CN103068175A - Method of improving buried resistance printed wire board resistance precision - Google Patents
Method of improving buried resistance printed wire board resistance precision Download PDFInfo
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- CN103068175A CN103068175A CN2012104455717A CN201210445571A CN103068175A CN 103068175 A CN103068175 A CN 103068175A CN 2012104455717 A CN2012104455717 A CN 2012104455717A CN 201210445571 A CN201210445571 A CN 201210445571A CN 103068175 A CN103068175 A CN 103068175A
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Abstract
The invention provides a method of improving buried resistance printed wire board resistance precision. The method of improving the buried resistance printed wire board resistance precision comprises the following steps: (1) supplying a board with a buried resistance layer, wherein the board with a buried resistance layer comprising an insulating medium layer, the buried resistance layer and a copper foil layer, (2) attaching a first light resistance film, proceeding a first time exposure, printing a circuit figure of a negative film on the first light resistance film, proceeding a first time develop, the circuit figure comprising a resistance circuit and a normal circuit, increasing 6 mil to a long side unilateral of circuit width of the resistance circuit, and increasing 1.25 mil to a broadside unilateral of circuit width of the resistance circuit, (3) proceeding a first time etching and a second time etching, (4) attaching a second light resistance film, proceeding a second time exposure, printing a circuit figure of a positive film on the second light resistance film, proceeding a second time develop, reducing 0.6 mil to a long side unilateral of circuit width of the resistance figure, and increasing 6 mil to a broadside unilateral of circuit width of the resistance figure, (5) proceeding a third time etching, and (6) proceeding brown oxide processing, controlling micro etching amount between 1.3-1.7um,proceeding a -17% extra compensation to the resistance figure of the positive film.
Description
Technical field
The present invention relates to bury the component type printed wiring board, relate in particular to a kind of method that improves buried resistor printed wiring board resistance value precision.
Background technology
For volume, the weight that improves assembling product density and performance and reduce product, and be a kind of effective way with passive device integration to wiring board, the buried resistor printed wiring board arises at the historic moment thus.The buried resistor printed wiring board has following advantage in the high speed transmission circuit design: the impedance matching that improves circuit, shorten the path of signal transmission, reduce stray inductance, eliminated the induction reactance that produces in surface mount or the plug-in unit technique, reduced signal cross-talk, noise and electromagnetic interference.
The normal employing of buried resistor printed wiring board is buried oil resistance China ink (the TU-XX-08 series of Asahi) and is processed as buried resistor, owing to be subjected to the restriction of silk screen printing process and equipment, can not make small size resistance, and the resistance live width must be greater than 15mil; The difficulty of simultaneously silk-screen making is very big, low precision, and poor reproducibility, poor stability, under current working condition, it is slow that this process is promoted progress, and major part is in model and small lot batch manufacture stage.Therefore, realize the production in enormous quantities of buried resistor printed wiring board, and can process small size resistance that the technical problem that obtains high-precision resistance remains those skilled in the art and further solves.
Summary of the invention
The object of the present invention is to provide a kind of method that improves buried resistor printed wiring board resistance value precision, the precision of the buried resistor resistance of the buried resistor printed wiring board that it makes is high, and can process small size resistance, realize simultaneously the production in enormous quantities of buried resistor printed wiring board.
For achieving the above object, the invention provides a kind of method that improves buried resistor printed wiring board resistance value precision, comprise the steps:
Step 1, provide the sheet material with the resistance layer of burying, it comprises insulating medium layer, is positioned at burying resistance layer and being positioned at the copper foil layer that buries on the resistance layer on the insulating medium layer;
Paste the first photoresistance film on step 2, the described copper foil layer, for the first time exposure, the line pattern of film negative film is printed onto on this first photoresistance film, develop for the first time, described line pattern is comprised of resistance circuit and regular link, the monolateral increasing 6mil in the long limit of the live width of described resistance circuit, the monolateral increasing 1.25mil of broadside;
The copper foil layer that part is developed in step 3, for the first time etching to exposing the described resistance layer of burying, then carries out etching second time, and the resistance layer of burying that exposes is etched to described insulating medium layer and exposes out, removes remaining the first photoresistance film again;
Step 4, subsides the second photoresistance film, for the second time exposure is printed onto on the second photoresistance film that covers on the described resistance circuit second development with the resistance pattern of film positive, the monolateral 0.6mil that dwindles in the long limit of the live width of described resistance pattern, the monolateral increasing 6mil of broadside;
Step 5, carry out for the third time etching, the Copper Foil etching of resistance pattern part is removed, and remove remaining the second photoresistance film;
Step 6, brown oxidation processes is carried out on the surface of sheet material, the microetch amount of palm fibre oxidation is controlled at 1.3-1.7um, then, and when computer-aided manufacture, resistance pattern to described film positive is made-17% extra compensation, thereby makes the buried resistor that the resistance value precision improves.
The described first time is when exposing, the monolateral increasing 1.25mil of the broadside of the live width of described regular link.
Be etched to acid etching the described first time, its etching factor is greater than 3.
Be etched to acid etching the described second time, etching period is 4-5min.
The described second time, etched etching solution mixed at 84-86 ℃ of lower cupric sulfate pentahydrate and the concentrated sulfuric acid of 250g/l of adopting, and wherein the concentrated sulfuric acid accounts for 0.3% of total liquor capacity.
The described alkali etching that is etched to for the third time, pH value is 7.6-8.4, and etch temperature is 47-53 ℃, describedly buries resistance layer down, and the etching downforce is 18-22PSI.
The described resistance layer of burying is dull and stereotyped interlayer resistance material.
Described sheet material is copper-clad plate.
Also comprise the steps:
Step 7, carry out the stack of central layer and prepreg according to the required number of plies of buried resistor printed wiring board, then carry out lamination, boring;
Step 8, the surface thickening copper of sheet material behind copper and the lamination is sunk in described boring, then carry out outer dry film, then outer graphics is electroplated;
Step 9, this skin is electroplated figure carry out alkali etching, thereby form outer-layer circuit, finish the making of buried resistor printed wiring board master operation.
Beneficial effect of the present invention: the present invention improves the method for buried resistor printed wiring board resistance value precision, at first, adopt dull and stereotyped interlayer resistance material (Ohmega-ply) to possess stability and the reappearance that can be mass as burying resistance layer making buried resistor PCB, reduced difficulty of processing, realize production in enormous quantities, possessed Commercial Prospect; Secondly, the resistance live width of the small size resistance of making can reach 8mil; At last, can obtain the high precision electro resistance, the resistance accuracy of 20mil live width ± 7%, the resistance accuracy of 10mil live width ± 10%, CP
k＞=1.33.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In the accompanying drawing,
Fig. 1 is the flow chart that the present invention improves the method for buried resistor printed wiring board resistance value precision;
Fig. 2 A to Fig. 2 H is buried resistor graphic making schematic flow sheet of the present invention;
Fig. 3 A to Fig. 3 B is that the present invention buries resistance layer film design principle figure;
Fig. 4 is buried resistor etching compensation principle schematic diagram of the present invention.
Embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
See also Fig. 1 to Fig. 4, the invention provides a kind of method that improves buried resistor printed wiring board resistance value precision, its technological process is as follows:
(erosion copper, acid etching DES) → washing → for the second time etching (erosion Ohmega-ply material, acid etching) → wash → move back film → second development → washing → for the third time etching (erosion copper, alkaline etching SES＜possessed 2mil central layer ability 〉) → move back washing → second time film develops for the first time → washing → for the first time etching.
The technological process of buried resistor printed substrate of the present invention is as follows:
Open material → subsides the first photoresistance film → exposure first time → for the first time development → for the first time etching (erosion copper, acid etching DES) → for the second time etching (erosion Ohmega-ply material, acid etching) → move back film → subsides the second photoresistance film → second time exposure → second development → for the third time etching (is lost copper, alkaline etching SES) → move back film (measuring resistance value 1) → automated optical for the second time to detect (AOI) → brown → lamination → gong edges of boards → boring → desmearing → heavy copper thickening copper → outer dry film → graphic plating → alkali etching → welding resistance → character → HAL → sharp processing → Electronic Testing → finished product detection (measuring resistance value 2) → packing shipment.
According to above-mentioned technological process, more specifically, the method for raising buried resistor printed wiring board resistance value precision of the present invention comprises the steps:
Step 1, provide the sheet material with resistance layer of burying 22, it comprises insulating medium layer 20, is positioned at burying resistance layer 22 and being positioned at the copper foil layer 24 that buries on the resistance layer 22 on the insulating medium layer 20;
Prior art adopts buries oil resistance China ink processing buried resistor, owing to be subjected to silk screen printing process and device-restrictive, can not make small size resistance; The difficulty of simultaneously silk-screen making is very big, low precision, poor reproducibility, poor stability; Bury resistance layer 22 making buried resistors so present embodiment adopts, this buries resistance layer 22 and is dull and stereotyped interlayer resistance material, be specially Ohmega-ply, and this thickness that buries resistance layer 22 is certain, and described sheet material is copper-clad plate;
Paste the first photoresistance film 26 on step 2, the described copper foil layer 24, for the first time exposure, the line pattern of film negative film is printed onto on this first photoresistance film 26, develop for the first time, described line pattern is comprised of resistance circuit 28 and regular link, the monolateral increasing 6mil in the long limit of the live width of described resistance circuit 28, the monolateral increasing 1.25mil of broadside;
The monolateral increasing 1.25mil of the broadside of the live width of above-mentioned regular link;
The line pattern of described film negative film is printed onto on described the first photoresistance film 26 by for the first time exposure, is printed with photoresistance film polymerization reaction take place under the irradiation of ultraviolet light of line pattern part, and the photoresistance film of this part of carrying out developing for the first time remains;
The copper foil layer 24 of step 3, for the first time etching development part, to exposing the described resistance layer 22 of burying, shown in Fig. 2 C, then carry out the etching second time, to be etched to described insulating medium layer 20 exposed out with the resistance layer 22 of burying that exposes, shown in Fig. 2 D, remove again remaining the first photoresistance film 26, shown in Fig. 2 E;
Wherein, be etched to the DES acid etching the described first time, its etching factor is greater than 3; Be etched to acid etching the described second time, etching period is 4-5min, the described second time, etched etching solution mixed at 84-86 ℃ of lower cupric sulfate pentahydrate and the concentrated sulfuric acid of 250g/l of adopting, wherein the concentrated sulfuric acid accounts for 0.3% of total liquor capacity, the cylinder block material of this etching machine is polypropylene PP or PPN, heating pen is the Teflon material, and transmitting rumble is the PPN material, does not all use stainless steel material;
Step 4, subsides the second photoresistance film 26 ', for the second time exposure is printed onto on the second photoresistance film 26 ' that covers on the described resistance circuit 28 second development with the resistance pattern 28 ' of film positive, the monolateral 0.6mil that dwindles in the long limit of the live width of described resistance pattern 28 ', the monolateral increasing 6mil of broadside;
The resistance pattern 28 ' of described film positive is printed onto on the second photoresistance film 26 ' by for the second time exposure, when carrying out second development, the photoresistance film that is printed with the resistance pattern part is not removed because the irradiation that is not subject to ultraviolet light has polymerization reaction take place, shown in figure F;
The present invention improves the method for buried resistor printed wiring board resistance value precision, it realizes accurate etched purpose by the live width compensation to etched figure, its design principle is consulted Fig. 3 A and Fig. 3 B and Fig. 4: as shown in Figure 3A, when it designs for burying the resistance layer film, the precompensation of length direction and contraposition fool-proof design; Shown in Fig. 3 B, when it designs for burying the resistance layer film, the precompensation of cross direction and contraposition fool-proof design; As shown in Figure 4, it is measured by way of compensation by reserving x at the photoresistance film, thereby etches the circuit that reaches desired design that precision improves;
Step 5, carry out for the third time etching, Copper Foil 24 etchings of resistance pattern 28 ' part are removed, and remove remaining the second photoresistance film 26 ';
The described SES alkali etching that is etched to for the third time, pH value is 7.6-8.4, and etch temperature is 47-53 ℃, and etching pressure is 18-22PSI;
Described first, second and third time etching is adopted and is optimized etching solution system formulation and parameter, improves the etched figure precision, thereby improves the resistance value precision;
Step 6, brown oxidation processes is carried out on the surface of sheet material, the microetch amount of palm fibre oxidation is controlled at 1.3-1.7um, then, and when computer-aided manufacture, resistance pattern to described film positive is made-17% extra compensation, thereby makes the buried resistor that the resistance value precision improves.
The method that the present invention improves the resistance value precision of buried resistor printed wiring board also comprises the steps:
Step 7, carry out the stack of central layer and prepreg according to the required number of plies of buried resistor printed wiring board, then carry out lamination, boring;
Step 8, the surface thickening copper of sheet material behind copper and the lamination is sunk in described boring, then carry out outer dry film, then outer graphics is electroplated;
Step 9, this skin is electroplated figure carry out alkali etching, thereby form outer-layer circuit, finish the making of buried resistor printed wiring board.
Thereby finish the main production process of buried resistor printed substrate by above steps, other operations can be selected existing operation, do not give unnecessary details in the present invention.
In sum, the method of the resistance value precision of raising buried resistor printed substrate of the present invention adopts dull and stereotyped interlayer resistance material (Ohmega-ply) to possess stability and the reappearance that can be mass as burying resistance layer making buried resistor PCB, reduced difficulty of processing, realize production in enormous quantities, possessed Commercial Prospect; The resistance live width of the small size resistance of its making can reach 8mil; It can obtain the high precision electro resistance, the resistance accuracy of 20mil live width ± 7%, the resistance accuracy of 10mil live width ± 10%, CP
k＞=1.33.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of claim of the present invention.
Claims (9)
1. a method that improves buried resistor printed wiring board resistance value precision is characterized in that, comprises the steps:
Step 1, provide the sheet material with the resistance layer of burying, it comprises insulating medium layer, is positioned at burying resistance layer and being positioned at the copper foil layer that buries on the resistance layer on the insulating medium layer;
Paste the first photoresistance film on step 2, the described copper foil layer, for the first time exposure, the line pattern of film negative film is printed onto on this first photoresistance film, develop for the first time, described line pattern is comprised of resistance circuit and regular link, the monolateral increasing 6mil in the long limit of the live width of described resistance circuit, the monolateral increasing 1.25mil of broadside;
The copper foil layer that part is developed in step 3, for the first time etching to exposing the described resistance layer of burying, then carries out etching second time, and the resistance layer of burying that exposes is etched to described insulating medium layer and exposes out, removes remaining the first photoresistance film again;
Step 4, subsides the second photoresistance film, for the second time exposure is printed onto on the second photoresistance film that covers on the described resistance circuit second development with the resistance pattern of film positive, the monolateral 0.6mil that dwindles in the long limit of the live width of described resistance pattern, the monolateral increasing 6mil of broadside;
Step 5, carry out for the third time etching, the Copper Foil etching of resistance pattern part is removed, and remove remaining the second photoresistance film;
Step 6, brown oxidation processes is carried out on the surface of sheet material, the microetch amount of palm fibre oxidation is controlled at 1.3-1.7um, then, and when computer-aided manufacture, resistance pattern to described film positive is made-17% extra compensation, thereby makes the buried resistor that the resistance value precision improves.
2. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, the described first time is when exposing, the monolateral increasing 1.25mil of the broadside of the live width of described regular link.
3. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, be etched to acid etching the described first time, its etching factor is greater than 3.
4. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, be etched to acid etching the described second time, etching period is 4-5min.
5. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 4, it is characterized in that, the described second time, etched etching solution mixed at 84-86 ℃ of lower cupric sulfate pentahydrate and the concentrated sulfuric acid of 250g/l of adopting, and wherein the concentrated sulfuric acid accounts for 0.3% of total liquor capacity.
6. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, the described alkali etching that is etched to for the third time, pH value is 7.6-8.4, etch temperature is 47-53 ℃, describedly buries resistance layer down, and the etching downforce is 18-22PSI.
7. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, the described resistance layer of burying is dull and stereotyped interlayer resistance material.
8. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that described sheet material is copper-clad plate.
9. the method for raising buried resistor printed wiring board resistance value precision as claimed in claim 1 is characterized in that, also comprises the steps:
Step 7, carry out the stack of central layer and prepreg according to the required number of plies of buried resistor printed wiring board, then carry out lamination, boring;
Step 8, the surface thickening copper of sheet material behind copper and the lamination is sunk in described boring, then carry out outer dry film, then outer graphics is electroplated;
Step 9, this skin is electroplated figure carry out alkali etching, thereby form outer-layer circuit, finish the making of buried resistor printed wiring board master operation.
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| CN2012104455717A CN103068175A (en) | 2012-11-08 | 2012-11-08 | Method of improving buried resistance printed wire board resistance precision |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104902690A (en) * | 2015-05-26 | 2015-09-09 | 广州杰赛科技股份有限公司 | Circuit board manufacturing method |
| CN106507585A (en) * | 2016-11-23 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The method for improving buried resistor printed wiring board resistance value precision |
| CN107333393A (en) * | 2017-07-19 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of preparation method for burying baffle-wall material |
| CN107466157A (en) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | A kind of method buried baffle-wall and baffle-wall making printed wiring board is buried using this |
| CN108323008A (en) * | 2018-03-06 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of buried resistor Rigid Flex |
| CN110691466A (en) * | 2019-09-17 | 2020-01-14 | 深圳明阳电路科技股份有限公司 | HDI board manufacturing method and device |
| CN111050484A (en) * | 2020-01-06 | 2020-04-21 | 江门崇达电路技术有限公司 | Manufacturing method of ultra-precise circuit |
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
| CN112001139A (en) * | 2020-08-14 | 2020-11-27 | 浪潮电子信息产业股份有限公司 | PCB selection method, system and device |
| CN113556875A (en) * | 2021-06-30 | 2021-10-26 | 惠州市金百泽电路科技有限公司 | Method for improving size precision of buried resistor PCB (printed circuit board) sheet resistor |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104902690A (en) * | 2015-05-26 | 2015-09-09 | 广州杰赛科技股份有限公司 | Circuit board manufacturing method |
| CN106507585A (en) * | 2016-11-23 | 2017-03-15 | 深圳崇达多层线路板有限公司 | The method for improving buried resistor printed wiring board resistance value precision |
| CN106507585B (en) * | 2016-11-23 | 2019-10-22 | 深圳崇达多层线路板有限公司 | The method for improving buried resistor printed wiring board resistance value precision |
| CN107466157A (en) * | 2017-06-20 | 2017-12-12 | 深圳崇达多层线路板有限公司 | A kind of method buried baffle-wall and baffle-wall making printed wiring board is buried using this |
| CN107333393A (en) * | 2017-07-19 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of preparation method for burying baffle-wall material |
| CN108323008A (en) * | 2018-03-06 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of buried resistor Rigid Flex |
| CN108323008B (en) * | 2018-03-06 | 2020-10-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of embedded resistor rigid-flex board |
| CN110691466A (en) * | 2019-09-17 | 2020-01-14 | 深圳明阳电路科技股份有限公司 | HDI board manufacturing method and device |
| CN111050484A (en) * | 2020-01-06 | 2020-04-21 | 江门崇达电路技术有限公司 | Manufacturing method of ultra-precise circuit |
| CN111642075A (en) * | 2020-07-03 | 2020-09-08 | 广东兴达鸿业电子有限公司 | Manufacturing method of single-sided resistor circuit board and manufacturing method of multilayer PCB |
| CN112001139A (en) * | 2020-08-14 | 2020-11-27 | 浪潮电子信息产业股份有限公司 | PCB selection method, system and device |
| CN113556875A (en) * | 2021-06-30 | 2021-10-26 | 惠州市金百泽电路科技有限公司 | Method for improving size precision of buried resistor PCB (printed circuit board) sheet resistor |
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Application publication date: 20130424 |