CN110931364A - White oil treatment process for surface of ceramic substrate - Google Patents
White oil treatment process for surface of ceramic substrate Download PDFInfo
- Publication number
- CN110931364A CN110931364A CN201911087701.2A CN201911087701A CN110931364A CN 110931364 A CN110931364 A CN 110931364A CN 201911087701 A CN201911087701 A CN 201911087701A CN 110931364 A CN110931364 A CN 110931364A
- Authority
- CN
- China
- Prior art keywords
- white oil
- ceramic substrate
- baking
- time
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a ceramic substrate surface white oil treatment process, which comprises the following steps: (1) carrying out sand blasting on the ceramic substrate to remove oxides and pollutants on the surface of the ceramic substrate; (2) taking white oil and adding a diluent into the white oil; (3) printing the diluted white oil on the surface of the ceramic substrate by using screen printing; (4) horizontally placing the printed white oil, and standing for more than 30 min; (5) baking the ceramic substrate printed with the white oil for the first time by using an oven; (6) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.3-1.6 m/min; (7) and carrying out secondary baking on the developed ceramic substrate. By adopting the process, the white oil can not fall off in a large area due to the attack of silver deposition liquid medicine after silver melting in the subsequent processing, and the bad phenomenon of copper exposure is avoided, thereby being beneficial to improving the product quality.
Description
Technical Field
The invention relates to the technical field of ceramic substrate manufacturing, in particular to a white oil treatment process for the surface of a ceramic substrate.
Background
At present, in the DPC ceramic substrate of the prior art, in order to improve the light reflectivity after packaging, a layer of white oil of 8-10um is generally directly filled in the channel, and then gold is plated on the surface. The technical problem existing in the prior art is that the white oil layer is easy to form, so that the white oil can fall off in a large area in the subsequent processing procedure, and the bad phenomenon of copper exposure is caused. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide a process for treating white oil on a surface of a ceramic substrate, which can effectively solve the problem that the conventional white oil treatment method causes a large area of white oil to fall off in the subsequent process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a ceramic substrate surface white oil treatment process comprises the following steps:
(1) carrying out sand blasting on the ceramic substrate to remove oxides and pollutants on the surface of the ceramic substrate;
(2) taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 10-50 ml/kg white oil; mixing white oil and diluent uniformly, standing for more than 30min to remove bubbles;
(3) printing the diluted white oil on the surface of the ceramic substrate by using screen printing;
(4) horizontally placing the printed white oil, and standing for more than 30 min;
(5) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 70-80 ℃, and the baking time is 20-30 min;
(6) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.3-1.6 m/min;
(7) and carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 140-160 ℃, and the baking time is 50-70 min.
As a preferable scheme, the screen mesh number adopted by the screen printing in the step (3) is 22-36T, the oil brushing frequency is 1-2 times, the scraper pressure is adjusted to be 4-6N during each oil brushing, and the scraper speed is 4-6 m/min.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
by adopting the process, the thickness of the white oil of the produced surface white oil product can be controlled within the range of 10-40 mu m, the white oil can not fall off in a large area due to the attack of silver deposition liquid medicine after silver melting in the subsequent process, and the occurrence of poor copper exposure is avoided, thereby being beneficial to improving the product quality.
Detailed Description
The invention discloses a ceramic substrate surface white oil treatment process, which comprises the following steps:
(1) the ceramic substrate is sand blasted to remove oxides and contaminants from the surface of the ceramic substrate.
(2) Taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 10-50 ml/kg white oil; mixing white oil and diluent uniformly, standing for more than 30min to remove bubbles.
(3) The diluted white oil was printed on the surface of the ceramic substrate using screen printing. The screen printing has 22-36T meshes, 1-2 times of oil brushing, 4-6N scraper pressure and 4-6m/min scraper speed.
(4) And horizontally placing the printed white oil, and standing for more than 30 min.
(5) And (3) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 70-80 ℃, and the baking time is 20-30 min.
(6) And (3) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.3-1.6 m/min.
(7) And carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 140-160 ℃, and the baking time is 50-70 min.
The invention is illustrated in more detail below in the following examples:
example 1:
a ceramic substrate surface white oil treatment process comprises the following steps:
(1) the ceramic substrate is sand blasted to remove oxides and contaminants from the surface of the ceramic substrate.
(2) Taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 10ml per kg white oil; mixing white oil and diluent uniformly, standing for 35min to remove bubbles.
(3) The diluted white oil was printed on the surface of the ceramic substrate using screen printing. The screen mesh number adopted by the screen printing is 22T, the oil brushing frequency is 1 time, the scraper pressure is adjusted to be 4N when oil brushing is carried out each time, and the scraper speed is 4 m/min.
(4) Standing the printed white oil horizontally for 40 min.
(5) And (3) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 70 ℃, and the baking time is 20 min.
(6) And (3) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.3 m/min.
(7) And (3) carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 140 ℃, and the baking time is 50 min.
After the treatment of the embodiment, the thickness of the white oil is 10 μm, and after the silver is processed in the subsequent process, the white oil can not fall off to expose copper due to the attack of silver-precipitating liquid medicine.
Example 2:
a ceramic substrate surface white oil treatment process comprises the following steps:
(1) the ceramic substrate is sand blasted to remove oxides and contaminants from the surface of the ceramic substrate.
(2) Taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 50 ml/kg white oil; mixing white oil and diluent uniformly, and standing for 40min to remove bubbles.
(3) The diluted white oil was printed on the surface of the ceramic substrate using screen printing. The screen mesh number adopted by the screen printing is 36T, the oil brushing times are 2 times, the scraper pressure is adjusted to 6N when brushing oil every time, and the scraper speed is 6 m/min.
(4) Standing the printed white oil horizontally for 40 min.
(5) And (3) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 80 ℃, and the baking time is 30 min.
(6) And (3) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.6 m/min.
(7) And (3) carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 160 ℃, and the baking time is 70 min.
After the treatment of the embodiment, the thickness of the white oil is 40 μm, and after the silver is processed in the subsequent process, the white oil can not fall off and expose copper due to the attack of silver-precipitating liquid medicine.
Example 3:
a ceramic substrate surface white oil treatment process comprises the following steps:
(1) the ceramic substrate is sand blasted to remove oxides and contaminants from the surface of the ceramic substrate.
(2) Taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 35ml per kg white oil; mixing white oil and diluent uniformly, standing for 50min to remove bubbles.
(3) The diluted white oil was printed on the surface of the ceramic substrate using screen printing. The screen mesh number adopted by the screen printing is 28T, the oil brushing times are 2 times, the scraper pressure is adjusted to 5N when brushing oil every time, and the scraper speed is 5 m/min.
(4) Standing the printed white oil horizontally for 50 min.
(5) And (3) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 75 ℃, and the baking time is 25 min.
(6) And (3) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.4 m/min.
(7) And (3) carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 150 ℃, and the baking time is 60 min.
After the treatment of the embodiment, the thickness of the white oil is 30 μm, and after the silver is processed in the subsequent process, the white oil can not fall off and expose copper due to the attack of silver-precipitating liquid medicine.
The design of the invention is characterized in that: by adopting the process, the thickness of the white oil of the produced surface white oil product can be controlled within the range of 10-40 mu m, the white oil can not fall off in a large area due to the attack of silver deposition liquid medicine after silver melting in the subsequent process, and the occurrence of poor copper exposure is avoided, thereby being beneficial to improving the product quality.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (2)
1. A ceramic substrate surface white oil treatment process is characterized in that: the method comprises the following steps:
(1) carrying out sand blasting on the ceramic substrate to remove oxides and pollutants on the surface of the ceramic substrate;
(2) taking white oil, and adding a diluent into the white oil, wherein the dosage of the diluent is as follows: 10-50 ml/kg white oil; mixing white oil and diluent uniformly, standing for more than 30min to remove bubbles;
(3) printing the diluted white oil on the surface of the ceramic substrate by using screen printing;
(4) horizontally placing the printed white oil, and standing for more than 30 min;
(5) baking the ceramic substrate printed with the white oil for the first time by using an oven, wherein the baking temperature is 70-80 ℃, and the baking time is 20-30 min;
(6) exposing the ceramic substrate by using an exposure machine to manufacture a circuit, wherein the exposure energy and time are based on the first piece, and the developing speed is set to be 1.3-1.6 m/min;
(7) and carrying out secondary baking on the developed ceramic substrate, wherein the baking temperature is 140-160 ℃, and the baking time is 50-70 min.
2. The ceramic substrate surface white oil treatment process according to claim 1, characterized in that: in the step (3), the mesh number of the screen used for screen printing is 22-36T, the number of times of oil brushing is 1-2, the pressure of the scraper is adjusted to 4-6N during each oil brushing, and the speed of the scraper is 4-6 m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087701.2A CN110931364A (en) | 2019-11-08 | 2019-11-08 | White oil treatment process for surface of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087701.2A CN110931364A (en) | 2019-11-08 | 2019-11-08 | White oil treatment process for surface of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110931364A true CN110931364A (en) | 2020-03-27 |
Family
ID=69853632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911087701.2A Pending CN110931364A (en) | 2019-11-08 | 2019-11-08 | White oil treatment process for surface of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110931364A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111942045A (en) * | 2020-08-26 | 2020-11-17 | 深圳市华仁三和科技有限公司 | Overprinting method for accurately coating reflective white oil on Mini-LED |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
| CN103117228A (en) * | 2013-02-26 | 2013-05-22 | 佘利宁 | Manufacturing method for COB (chip on board) packaging aluminum substrate |
| CN104661444A (en) * | 2015-02-16 | 2015-05-27 | 深圳华麟电路技术有限公司 | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method |
| CN106793553A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | The preparation method of white ink golden plate |
| CN106937488A (en) * | 2017-05-03 | 2017-07-07 | 奥士康精密电路（惠州）有限公司 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
| CN107128091A (en) * | 2017-05-26 | 2017-09-05 | 东莞翔国光电科技有限公司 | One kind improves wet film dirty oil plate and falls oily technique |
| CN108289386A (en) * | 2017-12-29 | 2018-07-17 | 东莞市合鼎电路有限公司 | A kind of printed wiring board anti-welding printing method |
| CN108770228A (en) * | 2018-06-15 | 2018-11-06 | 深圳市五株科技股份有限公司 | A kind of processing method and PCB of PCB |
| CN110012607A (en) * | 2019-04-28 | 2019-07-12 | 胜华电子（惠阳）有限公司 | A kind of 8K television set height highlights oily mainboard leveling and screen printing method |
-
2019
- 2019-11-08 CN CN201911087701.2A patent/CN110931364A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
| CN103117228A (en) * | 2013-02-26 | 2013-05-22 | 佘利宁 | Manufacturing method for COB (chip on board) packaging aluminum substrate |
| CN104661444A (en) * | 2015-02-16 | 2015-05-27 | 深圳华麟电路技术有限公司 | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method |
| CN106793553A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | The preparation method of white ink golden plate |
| CN106937488A (en) * | 2017-05-03 | 2017-07-07 | 奥士康精密电路（惠州）有限公司 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
| CN107128091A (en) * | 2017-05-26 | 2017-09-05 | 东莞翔国光电科技有限公司 | One kind improves wet film dirty oil plate and falls oily technique |
| CN108289386A (en) * | 2017-12-29 | 2018-07-17 | 东莞市合鼎电路有限公司 | A kind of printed wiring board anti-welding printing method |
| CN108770228A (en) * | 2018-06-15 | 2018-11-06 | 深圳市五株科技股份有限公司 | A kind of processing method and PCB of PCB |
| CN110012607A (en) * | 2019-04-28 | 2019-07-12 | 胜华电子（惠阳）有限公司 | A kind of 8K television set height highlights oily mainboard leveling and screen printing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111942045A (en) * | 2020-08-26 | 2020-11-17 | 深圳市华仁三和科技有限公司 | Overprinting method for accurately coating reflective white oil on Mini-LED |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN113543490B (en) * | 2021-07-08 | 2023-01-10 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110931364A (en) | White oil treatment process for surface of ceramic substrate | |
| CN106793553A (en) | The preparation method of white ink golden plate | |
| CN107509317B (en) | PCB solder mask processing method and PCB | |
| CN108668440B (en) | Reworking method for poor solder mask plug hole of finished circuit board | |
| CN103152992A (en) | Solder mask printing method of thick copper plate | |
| CN108966520B (en) | Anti-plagiarism shielding type PCB printing process | |
| CN111757602A (en) | Manufacturing method of blind hole | |
| CN104635994B (en) | A kind of preparation method of touch-screen metallic pattern | |
| CN110958781B (en) | Ink printing method capable of preventing orifice ink from whitening or peeling | |
| CN103233250A (en) | Method for electroplating goldfinger with thick gold layer | |
| CN109729651B (en) | Solder resist process for reducing ghost of white core material circuit board | |
| CN112048727A (en) | Treatment method of nickel-based high-temperature alloy return material | |
| CN113079648B (en) | Hole plugging method for PCB aluminum separating cover | |
| CN103987203A (en) | Solder resist machining method for large-thickness copper and grid printed board | |
| CN106686903A (en) | Treatment process of PTH (Plating Through Hole) plate | |
| CN108112195B (en) | Method for manufacturing multilayer circuit board | |
| CN106817849A (en) | A kind of thick copper plate solder resistance process | |
| CN105407646A (en) | Process for improving residual copper of stepped groove | |
| CN110719694B (en) | Chemical nickel gold surface treatment method for polyphenylene ether-containing printed circuit board | |
| CN106852008A (en) | A kind of method for preventing OSP copper faces heterochromatic | |
| CN111403295A (en) | Improved method of high-precision integrated circuit lead frame etching process | |
| CN115279055A (en) | Technological method for solving PAD on loose ink of PCB character jet printer | |
| CN111465208A (en) | Method for realizing high-precision convex copper plating | |
| KR20130060999A (en) | Method of forming pattern | |
| CN116825616A (en) | Substrate processing technology based on exposure developing technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200915 Address after: 710000 unit 1707, building 1, Wanke hi tech living Plaza, No.56 Xifeng Road, Yanta District, Xi'an, Shaanxi Province Applicant after: Xi'an Boxin Chuangda Electronic Technology Co.,Ltd. Address before: 523000 No. 12, ancient Liao Road, Tangxia Town, Dongguan, Guangdong Applicant before: DONGGUAN CHINA ADVANCED CERAMIC TECHNOLOGY Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200327 |