CN111698839A - Solder resist printing method for selective surface treatment of thick copper plate - Google Patents
Solder resist printing method for selective surface treatment of thick copper plate Download PDFInfo
- Publication number
- CN111698839A CN111698839A CN202010604051.0A CN202010604051A CN111698839A CN 111698839 A CN111698839 A CN 111698839A CN 202010604051 A CN202010604051 A CN 202010604051A CN 111698839 A CN111698839 A CN 111698839A
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- Prior art keywords
- surface treatment
- copper plate
- printing
- thick copper
- gold
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a solder mask printing method for selectively processing the surface of a thick copper plate, which comprises the steps of producing a solder mask through immersion type coating printing, then exposing and developing to produce a bonding pad, carrying out secondary solder mask in order to ensure the smoothness of the solder mask, carrying out primary surface processing after the secondary solder mask, carrying out outer layer dry film before the primary surface processing, carrying out film stripping after the primary surface processing, and then carrying out secondary surface processing. The method improves the problem of false copper exposure of the contact surface of the copper foil and the base material or the problem of surface pad formation of the corresponding copper exposure position in the surface treatment process, causes short circuit risk in the production process, simultaneously improves the problems of solder resist ink waste and low production timeliness of multiple whole-plate printing of solder resist ink of a thick copper plate, increases the usage amount of the solder resist ink and reduces the production efficiency, solves the problem that the thick copper plate cannot be subjected to selective surface treatment, enhances the combination diversity of surface treatment of the thick copper plate, and improves the efficiency and the quality.
Description
Technical Field
The invention relates to PCB production manufacturing process flow design, in particular to a solder mask printing method for thick copper plate selective surface treatment.
Background
Currently, most circuit boards include a substrate, an etched circuit layer (formed by etching a copper plate) covering the substrate, and a solder resist ink covering the circuit layer. In the manufacture of a PCB with a thick copper plate (the thickness is more than or equal to 3 OZ), if solder resist ink is printed normally, the ink at the circuit position (the covering position of copper wires and copper surfaces) of the circuit layer is thin and red, the base material position is thick, the development side corrosion is too large, the ink at the edge of the circuit is wrinkled and does not fall in place, gold or tin is plated in the surface treatment engineering, further, short circuit or false copper exposure is caused, and the printing difficulty is very high. And if the method of increasing the silk-screen pressure and slowing down the printing speed is adopted for printing, the solder resist ink is extremely easy to enter hole positions on the PCB, the technical requirements of operators by the printing process are correspondingly improved, the implementation is difficult, meanwhile, for thick copper plates, due to the side corrosion, in order to prevent the contact part of the side edge and the base material from being red, the ink needs to be printed for many times, the solder resist ink is filled in the circuit etching part, the consumption of the solder resist ink is huge, and the problem of solder resist ink entering holes cannot be solved. If solder mask oil is printed for many times, the problems of false copper exposure and the like can be solved, but because the thickness of the solder mask is far larger than the height of the bonding pad, dry film coverage cannot be realized, and the treatment of a selective surface process cannot be carried out, so that the prior art has defects and needs to be improved.
Disclosure of Invention
The invention provides a solder mask printing method for selective surface treatment of a thick copper plate, which avoids the trouble of printing for multiple times in the production process, solves the problems of side leakage and selective surface treatment, greatly saves solder mask ink, reduces the cost, improves the production efficiency and solves the problems.
In order to solve the above problems, the technical scheme provided by the invention is as follows: a solder resist printing method for selectively treating the surface of a thick copper plate comprises the following steps:
1) plugging holes, namely filling ink into the conductive holes needing plugging holes according to the manufacturing requirements of the board;
2) coating and printing;
3) secondary solder resist printing
4) Primary surface treatment;
5) and (5) secondary surface treatment.
According to the preferable technical scheme, the coating printing is soaking coating printing, the thick copper plate is vertically placed in a soaking pool at a certain inclination angle during soaking coating, the thick copper plate is placed at a certain inclination angle vertical to the horizontal plane, one side of the rectangular thick copper plate is placed at an angle of 30-90 degrees to the horizontal plane, and the thick copper plate is lifted at a speed of 2-5M/S during soaking coating; and carrying out first surface treatment after the coating and printing.
According to the preferable technical scheme, before the first surface treatment, the bonding pad further comprises an outer layer dry film, and the outer layer dry film is exposed and developed to leak out the bonding pad.
In a preferred technical scheme, after the first surface treatment, the method further comprises film stripping.
According to the preferable technical scheme, the selective surface treatment comprises selective gold deposition/chemical nickel palladium gold + OSP, gold deposition/chemical nickel palladium gold + carbon oil, gold deposition/chemical nickel palladium gold + gold fingers (with leads), gold deposition/chemical nickel palladium gold + long and short gold fingers (with leads), and gold deposition/chemical nickel palladium gold + blue printing glue.
According to the preferable technical scheme, in order to ensure the consistency of the thickness of the thick copper plate in resistance welding, the soaking and coating are carried out twice, and the soaking and coating are carried out once in the forward direction and once in the reverse direction.
Compared with the prior art, the method has the advantages that by adopting the scheme, the problems of false copper exposure of the contact surface of the copper foil and the base material or surface treatment of the corresponding position in the surface treatment process are solved, short circuit and bare leakage risk in the production process are caused, the problems of solder resist ink waste and low production timeliness of multiple whole-plate printing of the solder resist ink of the thick copper plate are solved, the problem that the thick copper plate cannot be subjected to selective surface treatment is solved, the combination diversity of the surface treatment of the thick copper plate is enhanced, and the efficiency and the quality are improved. And then the cost is reduced, the efficiency and the quality are improved, and the market competitiveness is improved.
Drawings
For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained from the drawings without creative efforts.
FIG. 1 is a schematic view of a raised structure in coating printing according to the present invention;
fig. 2 is a schematic diagram of the laser (top) and etching (bottom) structures of the circuit of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
One embodiment of the invention is: the utility model provides a thick copper board 1 selective surface treatment's hinders method of solder printing, according to the project organization of thick copper board 1, carries out corresponding structure and the design of corresponding size's PNL composing, corresponding structure is according to the mode of wiring and the trend of wiring, optimizes the composing, optimize the composing including the adjustment to wiring interval and wiring trend, also include simultaneously in the PNL composing design in the same direction as piece together, negative and positive makeup, rotatory makeup and the mixed makeup design of various composing modes.
After the makeup is finished, the production and the manufacture of corresponding working procedures such as drilling, copper deposition, circuits and the like are carried out, wherein the circuit production comprises laser or etching liquid etching production; as shown in fig. 2; the side surface of the copper wire irradiated by the laser is vertical to the surface of the base material, side etching does not exist, the side surface of the copper wire etched by etching is arc-shaped, and as the copper wire is the thick copper plate 1, for the treatment of the conductive hole, the hole-plugging film is used for plugging the conductive hole or ink is plugged into the conductive hole in a screen printing mode. As shown in fig. 1, after plugging the holes, coating and printing are performed, wherein the concentration of the ink is required to be adjusted, and the concentration of the ink is adjusted according to the thickness of the ink required by solder resistance on the thick copper plate 1; the coating printing is soaking coating printing, a thick copper plate is vertically placed in a soaking pool 2 at a certain inclination angle during soaking coating, the thick copper plate is placed vertical to a horizontal plane and soaked in ink, then the thick copper plate 1 is vertically lifted at a certain inclination angle, in order to facilitate the ink on the thick copper plate 1 to flow downwards along a substrate area, the thick copper plate 1 is lifted at one angle of 30-90 degrees with the horizontal plane, the thick copper plate 1 is lifted at the speed of 2-5M/S during lifting, and stays for a certain time when lifted to a certain height, in order to prevent the ink thickness of the upper end and the lower end lifted during ink vertical flow from being inconsistent, the edge direction is changed to be inverted for second coating printing, the second coating printing and the first coating are the same, and then the bonding pad is manufactured through exposure and development processing.
And the second coating is selective operation, an outer dry film is carried out after the second solder mask printing, the outer dry film selectively covers the bonding pad, and the bonding pad which does not need to be subjected to the first surface treatment is subjected to covering treatment.
In the above manufacturing method, because the waiting time of solder resist vertical flow needs to be increased, a flow guide groove of solder resist ink needs to be arranged in the production process, so that the solder resist ink falling from the vertical flow flows back. Therefore, the time of solder resist printing is prolonged, the use amount of ink or resin is reduced, the material cost is greatly saved, the existing production mode is simultaneously and directly changed, the existing production mode is adopted, in order to avoid horizontal printing, the plane ink amount is uniform, under the action of gravity, the ink flows downwards, the ink amount on the side surface of a copper wire cannot cover the side surface of the copper wire, the insulation requirement cannot be met, and particularly, etching side etching exists, therefore, the ink or the resin needs to be filled in a laser hollowed-out area or the etching hollowed-out area firstly, multiple times of printing and a large amount of ink or resin are needed in the filling process due to thick copper, and in the existing dry film printing, the filling thickness of the one-time solder resist ink or resin is about 35 um. A thick copper plate 1 of 3-20OZ excess means that a corresponding number of prints are required to fill the substrate area, wherein the printing is also a fast screen printing. In order to meet the requirement of electrical performance, the whole-plate solder mask printing is also required, and then the solder mask pad is produced through exposure and development.
If filling resin or ink is not carried out, the thickness of the ink around the bonding pad is large due to multiple times of whole-board printing, the height difference between the bonding pad and a solder mask area is increased, the welding difficulty is increased, and in addition, the side etching of the ink in the ink flushing process is also increased, so that the position of the bonding pad is deviated.
Meanwhile, the repair of the unclean etched or local short circuit board is facilitated, the unclean etched place can be repaired through the art designing knife, the secondary processing treatment of printing ink is carried out in an oil supplementing mode, the phenomenon that the problem cannot be repaired in the existing production process is avoided, and the production efficiency and the qualified rate of finished products can be greatly improved.
For the selective surface treatment, the combination of different surface treatments can be produced in different ways, for example, the process flow of immersion gold/electroless nickel palladium gold + carbon oil is the former process → the second solder resist printing → the solder resist inspection → immersion gold/electroless nickel palladium gold → carbon oil → the next process;
the process flow of the selective gold deposition/chemical nickel palladium gold + OSP comprises the steps of a former process → secondary solder resist printing → solder resist inspection → outer dry film → dry film inspection → gold deposition/chemical nickel palladium gold → film removal → characters → electric test → second drilling → milling board → final inspection → OSP → a next process; the dry film on the outer layer needs to cover the OSP part with the dry film, the other part is processed according to windowing, and the single side of the dry film is 20 mils (the minimum requirement is 7 mils) larger than the copper surface of the OSP; meanwhile, the dry film covering position distance of the copper surface or the bonding pad needing gold immersion is ensured to be more than or equal to 4 mil;
the technological process of immersion gold/electroless nickel palladium gold + gold finger (with lead) and immersion gold/electroless nickel palladium gold + long and short gold finger (with lead) is a former process → secondary solder resist printing → solder resist inspection → immersion gold/electroless nickel palladium gold → character → gold plating finger/hard gold plating → lower process, it needs to be explained that the above technical features are continuously combined with each other to form various embodiments which are not listed above, and all the technical features are regarded as the range recorded in the description of the invention; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A solder mask printing method for selectively processing the surface of a thick copper plate is characterized by comprising the following steps:
plugging holes, namely filling ink into the conductive holes needing plugging holes according to the manufacturing requirements of the board;
coating and printing;
secondary solder resist printing;
primary surface treatment;
and (5) secondary surface treatment.
2. The method for solder mask printing of the selective surface treatment of the thick copper plate according to claim 1, wherein the coating printing is a dip coating printing, the thick copper plate is vertically placed in a dip tank at a certain inclination angle when the dip coating is performed, one side of the thick copper plate is placed at an angle of 30-90 degrees with the horizontal plane, and the dip coating further comprises the step of lifting the thick copper plate at a speed of 2-5M/S; and carrying out first surface treatment after the coating and printing.
3. The method for solder mask printing of the selective surface treatment of the thick copper plate according to claim 2, further comprising an outer dry film before the first surface treatment, wherein the outer dry film is exposed and developed to leak out of the pad.
4. The method for solder mask printing of the selective surface treatment of the thick copper plate as claimed in claim 2, further comprising stripping after the first surface treatment.
5. The method for solder mask printing of thick copper plate selective surface treatment as claimed in claim 3, wherein the selective surface treatment is selective gold deposition/electroless nickel palladium gold + OSP.
6. The method for solder mask printing of the selective surface treatment of the thick copper plate according to claim 1 or 2, wherein the selective surface treatment is immersion gold/electroless nickel palladium gold + carbon oil, immersion gold/electroless nickel palladium gold + gold fingers (with lead), immersion gold/electroless nickel palladium gold + long and short gold fingers (with lead), and immersion gold/electroless nickel palladium gold + blue printing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604051.0A CN111698839A (en) | 2020-06-29 | 2020-06-29 | Solder resist printing method for selective surface treatment of thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010604051.0A CN111698839A (en) | 2020-06-29 | 2020-06-29 | Solder resist printing method for selective surface treatment of thick copper plate |
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| CN111698839A true CN111698839A (en) | 2020-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010604051.0A Withdrawn CN111698839A (en) | 2020-06-29 | 2020-06-29 | Solder resist printing method for selective surface treatment of thick copper plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286421A (en) * | 2021-04-16 | 2021-08-20 | 珠海杰赛科技有限公司 | Dense BGA conductor structure, printed circuit board and manufacturing method |
| CN114143978A (en) * | 2021-12-27 | 2022-03-04 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070134406A1 (en) * | 2005-12-14 | 2007-06-14 | Steve Castaldi | Method of using ultrasonics to plate silver |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN111263532A (en) * | 2020-01-21 | 2020-06-09 | 李荣根 | Vertical dip-coating method for PCB (printed circuit board) |
-
2020
- 2020-06-29 CN CN202010604051.0A patent/CN111698839A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070134406A1 (en) * | 2005-12-14 | 2007-06-14 | Steve Castaldi | Method of using ultrasonics to plate silver |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN111263532A (en) * | 2020-01-21 | 2020-06-09 | 李荣根 | Vertical dip-coating method for PCB (printed circuit board) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286421A (en) * | 2021-04-16 | 2021-08-20 | 珠海杰赛科技有限公司 | Dense BGA conductor structure, printed circuit board and manufacturing method |
| CN114143978A (en) * | 2021-12-27 | 2022-03-04 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
| CN114143978B (en) * | 2021-12-27 | 2022-07-05 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
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Application publication date: 20200922 |
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| WW01 | Invention patent application withdrawn after publication |