CN111465208B - Method for realizing high-precision copper plating - Google Patents
Method for realizing high-precision copper plating Download PDFInfo
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- CN111465208B CN111465208B CN202010211750.9A CN202010211750A CN111465208B CN 111465208 B CN111465208 B CN 111465208B CN 202010211750 A CN202010211750 A CN 202010211750A CN 111465208 B CN111465208 B CN 111465208B
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- Prior art keywords
- copper plating
- dry film
- gold
- realizing high
- solder mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a method for realizing high-precision copper plating, which comprises the following steps: cutting, drilling, copper deposition, copper plating, solder mask printing, pattern transfer, dry film pasting, developing, copper plating, inspection, dry film removal, surface treatment, solder mask removal, alkaline etching, secondary solder mask removal and test forming. The invention can avoid inaccurate alignment of the circuit caused by the height of the convex copper by a printing and welding prevention process, and can also avoid poor exposure of the circuit caused by the height of the convex copper, thereby improving the yield by 60%. Meanwhile, the surface treatment and alkaline etching are directly carried out after the dry film is removed, so that the time and the production cost are saved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a method for realizing high-precision copper plating.
Background
In the prior art, for the production process of the copper plate, the thickness of the dry film is generally utilized to plate the copper plate with the required height, then the dry film is removed, an exposure circuit is made, acid etching is performed, and then the anti-welding and surface treatment is performed.
However, the process in the prior art is easy to cause the defect of difficult circuit manufacture after the convex copper plating, the height of the convex copper is generally about 70um, the dry film is not tightly adhered, poor exposure occurs, etching liquid is easy to enter between the convex copper during etching, the convex copper is easy to be corroded by the etching liquid to generate irregularity, the product yield is low, and customers are dissatisfied with the appearance.
Disclosure of Invention
In view of the above, the invention provides a method for realizing high-precision copper plating, which can avoid inaccurate alignment of a circuit caused by the height of the copper and meanwhile can avoid poor exposure of the circuit caused by the height of the copper by a printing and welding prevention process, and the yield is improved by 60%.
The technical scheme of the invention is as follows:
the method for realizing high-precision copper plating is characterized by comprising the following steps: cutting, drilling, copper deposition, copper plating, solder mask printing, pattern transfer, dry film pasting, exposure, development, copper plating, inspection, dry film removal, surface treatment, solder mask removal, alkaline etching, secondary solder mask removal and test forming.
Furthermore, a layer of solder resist ink is printed before the dry film pasting process, the ink is fully cured after development, and then the dry film is pasted, so that the ink is fully cured and cannot be damaged by film stripping liquid medicine.
Furthermore, in the dry film pasting process, the height of the dry film meets the height requirement of the copper.
Further, after the convex copper plating process, the dry film is directly removed after the convex copper plating process is checked to meet the requirements.
Further, the surface treatment is a gold plating treatment.
Further, after the fade-preventing welding process, further alkaline etching is performed, and the required pattern is reserved. In the invention, the surface treatment and alkaline etching are directly carried out after the dry film is removed, so that the time and the production cost are saved.
Furthermore, in the printing and welding prevention process, the printing ink is used for making a circuit pattern. The solder mask layer is to protect the copper to be etched from the gold layer.
Further, the printing and welding prevention process specifically comprises the following steps: (1) Pretreatment, namely cleaning foreign matter impurities on the circuit board and preventing pollution; (2) mounting the circuit board on a machine table of a screen printing machine; (3) Carrying out screen printing of solder resist ink on one surface of a circuit board; (4) A high-temperature baking plate for completely solidifying the solder mask ink printed on the circuit board; the temperature of the baking plate is controlled to be 125+/-5 ℃, and the baking time is controlled to be 40-48 minutes; and (5) performing alignment exposure and development.
According to the invention, the circuit alignment inaccuracy caused by the height of the convex copper can be avoided through the printing and welding prevention process, meanwhile, the problem of poor circuit exposure caused by the problem of the height of the convex copper can be avoided, and the yield is improved by 60%.
Further, the surface treatment process specifically comprises the following steps: manufacturing an electric Jin Ganmo protective layer on the circuit board through an outer layer pattern process, wherein the electric Jin Ganmo protective layer is windowed at the electric gold position to expose the electric gold position; then electroplating gold on the gold electroplating position to form a gold electroplating layer; then electroplating thick gold on the gold electroplating position to form a thick gold layer; the electrical Jin Ganmo protection layer on the multilayer board is then removed.
Further, the alkaline etching process specifically comprises the following steps: before the circuit board with the solder mask removed is etched by using alkaline etching liquid, the compensation etching step is performed, wherein the production board is subjected to spray etching by using alkaline etching sub-liquid, and the upper spraying pressure and the lower spraying pressure of the compensation etching are both 1.5-2.5kg/cm 2 。
The innovation point of the invention is that:
1. before the dry film is pasted, the solder mask is used as a positive circuit, and the cured solder mask layer cannot be attacked by developing and film stripping liquid medicine.
2. The surface treatment is followed by alkaline etching.
The invention can avoid inaccurate alignment of the circuit caused by the height of the convex copper by a printing and welding prevention process, and can also avoid poor exposure of the circuit caused by the height of the convex copper, thereby improving the yield by 60%. Meanwhile, the surface treatment and alkaline etching are directly carried out after the dry film is removed, so that the time and the production cost are saved.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
The method for realizing high-precision copper plating is characterized by comprising the following steps: cutting, drilling, copper deposition, copper plating, solder mask printing, pattern transfer, dry film pasting, exposure, development, copper plating, inspection, dry film removal, surface treatment, solder mask removal, alkaline etching, secondary solder mask removal and test forming.
Furthermore, a layer of solder resist ink is printed before the dry film pasting process, the ink is fully cured after development, and then the dry film is pasted, so that the ink is fully cured and cannot be damaged by film stripping liquid medicine.
Furthermore, in the dry film pasting process, the height of the dry film meets the height requirement of the copper.
Further, after the convex copper plating process, the dry film is directly removed after the convex copper plating process is checked to meet the requirements.
Further, the surface treatment is a gold plating treatment.
Further, after the fade-preventing welding process, further alkaline etching is performed, and the required pattern is reserved. In the invention, the surface treatment and alkaline etching are directly carried out after the dry film is removed, so that the time and the production cost are saved.
Furthermore, in the printing and welding prevention process, the printing ink is used for making a circuit pattern. The solder mask layer is to protect the copper to be etched from the gold layer.
Further, the printing and welding prevention process specifically comprises the following steps: (1) Pretreatment, namely cleaning foreign matter impurities on the circuit board and preventing pollution; (2) mounting the circuit board on a machine table of a screen printing machine; (3) Carrying out screen printing of solder resist ink on one surface of a circuit board; (4) A high-temperature baking plate for completely solidifying the solder mask ink printed on the circuit board; the temperature of the baking plate is controlled to be 125+/-5 ℃, and the baking time is controlled to be 40-48 minutes; and (5) performing alignment exposure and development.
According to the invention, the circuit alignment inaccuracy caused by the height of the convex copper can be avoided through the printing and welding prevention process, meanwhile, the problem of poor circuit exposure caused by the problem of the height of the convex copper can be avoided, and the yield is improved by 60%.
Further, the surface treatment process specifically comprises the following steps: manufacturing an electric Jin Ganmo protective layer on the circuit board through an outer layer pattern process, wherein the electric Jin Ganmo protective layer is windowed at the electric gold position to expose the electric gold position; then electroplating gold on the gold electroplating position to form a gold electroplating layer; then electroplating thick gold on the gold electroplating position to form a thick gold layer; the electrical Jin Ganmo protection layer on the multilayer board is then removed.
Further, the alkaline etching process specifically comprises the following steps: before the circuit board with the solder mask removed is etched by using alkaline etching liquid, the compensation etching step is performed, wherein the production board is subjected to spray etching by using alkaline etching sub-liquid, and the upper spraying pressure and the lower spraying pressure of the compensation etching are both 1.5-2.5kg/cm 2 Wherein the upward spraying pressure is 2.0-2.5kg/cm 2 The downward spraying pressure is 1.5-2.0kg/cm 2 。
Example 2
The method for realizing high-precision copper plating is characterized by comprising the following steps: cutting, drilling, copper deposition, copper plating, solder mask printing, pattern transfer, dry film pasting, exposure, development, copper plating, inspection, dry film removal, surface treatment, solder mask removal, alkaline etching, secondary solder mask removal and test forming.
Furthermore, a layer of solder resist ink is printed before the dry film pasting process, the ink is fully cured after development, and then the dry film is pasted, so that the ink is fully cured and cannot be damaged by film stripping liquid medicine.
Furthermore, in the dry film pasting process, the height of the dry film meets the height requirement of the copper.
Further, after the convex copper plating process, the dry film is directly removed after the convex copper plating process is checked to meet the requirements.
Further, the surface treatment is a gold plating treatment.
Further, after the fade-preventing welding process, further alkaline etching is performed, and the required pattern is reserved. In the invention, the surface treatment and alkaline etching are directly carried out after the dry film is removed, so that the time and the production cost are saved.
Furthermore, in the printing and welding prevention process, the printing ink is used for making a circuit pattern. The solder mask layer is to protect the copper to be etched from the gold layer.
Further, the printing and welding prevention process specifically comprises the following steps: (1) Pretreatment, namely cleaning foreign matter impurities on the circuit board and preventing pollution; (2) mounting the circuit board on a machine table of a screen printing machine; (3) Carrying out screen printing of solder resist ink on one surface of a circuit board; (4) A high-temperature baking plate for completely solidifying the solder mask ink printed on the circuit board; the temperature of the baking plate is controlled to be 125+/-5 ℃, and the time of the baking plate is controlled to be 45 minutes; and (5) performing alignment exposure and development.
According to the invention, the circuit alignment inaccuracy caused by the height of the convex copper can be avoided through the printing and welding prevention process, meanwhile, the problem of poor circuit exposure caused by the problem of the height of the convex copper can be avoided, and the yield is improved by 60%.
Further, the surface treatment process specifically comprises the following steps: manufacturing an electric Jin Ganmo protective layer on the circuit board through an outer layer pattern process, wherein the electric Jin Ganmo protective layer is windowed at the electric gold position to expose the electric gold position; then electroplating gold on the gold electroplating position to form a gold electroplating layer; then electroplating thick gold on the gold electroplating position to form a thick gold layer; the electrical Jin Ganmo protection layer on the multilayer board is then removed.
Further, the alkaline etching process specifically comprises the following steps: before the circuit board with the solder mask removed is etched by using alkaline etching liquid, the compensation etching step is performed, wherein the production board is subjected to spray etching by using alkaline etching sub-liquid, and the upper spraying pressure and the lower spraying pressure of the compensation etching are both 1.5-2.5kg/cm 2 Wherein the upward spraying pressure is 2.35kg/cm 2 The downward spraying pressure was 1.65kg/cm 2 。
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art. It should be noted that technical features not described in detail in the present invention may be implemented by any prior art in the field.
Claims (10)
1. The method for realizing high-precision copper plating is characterized by comprising the following steps: cutting, drilling, copper deposition, copper plating, solder mask printing, pattern transfer, dry film pasting, exposure, development, copper plating, inspection, dry film removal, surface treatment, solder mask removal, alkaline etching, secondary solder mask removal and test forming.
2. The method for realizing high-precision copper plating according to claim 1, wherein a layer of solder resist ink is printed before the dry film pasting process, the ink is cured fully after development, and then the dry film is pasted.
3. The method for realizing high-precision copper plating according to claim 2, wherein in the dry film pasting process, the height of the dry film meets the height requirement of the copper.
4. The method for realizing high-precision copper plating according to claim 3, wherein after the copper plating process, the dry film is removed directly after the copper plating process is checked to be satisfactory.
5. The method for realizing high-precision copper plating according to claim 1, wherein the surface treatment is a gold plating treatment.
6. The method for realizing high-precision copper plating according to claim 5, wherein the surface treatment process is specifically as follows: manufacturing an electric Jin Ganmo protective layer on the circuit board through an outer layer pattern process, wherein the electric Jin Ganmo protective layer is windowed at the electric gold position to expose the electric gold position; then electroplating gold on the gold electroplating position to form a gold electroplating layer; then electroplating thick gold on the gold electroplating position to form a thick gold layer; the electrical Jin Ganmo protection layer on the multilayer board is then removed.
7. The method for high precision copper plating according to claim 1, wherein after the solder mask removal process, further alkaline etching is performed to preserve the desired pattern.
8. The method for realizing high-precision copper plating according to claim 7, wherein the printing and welding prevention process uses printing ink to make a circuit pattern.
9. The method for realizing high-precision copper plating according to claim 8, wherein the printing and welding prevention process is specifically as follows:
(1) Pretreatment, namely cleaning foreign matter impurities on the circuit board and preventing pollution;
(2) Mounting the circuit board on a machine table of a screen printing machine;
(3) Carrying out screen printing of solder resist ink on one surface of a circuit board;
(4) A high-temperature baking plate for completely solidifying the solder mask ink printed on the circuit board; the temperature of the baking plate is controlled to be 125+/-5 ℃, and the baking time is controlled to be 40-48 minutes;
(5) And (5) aligning exposure and development.
10. The method for realizing high-precision copper plating according to claim 7, wherein the alkaline etching process is specifically as follows: before the circuit board with the solder mask removed is etched by using alkaline etching liquid, the compensation etching step is performed, wherein the production board is subjected to spray etching by using alkaline etching sub-liquid, and the upper spraying pressure and the lower spraying pressure of the compensation etching are both 1.5-2.5kg/cm 2 。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010211750.9A CN111465208B (en) | 2020-03-24 | 2020-03-24 | Method for realizing high-precision copper plating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010211750.9A CN111465208B (en) | 2020-03-24 | 2020-03-24 | Method for realizing high-precision copper plating |
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| CN111465208A CN111465208A (en) | 2020-07-28 |
| CN111465208B true CN111465208B (en) | 2023-05-16 |
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| CN202010211750.9A Active CN111465208B (en) | 2020-03-24 | 2020-03-24 | Method for realizing high-precision copper plating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113103776B (en) * | 2021-04-09 | 2022-05-27 | 福建省铭兴激光科技有限公司 | Roller manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140313A (en) * | 2002-08-22 | 2004-05-13 | Jsr Corp | Method for forming bump on electrode pad using bilayer multilayer film |
| US20060094225A1 (en) * | 2004-10-28 | 2006-05-04 | Cheng-Yuan Lin | Methods for forming solder bumps on circuit boards |
| KR20090101404A (en) * | 2008-04-18 | 2009-09-28 | 대덕전자 주식회사 | Method of manufacturing coreless printed circuit board |
| CN102523689B (en) * | 2011-12-26 | 2014-06-25 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| CN102946693B (en) * | 2012-12-11 | 2015-01-14 | 桂林电子科技大学 | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
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