CN110913572B - LED lamp panel PAD ON PAD design structure and method - Google Patents

LED lamp panel PAD ON PAD design structure and method Download PDF

Info

Publication number
CN110913572B
CN110913572B CN201911228081.XA CN201911228081A CN110913572B CN 110913572 B CN110913572 B CN 110913572B CN 201911228081 A CN201911228081 A CN 201911228081A CN 110913572 B CN110913572 B CN 110913572B
Authority
CN
China
Prior art keywords
pad
ink layer
led lamp
size
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201911228081.XA
Other languages
Chinese (zh)
Other versions
CN110913572A (en
Inventor
洪少鸿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Ruomei Electronic Technology Co ltd
Original Assignee
Dongguan Ruomei Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Ruomei Electronic Technology Co ltd filed Critical Dongguan Ruomei Electronic Technology Co ltd
Priority to CN201911228081.XA priority Critical patent/CN110913572B/en
Publication of CN110913572A publication Critical patent/CN110913572A/en
Application granted granted Critical
Publication of CN110913572B publication Critical patent/CN110913572B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses an LED lamp panel PAD ON PAD design structure and a method, which comprises a substrate, a PAD and an anti-welding ink layer, wherein the PAD is arranged ON the surface of the substrate and fixed, the size of the PAD is designed to be a larger than the single side of a client manuscript, the anti-welding ink layer is arranged ON the surface of the substrate, the anti-welding ink layer covers the peripheral edge of the PAD, a window for the PAD to be exposed is formed ON the anti-welding ink layer, the size of the window is designed to be b larger than the client manuscript, and b is smaller than the single side a. According to the invention, the anti-welding windowing of the LED lamp panel is designed into an ON PAD mode, the size of the bonding PAD is increased, the windowing size of the bonding PAD is manufactured according to the requirements of customers, the redundant areas around the bonding PAD are covered by the anti-welding ink layer, so that the appearance rule of the finished bonding PAD is ensured to be consistent, the size completely meets the requirements of customers, the printing ink ON PAD has a certain preset size, the problem of anti-welding contraposition deviation is ensured, and the requirements of the rule and the ink color consistency of the bonding PAD of the LED lamp panel are met.

Description

LED lamp panel PAD ON PAD design structure and method
Technical Field
The invention relates to the technology of the field of manufacturing of LED lamp panels, in particular to a structure and a method for designing an ON PAD of a bonding PAD of an LED lamp panel.
Background
At present, the LED lamp panel welding pads are designed into a regular matrix, and the sizes of the welding pads are uniform. In order to ensure consistent color of the LED full-color display screen, a customer requires the welding disc to be regular and cannot have ink color difference before assembling. In actual production, however, the bonding pads are deformed to a certain extent due to side etching during PCB etching; meanwhile, the solder mask window is slightly larger than the bonding pad, and the overall appearance is directly influenced. In addition, the solder mask is used to prevent the alignment deviation, thereby affecting the ink color difference of the whole lamp surface.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main object of the present invention is to provide a PAD ON PAD design structure and method for an LED lamp panel, which can effectively solve the problem of ink color difference of the entire lamp surface of the existing LED lamp panel.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a LED lamp plate PAD ON PAD design structure, including the base plate, the PAD and prevent welding ink layer, this PAD setting is fixed ON the surface of base plate, the PAD size design becomes to be greater than the unilateral a of customer's original manuscript, should prevent welding ink layer and set up ON the surface of base plate, prevent welding ink layer cover the all around edge of PAD, and prevent forming ON the welding ink layer and supply the PAD to expose in the window that opens, the size design of opening the window becomes greater than the unilateral b of customer's original manuscript, b is less than an.
Preferably, a is 3mil, b is 1mil, and the portion of the solder mask ink layer covering the edge of the pad has a width of 2 mil.
A method for designing an ON PAD of a PAD of an LED lamp panel comprises the following steps:
(1) outer layer circuit treatment: sequentially carrying out film pasting, exposure and development treatment ON an outer layer circuit ON a substrate, specifically, transferring a required image onto a dry film resist in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the size of a film lamp surface PAD to be a larger than that of a single side of a client manuscript;
(2) acid washing and etching: sequentially etching and removing the film of the plate obtained in the step (1), specifically, dissolving and etching the unnecessary part by using an acidic etching solution to leave a required image;
(3) solder mask treatment: and (3) sequentially carrying out silk-screen printing, pre-baking, exposure and development ON the plate obtained in the step (2), specifically, transferring a required image to a solder mask ink layer in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the windowing size of a film lamp surface PAD to be b larger than the single side of a client manuscript, wherein b is smaller than a.
Preferably, a is 3mil, b is 1mil, and the portion of the solder mask ink layer covering the edge of the pad has a width of 2 mil.
Preferably, the exposure energy in step (1) is 7-9 levels, and the dimensional tolerance of the bonding pad is +/-10%.
As a preferable scheme, the etching speed in the step (2) is 4-5m/min, and the etching pressure is 2.0-2.5kg/m2The pad dimensional tolerance is ± 10%.
Preferably, the thickness of the solder mask ink layer in the step (3) is 25-30 μm, the exposure energy is 7-9 grades, and the dimensional tolerance of the bonding pad is +/-10%.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
according to the invention, the anti-welding windowing of the LED lamp panel is designed into an ON PAD (PAD ON ink) mode, the size of the PAD is increased, the windowing size of the PAD is manufactured according to the requirements of customers, the redundant areas around the PAD are covered by the anti-welding ink layer, so that the appearance rule and the size of the finished PAD are ensured to be consistent, the requirements of customers are completely met, the ink ON PAD has a certain preset size, the problem of anti-welding contraposition deviation is ensured, and the requirements of the rule and the ink color consistency of the PAD of the LED lamp panel are met.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a front view of a preferred embodiment of the present invention;
FIG. 2 is a partial cross-sectional view of a preferred embodiment of the present invention;
FIG. 3 is a flow chart illustrating a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. substrate 20 and bonding pad
30. A solder resist ink layer 31, and a window.
Detailed Description
Referring to fig. 1 and 2, a specific structure of a PAD ON PAD design structure of an LED lamp panel according to a preferred embodiment of the invention is shown, which includes a substrate 10, a PAD 20, and a solder mask ink layer 30.
The bonding pad 20 is fixed on the surface of the substrate 10, the size of the bonding pad 20 is designed to be a larger than one side of a customer manuscript, the anti-welding ink layer 30 is arranged on the surface of the substrate 10, the anti-welding ink layer 30 covers the peripheral edge of the bonding pad 20, a window 31 for the bonding pad 20 to expose is formed on the anti-welding ink layer 30, the size of the window 31 is designed to be b larger than one side of the customer manuscript, and b is smaller than a. In this embodiment, a is 3mil, b is 1mil, and the portion of the solder resist ink layer 30 covering the edge of the pad 20 has a width of 2 mil.
The invention also discloses a method for designing the LED lamp panel PAD ON PAD, which comprises the following steps:
(1) outer layer circuit treatment: the method comprises the steps of sequentially carrying out film pasting, exposure and development treatment ON an outer layer circuit ON a substrate 10, specifically, transferring a required image to a dry film resist in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the size of a film lamp surface PAD to be a larger than that of a single side of a client manuscript. The exposure energy in this step is of the order of 7-9 with a pad dimensional tolerance of + -10%.
(2) Acid washing and etching: and (2) sequentially carrying out etching and film stripping treatment on the plate obtained in the step (1), specifically, dissolving and etching away the unnecessary part by using an acidic etching solution to leave a required image. In this step, the etching rate is 4-5m/min, and the etching pressure is 2.0-2.5kg/m2The pad dimensional tolerance is ± 10%.
(3) Solder mask treatment: and (3) sequentially carrying out silk-screen printing, pre-baking, exposure and development ON the plate obtained in the step (2), specifically, transferring a required image to the solder resist ink layer 30 in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the windowing size of a film lamp surface PAD to be b larger than the single side of a client manuscript, wherein b is smaller than a. Where a is 3 mils, b is 1mil, and the portion of the solder mask ink layer 30 covering the edge of the pad has a width of 2 mils. In the step, the thickness of the solder mask ink layer is 25-30 μm, the exposure energy is 7-9 grades, and the dimensional tolerance of the bonding pad is +/-10%.
The design of the invention is characterized in that: according to the invention, the anti-welding windowing of the LED lamp panel is designed into an ON PAD mode, the size of the bonding PAD is increased, the windowing size of the bonding PAD is manufactured according to the requirements of customers, the redundant areas around the bonding PAD are covered by the anti-welding ink layer, so that the appearance rule of the finished bonding PAD is ensured to be consistent, the size completely meets the requirements of customers, the printing ink ON PAD has a certain preset size, the problem of anti-welding contraposition deviation is ensured, and the requirements of the rule and the ink color consistency of the bonding PAD of the LED lamp panel are met.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (5)

1. The utility model provides a LED lamp plate PAD ON PAD project organization, its characterized in that: including base plate, pad and anti-welding ink layer, this pad setting is fixed on the surface of base plate, and the pad size designs into the unilateral a that is big than the customer's original manuscript, and this anti-welding ink layer sets up on the surface of base plate, and the edge all around of anti-welding ink layer cover pad, and forms the windowing that supplies the pad to expose in on the anti-welding ink layer, and the size design of windowing becomes the unilateral b that is big than the customer's original manuscript, and b is less than an, a is 3 mils, and b is 1mil, and the part that the anti-welding ink layer covered the pad edge is 2 mil's width.
2. The method for designing the ON PAD of the LED lamp panel according to claim 1, wherein the method comprises the following steps: the method comprises the following steps:
(1) outer layer circuit treatment: sequentially carrying out film pasting, exposure and development treatment ON an outer layer circuit ON a substrate, specifically, transferring a required image onto a dry film resist in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the size of a film lamp surface PAD to be a larger than that of a single side of a client manuscript;
(2) acid washing and etching: sequentially etching and removing the film of the plate obtained in the step (1), specifically, dissolving and etching the unnecessary part by using an acidic etching solution to leave a required image;
(3) solder mask treatment: and (3) sequentially carrying out silk-screen printing, pre-baking, exposure and development ON the plate obtained in the step (2), specifically, transferring a required image to a solder mask ink layer in an exposure mode, carrying out ON PAD design ON an exposure film, and designing the windowing size of a film lamp surface PAD to be b larger than the single side of a client manuscript, wherein b is smaller than a.
3. The method for designing the ON PAD of the LED lamp panel according to claim 2, wherein: the exposure energy in the step (1) is 7-9 levels, and the dimensional tolerance of the bonding pad is +/-10%.
4. The method for designing LED lamp panel PAD ON PAD according to claim 2, wherein the method comprisesIs characterized in that: in the step (2), the etching speed is 4-5m/min, and the etching pressure is 2.0-2.5kg/m2The pad dimensional tolerance is ± 10%.
5. The method for designing the ON PAD of the LED lamp panel according to claim 2, wherein: in the step (3), the thickness of the solder mask ink layer is 25-30 μm, the exposure energy is 7-9 levels, and the dimensional tolerance of the bonding pad is +/-10%.
CN201911228081.XA 2019-12-04 2019-12-04 LED lamp panel PAD ON PAD design structure and method Active CN110913572B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911228081.XA CN110913572B (en) 2019-12-04 2019-12-04 LED lamp panel PAD ON PAD design structure and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911228081.XA CN110913572B (en) 2019-12-04 2019-12-04 LED lamp panel PAD ON PAD design structure and method

Publications (2)

Publication Number Publication Date
CN110913572A CN110913572A (en) 2020-03-24
CN110913572B true CN110913572B (en) 2022-02-18

Family

ID=69821942

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911228081.XA Active CN110913572B (en) 2019-12-04 2019-12-04 LED lamp panel PAD ON PAD design structure and method

Country Status (1)

Country Link
CN (1) CN110913572B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202262063U (en) * 2011-09-22 2012-05-30 捷开通讯科技(上海)有限公司 Circuit board structure and mobile terminal
CN102612274A (en) * 2011-01-21 2012-07-25 日本特殊陶业株式会社 Wiring board and method for manufacturing the same
CN202364474U (en) * 2011-11-24 2012-08-01 惠州Tcl移动通信有限公司 PCB structure for handset
CN103178043A (en) * 2011-12-20 2013-06-26 日本特殊陶业株式会社 Wiring board and method of manufacturing the same
CN205946344U (en) * 2016-08-23 2017-02-08 合肥鑫晟光电科技有限公司 Test point structure and PCB board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100546695B1 (en) * 2000-08-24 2006-01-26 앰코 테크놀로지 코리아 주식회사 structure of flexible circuit film for fabricating semiconductor package
CN106658978B (en) * 2016-10-28 2019-03-29 奥士康精密电路（惠州）有限公司 A kind of process improving pad size consistency
CN109413881B (en) * 2018-11-22 2021-10-22 奥士康科技股份有限公司 Manufacturing method of carbon oil circuit board and solder-mask windowing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102612274A (en) * 2011-01-21 2012-07-25 日本特殊陶业株式会社 Wiring board and method for manufacturing the same
CN202262063U (en) * 2011-09-22 2012-05-30 捷开通讯科技(上海)有限公司 Circuit board structure and mobile terminal
CN202364474U (en) * 2011-11-24 2012-08-01 惠州Tcl移动通信有限公司 PCB structure for handset
CN103178043A (en) * 2011-12-20 2013-06-26 日本特殊陶业株式会社 Wiring board and method of manufacturing the same
CN205946344U (en) * 2016-08-23 2017-02-08 合肥鑫晟光电科技有限公司 Test point structure and PCB board

Also Published As

Publication number Publication date
CN110913572A (en) 2020-03-24

Similar Documents

Publication Publication Date Title
WO2016074528A1 (en) Uv film sensor and preparation method therefor, and touch control screen
WO2017148053A1 (en) Anti-shatter film and manufacturing method, touch panel and display device thereof
CN109496082A (en) A kind of super thick copper sheet anti-welding printing method
CN113286431A (en) Manufacturing process of Mini LED PCB module
CN110913572B (en) LED lamp panel PAD ON PAD design structure and method
CN116017869A (en) Mini LED PCB micro-pad solder resist manufacturing method
CN109688700A (en) A kind of welding resistance windowing design of PCB pad
CN201936119U (en) Novel solder-proof green oil film for printed circuit board
CN105172400A (en) Method for silk-screen printing of different film thicknesses
CN204425776U (en) A kind of high-flatness Back Word type ink is windowed Rigid Flex
US20060265870A1 (en) Printed circuit board and printed circuit board manufacturing method
CN102480844A (en) Process for manufacturing diffusion coating prevention PCB (printed circuit board) gold-plated board
CN114364150A (en) Processing technology of solder resist ink for thick copper surface
CN114980518A (en) Production process of flexible circuit board
CN114630488A (en) PCB conductor area mimeograph structure, PCB and preparation method
CN113829738A (en) Long service life's screen version for screen printing process
CN219834511U (en) PCB solder resist exposure prevents exposure indentation structure
CN112770526A (en) Preparation method for matching and reinforcing of electromagnetic film and printing ink on FPC
CN202231956U (en) Structure for improving appearance of soldering pad to limit solder paste diffusion
CN217404695U (en) Full-pasting electronic paper
CN205827856U (en) A kind of novel electrostatic adsorption plate
CN104349598A (en) Stepped circuit board manufacturing method and stepped circuit board
TWI625607B (en) Substrate having film type pattern and the manufacturing method for making the same
WO2023070369A1 (en) Micro light-emitting diode display and manufacturing method therefor
CN108495476A (en) A kind of electroplating technology for reducing noble metal dosage in wiring board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant