CN108770228A - A kind of processing method and PCB of PCB - Google Patents
A kind of processing method and PCB of PCB Download PDFInfo
- Publication number
- CN108770228A CN108770228A CN201810622821.7A CN201810622821A CN108770228A CN 108770228 A CN108770228 A CN 108770228A CN 201810622821 A CN201810622821 A CN 201810622821A CN 108770228 A CN108770228 A CN 108770228A
- Authority
- CN
- China
- Prior art keywords
- pcb
- ceramic substrate
- processing method
- ceramic
- welding resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the processing method of PCB a kind of and PCB, the processing method includes：Before PCB welding resistance manufacturing procedures, roughening treatment is carried out to ceramic substrate.In the present invention, the roughening treatment carried out to the surface of ceramic substrate improves the binding force between ceramic substrate and solder mask, solve the problems, such as that welding resistance processing link mortality is high, avoiding welding resistance unsuccessfully causes ink to fall the effect of ink, blister or PCB scraps, and then has saved production cost.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
The processing method and PCB of PCB.
Background technology
As PCB develops to more highly integrated degree, the processing technology requirement of PCB is higher and higher.In order to ensure PCB's
Quality, in the processing technology of PCB, this link of welding resistance is particularly important.Solder mask is a kind of protective layer, is not required to coated in PCB
On the circuit and base material of welding, it is therefore an objective to circuit bridging when preventing from welding provides prolonged electric appliance time and anti-chemoproection,
Form printed board beautiful " coat ".
But in the prior art, welding resistance is one of highest process of mortality amount, since welding resistance is in PCB manufacturing processes
Process afterwards will influence the appearance and quality of PCB, result even in PCB and scrap if this link of welding resistance is out of joint.
Invention content
In view of the deficiencies of the prior art, the present invention provides a kind of processing method and PCB of PCB, and solution hinders in the prior art
The excessively high problem of weld-ring section mortality.
To achieve the above object, the present invention provides technical solution below：
A kind of processing method of PCB, including：Before PCB welding resistance manufacturing procedures, roughening treatment is carried out to ceramic substrate.
Optionally, the roughening treatment includes：
The ceramic substrate is ground by ceramic grinder；
Ceramic substrate plate face is rinsed using high pressure sand.
Optionally, in the step：It is further comprising the steps of before grinding the ceramic substrate by ceramic grinder：
Ceramic substrate is washed, pickling operation, removes the impurity of ceramic base plate surface.
Optionally, in the step：Further include following step after being rinsed to ceramic substrate plate face using high pressure sand
Suddenly：
Ceramic substrate is washed, the sand grains of ceramic base plate surface is removed.
The present invention also provides a kind of PCB, the PCB is made according to any of the above-described processing method.
Compared with prior art, the invention has the advantages that：
The present invention provides the processing method of PCB a kind of and PCB, carry out roughening treatment to the surface of ceramic substrate, improve
Binding force between ceramic substrate and solder mask, solves the problems, such as that PCB welding resistance manufacturing procedure mortalitys are high, avoid because
Ink is unsuccessfully caused to fall the effect of ink, blister for welding resistance or PCB scraps, and then has saved production cost.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of flow chart of the processing method for PCB that the embodiment of the present invention one provides；
Fig. 2 is a kind of flow chart of the processing method of PCB provided by Embodiment 2 of the present invention.
Specific implementation mode
To enable the purpose of the present invention, feature, advantage more apparent and understandable, implement below in conjunction with the present invention
Attached drawing in example, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that reality disclosed below
It is only a part of the embodiment of the present invention to apply example, and not all embodiment.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
Have circuit before PCB welding resistance manufacturing procedures, on wiring board to exist, and solder mask is then to be coated in be not required to welding
On circuit and base material, for placing welding when circuit bridging, and provide the beautiful " outer of long-time electric appliance environment and anti-chemoproection
Clothing ".When user sees PCB, most can intuitively reflect PCB mass and appearance is exactly this layer " coat ", and therefore, welding resistance technique will
Directly affect the appearance and quality of PCB.In order to improve the success rate of PCB welding resistance manufacturing procedures, it is ensured that the appearance and quality of PCB accords with
It closes and requires, the present invention provides a kind of processing method of PCB, is first carried out to the ceramic substrate of PCB before carrying out welding resistance process to PCB
Surface roughening treatment.
Embodiment one
Referring to Fig. 1, Fig. 1 shows the flow of the processing method of PCB in the present embodiment one, include the following steps：
S1, pre- roughening treatment
This with roughening treatment step, polishing treatment is ground to the surface of ceramic substrate by ceramic grinder,
Make ceramic base plate surface cleaning, smooth, in order to subsequently further from roughening treatment process, to for after the processing method
Continuous step lays the foundation.
S2, roughening treatment
In the roughening treatment step, by way of high-pressure sand blast, obtained after step S1 clean, smooth ceramics
Substrate is rinsed, and so that ceramic substrate is formed cleaning and rough rough surface, for making resistance in PCB welding resistance manufacturing procedures
Strong binding force is formed between solder paste ink and ceramic substrate, to substantially increase the success rate of welding resistance process.
Embodiment two
Based on embodiment one, the present embodiment two provides a kind of processing method of PCB.
Referring to Fig. 2, Fig. 2 shows the flow of the processing method of PCB in the present embodiment two, include the following steps：
S01, washing process
In this step, using directly to by the way of ceramic substrate shower water, removal remains after pre-processing on PCB
Working solution.
In order to avoid there is impurity residual on ceramic substrate, the mode of multi-stage water wash processing can be used, ceramic substrate is carried out
Multisection type is washed, and remains in the impurity on ceramic substrate to thoroughly remove in procedure of processing in front, is follow-up welding resistance work
Sequence lays the foundation.
In addition, in the present embodiment, can also repeatedly be washed to ceramic substrate, deimpurity mesh is thoroughly removed to reach
's.
S02, pickling processes
In this step, by carrying out pickling processes to ceramic substrate to remove remaining oil content on ceramic substrate.
As a kind of optional real-time mode in the present embodiment, ceramic substrate is immersed in degreaser in this step,
To remove remaining oil content on PCB.
Wherein, which is the solution that acidic cleaning is mixed with water.
S1, pre- roughening treatment
In this step, polishing treatment is ground to the surface of ceramic substrate by ceramic grinder, makes ceramic substrate
Surface cleaning, to lay the foundation for the subsequent step of roughening treatment.
S2, roughening treatment
The plate face of ceramic substrate is rinsed by way of high-pressure sand blast in this step, ceramic substrate is made to be formed clearly
Clean coarse rough surface, in PCB welding resistance manufacturing procedures, form strong combination between solder mask and ceramic substrate
Power substantially increases the success rate of welding resistance step.
One of in the present embodiment in optional mode, which is specially：
Ceramic substrate is rinsed under high pressure using the diamond dust of 200#, to form uniform rough surface.
S3, washing process
In this step, it is attached to the sand grains of ceramic base plate surface by washing removal, avoids processing to follow-up welding resistance
Process impacts.
Similarly, in order to ensure to wash cleaning effect, the step is identical as step S101, using directly to ceramic substrate spray
The mode of water drenching and multi-stage water wash processing, carries out ceramic substrate the washing of multiple multisection type, to thoroughly remove in front
Procedure of processing in remain in the sand grains on ceramic substrate, lay the foundation for follow-up welding resistance process.
In conclusion the present invention provides the processing method of PCB a kind of and PCB, to ceramics before the welding resistance process of PCB
The surface of substrate carries out roughening treatment, improves the binding force between ceramic substrate and solder mask, solves the processing of PCB welding resistances
The high problem of process mortality was avoided because of the problem of welding resistance unsuccessfully causes ink to fall the effect of ink, blister or PCB scraps, and then was saved
Production cost.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (5)
1. a kind of processing method of PCB, which is characterized in that including：Before PCB welding resistance manufacturing procedures, ceramic substrate is carried out thick
Change is handled.
2. the processing method of PCB according to claim 1, which is characterized in that the roughening treatment includes：
The ceramic substrate is ground by ceramic grinder；
Ceramic substrate plate face is rinsed using high pressure sand.
3. the processing method of PCB according to claim 2, which is characterized in that in the step：It is ground by ceramic grinder
It is further comprising the steps of before grinding the ceramic substrate：
Ceramic substrate is washed, pickling operation, removes the impurity of ceramic base plate surface.
4. the processing method of PCB according to claim 2, which is characterized in that in the step：Using high pressure sand to ceramics
It is further comprising the steps of after substrate surface is rinsed：
Ceramic substrate is washed, the sand grains of ceramic base plate surface is removed.
5. a kind of PCB, which is characterized in that the PCB is made according to any processing method of Claims 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810622821.7A CN108770228A (en) | 2018-06-15 | 2018-06-15 | A kind of processing method and PCB of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810622821.7A CN108770228A (en) | 2018-06-15 | 2018-06-15 | A kind of processing method and PCB of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770228A true CN108770228A (en) | 2018-11-06 |
Family
ID=63978428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810622821.7A Pending CN108770228A (en) | 2018-06-15 | 2018-06-15 | A kind of processing method and PCB of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770228A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
| US20130081870A1 (en) * | 2011-09-30 | 2013-04-04 | Toshiki Furutani | Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| CN104219893A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT board line resistance welding process |
-
2018
- 2018-06-15 CN CN201810622821.7A patent/CN108770228A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
| US20130081870A1 (en) * | 2011-09-30 | 2013-04-04 | Toshiki Furutani | Multilayer printed wiring board and method for manufacturing multilayer printed wiring board |
| CN104219893A (en) * | 2014-08-15 | 2014-12-17 | 安徽广德威正光电科技有限公司 | BT board line resistance welding process |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN113543490B (en) * | 2021-07-08 | 2023-01-10 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
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| PB01 | Publication | ||
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Application publication date: 20181106 |