CN105555051B - A kind of solder mask screen printing method - Google Patents
A kind of solder mask screen printing method Download PDFInfo
- Publication number
- CN105555051B CN105555051B CN201610051193.2A CN201610051193A CN105555051B CN 105555051 B CN105555051 B CN 105555051B CN 201610051193 A CN201610051193 A CN 201610051193A CN 105555051 B CN105555051 B CN 105555051B
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- Prior art keywords
- silk
- screen
- doctor
- face
- catch point
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of solder mask screen printing method, including the production of catch point net, copper sheet pre-treatment, the first face of silk-screen catch point net, standing, the second face of silk-screen catch point net, it is pre-baked, again stand, align, expose, stand, develop and afterwards bake process, copper sheet consent is carried out while silk-screen, when silk-screen catch point the first face of net, the additive amount of anti-solder ink controls within the scope of 25~35ml/kg, doctor angle is 10~20 °, and doctor pressure is 30~50kgf, and doctor speed is 2~4m/min；5~15min is stood after the completion of first face silk-screen；Start the second face of silk-screen catch point net, the additive amount of anti-solder ink controls within the scope of 0~10ml/kg, and doctor angle is 10~20 °, and doctor pressure is 80~95kgf, and doctor speed is 0.5~1m/min.Process of the present invention is simple, high-efficient, strong operability；Consume is reduced, and service life improves, and reduces cost；Ink is uniform, silk-screen good quality；Consent saturation degree improves, and ink thickness is controllable, and anti-welding effect is good, and operating procedure simplifies, high-efficient.
Description
Technical field
The present invention relates to the anti-welding technical fields of PCB, and in particular to a kind of solder mask screen printing method.
Background technique
In circuit board making process, after the completing of outer-layer circuit, it is necessary to impose anti-welding protection to the outer-layer circuit
Processing, in order to avoid outer-layer circuit oxidation or solder shorts, past common soldering-inhibiting method is first to carry out copper face to circuit board to locate in advance
Then reason prints one layer of anti-solder ink using screen printing mode on circuit boards, then successively by pre-baked, exposure, development and
It bakes afterwards and waits processing, realize the anti-welding processing to circuit board.Anti-welding processing can facilitate the welding processing to component, save scolding tin simultaneously
Prevent line short, protection copper wire can be played, prevents part welding dislocation.
Existing soldering-inhibiting method generally comprises process in detail below: first carrying out pre-treatment to copper sheet, then carries out using aluminium to it
Piece consent；Then carry out silk screen secondary printing, standing, it is pre-baked, stand again；It finally aligned, exposed, stood, developed, baked afterwards
Etc. subsequent handlings.Two screen printers are usually required using the production method of secondary printing while being printed, process is various, cost
It improves, and it is uneven easily ink thickness occur, creases easily between route, blisters and route jaundice, and doctor in secondary printing
Used parameter is identical, and the parameter of doctor is not adjusted according to the viscosity of ink, is not easy to obtain in doctor traveling process
Best in quality, the consume of doctor is also larger, and service life reduces；
In addition, using aluminium flake consent, it is cumbersome, easily there is false dew copper, consent saturation degree is not high, is easy to appear consent
Haloing be easy to cause ink to enter hole bad.
Summary of the invention
The technical problem to be solved by the present invention is to overcome existing drawbacks described above, provide a kind of solder mask screen printing side
Method.
The technical solution adopted by the present invention to solve the technical problems is: a kind of solder mask screen printing method, including catch point net system
Work, copper sheet pre-treatment, the first face of catch point net and the silk-screen in the second face, standing, it is pre-baked, stand, align again, exposing, standing, developing
With rear roasting process, copper sheet consent is carried out while silk-screen, when silk-screen catch point the first face of net, the additive amount control of anti-solder ink
At 25~35ml/kg (preferably 30ml/kg), doctor angle is 10~20 ° (preferably 15 °), and doctor pressure is 30~50kgf
(preferably 35~45kgf), doctor speed are 2~4m/min (preferably 3.2m/min)；Stand 5 after the completion of first face silk-screen~
15min；Starting the second face of silk-screen catch point net, the additive amount of anti-solder ink is controlled at 0~10ml/kg (preferably 5ml/kg),
Doctor angle is 10~20 ° (preferably 15 °), and doctor pressure is 80~95kgf (preferably 85~90kgf), doctor speed
For 0.5~1m/min (preferably 0.7m/min).
Compared with prior art, the invention has the following advantages that
(1) process is simple, high-efficient, strong operability；
(2) present invention optimizes additive amount needed for anti-solder ink the first face of silk-screen catch point net and the second face,
The performance and viscosity that can effectively improve ink are not only suitable for catch point net even printing demand of the plug with print after stirring anti-solder ink,
And make to correspond to required pressure and speed in doctor traveling process and reduce, reduce consume, improve service life, reduce at
This；
(3) present invention is to doctor angle, pressure and speed needed for anti-solder ink the first face of silk-screen catch point net and the second face
Degree optimizes, and in silk-screen printing process, can efficiently reduce ink layer corrugation and generate bubble, ink is uniform, silk-screen good quality；
(4) present invention carries out copper sheet consent while silk-screen, and consent saturation degree improves, and ink thickness is controllable, anti-welding
Effect is good, and operating procedure simplifies, anti-welding high-efficient.
Specific embodiment
The invention will be further described with reference to embodiments.
Embodiment 1
The present embodiment carries out anti-welding processing, process flow are as follows: catch point net production → copper to the audiovisual plate that plate thickness is 1.6mm
Plate pretreatment the → the first face catch point twine print → standing → the second face catch point twine print → pre-baked → standing → contraposition → exposure →
Standing → development → rear roasting.
Specific steps are as follows:
(1) catch point net makes, and the long short side coefficient of catch point net is equal are as follows: and 0.9999, all insert holes: unilateral increasing 4mil is opened
The hole via of window: the catch point of boring aperture < 1.2mm and boring aperture etc. be big, the unilateral small 2mil of boring aperture >=1.2mm, slot
Hole: 2mil smaller than boring aperture；
(2) copper sheet is pre-processed using existing routine operation；
(3) catch point twine is carried out to pretreated copper sheet and prints the first face, printed to be added in anti-solder ink used and commonly use
Additive, in 28ml/kg, doctor angle is 12 ° for additive amount control, and doctor pressure is 40kgf, doctor speed
For 2.8m/min；
(4) after the completion of catch point twine prints the first face, 5~15min is stood；
(5) the second face is printed to catch point twine, the additive amount of anti-solder ink is controlled in 6ml/kg, and doctor angle is
12 °, doctor pressure is 88kgf, and doctor speed is 0.6m/min；
(6) after the second face of catch point silk-screen printing, 20min is stood, it is then pre-baked, it stands, aligns, expose, stand, show
Shadow is baked with rear.
After solder mask screen printing, ink uniformly, it is consent appearance uniform, smooth, for saturation degree up to 98%, doctor consumes small, efficiency
It is high.
Embodiment 2
The present embodiment carries out anti-welding processing, process flow are as follows: catch point net production → copper to the audiovisual plate that plate thickness is 1.2mm
Plate pretreatment the → the first face catch point twine print → standing → the second face catch point twine print → pre-baked → standing → contraposition → exposure →
Standing → development → rear roasting.
Specific steps are as follows:
(1) catch point net makes, and the long short side coefficient of catch point net is equal are as follows: and 0.9999, all insert holes: unilateral increasing 4mil is opened
The hole via of window: the catch point of boring aperture < 1.2mm and boring aperture etc. be big, the unilateral small 2mil of boring aperture >=1.2mm, slot
Hole: 2mil smaller than boring aperture；
(2) copper sheet is pre-processed using existing routine operation；
(3) catch point twine is carried out to pretreated copper sheet and prints the first face, printed to be added in anti-solder ink used and commonly use
Additive, in 30ml/kg, doctor angle is 15 ° for additive amount control, and doctor pressure is 40kgf, doctor speed
For 3.2m/min；
(4) after the completion of catch point twine prints the first face, 5~15min is stood；
(5) the second face is printed to catch point twine, the additive amount of anti-solder ink is controlled in 5ml/kg, and doctor angle is
15 °, doctor pressure is 90kgf, and doctor speed is 0.7m/min；
(6) after the second face of catch point silk-screen printing, 20min is stood, it is then pre-baked, it stands, aligns, expose, stand, show
Shadow is baked with rear.
After solder mask screen printing, ink uniformly, it is consent appearance uniform, smooth, for saturation degree up to 100%, doctor consumes small, efficiency
It is high.
Claims (1)
1. a kind of solder mask screen printing method, including the production of catch point net, copper sheet pre-treatment, the first face of silk-screen catch point net, standing, silk-screen gear
Point the second face of net, it is pre-baked, stand, align again, exposing, standing, developing and afterwards bake process, it is characterised in that: while silk-screen into
Row copper sheet consent, when silk-screen catch point the first face of net, the additive amount of anti-solder ink is controlled within the scope of 25~35ml/kg, is scraped
Ink knife angle is 10~20 °, and doctor pressure is 30~50kgf, and doctor speed is 2~4m/min；First face silk-screen is completed
5~15min is stood afterwards；Start the second face of silk-screen catch point net, the additive amount of anti-solder ink is controlled in 0~10ml/kg range
Interior, doctor angle is 10~20 °, and doctor pressure is 80~95kgf, and doctor speed is 0.5~1m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051193.2A CN105555051B (en) | 2016-01-25 | 2016-01-25 | A kind of solder mask screen printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610051193.2A CN105555051B (en) | 2016-01-25 | 2016-01-25 | A kind of solder mask screen printing method |
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| Publication Number | Publication Date |
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| CN105555051A CN105555051A (en) | 2016-05-04 |
| CN105555051B true CN105555051B (en) | 2019-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610051193.2A Active CN105555051B (en) | 2016-01-25 | 2016-01-25 | A kind of solder mask screen printing method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793552A (en) * | 2017-02-10 | 2017-05-31 | 昆山元茂电子科技有限公司 | The soldering-inhibiting method of printed circuit board (PCB) |
| CN106937488A (en) * | 2017-05-03 | 2017-07-07 | 奥士康精密电路（惠州）有限公司 | A kind of anti-welding copper-clad plate printing process of electrolyte resistance |
| CN109475045B (en) * | 2018-11-21 | 2020-06-23 | 奥士康精密电路（惠州）有限公司 | Method for controlling thickness of ink at line angle of board surface |
| CN110430690B (en) * | 2019-07-31 | 2022-04-22 | 高德（无锡）电子有限公司 | Process for meeting minimum peelable glue thickness of PCB |
| CN110557895A (en) * | 2019-10-17 | 2019-12-10 | 昆山虹灿光电材料有限公司 | Method for selecting ink in large-aperture PCB (printed Circuit Board) selection process |
| CN112867278A (en) * | 2021-01-29 | 2021-05-28 | 深圳市强达电路有限公司 | Solder mask manufacturing method for printed circuit sheet |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101977483A (en) * | 2010-08-20 | 2011-02-16 | 奥士康精密电路（惠州）有限公司 | Welding resistance method for industrial control panel |
| CN102026494A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Solder mask screen printing method |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5106726B2 (en) * | 2001-08-10 | 2012-12-26 | イビデン株式会社 | Wiring board manufacturing method |
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2016
- 2016-01-25 CN CN201610051193.2A patent/CN105555051B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101977483A (en) * | 2010-08-20 | 2011-02-16 | 奥士康精密电路（惠州）有限公司 | Welding resistance method for industrial control panel |
| CN102026494A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Solder mask screen printing method |
| CN102026495A (en) * | 2010-12-18 | 2011-04-20 | 奥士康精密电路（惠州）有限公司 | Sheet welding preventing method |
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| CN105555051A (en) | 2016-05-04 |
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