CN101977483B - Welding resistance method for industrial control panel - Google Patents
Welding resistance method for industrial control panel Download PDFInfo
- Publication number
- CN101977483B CN101977483B CN2010102587568A CN201010258756A CN101977483B CN 101977483 B CN101977483 B CN 101977483B CN 2010102587568 A CN2010102587568 A CN 2010102587568A CN 201010258756 A CN201010258756 A CN 201010258756A CN 101977483 B CN101977483 B CN 101977483B
- Authority
- CN
- China
- Prior art keywords
- time
- screen printing
- silk screen
- industrial control
- control board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a welding resistance method for an industrial control panel, which is improved on the basis of the prior welding resistance technology. The method comprises the following steps: preprocessing the industrial control panel, carrying out primary screen-printing, standing, carrying out primary prebaking, standing, carrying out secondary screen-printing, standing, carrying out secondary prebaking, aligning, exposing, developing, and carrying out post-baking. The method can satisfy the customer requirement for ink thickness only by improving the working procedures of screen printing and prebaking, thereby greatly simplifying the welding resistance operation, saving the time and lowering the cost by more than 6%. The invention has favorable welding resistance effect, the ink can be evenly covered on the circuit and substrate, the appearance meets the IPC-600G standard requirement, the ink thickness can be controlled within 13-50 um, and the developing point is 45-50%.
Description
Technical field
The present invention relates to the manufacture method of industrial control board, relate in particular to a kind of soldering-inhibiting method of industrial control board.
Background technology
General circuit board manufacturing; After the completing of outer-layer circuit, must impose anti-welding protection to this outer-layer circuit and handle, in order to avoid this outer-layer circuit oxidation or solder shorts; Soldering-inhibiting method commonly used at present is earlier circuit board to be carried out the copper face preliminary treatment; Adopt screen printing mode on circuit board, to print one deck anti-solder ink (becoming green oil again) then, more successively through in advance roasting, exposure, develop and processing such as the back is roasting, then realized the anti-welding processing of circuit board.Anti-welding processing can be saved scolding tin and prevent line short conveniently to the welding processing of assembly, can play the protection copper cash, prevents that part is soldered to the effect in incorrect place.
Yet there are a lot of problems in existing soldering-inhibiting method, for example: when (1) utilizes silk screen printing that anti-solder ink is coated on circuit board, must adopt repeatedly silk screen printing program, could accumulate anti-solder ink to required thickness, so procedure operation be comparatively complicated; (2) printing ink can not completely be applied to the plate face equably in the screen printing process, thereby causes the circuit board performance unstable; (3) applying anti-solder ink easy bubble that infiltrates in the process of circuit board, cause anti-welding reliability bad, and the welding resisting layer life-span that forms is shorter.
Industrial control board typically uses among the Industry Control product and environment of long-time, high pressure, high temperature, high humidity, high speed etc., and therefore each item performance requirement and the reliability requirement to industrial control board must satisfy client's design specification.
In addition, the common copper of industrial control board is thick all >=2OZ, this type of thick copper coin exists between line when anti-welding the making and is difficult for the phenomenon of oil down with the copper sheet edge, thereby causes copper cash exposed, and line causes short circuit when scolding tin, causes functional quality problem.
At present; Adopt existing soldering-inhibiting method that this thick copper coin of industrial control board is carried out anti-welding processing; In order to guarantee that ink thickness can reach requirement; Generally all need walk anti-welding flow process twice, idiographic flow is: the roasting → contraposition → exposure → developments → check → back of copper face preliminary treatment → silk screen printing → leave standstill → in advance bakes → and copper face preliminary treatment → silk screen printing → leave standstill → bake preparatory baking → contraposition → exposure → development → check → back.This anti-welding operation is very complicated and time-consuming longer.
Therefore, in view of the application circumstances and the thicker characteristics of copper coin of industrial control board, need a kind of soldering-inhibiting method of high-quality high benefit, not seeing as yet at present has the correlative study report.
Summary of the invention
The objective of the invention is to the deficiency to prior art, a kind of soldering-inhibiting method to industrial control board is provided, this method is simple to operate, weak point consuming time, and cost is low, and anti-welding effective.
Above-mentioned purpose of the present invention is achieved through following scheme:
To the deficiency of existing soldering-inhibiting method, and consider the characteristics of industrial control board, the inventor improves existing soldering-inhibiting method, mainly is to carry out conceptual design and improvement to the following aspects:
(1), makes the silk screen printing of the suitable thick copper coin of viscosity after anti-solder ink stirs through optimizing the addition of diluent in the anti-solder ink;
(2), make that can guarantee that printing ink is complete in the screen printing process is applied to copper cash between plate face and adjacent lines equably through adjustment scraper angle, pressure and speed;
(3),, it is disappeared automatically or minimize through parking the mode that leaves standstill through with between circuit that produces in the screen printing process and base material and the bubble between copper face and base material;
(4), and can not influence the subsequent handling operation through the quality after preparatory the baking of plank of assurance silk-screen secondary printing ink.
The inventor is through the research to above-mentioned several aspects; Finally obtained a kind of soldering-inhibiting method of industrial control board; The operating process of this method is: bake → leave standstill in advance the industrial control board preliminary treatment → silk screen printing first time → leave standstill → first time → silk screen printing for the second time → leave standstill → roasting → contraposition → exposure → development → back is roasting in advance for the second time, and its concrete operations step is:
(1) industrial control board is carried out preliminary treatment;
(2) carry out the silk screen printing first time, silk screen printing is left standstill after finishing;
(3) carry out the first time and bake in advance, leave standstill behind roasting in advance the end;
(4) carry out the silk screen printing second time, silk screen printing is left standstill after finishing;
(5) carrying out the second time bakes in advance;
(6) behind preparatory for the second time roasting the end, industrial control board is carried out the roasting processing in contraposition, exposure, development and back successively.
The soldering-inhibiting method and the existing thick copper coin soldering-inhibiting method of above-mentioned industrial control board are compared; Can find that soldering-inhibiting method of the present invention is that circuit board is carried out twice silk screen printing continuously, leaves standstill and bakes in advance; And then continue contraposition, exposure, development and back and bake operation; Greatly simplify operating procedure, saved the time.
In the soldering-inhibiting method of above-mentioned a kind of industrial control board, roasting this several steps in the preliminary treatment of industrial control board, contraposition, exposure, development and back adopts routine operation of the prior art to get final product.
In the soldering-inhibiting method of above-mentioned a kind of industrial control board, the method for operation of twice silk screen printing also adopts the routine operation of prior art to get final product.
In the soldering-inhibiting method of above-mentioned a kind of industrial control board, silk screen printing is for the first time left standstill 20min after accomplishing, and beginning is roasting in advance for the first time, and roasting in advance condition is 74 ℃ * 10min; Behind roasting in advance for the first time the end, leave standstill 5min, beginning silk screen printing for the second time; Silk screen printing is for the second time left standstill 30min after finishing, and beginning is roasting in advance for the second time, and roasting in advance condition is 74 ℃ * 35min.
During silk screen printing, usually can add diluent in printing ink, to improve the performance of ink film in the printshop.Some can quicken diluent in the printing ink ink film curing or cause to solidify, and some can make, and bubble breaks, black matter is even, reduces the conjunctiva possibility.The inventor is through discovering; In the soldering-inhibiting method of above-mentioned a kind of industrial control board; No matter silk screen printing for the first time; Still silk screen printing for the second time, the diluent consumption of anti-solder ink all need be controlled at 100～120ml/kg, can make the silk screen printing of the suitable thick copper coin of viscosity after anti-solder ink stirs like this.
In silk screen printing; The speed of scraper, the angle of scraper and pressure also can have certain influence to printing effect, normally will require the parameter of scraper is selected according to the smooth degree of Workpiece printing, printing effect, ink characteristics, workpiece and black down amount.The inventor is through discovering, in the soldering-inhibiting method of above-mentioned a kind of industrial control board, scraper angle is selected 35～45 °, and scraper pressure is selected 5～8kg/cm
2, scraper speed is selected 2～4m/min, can obtain printing effect preferably.
To have industrial control board now and adopt method of the present invention to carry out anti-welding processing, and produce sheets thus obtained each item performance index and all can reach requirement:
(1) printing ink covers on circuit and the base material equably;
(2) industrial control board visual inspection meets the IPC-600G standard-required;
(3) the printing ink THICKNESS CONTROL exists on the industrial control board: 13～50um.
Compared with prior art, the present invention has following beneficial effect:
1. at present for the anti-welding technology of copper plate thickness＜2OZ, mature and stable in each side such as technological qualities, and also have variety of issue for the anti-welding technology of copper plate thickness >=2OZ; The present invention studies optimization to each step and parameter in the method on the basis of existing thick copper coin soldering-inhibiting method, finally obtain a kind of soldering-inhibiting method of industrial control board; This method only needs silk screen printing and in advance roasting two operations are improved; Ink thickness just can reach requirement of client, and anti-welding operation is simplified greatly, has practiced thrift the time; Reduced cost, and anti-welding effective;
2. adopt soldering-inhibiting method of the present invention that industrial control board is carried out anti-welding processing; Can reduce cost more than 6%, printing ink can cover on circuit and the base material equably, and visual inspection meets the IPC-600G standard-required; Ink thickness can be controlled in 13～50um, and the point that develops is 45～50%;
3. industrial control board soldering-inhibiting method of the present invention is also optimized the diluent consumption of anti-solder ink, has guaranteed that ink viscosity is 70～90PS, is fit to the silk screen printing of thick copper coin;
The present invention silk screen printing with in advance roasting after all adopted and left standstill operation, through parking the mode that leaves standstill, make between the circuit that produces in the silk-screen process and base material and the steam bubble between copper face and base material disappears automatically or minimizes.
Embodiment
Below in conjunction with specific embodiment the present invention is done description further, but specific embodiment is not done any qualification to the present invention.
Present embodiment carries out anti-welding processing to industrial control board; Its operating process is: bake → leave standstill in advance the industrial control board preliminary treatment → silk screen printing first time → leave standstill → first time → silk screen printing for the second time → leave standstill → roasting → contraposition → exposure → development → back is roasting in advance for the second time, and concrete steps are following:
(1) adopt existing routine operation that industrial control board is carried out preliminary treatment;
(2) pretreated industrial control board is carried out the silk screen printing first time; Add diluent commonly used in the anti-solder ink that the printshop is used, the addition of diluent is controlled at 100～120ml/kg, during silk screen printing; Scraper angle is selected 35～45 °, and scraper pressure is selected 5～8kg/cm
2, scraper speed is selected 2～4m/min, and those skilled in the art's routine operation is adopted in all the other operations of silk screen printing;
(3) after the silk screen printing for the first time, leave standstill 20min;
(4) roasting in advance for the first time, roasting in advance condition is 74 ℃ * 10min;
(5) after preparatory for the first time the baking, leave standstill 5min;
(6) beginning silk screen printing for the second time, the silk screen printing first time of the same step of operation (2) of silk screen printing for the second time;
(7) after the silk screen printing for the second time, leave standstill 30min;
(8) roasting in advance for the second time, roasting in advance condition is 74 ℃ * 35min;
(9) behind preparatory for the second time roasting the end, industrial control board is carried out the roasting processing in contraposition, exposure, development and back successively, the operation in these four steps all adopts those skilled in the art's routine operation to get final product.
Through the industrial control board that above-mentioned soldering-inhibiting method was handled, its each item performance index all can reach requirement:
(1) printing ink covers on circuit and the base material equably;
(2) industrial control board visual inspection meets the IPC-600G standard-required;
(3) the printing ink THICKNESS CONTROL exists on the industrial control board: 13～50um.
And this method is compared than the soldering-inhibiting method of traditional industrial control board, and cost can reduce more than 6%, and institute takes time and also significantly reduces.
Claims (1)
1. the soldering-inhibiting method of an industrial control board is characterized in that this method comprises the steps:
(1) industrial control board is carried out preliminary treatment;
(2) carry out the silk screen printing first time, silk screen printing is left standstill 20min after finishing;
(3) carry out the first time and bake in advance, roasting in advance condition is 74 ℃ * 10min, leaves standstill 5min behind roasting in advance the end;
(4) carry out the silk screen printing second time, silk screen printing is left standstill 30min after finishing;
(5) carry out the second time and bake in advance, roasting in advance condition is 74 ℃ * 35min;
(6) behind preparatory for the second time roasting the end, industrial control board is carried out the roasting processing in contraposition, exposure, development and back successively;
In the above-mentioned silk screen printing first time and the silk screen printing for the second time, the consumption of diluent is 100～120ml/kg in the anti-solder ink;
In the above-mentioned silk screen printing first time and the silk screen printing for the second time, scraper angle is 35～45 °, and scraper pressure is 5～8kg/cm
2, scraper speed is 2～4m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102587568A CN101977483B (en) | 2010-08-20 | 2010-08-20 | Welding resistance method for industrial control panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102587568A CN101977483B (en) | 2010-08-20 | 2010-08-20 | Welding resistance method for industrial control panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101977483A CN101977483A (en) | 2011-02-16 |
| CN101977483B true CN101977483B (en) | 2012-01-04 |
Family
ID=43577319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102587568A Active CN101977483B (en) | 2010-08-20 | 2010-08-20 | Welding resistance method for industrial control panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101977483B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510664B (en) * | 2011-10-18 | 2013-12-25 | 东莞生益电子有限公司 | Method for solving thin oil of circuit of PCB (printed circuit board) |
| CN103096633B (en) * | 2011-11-03 | 2015-10-07 | 深南电路有限公司 | Wiring board welding resistance method |
| CN102724818B (en) * | 2012-06-29 | 2015-03-11 | 奥士康精密电路（惠州）有限公司 | Solder mask green ink plugging method |
| CN102883546B (en) * | 2012-09-19 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | A kind of thick copper plate solder resistance technique |
| CN103496261B (en) * | 2013-09-23 | 2015-09-09 | 胜华电子（惠阳）有限公司 | A kind of screen printing method of thick copper coin |
| CN105307413A (en) * | 2015-10-29 | 2016-02-03 | 胜华电子（惠阳）有限公司 | Ultra-thick white oil circuit board screen-printing method |
| CN105555051B (en) * | 2016-01-25 | 2019-08-16 | 奥士康科技股份有限公司 | A kind of solder mask screen printing method |
| CN106211609B (en) * | 2016-07-27 | 2019-02-01 | 东莞万钧电子科技有限公司 | The screen printing method of thick copper printed circuit board |
| CN108668460B (en) * | 2017-03-29 | 2020-06-23 | 北大方正集团有限公司 | Circuit board solder mask processing method and circuit board |
| CN108990262B (en) * | 2018-03-20 | 2021-07-09 | 东莞市若美电子科技有限公司 | Manufacturing process of double-sided thick copper circuit board |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN109475045B (en) * | 2018-11-21 | 2020-06-23 | 奥士康精密电路（惠州）有限公司 | Method for controlling thickness of ink at line angle of board surface |
| CN110881247B (en) * | 2019-12-04 | 2022-02-18 | 东莞市若美电子科技有限公司 | Simple and reliable LED lamp panel ink color control method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481394A (en) * | 1987-09-24 | 1989-03-27 | Ibiden Co Ltd | Formation of photosolder resist film |
| CN101534612B (en) * | 2009-04-10 | 2011-03-16 | 深圳市博敏电子有限公司 | Resistance welding superposition technology for PCB thick copper lines |
| CN101670718B (en) * | 2009-09-29 | 2010-12-01 | 梅州博敏电子有限公司 | Method for printing printed circuit board double sided characters |
| CN101695219B (en) * | 2009-10-13 | 2011-08-17 | 惠州中京电子科技股份有限公司 | Selective immersion process of PCB |
| CN101795537A (en) * | 2010-03-09 | 2010-08-04 | 施吉连 | Solder mask printing technology of microwave high-frequency circuit board |
-
2010
- 2010-08-20 CN CN2010102587568A patent/CN101977483B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101977483A (en) | 2011-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101977483B (en) | Welding resistance method for industrial control panel | |
| CN102026494B (en) | Solder mask screen printing method | |
| CN102026495B (en) | Sheet welding preventing method | |
| CN110267457B (en) | Ink screen printing process of thick-copper white solder resist ink PCB | |
| CN102378499B (en) | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding | |
| CN105228353B (en) | A kind of printed circuit board solder mask jack process | |
| CN102387671B (en) | Manufacturing method for single face windowing hole plugging of tin spayed plate | |
| CN102883546A (en) | Thick copper plate solder resistance process | |
| CN105555051A (en) | Solder mask silk printing method | |
| CN102076176A (en) | A solder mask ink coating method | |
| CN108513451A (en) | A kind of production method of the wiring board through-hole solder mask consent depth more than 80% | |
| CN106102332B (en) | A kind of wiring board and its method for adhering film | |
| CN105263269A (en) | Control method of single-side mask opening hole and plumpness of hole clogging | |
| CN105101662A (en) | Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask | |
| CN104378925B (en) | Printed wiring board and its blending surface handling process | |
| CN105813393B (en) | Selective turmeric board manufacturing method | |
| CN103118496A (en) | Method for improving solder-mask cracking in heavy copper printed circuit boards | |
| CN103079355A (en) | PCB (printed circuit board) thick copper board ink printing method | |
| CN104902695A (en) | Solder resist manufacturing method of windowing taphole design | |
| CN107128091A (en) | One kind improves wet film dirty oil plate and falls oily technique | |
| CN109041443A (en) | A kind of pcb board prevents solder mask from entering the method in hole | |
| CN107351558A (en) | A kind of high water resistant mobile phone glass cover plate and its manufacturing process | |
| CN103687324A (en) | Thin plate solder mask printing method | |
| CN106061128A (en) | Printed circuit board and method of coating white oil on surface | |
| CN107215113A (en) | A kind of preparation method for laser carving bar code word white oil block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160128 Address after: 413000 Changchun Industrial Park, Ziyang District, Hunan, Yiyang Patentee after: AOSHIKANG TECHNOLOGY CO., LTD. Address before: 516200 Guangdong city in Huizhou province Xin Wei Zhen Patentee before: Aoshikang precision circuit (Huizhou) Co. Ltd. |