CN109219253B - Manufacturing process of PCB without suspended nickel and lead - Google Patents
Manufacturing process of PCB without suspended nickel and lead Download PDFInfo
- Publication number
- CN109219253B CN109219253B CN201811125951.6A CN201811125951A CN109219253B CN 109219253 B CN109219253 B CN 109219253B CN 201811125951 A CN201811125951 A CN 201811125951A CN 109219253 B CN109219253 B CN 109219253B
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- copper foil
- layer
- surface copper
- dry film
- pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
A process for manufacturing a PCB without suspended nickel and lead wires, which is used for manufacturing the PCB with an anti-corrosion layer, comprises the following steps: (1) cutting, 2, coating ink on a non-pattern area of the CS surface copper foil in a silk-screen printing mode to form a dry film on an outer layer dry film; (3) electroplating a copper layer in the pattern area of the SS surface copper foil and the CS surface copper foil; (4) etching the outer layer; (5) generating a dry film on the SS surface copper foil; (6) electroplating a layer of hard gold on the surface of the CS surface copper foil to form an anti-corrosion layer; (7) depositing gold and removing film; (8) an outer layer dry film is formed on the CS surface copper foil and the SS surface copper foil; (9) and etching the inner layer. The outer layer pattern is etched twice, firstly, only the CS surface is etched, the inner lead and the outer lead are conducted by using the SS surface whole plate copper sheet and the VIP hole to realize the CS surface electro-nickel gold, and then the SS surface pattern is etched. The problem of nickel suspension caused by gold corrosion resistance adopted in the old process is thoroughly avoided.
Description
Technical Field
The invention relates to a PCB (printed circuit board) forming process, in particular to a manufacturing process of a PCB without suspended nickel and a lead.
Background
At present, for a circuit board processed by OSP (organic solder mask) processing, single-sided full-board thickness hard gold is required, and the surface appearance of the gold is very strict. A selective electrogilding process flow is mostly adopted, and a gold-nickel surface is used as an anti-corrosion layer for manufacturing; the characteristic of this technology lies in that there is a problem of side etching after the gold surface is etched to form a pattern, and it is easy to cause the occurrence of metal wire, which causes the problem of short circuit. Therefore, there is a need for improving the conventional manufacturing process.
Disclosure of Invention
Therefore, the invention aims to provide a manufacturing process of a PCB without suspended nickel and a lead, which aims to overcome the defect that the existing gold surface has side corrosion after being etched into a pattern.
A process for manufacturing a PCB without suspended nickel and lead wires is used for manufacturing the PCB with an anti-corrosion layer, and is characterized by comprising the following steps:
(1) cutting materials, selecting a proper jointed board and a board cutting mode, and improving the utilization rate of the board to the maximum extent, wherein the jointed board comprises an inner layer substrate, a CS surface copper foil attached to one surface of the inner layer substrate, and an SS surface copper foil attached to the other surface of the inner layer substrate, the jointed board is provided with a VIP hole, a copper layer is arranged on the hole wall of the VIP hole and used for connecting the CS surface copper foil and the SS surface copper foil, the VIP hole is filled with resin, and the CS surface copper foil is provided with a pattern area and a non-pattern area;
(2) the outer layer dry film is formed by coating ink on a non-pattern area of the CS surface copper foil in a silk-screen printing mode, and hardening the ink by utilizing the irradiation of ultraviolet light to form a dry film;
(3) pattern electroplating, namely electroplating a copper layer in the pattern areas of the SS surface copper foil and the CS surface copper foil to increase the thickness of the copper layer in the pattern areas of the SS surface copper foil and the CS surface copper foil;
(4) etching the outer layer, namely etching the non-pattern area on the CS surface copper foil by adopting liquid medicine, and removing the copper layer of the non-pattern area on the CS surface copper foil;
(5) an outer layer dry film, generating a dry film on the SS surface copper foil 30 to protect the SS surface copper foil;
(6) electroplating a layer of hard gold on the surface of the CS surface copper foil to form an anti-corrosion layer;
(7) performing gold deposition treatment on the surface of the anti-corrosion layer through chemical deposition, and removing a dry film on the copper foil with the SS surface by using chemical liquid after the treatment is finished;
(8) the outer layer dry film is produced on the CS surface copper foil and the SS surface copper foil in a screen printing mode, wherein the SS surface copper foil is also provided with a graphic area and a non-graphic area, and the dry film covers the graphic area of the CS surface copper foil and the graphic area of the SS surface copper foil;
(9) and etching the inner layer, etching off the copper layer part of the non-pattern area of the copper foil of the SS surface, and removing the dry film after the etching is finished.
The manufacturing process of the PCB without the suspended nickel and the lead wire has the beneficial effects that: the outer layer pattern is etched twice, firstly, only a CS surface (electrogilding surface) is etched, inner and outer leads are conducted by using a SS surface whole plate copper sheet and a VIP hole to realize CS surface electrogilding, and then, the SS surface pattern is etched. The problem of nickel suspension caused by gold corrosion resistance adopted in the old process is thoroughly avoided, meanwhile, the production process is reduced, and the cost is saved; the stability of the process quality is improved, and the abnormal risk of batch scrapping is reduced. The electroplating time is shortened, the problem of nickel suspension caused by gold corrosion resistance is thoroughly solved, and the cost is saved; the stability of the process quality is improved, and the abnormal risk of batch scrapping is reduced.
Drawings
Fig. 1 is a process flow diagram of the steps (2) - (8) of the manufacturing process of the PCB without suspended nickel and lead of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the present invention provides a manufacturing process of a suspension-free nickel leadless PCB for manufacturing a PCB with an anti-corrosion layer, the manufacturing process of the suspension-free nickel leadless PCB comprises the following steps:
(1) cutting materials, selecting a proper jointed board and a board cutting mode, and improving the utilization rate of the board to the maximum extent, wherein the jointed board comprises an inner layer substrate 10, a CS surface copper foil 20 attached to one surface of the inner layer substrate 10, and an SS surface copper foil 30 attached to the other surface of the inner layer substrate 10, a VIP hole is arranged on the jointed board, a copper layer 50 is arranged on the hole wall of the VIP hole and used for connecting the CS surface copper foil 20 and the SS surface copper foil 30, resin 40 is filled in the VIP hole, and the CS surface copper foil 20 is provided with a pattern area and a non-pattern area;
(2) an outer layer dry film, which is formed by coating ink on a non-pattern area of the CS surface copper foil 20 in a silk-screen printing mode, and hardening the ink by utilizing the irradiation of ultraviolet light to form a dry film 60;
(3) pattern electroplating, namely electroplating a copper layer on the pattern areas of the SS surface copper foil 30 and the CS surface copper foil 20 to increase the thickness of the copper layer on the pattern areas of the SS surface copper foil 30 and the CS surface copper foil 20;
(4) etching the outer layer, namely etching the non-pattern area on the CS surface copper foil 20 by using a liquid medicine, and removing the copper layer on the non-pattern area on the CS surface copper foil 20;
(5) an outer layer dry film, generating a dry film 70 on the SS surface copper foil 30 to protect the SS surface copper foil 30;
(6) electroplating a layer of hard gold on the surface of the CS surface copper foil 20 to form a corrosion-resistant layer 80;
(7) performing gold deposition treatment on the surface of the anti-corrosion layer 80 through chemical deposition, and removing the dry film 70 on the SS-surface copper foil 30 by using chemical liquid after the treatment is finished;
(8) an outer layer dry film, adopting a silk-screen printing form to generate a dry film 90 on the CS surface copper foil 20 and the SS surface copper foil 30, wherein the SS surface copper foil 30 is also provided with a graphic area and a non-graphic area, and the dry film 90 covers the graphic area of the CS surface copper foil 20 and the graphic area of the SS surface copper foil 30;
(9) and etching the inner layer, namely etching away the copper layer part of the non-pattern area of the SS-surface copper foil 30, and removing the dry film 90 after the completion.
The manufacturing process of the PCB without the suspended nickel and the lead wire has the beneficial effects that: the outer layer pattern is etched twice, firstly, only a CS surface (electrogilding surface) is etched, inner and outer leads are conducted by using a SS surface whole plate copper sheet and a VIP hole to realize CS surface electrogilding, and then, the SS surface pattern is etched. The problem of nickel suspension caused by gold corrosion resistance adopted in the old process is thoroughly avoided, meanwhile, the production process is reduced, and the cost is saved; the stability of the process quality is improved, and the abnormal risk of batch scrapping is reduced. The electroplating time is shortened, the problem of nickel suspension caused by gold corrosion resistance is thoroughly solved, and the cost is saved; the stability of the process quality is improved, and the abnormal risk of batch scrapping is reduced.
The above-mentioned embodiments only represent one embodiment of the present invention, and the description is specific and detailed, but not understood as the limitation of the scope of the invention, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these are within the scope of the invention, and therefore, the scope of the invention should be determined by the appended claims.
Claims (1)
1. A process for manufacturing a PCB without suspended nickel and lead wires is used for manufacturing the PCB with an anti-corrosion layer, and is characterized by comprising the following steps:
(1) cutting materials, and selecting a proper jointed board and a board cutting mode, wherein the jointed board comprises an inner layer substrate, a CS surface copper foil attached to one surface of the inner layer substrate, and an SS surface copper foil attached to the other surface of the inner layer substrate, a VIP hole is formed in the jointed board, a copper layer is arranged on the hole wall of the VIP hole and used for connecting the CS surface copper foil and the SS surface copper foil, resin is filled in the VIP hole, and the CS surface copper foil is provided with a pattern area and a non-pattern area;
(2) the outer layer dry film is formed by coating ink on a non-pattern area of the CS surface copper foil in a silk-screen printing mode, and hardening the ink by utilizing the irradiation of ultraviolet light to form a dry film;
(3) pattern electroplating, namely electroplating a copper layer in the pattern areas of the SS surface copper foil and the CS surface copper foil to increase the thickness of the copper layer in the pattern areas of the SS surface copper foil and the CS surface copper foil;
(4) etching the outer layer, namely etching the non-pattern area on the CS surface copper foil by adopting liquid medicine, and removing the copper layer of the non-pattern area on the CS surface copper foil;
(5) generating a dry film on the SS surface copper foil to protect the SS surface copper foil;
(6) electroplating a layer of hard gold on the surface of the CS surface copper foil to form an anti-corrosion layer;
(7) performing gold deposition treatment on the surface of the anti-corrosion layer through chemical deposition, and removing a dry film on the copper foil with the SS surface by using chemical liquid after the treatment is finished;
(8) the outer layer dry film is produced on the CS surface copper foil and the SS surface copper foil in a screen printing mode, wherein the SS surface copper foil is also provided with a graphic area and a non-graphic area, and the dry film covers the graphic area of the CS surface copper foil and the graphic area of the SS surface copper foil;
(9) and etching the inner layer, etching off the copper layer part of the non-pattern area of the copper foil of the SS surface, and removing the dry film after the etching is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811125951.6A CN109219253B (en) | 2018-09-26 | 2018-09-26 | Manufacturing process of PCB without suspended nickel and lead |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811125951.6A CN109219253B (en) | 2018-09-26 | 2018-09-26 | Manufacturing process of PCB without suspended nickel and lead |
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| Publication Number | Publication Date |
|---|---|
| CN109219253A CN109219253A (en) | 2019-01-15 |
| CN109219253B true CN109219253B (en) | 2021-02-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811125951.6A Active CN109219253B (en) | 2018-09-26 | 2018-09-26 | Manufacturing process of PCB without suspended nickel and lead |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114501814B (en) * | 2022-01-27 | 2023-06-02 | 深圳市景旺电子股份有限公司 | Method for removing gold-plated lead of printed circuit board and method for manufacturing golden finger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102781171B (en) * | 2012-07-24 | 2015-08-12 | 广东达进电子科技有限公司 | A kind of multilayer is without the manufacture method of lead-in wire golden finger circuit board |
| JP6258810B2 (en) * | 2014-07-31 | 2018-01-10 | 京セラ株式会社 | Wiring board manufacturing method |
| CN105357892B (en) * | 2015-10-29 | 2018-10-19 | 广州兴森快捷电路科技有限公司 | Printed wiring board and preparation method thereof |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
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