CN103957667B - The anti-welding manufacture method with text printout of printed substrate - Google Patents
The anti-welding manufacture method with text printout of printed substrate Download PDFInfo
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- CN103957667B CN103957667B CN201410182847.6A CN201410182847A CN103957667B CN 103957667 B CN103957667 B CN 103957667B CN 201410182847 A CN201410182847 A CN 201410182847A CN 103957667 B CN103957667 B CN 103957667B
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Abstract
The present invention relates to the anti-welding manufacture method with text printout of a kind of printed substrate, comprise the following steps: anti-pre-welding treatment, anti-welding printing, anti-welding exposure, welding masking developing, anti-welding OQC, text printout first, text printout second, merging baking, OQC.The present invention, by three times in existing technique are toasted the once baking after being merged into text printout operation, is effectively shortened flow process, improves production efficiency, reduce cost.
Description
Technical field
The present invention relates to the manufacture method of printed substrate, specifically a kind of printed substrate is anti-welding and civilian
The manufacture method of word printing.
Background technology
The processing technology of printed substrate (PCB) includes anti-welding operation and text printout operation.Anti-welding operation
Purpose be on conducting wire formation welding resisting layer, be used for protecting conducting wire and external insulation, prevent welding
Short circuit is produced during electronic component；The purpose of text printout operation is at wiring board surface printing word marking, uses
In the effect indicating wiring board each several part.
In existing technique, anti-welding operation is provided with anti-welding baking, text printout operation is provided with twice baking
Roasting, altogether need to toast for three times.This technique there is problems in that 1, power consumption is high, and cost is high；2、
Long flow path causes human cost higher, and the production time is long, and production efficiency is low；3, long flow path, manual operation
Loaded down with trivial details, labor intensity is big, and easily scratches printed substrate.
Summary of the invention
The present invention is directed to that above-mentioned cost is high, production efficiency is low and the problem of long flow path, it is provided that a kind of new printing
The anti-welding manufacture method with text printout of wiring board, the method low cost, production efficiency are high, flow process is short.
According to technical scheme: the anti-welding manufacture method with text printout of a kind of printed substrate, bag
Include following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increase copper face with
The adhesion of anti-solder ink；
Second step, anti-welding printing, on a printed-wiring board print last layer ink, and pre-baked；
3rd step, anti-welding exposure, by printed wire board to explosure；
4th step, welding masking developing, by not having the ink development at optically focused to fall, expose the pad of needs；
5th step, anti-welding OQC, printed substrate shipment after the assay was approved；
6th step, text printout first, word in first printing of printed substrate；
7th step, text printout second, word in second printing of printed substrate；
8th step, merging baking, by printed substrate elder generation low-temperature bake high-temperature baking again；
9th step, OQC, after the assay was approved shipment.
Further, in second step, pre-baked temperature is 70-80 DEG C, and the pre-baked time is 10-20 minute.
Further, in the 7th step, during text printout second, screen printer table top uses four and covers
Copper coin surrounds the square frame consistent with circuit board technique limit to be printed, installs 3 and above in copper-clad plate
Positioning pin, is provided with the fastener contour with copper-clad plate every 10-15cm in the frame that copper-clad plate surrounds, scrapes
Cutter becomes 70-80 degree angle, scraper pressure 6-7.5KG/cm with half tone2Print.
Further, in the 7th step, flashboard rack mode is used to place wiring board, it is to avoid word is wiped and spent, no
Clearly.
Further, in the 8th step, the temperature of low-temperature bake is 70-90 DEG C, and baking time is 1-2H；High
The temperature of temperature baking is 150-160 DEG C, and baking time is 1-2H.
Further, printed wire plate thickness is not less than 0.5mm.
The method have technical effect that: the present invention is by being merged into word by three bakings in existing technique
Once baking after printing process, is effectively shortened flow process, improves production efficiency, reduce cost.
Accompanying drawing explanation
Fig. 1 is the flow chart of the present invention.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with the accompanying drawings and
The present invention is further detailed explanation for detailed description of the invention.
As it is shown in figure 1, the present invention to be a kind of printed substrate anti-welding and the manufacture method of text printout, including
Following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increase copper face with
The adhesion of anti-solder ink.
Second step, anti-welding printing, on a printed-wiring board print last layer ink, and pre-baked；Pre-baked temperature
For 70-80 DEG C, the pre-baked time is 10-20 minute.
3rd step, anti-welding exposure, by printed wire board to explosure.
4th step, welding masking developing, by not having the ink development at optically focused to fall, expose the pad of needs.
5th step, anti-welding OQC, printed substrate shipment after the assay was approved.
6th step, text printout first, word in first printing of printed substrate.
7th step, text printout second, word in second printing of printed substrate.
For avoiding silk-screen deviation problem, during text printout second, screen printer table top uses four and covers copper
Plate surrounds the square frame consistent with circuit board technique limit to be printed, installs 3 and above determining in copper-clad plate
Position pin, prevents plate from moving.
Printed wire plate thickness is not less than 0.5mm, in the frame that copper-clad plate surrounds every 10-15cm be provided with
The fastener that copper-clad plate is contour, fastener plays the effect supporting printed substrate.Scraper becomes 70-80 degree angle with half tone,
Scraper pressure 6-7.5KG/cm2Print.
Use flashboard rack mode to place wiring board, it is to avoid between plank, the friction of plate face and other objects, collision,
Word is avoided to wipe colored, unintelligible.
8th step, merging baking, by printed substrate elder generation low-temperature bake high-temperature baking again；The temperature of low-temperature bake
Degree is for 70-90 DEG C, and baking time is 1-2H；The temperature of high-temperature baking is 150-160 DEG C, and baking time is 1-2H.
9th step, OQC, after the assay was approved shipment.
The present invention is by entering the baking in the anti-welding operation in existing technique and the baking in text printout operation
Row merges, and carries out after being placed on text printout operation, thus is effectively shortened flow process, when shortening making
Between, improve production efficiency, decrease manpower expense, reduce scrape wound scrap probability, save simultaneously
Baking cost.
Above the present invention has been carried out the most detailed description with certain particularity.General in art
Logical it is to be understood by the skilled artisans that what description in embodiment was merely exemplary, true without departing from the present invention
Make being changed on the premise of real spirit and scope and all should belong to protection scope of the present invention.Institute of the present invention
Claimed scope be defined by described claims rather than above-mentioned by embodiment
Description limits.
Claims (5)
1. the anti-welding manufacture method with text printout of printed substrate, is characterized in that, comprise the following steps:
The first step, anti-pre-welding treatment, carry out roughening treatment by the copper face on printed substrate, increase copper face with
The adhesion of anti-solder ink；
Second step, anti-welding printing, on a printed-wiring board print last layer ink, and pre-baked；
3rd step, anti-welding exposure, by printed wire board to explosure；
4th step, welding masking developing, by not having the ink development at optically focused to fall, expose the pad of needs；
5th step, anti-welding OQC, printed substrate shipment after the assay was approved；
6th step, text printout first, word in first printing of printed substrate；
7th step, text printout second, word in second printing of printed substrate；
8th step, merging baking, by printed substrate elder generation low-temperature bake high-temperature baking again；The temperature of low-temperature bake
Degree is for 70-90 DEG C, and baking time is 1-2h；The temperature of high-temperature baking is 150-160 DEG C, and baking time is 1-2h；
9th step, OQC, after the assay was approved shipment.
2. according to the printed substrate described in claim 1 is anti-welding and the manufacture method of text printout, its feature
Being: in second step that pre-baked temperature is 70-80 DEG C, the pre-baked time is 10-20 minute.
3. according to the printed substrate described in claim 1 is anti-welding and the manufacture method of text printout, its feature
Be: in the 7th step, during text printout second, screen printer table top uses four copper-clad plates surround with
The square frame that circuit board technique limit to be printed is consistent, installs the positioning pin of more than 3 in copper-clad plate,
Being provided with the fastener contour with copper-clad plate every 10-15cm in the frame that copper-clad plate surrounds, scraper becomes with half tone
70-80 degree angle, scraper pressure 6-7.5KG/cm2Print.
4. according to the printed substrate described in claim 1 is anti-welding and the manufacture method of text printout, its feature
It is: in the 7th step to use flashboard rack mode to place wiring board, it is to avoid word is wiped colored, unintelligible.
5. according to the printed substrate described in claim 1 is anti-welding and the manufacture method of text printout, its feature
It is: printed wire plate thickness is not less than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182847.6A CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182847.6A CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
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| Publication Number | Publication Date |
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| CN103957667A CN103957667A (en) | 2014-07-30 |
| CN103957667B true CN103957667B (en) | 2016-10-05 |
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| CN201410182847.6A Active CN103957667B (en) | 2014-04-30 | 2014-04-30 | The anti-welding manufacture method with text printout of printed substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168270A (en) * | 2018-09-19 | 2019-01-08 | 柏承科技(昆山)股份有限公司 | The anti-welding text technique of energy conservation |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104085213B (en) * | 2014-06-12 | 2016-07-13 | 胜宏科技（惠州）股份有限公司 | A kind of double-sided wiring board text printout method |
| CN104401142B (en) * | 2014-12-05 | 2018-06-26 | 深圳市博敏电子有限公司 | A kind of wiring board text printout method |
| CN104582280A (en) * | 2014-12-19 | 2015-04-29 | 胜华电子（惠阳）有限公司 | PTFE-based PCB manufacturing technique |
| JP6103547B2 (en) * | 2015-01-09 | 2017-03-29 | 三菱電機株式会社 | Electronic board unit |
| CN105744730A (en) * | 2016-04-27 | 2016-07-06 | 广东欧珀移动通信有限公司 | PCB panel and processing method thereof |
| CN105916312A (en) * | 2016-05-27 | 2016-08-31 | 建业科技电子（惠州）有限公司 | Blue glue production process for printed circuit boards |
| CN106961804A (en) * | 2017-05-05 | 2017-07-18 | 柏承科技(昆山)股份有限公司 | PCB word techniques |
| CN109121298A (en) * | 2018-08-15 | 2019-01-01 | 昱鑫科技(苏州)有限公司 | printed circuit board green oil character manufacturing method |
| CN110239206A (en) * | 2019-06-14 | 2019-09-17 | 广州兴森快捷电路科技有限公司 | PCB character silk-screen production system and method |
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| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102802357A (en) * | 2012-08-10 | 2012-11-28 | 东莞市五株电子科技有限公司 | Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage |
| CN103660652A (en) * | 2012-09-04 | 2014-03-26 | 深南电路有限公司 | Silk screen printing technology for printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168270A (en) * | 2018-09-19 | 2019-01-08 | 柏承科技(昆山)股份有限公司 | The anti-welding text technique of energy conservation |
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| CN103957667A (en) | 2014-07-30 |
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