CN106937488A - A kind of anti-welding copper-clad plate printing process of electrolyte resistance - Google Patents
A kind of anti-welding copper-clad plate printing process of electrolyte resistance Download PDFInfo
- Publication number
- CN106937488A CN106937488A CN201710303098.1A CN201710303098A CN106937488A CN 106937488 A CN106937488 A CN 106937488A CN 201710303098 A CN201710303098 A CN 201710303098A CN 106937488 A CN106937488 A CN 106937488A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- screen
- silk
- electrolyte resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The present invention provides a kind of anti-welding copper-clad plate printing process of electrolyte resistance, comprises the following steps：Copper-clad plate is pre-processed；To the first face of copper-clad plate silk-screen；To the second face of copper-clad plate silk-screen, 10 20min are stood；Pre-baked to copper-clad plate, pre-baked rear standing is cooled to room temperature until it；Copper-clad plate is aligned；15 20min are stood after exposure copper-clad plate；Dried after copper-clad plate development；Heating baking copper-clad plate 20 30min.By the parameter of drawing in the net of management and control silk-screen half tone, the collocation of adjustment ink, screen printing method and baking sheet parameter improve the adhesion of ink and copper-clad plate, reach the purpose that electrolyte resistance immersion ink does not fall off.
Description
Technical field
The present invention relates to art of printed circuit boards, and in particular to a kind of anti-welding copper-clad plate printing process of electrolyte resistance.
Background technology
With the multifunctionality development of electronic product, the application of PCB is more and more extensive, so as to the requirement to PCB is also more next
It is more, there is requirement-ink higher to need electrolyte resistance to soak for outward appearance ink；With being continuously increased for customer requirement, no
The technological ability of disconnected my department of lifting, meets the demand of client, so that enterprise profit and lifting company synthesized competitiveness are improved,
Occupation rate of market is captured and expands to be determined to win.
The traditional handicraft in combined circuit plate field, by the parameter of drawing in the net of management and control silk-screen half tone, adjusts screen printing method and bakes
Board parameter, improves the adhesion of ink and plate, the purpose that electrolyte resistance immersion ink does not fall off is reached, so as to meet the need of client
Ask.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of anti-welding copper-clad plate printing process of electrolyte resistance, by pipe
The parameter of drawing in the net of silk-screen half tone is controlled, screen printing method and baking sheet parameter is adjusted, the adhesion of ink and copper-clad plate is improved, resistance to electricity is reached
The purpose that solution immersion bubble ink does not fall off.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of anti-welding copper-clad plate printing process of electrolyte resistance, comprises the following steps：
（1）Copper-clad plate is pre-processed；
（2）To the first face of copper-clad plate silk-screen；
（3）To the second face of copper-clad plate silk-screen, 10-20min is stood；
（4）Pre-baked to copper-clad plate, pre-baked rear standing is cooled to room temperature until it；
（5）Copper-clad plate is aligned；
（6）15-20min is stood after exposure copper-clad plate；
（7）Dried after copper-clad plate development；
（8）Heating baking copper-clad plate 20-30min.
The first described face silk-screen or the operation of the second face silk-screen are：（1）Oil is opened, prepares anti-solder ink and curing agent,
It is well mixed；（2）Silk-screen, will anti-solder ink the component side or solder side of copper coin are printed on by screen printing mode；Wherein
Control parameter is：When opening oil, per 1kg ink addition 450 ± 50g of curing agent, without diluent；Ink knife angle during silk-screen
Incline 20 ° ± 2 °, 4 ± 2kg/cm of silk-screen pressure2, the web plate that silk-screen is used is the blank web plate of 39T.Described anti-solder ink with
And the preferred sun PSR-2000 ink collocation 883HF3 curing agent of curing agent.
Further, described copper-clad plate is pre-processed：Using volcanic ash nog plate.
Further, described pre-baked control parameter is：40-45 DEG C of temperature, time 20-25min.
Further, the control parameter of described exposure is：Exposure environment vacuumizes -680 to -720mmHg, time for exposure
110 ± 15s, uses 21 grades of exposure guide rule 3-4 lattice.
Further, the control parameter of drying is after described development：Developing powder：3.5 ± 0.5 m/min, development pressure
Power：1.8±0.3 kg/c㎡；40-45 DEG C of the process keeping temperature of drying.
Further, the temperature control of described heating baking is at 150-165 DEG C.
The present invention has the advantages that：
This method adds curing agent in ink according to a specific ratio, arrange in pairs or groups specific scraper angle and silk-screen pressure, increases oil
Adhesive force and acid-proof alkaline to plate face after ink exposure, it is ensured that it receives electrolyte to attack and do not fall off.Simultaneously using general
Logical anti-solder ink replaces special electrolyte resistance ink, has saved cost, and on silk-screen quality without influence.Again by a series of works
Skill flow and state modulator, improve the adhesion of ink for screen printing and copper-clad plate, reach what electrolyte resistance immersion ink did not fell off
Effect.
Specific embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
A kind of anti-welding copper-clad plate printing process of electrolyte resistance, comprises the following steps：
（1）Copper-clad plate is pre-processed, using volcanic ash nog plate；
（2）To the first face of copper-clad plate silk-screen；
（3）To the second face of copper-clad plate silk-screen, 10-20min is stood；
（4）Pre-baked to copper-clad plate, pre-baked rear standing is cooled to room temperature until it；
（5）Copper-clad plate is aligned；
（6）15-20min is stood after exposure copper-clad plate；
（7）Dried after copper-clad plate development；
（8）Heating baking copper-clad plate 20-30min.
The first described face silk-screen or the operation of the second face silk-screen are：（1）Oil is opened, prepares anti-solder ink and curing agent,
It is well mixed；（2）Silk-screen, will anti-solder ink the component side or solder side of copper coin are printed on by screen printing mode；Wherein
Control parameter is：When opening oil, per 1kg ink addition 450 ± 50g of curing agent, without diluent；Ink knife angle during silk-screen
Incline 20 ° ± 2 °, 4 ± 2kg/cm of silk-screen pressure2, the web plate that silk-screen is used is the blank web plate of 39T.
Wherein, copper-clad plate pre-processes and is：Using volcanic ash nog plate.
Wherein, described pre-baked control parameter is：40-45 DEG C of temperature, time 20-25min.
Wherein, the control parameter of described exposure is：Exposure environment vacuumizes -680 to -720mmHg, time for exposure 110
± 15s, uses 21 grades of exposure guide rule 3-4 lattice.
Wherein, the control parameter of drying is after described development：Developing powder：3.5 ± 0.5 m/min, developer pressure：
1.8±0.3 kg/c㎡；40-45 DEG C of the process keeping temperature of drying.
Wherein, the temperature control of described heating baking is at 150-165 DEG C.
In order to further illustrate ink for screen printing disclosed in this invention proportioning, the present invention also with ink and curing agent model with
And preparation method carries out electrolyte resistance Soak Test, such as following table for variable：
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert this hair
Bright specific implementation is confined to these explanations.For general technical staff of the technical field of the invention, do not taking off
On the premise of present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to protection of the invention
Scope.
Claims (6)
1. a kind of anti-welding copper-clad plate printing process of electrolyte resistance, comprises the following steps：
（1）Copper-clad plate is pre-processed；
（2）To the first face of copper-clad plate silk-screen；
（3）To the second face of copper-clad plate silk-screen, 10-20min is stood；
（4）Pre-baked to copper-clad plate, pre-baked rear standing is cooled to room temperature until it；
（5）Copper-clad plate is aligned；
（6）15-20min is stood after exposure copper-clad plate；
（7）Dried after copper-clad plate development；
（8）Heating baking copper-clad plate 20-30min；
The first described face silk-screen or the operation of the second face silk-screen are：（1）Oil is opened, prepares anti-solder ink and curing agent, mixing
Uniformly；（2）Silk-screen；Wherein control parameter is：When opening oil, per 450 ± 50g of 1kg ink addition curing agent；Ink knife during silk-screen
Angle inclines 20 ° ± 2 °, 4 ± 2kg/cm of silk-screen pressure2, the web plate that silk-screen is used is the blank web plate of 39T.
2. the anti-welding copper-clad plate printing process of electrolyte resistance according to claim 1, it is characterised in that described copper coin is pre-
It is processed as：Using volcanic ash nog plate.
3. the anti-welding copper-clad plate printing process of electrolyte resistance according to claim 1, it is characterised in that described is pre-baked
Control parameter is：40-45 DEG C of temperature, time 20-25min.
4. the anti-welding copper-clad plate printing process of electrolyte resistance according to claim 1, it is characterised in that described exposure
Control parameter is：Exposure environment vacuumizes -680 to -720mmHg, 110 ± 15s of time for exposure, uses 21 grades of exposure guide rule 3-4 lattice.
5. the anti-welding copper-clad plate printing process of electrolyte resistance according to claim 1, it is characterised in that after described development
The control parameter of drying is：Developing powder：3.5 ± 0.5 m/min, developer pressure：1.8±0.3 kg/c㎡；The process of drying
40-45 DEG C of keeping temperature.
6. the anti-welding copper-clad plate printing process of electrolyte resistance according to claim 1, it is characterised in that described heating is dried
Roasting temperature control is at 150-165 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710303098.1A CN106937488A (en) | 2017-05-03 | 2017-05-03 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710303098.1A CN106937488A (en) | 2017-05-03 | 2017-05-03 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
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| Publication Number | Publication Date |
|---|---|
| CN106937488A true CN106937488A (en) | 2017-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710303098.1A Pending CN106937488A (en) | 2017-05-03 | 2017-05-03 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN114211893A (en) * | 2021-12-14 | 2022-03-22 | 广东合通建业科技股份有限公司 | Preparation process for improving reflectivity of Mini-LED lamp panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335831A (en) * | 1997-05-23 | 1998-12-18 | Samsung Aerospace Ind Ltd | Multilayered wiring board and its manufacture |
| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN105555051A (en) * | 2016-01-25 | 2016-05-04 | 奥士康科技股份有限公司 | Solder mask silk printing method |
-
2017
- 2017-05-03 CN CN201710303098.1A patent/CN106937488A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335831A (en) * | 1997-05-23 | 1998-12-18 | Samsung Aerospace Ind Ltd | Multilayered wiring board and its manufacture |
| CN102724818A (en) * | 2012-06-29 | 2012-10-10 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN105555051A (en) * | 2016-01-25 | 2016-05-04 | 奥士康科技股份有限公司 | Solder mask silk printing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931364A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | White oil treatment process for surface of ceramic substrate |
| CN113543490A (en) * | 2021-07-08 | 2021-10-22 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN113543490B (en) * | 2021-07-08 | 2023-01-10 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
| CN114211893A (en) * | 2021-12-14 | 2022-03-22 | 广东合通建业科技股份有限公司 | Preparation process for improving reflectivity of Mini-LED lamp panel |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
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| RJ01 | Rejection of invention patent application after publication |