 25min.
The step (5.2) includes the following steps：
Plate after (5.2.1) exposure, which returns, to be washed：Impregnate 5min, the time carries plate to impregnating in clear water cylinder after, proposition water
Rifle is rinsed well, is returned and is washed not more than 3 times；
Plate after (5.2.2) is baked afterwards is returned and is washed：Opening returns ultrasonic wave in washing trough, impregnates 90min, the time after just by plate carry to
It is impregnated in clear water cylinder, proposition is rinsed well with hydraulic giant, returns and wash not more than 2 times.
Embodiment five：
The present embodiment and embodiment one to embodiment three the difference is that, it is further comprising the steps of：
(5) anti-welding return is washed
(5.1) slot allocation：Clear water 350L is filled in round-trip washing trough, sodium hydroxide solution is slowly added to return in washing trough, until
It is 12% to return chemical concentration in washing trough, opens heater, is heated with 90 DEG C of temperature；
(5.2) it returns and washes：It will need to return the plate washed to be inserted into bubble grillage every a lattice slot, placement, which is returned in washing trough, impregnates, then is put into
It impregnates in clear water cylinder, is finally rinsed well with hydraulic giant；
(5.3) it cleans：Return the plate after washing developing machine excessively need to clean up in 30min.
The step (5.2) includes the following steps：
Plate after (5.2.1) exposure, which returns, to be washed：Impregnate 10min, the time carries plate to impregnating in clear water cylinder after, proposition water
Rifle is rinsed well, is returned and is washed not more than 3 times；
Plate after (5.2.2) is baked afterwards is returned and is washed：Opening returns ultrasonic wave in washing trough, impregnates 100min, and the time just carries plate after
It is impregnated in clear water cylinder, proposition is rinsed well with hydraulic giant, is returned and is washed not more than 2 times.
Embodiment six：
The present embodiment and embodiment one to embodiment three the difference is that, it is further comprising the steps of：
(5) anti-welding return is washed
(5.1) slot allocation：Clear water 300L is filled in round-trip washing trough, sodium hydroxide solution is slowly added to return in washing trough, until
It is 10% to return chemical concentration in washing trough, opens heater, is heated with 80 DEG C of temperature；
(5.2) it returns and washes：It will need to return the plate washed to be inserted into bubble grillage every a lattice slot, placement, which is returned in washing trough, impregnates, then is put into
It impregnates in clear water cylinder, is finally rinsed well with hydraulic giant；
(5.3) it cleans：Return the plate after washing developing machine excessively need to clean up in 27min.
The step (5.2) includes the following steps：
Plate after (5.2.1) exposure, which returns, to be washed：Impregnate 7min, the time carries plate to impregnating in clear water cylinder after, proposition water
Rifle is rinsed well, is returned and is washed not more than 3 times；
Plate after (5.2.2) is baked afterwards is returned and is washed：Opening returns ultrasonic wave in washing trough, impregnates 95min, the time after just by plate carry to
It is impregnated in clear water cylinder, proposition is rinsed well with hydraulic giant, returns and wash not more than 2 times.
Process is washed by returning of providing of example IV to embodiment six, the plate that need to be done over again is positioned over and is returned in washing trough certain
It is handled by liquid medicine under temperature condition, reaches the good result without ink in plate face and hole.
Embodiment seven：
The present embodiment and embodiment one to embodiment three the difference is that, in the step (2.5), falling oil
Before, further include that ink opens oily step：
Curing agent is poured into ink host agent and is mixed by (2.5.1), while the diluent of 5-10ml/kg is added dropwise, and receipts ink is used in combination
Knife is stirred 8-15min；
After (2.5.2) is stirred evenly, then ink poured into blender, opens stirring electromechanical source, blender is with 30-
The mixing speed of 60rpm is stirred, and is alarmed after stirring 10-15min, and automatic stirring switch is turned off；
(2.5.3) stand 15-60min after, then open viscosmeter level be put into ink rotate 25-35s after read, obtain
Ink viscosity, wherein the viscosity of one-step print ink is 120-180dpa.s, and the viscosity of secondary printing ink is 60-
100dpa.s。
Ink host agent and curing agent are uniformly mixed by carrying out out oil to ink, make the plate that printing is later by the present embodiment
There is certain glossiness and achievees the purpose that optimized solidification.
Embodiment eight：
The present embodiment and embodiment one to embodiment three the difference is that, the step (3.2) and step (3.5) it
Between it is further comprising the steps of：
(3.3) exposure machine is cleaned
(3.3.1) is stained with wipes of alcohol exposure machine glass table top with dust-free paper, wheat draws dirty point/ink, often exposes five in production process
Frame must all use binding dust rumble primary to Mai La and glass table top binding dust, often expose 50 frames and stop and carefully clean a upper and lower frames with alcohol
Wheat draws and table top, avoids wheat from pulling on after rubbish/ink causes development and reveals copper；
(3.3.2) binding dust rumble access times are that upper and lower frames exposure is replaced once when amounting to 200PNL.
(3.4) exposure guide rule is done：
(3.4.1) takes and has aligned but exposure guide rule is put among plate and the film by unexposed plate or exposure guide rule personality board；
(3.4.2) setting exposure energy parameter is exposed；
It tears after the film stands 10-20min and develops after (3.4.3) exposure；
The lattice number that plate face sees never development to dew copper after (3.4.4) development is exposure guide rule.
By cleaning exposure machine process, avoids wheat from pulling on after rubbish/ink causes development and dew copper phenomenon occur.
Embodiment nine：
The present embodiment and embodiment one to embodiment three the difference is that, further include pre-baked step before step (3)
Suddenly：
A, plate is put：Wiring board after anti-welding printing is put among oven, and wiring board direction down wind is placed；
B, it toasts：Roasting the temperature inside the box is raised to 72-78 DEG C by room temperature within the time less than 5min, and toasts 5-30min.
By pre-baked process, volatilizable diluent in allowing ink is toasted by defined low temperature and is volatilized, to make plate face
Ink becomes the state that do not glue, and exposure process is enable to smoothly complete.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore identical as the above embodiment of the present invention or approximate technical characteristic is used, and obtained other structures, the guarantor in the present invention
Within the scope of shield.
Claims (8)
1. a kind of printed wiring board anti-welding printing method, which is characterized in that include the following steps：
(1) anti-pre-welding treatment
(2) anti-welding printing
(2.1) frame web plate, scraper：With non-dust cloth be stained with anti-plain boiled water by web plate both sides it is clean after, by web plate put into board on, lock
Tight screw, and institute's frame web plate is made to be adjusted to 3-8mm with table surface height；It is solid with double faced adhesive tape by copper coin to be printed to net dress pin nails
It is fixed；By scraper screw locking, it is adjusted to position corresponding with web plate figure；
(2.2) plate is taken：Held by both hands edges of boards, vertically take out from frame, and check whether plate face aoxidizes glue stain；
(2.3) PIN is hung：First the lower left corner is fixed, plate will be in 45° angle, directly put plate after the holes the pin alignment pin nails in the upper left corner, keep away
Exempt to scratch circuit；
(2.4) block edges of boards：Web plate redundance is sealed net lower curtate by pressing board feature size with gummed paper, and ensures circuit sheet metal forming
All covering ink, short side respectively retain 1.5-2.5mm dew copper to the outer long side of line；
(2.5) it falls oily：Test paper three is opened on web plate underlay, and 1/3 amount of a tank ink is poured under scraper；
(2.6) insert rack：Both hands take edges of boards to be inserted into frame, big plate-laying partition insert rack；
(3) anti-welding exposure
(3.1) it aligns：Plate is gently placed on aligning platform by both hands by edges of boards, must check that plate face non-oxidation and stamp-pad ink are bad；It uses again
Both hands finger takes any two of the film diagonal respectively, hangs over the film according to pin nails position and is aligned on corresponding hole；Then,
Pin nails are gently pinned into extension tightly with hand, are confirmed to no offset；
(3.2) it is switched on：General supply is opened, then is on switch and enters man-machine interface, voltage is waited for cross lighting after 500v；
(3.5) it exposes
(3.5.1) covers exposure machine table top, presses exposure machine " vacuumizing key " and starts to vacuumize；
(3.5.2) after pressure vacuum gauge is shown in 85kpa~100kpa, held by both hands scraper is on table top, since at edges of boards
Front and back whole plate back and forth catches up with gas, held by both hands scraper to catch up with gas back and forth at 30 °~45° angle；
(3.5.3) presses blue " entrance " key of exposure machine, and table top enters to light exposure automatically；
(3.6) plate is taken：By the plate exposed, level is picked up from glass table top；
(3.7) film/insert rack is torn：The film is torn up from plate face, and the plate exposed is subjected to insert rack；
(3.8) it shuts down：Exposure lamp source is first closed, turns off system after waiting for 5-8min, finally closes general supply；
(4) welding masking developing
(4.1) after exposing and tearing the film, 15-20min is stood；
(4.2) match liquid
(4.2.1) opens adding trough running water switch and adds water 1000-2100L；
(4.2.2) claims 10-20kg sodium carbonate to pour into stirring 5-10min in adding trough, is slowly added to develop by mixed liquor after dissolving
In cylinder；
(4.3) it is switched on：All control buttons of developing are opened, liquid medicine is allowed circulated sprinkling and to be heated in development cylinder；
(4.4) plate is put：When putting plate, dual platen element is face-down, and welding is face-up, and single sided board welding resistance is face-up；
(4.5) develop：With the developing powder of 3.8-4.8m/min, temperature, 1.0-2.5kg/cm at 28-32 DEG C2Developer pressure
Under, complete development operation；
(4.6) it cleans：After development, first cleaned with the clear water flow of 8-10L/min, then with 1.2-2.5kg/cm2Hydraulic pressure overflow water
It washes；
(4.7) it dries：After cleaning, dried with 40-60 DEG C of temperature.
2. printed wiring board anti-welding printing method according to claim 1, which is characterized in that the step (1) include with
Lower step：
(1.1) plate is put：Both hands wearing gloves, both hands take plate, and intersect and put plate, and 5-6cm spacing is kept between plate and plate, prevent
Lamination when brushing, and be delivered on pretreating machine；
(1.2) overflow is washed before：Start pretreating machine, in 1.5-2.0kg/cm2Overflow washing pressure under, to plate face carry out water
2-5min is washed, next station is delivered to the conveying speed of 2.0-4.0m/min；
(1.3) nog plate：Polish-brush is carried out to plate face by the polish-brush that 10-20mm wide and front and back brush are 500 mesh, plate face is kept to generate
Polishing scratch within the scope of 10-20mm, next station is delivered to the conveying speed of 2.0-4.0m/min；
(1.4) overflow is washed in：In 1.5-2.0kg/cm2Overflow washing pressure under, washing 3-6min is carried out to plate face, with
2.0-4.0m/min conveying speed be delivered to next station；
(1.5) pickling：With the pickling concentration of 3-5%, 1.5-3.0kg/cm2Pickling pressure pickling 1-3min, with 2.0-4.0m/
The conveying speed of min is delivered to next station；
(1.6) overflow is washed afterwards：In 1.5-2.0kg/cm2Overflow washing pressure under, washing 5-6min is carried out to plate face, with
2.0-4.0m/min conveying speed be delivered to next station；
(1.7) it dries：Plate face is dried with 80-90 DEG C of temperature, completes anti-pre-welding treatment.
3. printed wiring board anti-welding printing method according to claim 1, which is characterized in that further comprising the steps of：
(5) anti-welding return is washed
(5.1) slot allocation：Clear water 250-350L is filled in round-trip washing trough, sodium hydroxide solution is slowly added to return in washing trough, until
It is 8-12% to return chemical concentration in washing trough, opens heater, is heated with 70-90 DEG C of temperature；
(5.2) it returns and washes：It will need to return the plate washed to be inserted into bubble grillage every a lattice slot, placement, which is returned in washing trough, impregnates, then is put into clear water
It impregnates in cylinder, is finally rinsed well with hydraulic giant；
(5.3) it cleans：Return the plate after washing developing machine excessively need to clean up in 25-30min.
4. printed wiring board anti-welding printing method according to claim 3, which is characterized in that the step (5.2) includes
Following steps：
Plate after (5.2.1) exposure, which returns, to be washed：Impregnate 5-10min, the time carries plate to impregnating in clear water cylinder after, proposition hydraulic giant
It rinses well, returns and wash not more than 3 times；
Plate after (5.2.2) is baked afterwards is returned and is washed：Opening returns ultrasonic wave in washing trough, impregnates 90-100min, the time after just by plate carry to
It is impregnated in clear water cylinder, proposition is rinsed well with hydraulic giant, returns and wash not more than 2 times.
5. printed wiring board anti-welding printing method according to claim 1, which is characterized in that in the step (2.5),
Further include that ink opens oily step before oil：
Curing agent is poured into ink host agent and is mixed by (2.5.1), while the diluent of 5-10ml/kg is added dropwise, be used in combination receive ink knife into
Row stirring 8-15min；
After (2.5.2) is stirred evenly, then ink poured into blender, opens stirring electromechanical source, blender is with 30-60rpm's
Mixing speed is stirred, and is alarmed after stirring 10-15min, and automatic stirring switch is turned off；
(2.5.3) stand 15-60min after, then open viscosmeter level be put into ink rotate 25-35s after read, obtain ink
Viscosity, wherein the viscosity of one-step print ink is 120-180dpa.s, and the viscosity of secondary printing ink is 60-100dpa.s.
6. printed wiring board anti-welding printing method according to claim 1, which is characterized in that the step (3.2) and step
Suddenly further comprising the steps of between (3.5)：
(3.3) exposure machine is cleaned
(3.3.1) is stained with wipes of alcohol exposure machine glass table top with dust-free paper, wheat draws dirty point/ink, often exposes five frames all in production process
Must be primary to Mai La and glass table top binding dust with binding dust rumble, it often exposes 50 frames and stops and carefully clean the drawing of upper and lower frames wheat with alcohol
And table top, it avoids wheat from pulling on after rubbish/ink causes development and reveals copper；
(3.3.2) binding dust rumble access times are that upper and lower frames exposure is replaced once when amounting to 200PNL.
7. printed wiring board anti-welding printing method according to claim 6, which is characterized in that the step (3.3) and step
Suddenly further comprising the steps of between (3.5)：
(3.4) exposure guide rule is done：
(3.4.1) takes and has aligned but exposure guide rule is put among plate and the film by unexposed plate or exposure guide rule personality board；
(3.4.2) setting exposure energy parameter is exposed；
It tears after the film stands 10-20min and develops after (3.4.3) exposure；
The lattice number that plate face sees never development to dew copper after (3.4.4) development is exposure guide rule.
8. printed wiring board anti-welding printing method according to claim 6, which is characterized in that also wrapped before step (3)
Include pre-baked step：
A, plate is put：Wiring board after anti-welding printing is put among oven, and wiring board direction down wind is placed；
B, it toasts：Roasting the temperature inside the box is raised to 72-78 DEG C by room temperature within the time less than 5min, and toasts 5-30min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711487515.9A CN108289386A (en) | 2017-12-29 | 2017-12-29 | A kind of printed wiring board anti-welding printing method |
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|---|---|---|---|
| CN201711487515.9A CN108289386A (en) | 2017-12-29 | 2017-12-29 | A kind of printed wiring board anti-welding printing method |
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| CN108289386A true CN108289386A (en) | 2018-07-17 |
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ID=62832677
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109624533A (en) * | 2018-12-17 | 2019-04-16 | 智恩电子(大亚湾)有限公司 | A kind of thin plate double-sided printing process |
| CN109729651A (en) * | 2019-01-09 | 2019-05-07 | 深圳市江霖电子科技有限公司 | It is a kind of to reduce white core material wiring board and the welding resistance technique of ghost occur |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN111182738A (en) * | 2020-01-15 | 2020-05-19 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
| CN111526672A (en) * | 2020-06-19 | 2020-08-11 | 奥士康精密电路（惠州）有限公司 | Anti-welding manufacturing method for white oil plate with plate thickness less than or equal to 0.4mm |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109624533A (en) * | 2018-12-17 | 2019-04-16 | 智恩电子(大亚湾)有限公司 | A kind of thin plate double-sided printing process |
| CN109729651A (en) * | 2019-01-09 | 2019-05-07 | 深圳市江霖电子科技有限公司 | It is a kind of to reduce white core material wiring board and the welding resistance technique of ghost occur |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN111182738A (en) * | 2020-01-15 | 2020-05-19 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
| CN111182738B (en) * | 2020-01-15 | 2021-01-15 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
| CN111526672A (en) * | 2020-06-19 | 2020-08-11 | 奥士康精密电路（惠州）有限公司 | Anti-welding manufacturing method for white oil plate with plate thickness less than or equal to 0.4mm |
| CN111818737A (en) * | 2020-07-23 | 2020-10-23 | 深圳市和美精艺科技有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111818737B (en) * | 2020-07-23 | 2022-01-07 | 深圳和美精艺半导体科技股份有限公司 | Method for plugging ink front plug coating hole of packaging substrate |
| CN111867270A (en) * | 2020-07-29 | 2020-10-30 | 深圳市正基电子有限公司 | Method for removing alkaline ink after solder mask laser exposure |
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Application publication date: 20180717 |