CN113543490B - Method for increasing adhesion of printing ink on ceramic substrate - Google Patents
Method for increasing adhesion of printing ink on ceramic substrate Download PDFInfo
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- CN113543490B CN113543490B CN202110772093.XA CN202110772093A CN113543490B CN 113543490 B CN113543490 B CN 113543490B CN 202110772093 A CN202110772093 A CN 202110772093A CN 113543490 B CN113543490 B CN 113543490B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Abstract
The invention discloses a method for increasing the adhesion of ink on a ceramic substrate, which comprises the following steps: (1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer; (2) Placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60min; (3) Taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60min; by adopting the method to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, so that the product can be processed and used in a harsh environment, the processing and use yield of the product is improved, and convenience is brought to production operation.
Description
Technical Field
The invention relates to the technical field of ceramic substrates, in particular to a method for increasing the adhesion of ink on a ceramic substrate.
Background
With the development of integration and miniaturization of semiconductor devices, the precision requirement on circuit patterns on a ceramic substrate bearing a chip is higher and higher, so that the adhesive force for manufacturing ink on a substrate with high circuit resolution has certain requirement, and the adhesive force of the ink with small line width on the ceramic substrate is more challenging. The ceramic substrate with ink may be stripped off due to the surface treatment in a strong acid environment and the high temperature treatment in the packaging process, resulting in poor product reliability. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to a method for increasing adhesion of ink on a ceramic substrate, which can increase adhesion of ink on the ceramic substrate.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer;
(2) Placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60min;
(3) Taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60min;
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil water to the ink is 150-500ml/KG, then adding 50-200ml of curing agent, and printing the ink with different thicknesses by using screen plates with different meshes, wherein the printing pressure is 0.4-1.2Mpa;
(5) Horizontally standing for 15-45min after printing ink, and pre-baking in an oven at 75-125 deg.C for 30-60min;
(6) Exposing with high energy exposure machine with exposure energy of 100-500mj/cm 2 The exposure time is 5-15s;
(7) Developing by adopting sodium carbonate with the mass concentration of 0.7-1.5% and the developing speed of 120-350 cm/min;
(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.
Preferably, the etching solution is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.
As a preferable scheme, the cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.
Preferably, the inks of different colors in step (4) include green, white, black and blue.
As a preferable scheme, the mesh plates with different mesh numbers in the step (4) comprise 36T, 45T, 63T and 100T.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
by adopting the method to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, so that the product can be processed and used in a harsh environment, the processing and use yield of the product is improved, and convenience is brought to production operation.
Detailed Description
The invention discloses a method for increasing the adhesion of ink on a ceramic substrate, which comprises the following steps:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0Mpa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 microns. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60min. The cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60min.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 150-500ml/KG, adding 50-200ml of curing agent, and printing the ink with different thicknesses by using screen plates with different meshes, wherein the printing pressure is 0.4-1.2Mpa. The inks of different colors include green, white, black and blue inks or other color inks, and the screens of different meshes include 36T, 45T, 63T and 100T or other meshes.
(5) Printing ink, horizontally standing for 15-45min, and pre-baking in oven at 75-125 deg.C for 30-60min.
(6) Exposing with high energy exposure machine with exposure energy of 100-500mj/cm 2 And the exposure time is 5-15s.
(7) Developing with sodium carbonate of 0.7-1.5 wt% and developing speed of 120-350 cm/min.
(8) Baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.
The invention is illustrated in more detail below in the following examples:
example 1:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200 meshes, the sand blasting pressure is 2.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching reagent is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5g/L, and the mass concentration of the sulfuric acid is 1%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30min. The cleaning solution comprises the following components in percentage by mass: 35% of alcohol, 10% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven for 50min at 50 ℃.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 500ml/KG, then adding 100ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 1.2Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, horizontally standing for 15min, and pre-baking in oven at 80 deg.C for 40min.
(6) Exposing with high energy exposure machine at 500mj/cm 2 Exposure time 10s.
(7) And developing with sodium carbonate of 0.8% mass concentration and at a developing speed of 120 cm/min.
(8) And baking the developed copper-clad ceramic substrate for 1H at 150 ℃.
Example 2:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 800 meshes, the sand blasting pressure is 5.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 60g/L, and the mass concentration of the sulfuric acid is 20%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 60min. The cleaning solution comprises the following components in percentage by mass: 5% of alcohol, 2% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 100 ℃ for 10min.
(4) Printing ink with different colors is printed on a copper-clad ceramic substrate, the ratio of oil to water is 150ml/KG, 50ml of curing agent is added, and screen plates with different meshes are used for printing ink with different thicknesses, and the printing pressure is 0.4Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, horizontally standing for 35min, and pre-baking in oven at 75 deg.C for 30min.
(6) Exposing with high energy exposure machine with exposure energy of 100mj/cm 2 Exposure time 5s.
(7) The development was carried out using sodium carbonate of 0.7% by mass and at a development speed of 200 cm/min.
(8) And baking the developed copper-clad ceramic substrate for 2H at 150 ℃.
Example 3:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 500 meshes, the sand blasting pressure is 6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching reagent is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 20g/L, and the mass concentration of the sulfuric acid is 10%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 35min. The cleaning solution comprises the following components in percentage by mass: 15% of alcohol, 5% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 70 ℃ for 60min.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 200ml/KG, then adding 150ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.8Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, horizontally standing for 45min, and pre-baking in oven at 125 deg.C for 35min.
(6) Exposing with high energy exposure machine at 200mj/cm 2 Exposure time 8s.
(7) The development was carried out using sodium carbonate of 1.2% by mass and at a development speed of 350 cm/min.
(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.5H.
Example 4:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching roughening treatment on a copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 600 meshes, the sand blasting pressure is 4.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 30g/L, and the mass concentration of the sulfuric acid is 13%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 40min. The cleaning solution comprises the following components in percentage by mass: 25% of alcohol, 1% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 60 ℃ for 30min.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 250ml/KG, then adding 200ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.7Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, horizontally standing for 30min, and pre-baking in oven at 90 deg.C for 45min.
(6) Performing exposure treatment with high energy exposure machine with exposure energy of 300mj/cm 2 Exposure time 12s.
(7) The development was carried out using sodium carbonate of 1.5% by mass and at a development speed of 320 cm/min.
(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.2H.
Example 5:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 400 meshes, the sand blasting pressure is 3.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 25g/L, and the mass concentration of the sulfuric acid is 16%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 45min. The cleaning solution comprises the following components in percentage by mass: 30% of alcohol, 7% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 80 ℃ for 40min.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 350ml/KG, then adding 180ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.5Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, standing for 20min, and pre-baking in an oven at 85 deg.C for 50min.
(6) Exposing with high energy exposure machine at exposure energy of 250mj/cm 2 Exposure time 15s.
(7) The development was carried out using sodium carbonate of 1.3% by mass and at a development speed of 250 cm/min.
(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.8H.
Example 6:
a method of increasing the adhesion of an ink to a ceramic substrate comprising the steps of:
(1) Carrying out sand blasting and etching coarsening treatment on the copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 300 meshes, the sand blasting pressure is 5.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micrometer. The etching reagent is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 48g/L, and the mass concentration of the sulfuric acid is 8%.
(2) And placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 50min. The cleaning solution comprises the following components in percentage by mass: 20% of alcohol, 8% of acetone and the balance of deionized water.
(3) And taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 75 ℃ for 45min.
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil to water to the ink is 400ml/KG, then adding 120ml of curing agent, and using screen plates with different meshes to print the ink with different thicknesses, wherein the printing pressure is 0.9Mpa. The inks of different colors include green, white, black and blue, and the screens of different meshes include 36T, 45T, 63T and 100T.
(5) Printing ink, standing for 18min, and pre-baking in an oven at 100 deg.C for 60min.
(6) Performing exposure treatment with high energy exposure machine with exposure energy of 400mj/cm 2 Exposure time 12s.
(7) The development was carried out using sodium carbonate of 0.9% by mass and at a development speed of 300 cm/min.
(8) And baking the developed copper-clad ceramic substrate at 150 ℃ for 1.7H.
Comparative example:
the copper-clad ceramic substrates of the embodiments are respectively processed by adopting the traditional process, and the steps are as follows: 1. cleaning the board surface by using a certain sulfuric acid solution; 2. printing ink; 3. pre-baking; 4. exposing and developing; 5. and (5) post-baking. To obtain the corresponding six comparative examples.
The above examples and comparative examples were tested by the following methods:
the first step is as follows: and scribing, partitioning, transversely and vertically 10 times by adopting a 1mm 11-edge louver knife on the ink printing surface of the substrate with the same area, wherein the area can be 100 x 100mm, the unit area is 1 x 1mm, and the total unit area is 10000.
The second step is that: and (5) observing the proportion of the ink falling in the unit area by adopting a 3M adhesive tape to perform the same angle and the same rolling times.
The test results are shown in the following table:
| serial number | The process oil of the inventionNumber of ink drop per unit area | Number of ink drop per unit area in conventional process |
| 1 | 2 | 25 |
| 2 | 1 | 51 |
| 3 | 0 | 54 |
| 4 | 3 | 35 |
| 5 | 1 | 42 |
| 6 | 2 | 32 |
As can be seen from the above table, the adhesion of the ink on the ceramic substrate is greatly improved by adopting the method of the invention.
The design of the invention is characterized in that: by adopting the method of the invention to form the printing ink on the ceramic substrate, the adhesive force of the printing ink on the ceramic substrate can be effectively increased, thereby ensuring that the product is processed and used in a harsh environment, improving the processing and use yield of the product and bringing convenience to production operation.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (5)
1. A method of increasing the adhesion of an ink to a ceramic substrate, comprising: the method comprises the following steps:
(1) Carrying out sand blasting and etching roughening treatment on a copper-clad ceramic substrate to be printed with ink, wherein the mesh number of carborundum adopted during sand blasting is 200-800 meshes, the sand blasting pressure is 2.0-6.0MPa, and etching liquid medicine is adopted during etching, so that the roughness of the copper-clad ceramic substrate is more than 0.15 micron;
(2) Placing the roughened copper-clad ceramic substrate in a cleaning solution for ultrasonic cleaning for 30-60min;
(3) Taking out the cleaned copper-clad ceramic substrate, and baking the copper-clad ceramic substrate in an oven at 50-100 ℃ for 10-60min;
(4) Printing ink with different colors on a copper-clad ceramic substrate, wherein the ratio of oil water to the ink is 150-500ml/KG, then adding 50-200ml of curing agent, and printing the ink with different thicknesses by using screen plates with different meshes, wherein the printing pressure is 0.4-1.2Mpa;
(5) Horizontally standing for 15-45min after printing ink, and pre-baking in an oven at 75-125 deg.C for 30-60min;
(6) Exposing with high energy exposure machine with exposure energy of 100-500mj/cm 2 The exposure time is 5-15s;
(7) Developing with sodium carbonate of 0.7-1.5 wt% and developing speed of 120-350 cm/min;
(8) Baking the developed copper-clad ceramic substrate at 150 ℃ for 1-2H.
2. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the etching liquid medicine is sodium persulfate and sulfuric acid, the concentration of the sodium persulfate is 5-60g/L, and the mass concentration of the sulfuric acid is 1-20%.
3. The method of claim 1, wherein the method comprises: the cleaning solution comprises the following components in percentage by mass: 5-35% of alcohol, 1-10% of acetone and the balance of deionized water.
4. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the inks with different colors in the step (4) comprise green, white, black and blue.
5. The method of increasing the adhesion of an ink to a ceramic substrate of claim 1, wherein: the otter boards with different meshes in the step (4) comprise 36T, 45T, 63T and 100T.
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