CN105072818A - No-board-edge nickel-gold technology of circuit board - Google Patents
No-board-edge nickel-gold technology of circuit board Download PDFInfo
- Publication number
- CN105072818A CN105072818A CN201510500954.3A CN201510500954A CN105072818A CN 105072818 A CN105072818 A CN 105072818A CN 201510500954 A CN201510500954 A CN 201510500954A CN 105072818 A CN105072818 A CN 105072818A
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- CN
- China
- Prior art keywords
- wiring board
- nickel
- edges
- board
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a no-board-edge nickel-gold technology of a circuit board. The no-board-edge nickel-gold technology of a circuit board comprises steps of performing cutting on a substrate of the circuit board, exposing an inner layer circuit, laminating, boring, precipitating copper and electroplating, adopting a positive technology to perform copper plating, tin plating, removing films, etching, removing tin, performing solder mask, and performing character back baking on the outer layer circuit. The steps before the chemical nickel-gold technology comprises steps of removing the technology edges on the circuit board, performing chemical nickel-gold processing on the circuit board, and testing and checking the electric performance and appearance of the finished board. The invention can save the nickel amount in the nickel gold technology so as to save the cost.
Description
Technical field
The present invention relates to a kind of circuit board gold plating method, be specifically related to a kind of wiring board without edges of boards nickel gold process.
Background technology
Pcb board is the circuit board for making electronic devices and components made by terahertz wave quasi-optics, the complex manufacturing technology of pcb board, flow process is longer, generally comprise the operations such as sawing sheet-boring-heavy copper-electric plating of whole board-Graphic transitions-pattern plating copper nickel gold-etching-inspection, the wherein copper foil surface nickel plating of conductive pattern and gold on a printed-wiring board, be very important step, effectively can prevent migration and the oxidation of copper, and improve conduction and the antioxygenic property of pcb board.In the electric nickel gold process of traditional printed substrate, electroplate in manufacturing process at PCB, in order to normally electroplate and silk-screen, usually leave the technique edges of 10mm-12mm in effective district surrounding of pcb board.When using the film " positive " technique, this technique edges is after plating, etching, the layers of copper on technique edges two sides still retains complete, if the surface treatment mode of this plate is chemical nickel and gold, when chemical nickel and gold, this technique edges equally with normal copper face can go up chemical nickel and gold, so just causes the waste of golden salt.Current technology mode is: before chemical nickel and gold, adhesive tape bag technique edges or use ink is by hand coated on technique edges and dries, then carry out heavy nickel gold.Following shortcoming is there is: bound edge and coating ink cause raw material and artificial waste by current method; Adhesive tape and ink are under the etch of chemical nickel and gold liquid medicine, and having comes off causes the contaminated risk of chemical nickel wire;
Summary of the invention
The object of the invention is, in order to overcome the above-mentioned defect existed in prior art, to provide a kind of wiring board without edges of boards nickel gold process.
The wiring board that the present invention proposes, without edges of boards nickel gold process, comprising:
S1, circuit board substrate carried out to sawing sheet, boring, heavy copper, whole plate electroplating processes;
S2, to wiring board by positive blade technolgy carry out pad pasting, exposure, development, graphic plating copper facing and zinc-plated after, through moving back film, etch, move back tin, anti-welding operation;
S3, before chemical nickel and gold technique, remove the technique edges on wiring board;
S4, chemical nickel and gold process is carried out to wiring board;
The electric property of S5, test-based examination production board and outward appearance, qualified i.e. obtained finished product.
In technique scheme, in described S3, when removing the technique edges on wiring board, first press form wire and make gong band, gong band is positioned at outside form wire, and gong band and form wire distance, at more than 1mm, after removing technique edges, leave the sensing block of protrusion wiring board one jiao.
In technique scheme, described sensing block is also provided with fool proof hole.
In technique scheme, described sensing block length 8-12mm, wide 4-6mm.
Wiring board in the present invention is without edges of boards nickel gold process, by removing the technique edges on wiring board before chemical nickel and gold technique, carry out the operation of nickel gold subsequently, owing to eliminating technique edges, in nickel gold process, save golden consumption, while removal technique edges, wiring board one jiao is provided with sensing block, sensing block is provided with fool proof hole position, ensures wiring board travel direction location when subsequent technique.
Accompanying drawing explanation
Fig. 1 is the circuit board structure schematic diagram before removing technique edges in the present invention;
Fig. 2 is the circuit board structure schematic diagram after removing technique edges in the present invention;
In figure: 1, wiring board; 2, form wire; 3, fool proof hole;
4, technique edges; 5, block is pointed to.
Embodiment
Be described below in conjunction with the drawings and specific embodiments:
A kind of wiring board, without edges of boards nickel gold process, comprising:
S1, sawing sheet (sheet material type: FR-4TG140A level plate is carried out to wiring board 1 substrate, long 622mm, wide 435mm, thickness of slab 1.5mm, the thick 1/1OZ of copper, reserved technique edges 4 is wide is Width 10.2mm, length direction 13.48mm), boring (Shenzhen big nation drilling machine, the speed of mainshaft 200,000 turns/min, drilling P02E57032A0.drl, minimum-value aperture 0.4mm), after electroless copper plating, observing backlight level under using 50 power microscopes is 9 grades; Carry out whole plate plating subsequently, current density 15ASF, electroplating time 30min;
S2, dry film pre-treatment is pasted to plating rear board after, in dust free room, paste dry film (Changxing dry film HT-115T21.00inch, 600ft, pad pasting pressure 3.8kg/cm
2pad pasting temperature 110 DEG C), 30min is left standstill after pad pasting, use positive film aligning, exposure, exposure energy is 7 lattice exposure guide rules (totally 21 lattice exposure guide rules), leaves standstill 30min after exposure, carries out developing (using 2 cylinders that develop to develop, developing powder 2.5m/min, solution level Na
2cO
3%=1%, development sprays 1.1kg/cm
2, under spray 1.3kg/cm
2, temperature 30 DEG C); After development, carry out figure line plating, during electro-coppering, current density 15ASF, electroplating time 60min, during electric degree tin, current density 12ASF, electroplating time 10min; After graphic plating, measuring surface copper thickness under metallomicroscope of cutting into slices is 55.3 μm, and hole copper thickness is 22 μm; Carry out moving back film process subsequently, etching (uses 2 to etch cylinder to etch, etch temperature 45 DEG C, etching speed 2.5m/min, etching solution proportion 1.18g/cm
3, etching sprays 1.6kg/cm
2, under spray 1.8kg/cm
2), move back tin; In AOI etching after the assay was approved, carry out anti-welding (the solder mask green model: the safe R-5002GAH of Yongsheng of green oil, use 43T silk screen printing, after leaving standstill 30min, pre-baked 40min at 75 DEG C, anti-welding exposure, exposure energy is 11 grades of exposure guide rules), welding masking developing (uses 3 cylinders that develop to develop, Na
2cO
3concentration=1.0%, development temperature 30.5 DEG C, developing powder 2.8m/min, development sprays 2.0kg/cm
2, under spray 1.5kg/cm
2, IC faces down, green oil solidification 30min under the condition of 150 DEG C);
S3 is before chemical nickel and gold technique, circuit board structure schematic diagram as shown in Figure 1, first makes gong band by form wire 2, and gong band is positioned at outside form wire 2, gong band and form wire 2 distance are at more than 1mm, use gong band to remove technique edges 4 (gong band is 57032.rou), make technique edges 4 become 5.5mm and 4.3mm from 13.4mm and 10.2mm, after removing technique edges, circuit board structure schematic diagram as shown in Figure 2, make fool proof hole 3 be positioned on reserved sensing block 5, point to the long 12mm of block 5, wide 6mm;
S4, (linear velocity 2.5m/min above sprays 2.0kg/cm to carry out chemical nickel and gold pre-treatment to wiring board 1
2, under spray 1.8kg/cm
2, polish-brush electric current 3.1A) after; Carry out chemical nickel and gold (chemical nickel temperature 82 DEG C, chemical nickel concentration 4.75g/L, chemical golden temperature 88 DEG C, chemical gold concentration 0.45g/L, time 175S);
The electric property of S5, test-based examination production board and outward appearance, remove the sensing block 5 that wiring board 1 protrudes, obtained finished product, and measuring its gold thick is 0.026 μm, owing to eliminating some processes limit, has saved material consumption during chemical nickel and gold.
The content be not described in detail in this specification belongs to the known prior art of professional and technical personnel in the field.
Claims (4)
1. wiring board is without an edges of boards nickel gold process, it is characterized in that, comprises the following steps:
S1, circuit board substrate carried out to sawing sheet, boring, heavy copper, whole plate electroplating processes;
S2, to wiring board by positive blade technolgy carry out pad pasting, exposure, development, graphic plating copper facing and zinc-plated after, through moving back film, etch, move back tin, anti-welding operation;
S3, before chemical nickel and gold technique, remove the technique edges on wiring board;
S4, chemical nickel and gold process is carried out to wiring board;
The electric property of S5, test-based examination production board and outward appearance, qualified i.e. obtained finished product.
2. according to claim 1 wiring board without edges of boards nickel gold process, it is characterized in that: in described step S3, when removing the technique edges on wiring board, first press form wire and make gong band, gong band is positioned at outside form wire, gong band and form wire distance, at more than 1mm, after removing technique edges, leave the sensing block of protrusion wiring board one jiao.
3. wiring board, without edges of boards nickel gold process, is characterized in that according to claim 2: described sensing block is also provided with fool proof hole.
4. wiring board, without edges of boards nickel gold process, is characterized in that according to claim 3: described sensing block length 8-12mm, wide 4-6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510500954.3A CN105072818A (en) | 2015-08-14 | 2015-08-14 | No-board-edge nickel-gold technology of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510500954.3A CN105072818A (en) | 2015-08-14 | 2015-08-14 | No-board-edge nickel-gold technology of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105072818A true CN105072818A (en) | 2015-11-18 |
Family
ID=54502054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510500954.3A Pending CN105072818A (en) | 2015-08-14 | 2015-08-14 | No-board-edge nickel-gold technology of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105072818A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040664A (en) * | 2020-08-04 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Method for preventing edge of PCB from being gold-plated |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201018170Y (en) * | 2007-02-08 | 2008-02-06 | 上海莫仕连接器有限公司 | Electrical connector |
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN202496137U (en) * | 2012-03-13 | 2012-10-17 | 四川深北电路科技有限公司 | SMT positioning structure used for printed board component board |
-
2015
- 2015-08-14 CN CN201510500954.3A patent/CN105072818A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201018170Y (en) * | 2007-02-08 | 2008-02-06 | 上海莫仕连接器有限公司 | Electrical connector |
| US20090020320A1 (en) * | 2007-07-16 | 2009-01-22 | Nanya Technology Corporation | Gold finger of circuit board and fabricating method thereof |
| CN101631427A (en) * | 2008-07-14 | 2010-01-20 | 深圳市九和咏精密电路有限公司 | Method for plating thick gold layer in circuit board manufacturing process |
| CN202496137U (en) * | 2012-03-13 | 2012-10-17 | 四川深北电路科技有限公司 | SMT positioning structure used for printed board component board |
Non-Patent Citations (1)
| Title |
|---|
| 李加余等: "防呆法在印制电路板行业之应用", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040664A (en) * | 2020-08-04 | 2020-12-04 | 胜宏科技（惠州）股份有限公司 | Method for preventing edge of PCB from being gold-plated |
| CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20190531 |