CN111970839A - Processing technology of printed circuit board capable of effectively saving electrogilding cost - Google Patents
Processing technology of printed circuit board capable of effectively saving electrogilding cost Download PDFInfo
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- CN111970839A CN111970839A CN202010886004.XA CN202010886004A CN111970839A CN 111970839 A CN111970839 A CN 111970839A CN 202010886004 A CN202010886004 A CN 202010886004A CN 111970839 A CN111970839 A CN 111970839A
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- circuit board
- film
- electrogilding
- copper
- circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
The invention relates to the technical field of circuit board processing, in particular to a processing technology of a printed circuit board capable of effectively saving electrogilding cost, which comprises the following steps: step one, drilling; step two, primary circuit; step three, electroplating nickel on the primary circuit; step four, secondary circuit; step five, gold plating; sixthly, removing the film; step seven, etching; step eight, line scanning; step nine, solder resist; step ten, obtaining a finished product, wherein the area of the nickel-gold of the circuit board prepared by the gold-saving process provided by the invention is obviously smaller than that of the circuit board prepared by the traditional process, and the production cost of enterprises is greatly saved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a processing technology of a printed circuit board, which can effectively save the cost of electrogilding.
Background
Although PCBs can be called high-tech products in the electronic industry, the development of PCBs is not only challenged by the cost-benefit problem of PCBs, but also challenged by peripheral energy conservation and environmental protection, especially the energy conservation and environmental protection requirements of electronic product manufacturers and social requirements. Therefore, the PCB must take a green development way, energy conservation, consumption reduction, emission reduction and pollution control must be placed at an important position of industrial development, the existing nickel-gold electroplating process in the industry is the whole-board nickel-gold electroplating, and the non-welding part is used for electroplating gold together, but the market price of gold continuously rises, the production cost of an enterprise is increased, and the order is lost or the operation is not profitable. In view of this, we propose a process for manufacturing a printed circuit board that can effectively save the cost of electrogilding.
Disclosure of Invention
In order to make up for the defects, the invention provides a processing technology of a printed circuit board, which can effectively save the cost of electrogilding.
The technical scheme of the invention is as follows:
a processing technology of a printed circuit board capable of effectively saving the cost of electrogilding comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, primary circuit: a layer of dry mold is pasted on the circuit board after copper plating, the manufactured primary positive film is pasted on the dry film after film pasting, the circuit board pasted with the positive film forms a primary circuit after exposure and development treatment, all parts needing to be welded of a circuit pattern, metal holes and the copper surface of the circuit are exposed, and the circuit board is sent to a next process for nickel plating after QC inspection;
step three, primary circuit nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step four, secondary circuit: attaching a dry die on the circuit board after nickel plating, attaching the manufactured secondary positive film to the dry film after film attaching, exposing and developing the circuit board attached with the secondary positive film to form a secondary circuit, exposing all nickel surfaces of parts needing to be welded of a circuit pattern, and sending the circuit board to a next process for gold plating after QC inspection;
step five, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
sixthly, removing the film, namely putting the exposed dry film in a film removing machine and spraying film removing liquid to carry out film removing treatment;
step seven, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step eight, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step nine, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step ten, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
Preferably, the dry film in step two and step four is a polymer compound, which can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance to be attached to the plate surface, thereby achieving the function of blocking electroplating and etching.
Preferably, the positive film in the second step and the fourth step is a photosensitive positive film of all the parts of the circuit board pattern required by the customer to be welded, the bonding pads of the metal holes and all the conductive patterns.
Preferably, the electrolyte in the third step is mainly composed of nickel salt, conductive salt, pH buffer and wetting agent.
Preferably, the pH buffer is one of a hydrochloric acid buffer, a phosphate buffer, a sodium citrate buffer, a sodium acetate buffer and a borax buffer.
As a preferable example of the wetting agent in the present invention, one of alkyl sulfate, sulfonate, fatty acid ester sulfate, polyoxyethylene alkylphenol ether, polyoxyethylene fatty alcohol ether, and polyoxyethylene polyoxypropylene block copolymer is used.
Preferably, the chemical solution in the fifth step is a citrate gold plating solution.
Preferably, the film removing liquid in the sixth step adopts CL-506 film removing liquid, and is sprayed into the film removing machine in a pressurized spraying mode, the spraying pressure is 1-3kg/cm2, the spraying temperature is 50-60 ℃, the cylinder opening ratio is 20 +/-5%, and the time is 1-3 min.
Preferably, in the seventh step, one of acidic copper chloride, basic copper chloride, ferric chloride and ammonium persulfate is used as the etching solution.
Preferably, the solder resist oil applying region in the ninth step also includes a pad.
Compared with the prior art, the invention has the beneficial effects that:
the area of the nickel-gold electroplating of the circuit board manufactured by the gold-saving process provided by the invention is obviously lower than that of the circuit board manufactured by the traditional process, so that the production cost of enterprises is greatly saved.
Drawings
FIG. 1 is a diagram showing the area of an electroless nickel-gold layer (front side) in the conventional process of the present invention;
FIG. 2 is a diagram showing the area of an electroless nickel-gold layer (reverse side) in the conventional process of the present invention;
FIG. 3 is a diagram showing the area of the electroless nickel/gold layer in the gold-saving process of the present invention (front side);
FIG. 4 is a diagram showing the area of the electroless nickel-gold layer in the gold-saving process of the present invention (reverse side).
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Example 1
The embodiment provides a processing technology of a printed circuit board capable of effectively saving the cost of electrogilding, which comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, primary circuit: a layer of dry mold is pasted on the circuit board after copper plating, the manufactured primary positive film is pasted on the dry film after film pasting, the circuit board pasted with the positive film forms a primary circuit after exposure and development treatment, all parts needing to be welded of a circuit pattern, metal holes and the copper surface of the circuit are exposed, and the circuit board is sent to a next process for nickel plating after QC inspection;
step three, primary circuit nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step four, secondary circuit: attaching a dry die on the circuit board after nickel plating, attaching the manufactured secondary positive film to the dry film after film attaching, exposing and developing the circuit board attached with the secondary positive film to form a secondary circuit, exposing all nickel surfaces of parts needing to be welded of a circuit pattern, and sending the circuit board to a next process for gold plating after QC inspection;
step five, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
sixthly, removing the film, namely putting the exposed dry film in a film removing machine and spraying film removing liquid to carry out film removing treatment;
step seven, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step eight, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step nine, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step ten, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
In this embodiment, the dry film in the second step and the fourth step is a polymer compound, which can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the surface of the board, thereby achieving the function of blocking electroplating and etching.
In this embodiment, the positive film in step two and step four is a photosensitive positive film of all the welding parts and bonding pads of the metal holes and all the conductive patterns of the circuit board pattern required by the customer.
In this embodiment, the main components of the electrolyte in step three are nickel salt, conductive salt, pH buffer and wetting agent.
In this example, hydrochloric acid buffer was used as the pH buffer.
In this example, alkyl sulfate was used as the wetting agent.
In this embodiment, the chemical liquid in the fifth step is a citrate gold plating solution.
In the embodiment, the film stripping solution in the sixth step is CL-506 film stripping solution, and is sprayed into the film stripping machine in a pressurized spraying mode, the spraying pressure is 1kg/cm2, the spraying temperature is 50 ℃, the cylinder opening ratio is 20%, and the time is 1 min.
In this embodiment, the etching solution in the seventh step adopts acidic copper chloride.
In this embodiment, the solder resist oil application region in step nine also includes a pad.
Example 2
The embodiment provides a processing technology of a printed circuit board capable of effectively saving the cost of electrogilding, which comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, primary circuit: a layer of dry mold is pasted on the circuit board after copper plating, the manufactured primary positive film is pasted on the dry film after film pasting, the circuit board pasted with the positive film forms a primary circuit after exposure and development treatment, all parts needing to be welded of a circuit pattern, metal holes and the copper surface of the circuit are exposed, and the circuit board is sent to a next process for nickel plating after QC inspection;
step three, primary circuit nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step four, secondary circuit: attaching a dry die on the circuit board after nickel plating, attaching the manufactured secondary positive film to the dry film after film attaching, exposing and developing the circuit board attached with the secondary positive film to form a secondary circuit, exposing all nickel surfaces of parts needing to be welded of a circuit pattern, and sending the circuit board to a next process for gold plating after QC inspection;
step five, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
sixthly, removing the film, namely putting the exposed dry film in a film removing machine and spraying film removing liquid to carry out film removing treatment;
step seven, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step eight, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step nine, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step ten, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
In this embodiment, the dry film in the second step and the fourth step is a polymer compound, which can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the surface of the board, thereby achieving the function of blocking electroplating and etching.
In this embodiment, the positive film in step two and step four is a photosensitive positive film of all the welding parts and bonding pads of the metal holes and all the conductive patterns of the circuit board pattern required by the customer.
In this embodiment, the main components of the electrolyte in step three are nickel salt, conductive salt, pH buffer and wetting agent.
In this example, phosphate buffer was used as the pH buffer.
In this example, fatty acid ester sulfate was used as the wetting agent.
In this embodiment, the chemical liquid in the fifth step is a citrate gold plating solution.
In the embodiment, the film stripping solution in the sixth step is CL-506 film stripping solution, and is sprayed into the film stripping machine in a pressurized spraying mode, the spraying pressure is 2kg/cm2, the spraying temperature is 55 ℃, the cylinder opening ratio is 22.5%, and the time is 2 min.
In this embodiment, the etching solution in the seventh step adopts alkaline copper chloride.
In this embodiment, the solder resist oil application region in step nine also includes a pad.
Example 3
The embodiment provides a processing technology of a printed circuit board capable of effectively saving the cost of electrogilding, which comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, primary circuit: a layer of dry mold is pasted on the circuit board after copper plating, the manufactured primary positive film is pasted on the dry film after film pasting, the circuit board pasted with the positive film forms a primary circuit after exposure and development treatment, all parts needing to be welded of a circuit pattern, metal holes and the copper surface of the circuit are exposed, and the circuit board is sent to a next process for nickel plating after QC inspection;
step three, primary circuit nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step four, secondary circuit: attaching a dry die on the circuit board after nickel plating, attaching the manufactured secondary positive film to the dry film after film attaching, exposing and developing the circuit board attached with the secondary positive film to form a secondary circuit, exposing all nickel surfaces of parts needing to be welded of a circuit pattern, and sending the circuit board to a next process for gold plating after QC inspection;
step five, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
sixthly, removing the film, namely putting the exposed dry film in a film removing machine and spraying film removing liquid to carry out film removing treatment;
step seven, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step eight, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step nine, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step ten, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
In this embodiment, the dry film in the second step and the fourth step is a polymer compound, which can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the surface of the board, thereby achieving the function of blocking electroplating and etching.
In this embodiment, the positive film in step two and step four is a photosensitive positive film of all the welding parts and bonding pads of the metal holes and all the conductive patterns of the circuit board pattern required by the customer.
In this embodiment, the main components of the electrolyte in step three are nickel salt, conductive salt, pH buffer and wetting agent.
In this example, the pH buffer is borax buffer.
In this example, a polyoxyethylene polyoxypropylene block copolymer was used as the wetting agent.
In this embodiment, the chemical liquid in the fifth step is a citrate gold plating solution.
In the embodiment, the film stripping solution in the sixth step is CL-506 film stripping solution, and is sprayed into the film stripping machine in a pressurized spraying mode, the spraying pressure is 3kg/cm2, the spraying temperature is 60 ℃, the cylinder opening ratio is 25%, and the time is 3 min.
In this embodiment, the etching solution in the seventh step adopts one of acidic copper chloride, alkaline copper chloride, ferric chloride, or ammonium persulfate.
In this embodiment, the solder resist oil application region in step nine also includes a pad.
Comparative example
The embodiment provides an electro-nickel-gold process of a printed circuit board, which comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step three, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
step four, film stripping, namely placing the exposed dry film in a film stripping machine and spraying a film stripping liquid for film stripping treatment;
step five, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step six, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step seven, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step eight, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
In this embodiment, the main components of the electrolyte in the second step are nickel salt, conductive salt, pH buffering agent and wetting agent.
In this example, hydrochloric acid buffer was used as the pH buffer.
In this example, alkyl sulfate was used as the wetting agent.
In this embodiment, the chemical liquid in step three is a citrate gold plating solution.
In the embodiment, the film stripping solution in the fourth step is CL-506 film stripping solution, and is sprayed into the film stripping machine in a pressurized spraying mode, the spraying pressure is 2kg/cm2, the spraying temperature is 55 ℃, the cylinder opening ratio is 22.5%, and the time is 2 min.
In this embodiment, the etching solution in the fifth step adopts acidic copper chloride.
In this embodiment, the solder resist oil applying region in step seven also includes a pad.
Comparing the area of the nickel and gold in the circuit board manufactured by the processes provided by the three embodiments with the area of the circuit board manufactured by the process provided by the comparative example, as shown in fig. 1 to 4, it is obvious from fig. 1 to 4 that the area of the nickel and gold in the circuit board manufactured by the processes provided by the three embodiments of the present invention is significantly lower than that of the circuit board manufactured by the process provided by the comparative example. And the following data can be derived:
| process for the preparation of a coating | Area of plating | Unit price per square meter |
| Conventional Process (comparison example) | 109％ | 406 |
| Province gold art (example 1) | 35％ | 218 |
| Province gold art (example 2) | 36％ | 218 |
| Province gold art (example 3) | 34％ | 218 |
Compared with the two processes, the gold plating of the circuit board manufactured by the process provided by the invention is saved by about half.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A processing technology of a printed circuit board capable of effectively saving the cost of electrogilding is characterized in that: the method comprises the following steps:
step one, drilling: firstly, drilling holes on a copper-clad plate which is cut and baked according to a program compiled by a customer requirement, and then carrying out copper deposition and copper plating treatment on the drilled holes so as to conduct circuits on two sides of the copper-clad plate;
step two, primary circuit: a layer of dry mold is pasted on the circuit board after copper plating, the manufactured primary positive film is pasted on the dry film after film pasting, the circuit board pasted with the positive film forms a primary circuit after exposure and development treatment, all parts needing to be welded of a circuit pattern, metal holes and the copper surface of the circuit are exposed, and the circuit board is sent to a next process for nickel plating after QC inspection;
step three, primary circuit nickel electroplating: taking a plated part as a cathode, taking metal nickel as an anode, placing the plated part in electrolyte, and applying direct current to deposit a uniform and compact nickel plating layer on the plated part;
step four, secondary circuit: attaching a dry die on the circuit board after nickel plating, attaching the manufactured secondary positive film to the dry film after film attaching, exposing and developing the circuit board attached with the secondary positive film to form a secondary circuit, exposing all nickel surfaces of parts needing to be welded of a circuit pattern, and sending the circuit board to a next process for gold plating after QC inspection;
step five, gold plating, namely dissolving gold in chemical liquid medicine, immersing the circuit board in an electroplating cylinder and switching on current so as to generate a nickel-gold plating layer on the copper foil surface of the circuit board;
sixthly, removing the film, namely putting the exposed dry film in a film removing machine and spraying film removing liquid to carry out film removing treatment;
step seven, etching: spraying the etching solution on the surface of the circuit board, and corroding unnecessary copper in the circuit board to leave a required part;
step eight, line scanning: scanning detection is carried out through optical AOI equipment, high-definition image cameras are used for carrying out rapid shooting, and then shot pictures are compared with original files;
step nine, solder resist: printing solder resist oil on all places of a circuit board, placing a solder resist film on the circuit board which is completely covered with the solder resist oil, then placing the circuit board on an exposure machine for exposure, and exposing required holes and pads after development;
step ten, finished product: and (3) carrying out die punching on the circuit board according to an exterior diagram provided by a client, carrying out functional test on the circuit board by a universal machine, checking the circuit board which is qualified in the test, printing the position number and the board name of the device on the circuit board which is qualified in the test, and delivering the packaged circuit board.
2. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: the dry film in the second step and the fourth step is a high molecular compound which can generate a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance to be attached to the board surface, thereby achieving the functions of blocking electroplating and etching.
3. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: and step two and step four, the positive film is the photosensitive positive film of all the welding parts and the bonding pads of the metal holes and all the conductive patterns of the circuit board patterns required by the customers.
4. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: the main components of the electrolyte in the third step are nickel salt, conductive salt, pH buffering agent and wetting agent.
5. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 4, wherein: the pH buffer adopts one of hydrochloric acid buffer solution, phosphoric acid buffer solution, sodium citrate buffer solution, sodium acetate buffer solution or borax buffer solution.
6. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 4, wherein: the wetting agent is one of alkyl sulfate, sulfonate, fatty acid ester sulfate, polyoxyethylene alkylphenol ether, polyoxyethylene fatty alcohol ether or polyoxyethylene polyoxypropylene block copolymer.
7. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: and the chemical liquid in the fifth step is citrate gold plating liquid.
8. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: and removing the membrane liquid by CL-506 in the sixth step, spraying the membrane liquid into the membrane removing machine in a pressurized spraying mode, wherein the spraying pressure is 1-3kg/cm2, the spraying temperature is 50-60 ℃, the cylinder opening proportion is 20 +/-5%, and the time is 1-3 min.
9. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: and the etching solution in the seventh step adopts one of acidic copper chloride, alkaline copper chloride, ferric chloride or ammonium persulfate.
10. The process for manufacturing a printed wiring board effective for saving the cost of electrogilding as described in claim 1, wherein: the solder resist oil applied area in step nine also includes a pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010886004.XA CN111970839A (en) | 2020-08-28 | 2020-08-28 | Processing technology of printed circuit board capable of effectively saving electrogilding cost |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010886004.XA CN111970839A (en) | 2020-08-28 | 2020-08-28 | Processing technology of printed circuit board capable of effectively saving electrogilding cost |
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| CN111970839A true CN111970839A (en) | 2020-11-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867290A (en) * | 2021-01-06 | 2021-05-28 | 湖北共铭电路有限公司 | Reinforced PCB and processing technology thereof |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
-
2020
- 2020-08-28 CN CN202010886004.XA patent/CN111970839A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867290A (en) * | 2021-01-06 | 2021-05-28 | 湖北共铭电路有限公司 | Reinforced PCB and processing technology thereof |
| CN116156772A (en) * | 2022-12-28 | 2023-05-23 | 南通威斯派尔半导体技术有限公司 | AMB copper-clad ceramic circuit board and preparation method thereof |
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