CN110248489A - A method of promoting thick copper plate solder resistance producing efficiency - Google Patents
A method of promoting thick copper plate solder resistance producing efficiency Download PDFInfo
- Publication number
- CN110248489A CN110248489A CN201910610351.7A CN201910610351A CN110248489A CN 110248489 A CN110248489 A CN 110248489A CN 201910610351 A CN201910610351 A CN 201910610351A CN 110248489 A CN110248489 A CN 110248489A
- Authority
- CN
- China
- Prior art keywords
- thick copper
- ink
- printing ink
- producing efficiency
- promoting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The present invention provides a kind of method for promoting thick copper plate solder resistance producing efficiency, include the steps that successively executing: S1: interstitial site the line for the thick copper circuit board that etching is completed being filled using UV cured printing ink, make the difference in height Δ H between the liquid level of UV cured printing ink and the copper surface of route, wherein, │≤50 μm │ Δ H；S2: under ultraviolet light by thick copper circuit board exposure, solidify the UV cured printing ink；S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface.By using gap between the line of UV cured printing ink fill line plate, the drop between copper face and substrate is reduced, makes only to need to carry out one-step print when thick copper sheet route is anti-welding that anti-welding production can be completed.The filling of UV cured printing ink only needs time-consuming about 20min, and the anti-welding production of thick copper circuit board can be completed in 5h.Relative to traditional time-consuming at least method of 8h, the method for the present invention greatlys improve the anti-welding producing efficiency of thick copper circuit board and the oil film thickness quality at route turning meets quality criteria requirements.
Description
Technical field
The present invention relates to metal-base printed wiring board manufacture technology fields, refer in particular to a kind of thick copper plate solder resistance production of promotion
The method of efficiency.
Background technique
With the development of electronics industry, client the thermal diffusivity of PCB product is pursued it is higher and higher, Metal Substrate thickness copper sheet due to
It is applied on high-power illumination and power source products with efficient heat dissipation performance by more and more.General thickness copper sheet (3OZ)
Anti-welding production needs to print twice or three times, just can ensure that the ink at route turning since the drop of copper face and substrate is too big
Thickness meets quality requirements.In traditional handicraft, anti-solder ink time-consuming at least 4h of printing is completed, if according to anti-welding quality requirements
Ink twice or thrice is printed, then entire anti-welding production at least time-consuming 8h or 12h, i.e. production efficiency is lower.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of method for promoting thick copper plate solder resistance producing efficiency.
In order to solve the above-mentioned technical problem, a kind of the technical solution adopted by the present invention are as follows: thick copper plate solder resistance production effect of promotion
The method of rate includes the steps that successively executing:
S1: interstitial site the line for the thick copper circuit board that etching is completed is filled using UV cured printing ink, makes UV
Difference in height between the liquid level of cured printing ink and the copper surface of route is Δ H, wherein │≤50 μm │ Δ H；
S2: under ultraviolet light by thick copper circuit board exposure, solidify the UV cured printing ink；
S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface.
Further, it before the step S1, further comprises the steps of: and the thick copper circuit board that etching is completed is carried out at sandblasting
Reason.
Further, between the step S2 and step S3, the UV cured printing ink removed on copper face is further comprised the steps of:.
Further, the UV cured printing ink on copper face is brushed using ceramic grinding.
Further, in the step S1, by using the ink-jet of spray printing data in gap between the line for having imported wiring board
Machine carries out the filling of UV cured printing ink to interstitial site whole lines of wiring board, and the flatness of UV cured printing ink is 0- after filling
10μm。
Further, in the step S2, the UV cured printing ink is solidified under the conditions of 465nm or 485nm,
Curing time is 20-40s, energy 1000-1500wj/cm2。
Further, in the step S3, the anti-solder ink printing treatment include successively carry out anti-solder ink printing,
First time baking sheet, exposure, development and second of baking sheet；White wire mark brush is used when anti-solder ink prints.
Further, in the step S3, first time baking sheet, the first time baking sheet time are carried out at 70-80 DEG C
For 30-40min.
Further, in the step S3, second of baking sheet is carried out at 145-155 DEG C, when second of baking sheet
Between be 50-70min.
Further, in the step S3, it is exposed under film exposure machine, exposure energy 700-900wj/cm2,
Developed under the conditions of 28-32 DEG C of temperature using the sodium carbonate liquid medicine that concentration is 0.5-1.5%.
The beneficial effects of the present invention are: by using gap between the line of UV cured printing ink fill line plate, reduce copper
Drop between face and substrate, so that thick copper sheet route, which only needs to carry out one-step print when anti-welding, can complete anti-welding production, no
It needs to carry out the second printing again.The filling of UV cured printing ink only needs time-consuming about 20min, therefore uses the method for the present invention can be in 5h
Complete the anti-welding production of thick copper circuit board.Relative to traditional method at least printed twice, i.e., the time-consuming at least method of 8h, this
Inventive method greatly improves the anti-welding producing efficiency of thick copper circuit board and the oil film thickness quality at route turning meets quality
Standard requirements.
Detailed description of the invention
Specific structure of the invention is described in detail with reference to the accompanying drawing
Fig. 1 is that a kind of method of promotion thickness copper plate solder resistance producing efficiency through the invention completes the thick copper wire of anti-welding production
Road plate diagrammatic cross-section；
1- substrate, 2- route, 3-UV cured printing ink, 4- anti-solder ink.
Specific embodiment
Present inventive concept is: by filling UV cured printing ink in trace clearance, reducing the height between copper face and substrate
Difference, realize one-step print it is complete anti-welding production.
For the present invention will be described in detail design feasibility, in conjunction with technology contents of the invention, construction feature, realized purpose
And effect, embodiment and attached drawing is cooperated to be explained in detail.
Embodiment 1
A method of thick copper plate solder resistance producing efficiency is promoted, includes the steps that successively executing:
S0: blasting treatment is carried out to the thick copper circuit board that etching is completed；
S1: by using the ink jet printer of spray printing data in gap between the line for having imported wiring board, using UV cured printing ink to thickness
Interstitial site is filled between the line of copper circuit board, is made 5 μm of flatness of UV cured printing ink after filling, is made UV cured printing ink
Difference in height between liquid level and the copper surface of route is 25 μm；
S2: being 1250wj/cm by the energy that thick copper circuit board is exposed to 465nm2Ultraviolet light under solidify 30s；Use pottery
Porcelain mill brushes the UV cured printing ink on copper face；
S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface, the anti-solder ink printing treatment includes: first to adopt
Brush anti-solder ink is stenciled with white wire mark；Then first time baking sheet is carried out at 75 DEG C, the first time baking sheet time is 35min；
Then it is exposed under film exposure machine, exposure energy 800wj/cm2；Then it is using concentration under the conditions of 30 DEG C of temperature
1.0% sodium carbonate liquid medicine develops；Second of baking sheet is finally carried out at 150 DEG C, second of baking sheet time is
60min。
In step S0, so that thick copper surface is removed metal oxide layer by blasting treatment and obtain certain cleannes and coarse
Degree, improves its mechanical performance, and improve its fatigue resistance, increases the adhesive force between copper face and ink, also have
Conducive to the printing uniformity of anti-solder ink.In step sl, the filling accuracy of UV cured printing ink is improved using ink jet printer and fill out
Fill speed.In step s 2, due to using UV cured printing ink, being acted in 1min by ultraviolet irradiation is to be able to achieve to be fully cured,
It is fast and convenient and have the function that support anti-solder ink.Brush the UV cured printing ink on the copper face of route with ceramic grinding, increases
Adhesive force between anti-solder ink and copper face promotes anti-welding production quality.In step s3, due to being filled by UV cured printing ink
Gap between the line of thick copper sheet route, it is only necessary to which anti-welding production can be completed by printing an anti-solder ink.Due to not needing secondary print
Brush prints three times, greatly reduces the total duration of anti-welding production, that is, improves anti-welding producing efficiency.
Embodiment 2
A method of thick copper plate solder resistance producing efficiency is promoted, includes the steps that successively executing:
S0: blasting treatment is carried out to the thick copper circuit board that etching is completed；
S1: by using the ink jet printer of spray printing data in gap between the line for having imported wiring board, using UV cured printing ink to thickness
Interstitial site is filled between the line of copper circuit board, is made 0 μm of flatness of UV cured printing ink after filling, is made UV cured printing ink
Difference in height between liquid level and the copper surface of route is 0 μm；
S2: being 1000wj/cm by the energy that thick copper circuit board is exposed to 485nm2Ultraviolet light under solidify 20s；Use pottery
Porcelain mill brushes the UV cured printing ink on copper face；
S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface, the anti-solder ink printing treatment includes: first to adopt
Brush anti-solder ink is stenciled with white wire mark；Then first time baking sheet is carried out at 70 DEG C, the first time baking sheet time is 30min；
Then it is exposed under film exposure machine, exposure energy 700wj/cm2；Then it is using concentration under the conditions of 28 DEG C of temperature
0.5% sodium carbonate liquid medicine develops；Second of baking sheet is finally carried out at 145 DEG C, second of baking sheet time is
50min。
Embodiment 3
A method of thick copper plate solder resistance producing efficiency is promoted, includes the steps that successively executing:
S0: blasting treatment is carried out to the thick copper circuit board that etching is completed；
S1: by using the ink jet printer of spray printing data in gap between the line for having imported wiring board, using UV cured printing ink to thickness
Interstitial site is filled between the line of copper circuit board, is made 10 μm of flatness of UV cured printing ink after filling, is made UV cured printing ink
Liquid level and route copper surface between difference in height be 50 μm；
S2: being 1500wj/cm by the energy that thick copper circuit board is exposed to 465nm2Ultraviolet light under solidify 40s；Use pottery
Porcelain mill brushes the UV cured printing ink on copper face；
S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface, the anti-solder ink printing treatment includes: first to adopt
Brush anti-solder ink is stenciled with white wire mark；Then first time baking sheet is carried out at 80 DEG C, the first time baking sheet time is 40min；
Then it is exposed under film exposure machine, exposure energy 900wj/cm2；Then it is using concentration under the conditions of 32 DEG C of temperature
1.5% sodium carbonate liquid medicine develops；Second of baking sheet is finally carried out at 155 DEG C, second of baking sheet time is
70min。
The prepared thick copper circuit board partial cutaway schematic of above-described embodiment 1-3 according to the method for the present invention, please join
Fig. 1 is read, the thick copper circuit board that etching is completed includes substrate 1 and route 2, and method according to the embodiment first uses UV cured printing ink 3
Gap between filling line, solder-mask printing ink 4 obtains thick copper circuit board structure as shown in the figure after UV cured printing ink 3 solidifies.
In conclusion a kind of method for promoting thick copper plate solder resistance producing efficiency provided by the invention, is solidified by using UV
Gap between the line of ink fill line plate, reduces the drop between copper face and substrate, so that thick copper sheet route only needs when anti-welding
Anti-welding production can be completed by carrying out primary " anti-solder ink printing-first time baking sheet-- second baking sheet of exposure-development ", no longer
It needs to carry out the second printing.The filling of UV cured printing ink only needs time-consuming about 20min, therefore uses the method for the present invention can be complete in 5h
At the anti-welding production of thick copper circuit board.Relative to traditional method at least printed twice, i.e., the time-consuming at least method of 8h, this hair
Bright method greatly improves the anti-welding producing efficiency of thick copper circuit board and the oil film thickness quality at route turning meets quality mark
Alignment request.
Herein first, second ... only represents the differentiation of its title, not representing their significance level and position has what
It is different.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of method for promoting thick copper plate solder resistance producing efficiency, which is characterized in that include the steps that successively executing:
S1: interstitial site the line for the thick copper circuit board that etching is completed is filled using UV cured printing ink, solidifies UV
Difference in height between the liquid level of ink and the copper surface of route is Δ H, wherein │≤50 μm │ Δ H；
S2: under ultraviolet light by thick copper circuit board exposure, solidify the UV cured printing ink；
S3: anti-solder ink printing treatment is carried out in thick copper circuit plate surface.
2. promoting the method for thick copper plate solder resistance producing efficiency as described in claim 1, which is characterized in that before the step S1,
It further comprises the steps of: and blasting treatment is carried out to the thick copper circuit board that etching is completed.
3. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 2, which is characterized in that in the step S2 and step
Between rapid S3, the UV cured printing ink removed on copper face is further comprised the steps of:.
4. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 3, which is characterized in that brushed using ceramic grinding
UV cured printing ink on copper face.
5. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 4, which is characterized in that in the step S1,
By using spray printing data in gap between the line for having imported wiring board ink jet printer between interstitial site whole lines of wiring board into
The filling of row UV cured printing ink, the flatness of UV cured printing ink is 0-10 μm after filling.
6. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 5, which is characterized in that in the step S2,
The UV cured printing ink is solidified under the conditions of 465nm or 485nm, curing time 20-40s, energy 1000-
1500wj/cm2。
7. promoting the method for thick copper plate solder resistance producing efficiency as described in claim 1 to 6 is any, which is characterized in that in the step
In rapid S3, the anti-solder ink printing treatment includes successively carrying out anti-solder ink printing, first time baking sheet, exposure, development and the
Secondary baking sheet；White wire mark brush is used when anti-solder ink prints.
8. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 7, which is characterized in that in the step S3,
First time baking sheet is carried out at 70-80 DEG C, the first time baking sheet time is 30-40min.
9. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 8, which is characterized in that in the step S3,
Second of baking sheet is carried out at 145-155 DEG C, second of baking sheet time is 50-70min.
10. promoting the method for thick copper plate solder resistance producing efficiency as claimed in claim 9, which is characterized in that in the step S3,
It is exposed under film exposure machine, exposure energy 700-900wj/cm2, it is 0.5- that concentration is used under the conditions of 28-32 DEG C of temperature
1.5% sodium carbonate liquid medicine develops.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910610351.7A CN110248489A (en) | 2019-07-08 | 2019-07-08 | A method of promoting thick copper plate solder resistance producing efficiency |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910610351.7A CN110248489A (en) | 2019-07-08 | 2019-07-08 | A method of promoting thick copper plate solder resistance producing efficiency |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050487A (en) * | 2019-12-23 | 2020-04-21 | 上海美维电子有限公司 | Solder mask layer manufacturing method, printed circuit board manufacturing method and printed circuit board |
| CN112074077A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inlayer resin filling structure and circuit board thereof |
| CN112074104A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inner layer resin filling process |
| CN112087884A (en) * | 2020-08-17 | 2020-12-15 | 鹤山市中富兴业电路有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
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| CN109413878A (en) * | 2018-09-13 | 2019-03-01 | 镇江华印电路板有限公司 | A kind of production technology of two ounces of copper thickness UV welding resistance silk-screen circuit board |
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| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050487A (en) * | 2019-12-23 | 2020-04-21 | 上海美维电子有限公司 | Solder mask layer manufacturing method, printed circuit board manufacturing method and printed circuit board |
| CN112087884A (en) * | 2020-08-17 | 2020-12-15 | 鹤山市中富兴业电路有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN112074077A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inlayer resin filling structure and circuit board thereof |
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| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
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Application publication date: 20190917 |
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