CN109041443A - A kind of pcb board prevents solder mask from entering the method in hole - Google Patents
A kind of pcb board prevents solder mask from entering the method in hole Download PDFInfo
- Publication number
- CN109041443A CN109041443A CN201811033993.7A CN201811033993A CN109041443A CN 109041443 A CN109041443 A CN 109041443A CN 201811033993 A CN201811033993 A CN 201811033993A CN 109041443 A CN109041443 A CN 109041443A
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- China
- Prior art keywords
- hole
- pcb board
- solder mask
- entering
- silk
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
Abstract
The invention belongs to pcb board manufacture field fields, disclose a kind of method that pcb board prevents solder mask from entering hole, including successively carry out nog plate step, silk-screen step, pre-baked step, contraposition step of exposure, development step and afterwards bake step, further include the vacuum step for detaching air in hole and ink being arranged between silk-screen step and pre-baked step.This method is improved to operation after silk-screen in the prior art, its principle is to be detached air in lid oilhole hole by using closed evacuator manufacture vacuum environment, to reduce ink residual, when development can sufficiently rinse out residual ink, the operating time is reduced, qualification rate is improved.
Description
Technical field
The present invention relates to pcb board manufacture field, especially a kind of pcb board prevents solder mask from entering the method in hole.
Background technique
For because certain customer requirements are when PCB installs plug-in unit original part, insert hole, the hole VIA (through-hole) does not allow oil at present
Ink enters hole, routinely using the production method of halftone shelves point in PCB welding resistance manufacturing process.
The production of existing PCB welding resistance is mainly according to " --- --- pre-baked --- contraposition of silk-screen exposes for nog plate pre-treatment
Light --- development --- is roasting afterwards " operating process successively handled.
Needed in silk-screen printing process using halftone catch point, its working principle is that it is white it is online with block glue by insert hole and the hole VIA
The part for not needing consent is blocked, and prevents ink from penetrating into hole in silk-screen printing process.
Such method is more universal in industry, and solder mask is made on PCB as CN 201510633473.X discloses kind
Method, reinforce solder mask by carrying out re-expose, while the first lightproof area and second are set on the secondary film
Lightproof area prevents the solder mask in via hole to be cured, then first pasted at welding resistance bridge red adhesive tape again carry out it is secondary aobvious
Shadow can completely remove remaining solder mask in via hole, and can guarantee that welding resistance bridge does not occur swelling because of redevelopment and whitens
The problem of.The area that the first shading region and the second shading region is arranged is greater than corresponding exposed position and covers the area in aperture at oil level,
It can effectively prevent when re-expose remaining solder mask solidification in via hole and be difficult to remove.Solder mask is made using this method
It can prevent from carrying out occurring the problem of solder mask pollutes heavy nickel gold face when heavy nickel golden watch surface treatment.
CN 201410685979.0 discloses a kind of solder mask production method, comprising the following steps: one substrate of offer,
Silk screen is applied on the copper foil of substrate, ink is coated on silk screen, takes out that silk screen, pasting protective film, vacuum press fastly, are cold on substrate
But, protective film, etching copper treatment, the foil section in addition to ink figure layer, the ink for removing copper foil surface, the solder mask are removed
After production method uses silk-screen printing, in solder mask surface pasting protective film, then in such a way that vacuum is pressed fastly, ink is flattened
It is whole, guarantee that the thickness of ink is uniform, and control the thickness of ink, to realize that ink thickness is adjustable according to production requirement, be applicable in
Property it is strong, automatization level degree is high, guarantees the qualification rate of product.
But the above method has several drawbacks in that:
1, it such as encounters in plank that hole count is more, aperture is small and ink easily enters hole in the case that distribution is more intensive, and make
Residual ink causes aperture to be developed not clean or ink cap bore unfavorable condition in pore-forming, it is difficult to meet customer need and fraction defective and
Scrap raising consumption manufacturing cost.
2, production jigsaw can not be too big, because silk-screen aligning accuracy requires height, be easy to cause deviation that ink is made to enter hole and ink
Cap bore.
Ink once complete cap bore, can be completely roasting dead by ink in hole during pre-baked, so that can not in development
Ink in hole is rinsed well, ink plug-hole is caused, is not able to satisfy customer requirement.
In conclusion do over again higher with scrappage in PCB production to the welding resistance manufacture craft for being not required to consent, product quality
It is greatly affected, production cost is big.
Summary of the invention
The object of the present invention is to provide a kind of pcb boards to prevent solder mask from entering the method in hole, and this method is to the prior art
In silk-screen after operate and improve, principle is will be in lid oilhole hole by using closed evacuator manufacture vacuum environment
Air detaches, to reduce ink residual, when development can sufficiently rinse out residual ink, reduce the operating time, improves qualification rate.
Technical solution provided by the invention are as follows: a kind of pcb board prevents solder mask from entering the method in hole, including what is successively carried out
Nog plate step, pre-baked step, aligns step of exposure, development step and bakes step afterwards silk-screen step, further includes that setting is walked in silk-screen
The vacuum step for detaching air in hole and ink between rapid and pre-baked step.
In the method that above-mentioned pcb board prevents solder mask from entering hole, in the vacuum step, time for vacuumizing
For 5~15min；Evacuated pressure: 7.84KPa~11.76KPa (absolute pressure).
Certainly, in practical applications, it is also what there is no problem that the pumpdown time is appropriately extended again, and vacuum degree is theoretically come
The lower say the better.
In the method that above-mentioned pcb board prevents solder mask from entering hole, in the vacuum step, by entire pcb board
It is placed in vacuum environment and carries out vacuum pumping.
This is also required, the accommodating chamber of vaccum-pumping equipment used in us should it is appropriate it is big a bit, to be sufficient to accommodate
Entire pcb board, especially big plate.
In the method that above-mentioned pcb board prevents solder mask from entering hole, need after the silk-screen step by pcb board
It stands and carries out vacuum step again for a period of time.
The main purpose of standing is to settle out solder mask, and the solder mask just printed is avoided to have mobility.
In the method that above-mentioned pcb board prevents solder mask from entering hole, the time of repose is 10-30min.
In practical applications, time of repose is more than and is also allowed for 20 minutes, such as 30 minutes or 40 minutes.
In the method that above-mentioned pcb board prevents solder mask from entering hole, the ratio of the diameter of the thickness and hole of the pcb board
Example≤10:1 is applicable.
In the method that above-mentioned pcb board prevents solder mask from entering hole, the diameter in the hole is 0.2mm~0.4mm.
In the method that above-mentioned pcb board prevents solder mask from entering hole, in the silk-screen step, pcb board upper and lower surface
Without being laid with catch point net.
The present invention is after adopting the above technical scheme, it has the beneficial effect that
1. it is mature and stable in various aspects such as technological qualities at present for conventional silk-screen technology, and complexity is set
There is also various problems for the technology that the plank and benefit of meter are promoted.And the present invention in existing silk-screen technical foundation and need to be only not required to
Add catch point twine to print, only need to increase a processing step, then every quality parameter, which can be achieved, can reach customer requirement, production effect
Rate is obviously improved, production technology operation simplifies, reduce production cost and quality appearance works well；
2. method of the invention can integrate 30% or more the production time of saving and qualification rate reaches 99.5% or more, effectively solve
Certainly it is bad to enter hole for ink, or even enters hole without ink, and appearance test meets IPC-A-600 standard requirements, and silk-screen effect can meet visitor
Family requires.
3. the print operation of existing catch point twine, when pore diameter range is in 0.2mm~0.4mm, difficulty is aligned in silk-screen printing process
Greatly, easily deviation is caused to enter hole.And method of the invention is by after with general white twine print, using evacuator by ink
It detaches, can effectively solve ink, to enter hole bad, or even enters hole without ink.
4. vacuumizing parameter using what is formulated in method of the invention: the pumpdown time: 5~15min；Evacuated pressure:
7.84KPa~11.76KPa can effectively meet thick to special pcb board, different pore size and closeness requirement, can effectively reach eventually
Hold client's quality requirements.And the process technology scheme not being modified now is unable to reach this functional effect at all.
5. compared with prior art, method of the invention simplifies catch point technology in the prior art, and increases and take out together
Vacuum step, it can effectively solve that ink caused by catch point silk-screen stand-off error enters hole problem, and ink in hole can be sucked out
The additional adjusting machine time of catch point net, stay in grade can be reduced using white twine print up to 99.5% or more, and in silk-screen printing process.
Specific embodiment
With reference to embodiment, technical solution of the present invention is described in further detail, but do not constituted pair
Any restrictions of the invention.
Embodiment 1
The pcb board of embodiment is made as the prior art, and concrete operations process is followed successively by " nog plate pre-treatment-silk-screen-pumping
Vacuum-is pre-baked-and contraposition exposure-development-is roasting afterwards ".
The specification for the pcb board that the present embodiment uses is 620*550mm；The pore diameter range of pcb board: 0.2mm~0.4mm；Plate
The thick aspect ratio with aperture: 10 ﹕ 1；
The substantially operation of nog plate pre-treatment are as follows: plank is put and roughly grinds plate face into Plate grinder, by the oxide layer of plate face, spot
It is removed completely with rubbish, while polishing plate face and providing condition for subsequent silk-screen.Plate grinder parameter: nog plate speed: 3.0 ± 0.2m/
min；Wear scar width: 12 ± 2mm.；
The substantially operation of silk-screen step are as follows: after the plank after nog plate is stood 10min cooling, poured into the ink modulated
Silk-screen is carried out in the halftone of screen printer.Silk-screen parameter: screen printer pressure: 2~7kg/cm2；Print speed printing speed: 2~7 lattice；Silk-screen is scraped
Nose angle degree: 2~15 DEG C；Halftone distance: 4~8mm.；
The concrete operations vacuumized are as follows:
1, using a kind of independent closed evacuator and time and pressure adjustable section, the evacuator is independent
Equipment, vacuumizing volume is 0.8m3.
2, after the silk-screen of plank two sides, it is necessary to carry out vacuum step again after standing 15min.
3, closed evacuator setting parameter is the pumpdown time: 15min；Evacuated pressure: 7.84KPa~
11.76KPa；
The substantially operation of pre-baked step are as follows: the plank after vacuumizing is put into pre- oven, effect is to carry out ink
Extra moisture and solvent are volatilized in solidification, provide basic condition for subsequent contraposition exposure.Pre-baked parameter: temperature setting 72
± 3 DEG C, the time is set as 49 ± 5min.；
Align the substantially operation of exposure are as follows: fix the film on CCD automatic exposure machine, the plank after pre-baked is cooling
Afterwards, it is put into the contraposition PAD progress ultraviolet exposure that four angles on plank are directed in exposure machine, exposure parameter: its principle is to utilize
Ultraviolet light is mapped to plank curing ink and polymerization reaction occurs by film light transmission part, forms one layer of hard and corrosion resistant protective layer,
And film light-blocking part sub-ink is not affected by ultraviolet irradiation, can be rinsed in subsequent development clean.Exposure parameter: exposure energy
Measure Fei Situ (stouffer) exposure guide rule: 9~13 grades of epiphragmas；Exposure table top temperature: 20 ± 4 DEG C；Expose table top suction :≤
650mmHg；Aligning accuracy: 30 ± 5um；
The substantially operation of development step are as follows: after the plank after exposure need to stand 15min, it is put into developing machine and develops,
Using the Na2CO3 developing solution of configuration, the part ink dissolution that do not irradiated by ultraviolet light is rinsed well.Photographic parameter:
Na2CO3 concentration 0.8~1.3%；Developing powder: 3.5~6.9 ± 0.5m/min；Development cylinder pressure: 2.0 ± 0.5kg/ is above pressed
Cm2,1.0 ± 0.5kg/cm2 is pushed；Development temperature: 30 ± 2 DEG C；Drying temperature: 55 ± 5 DEG C；
The substantially operation of step is baked afterwards are as follows: plank is put into oven → unlatching oven → setup parameter → baking sheet → and comes out of the stove.Its
Principle is to make solder mask that heat cure reaction occur by high-temperature baking, and the solvent in ink further volatilizees, reached
All solidstate degree, to meet the requirement of following process and client to pcb board electric property.Bake parameter afterwards: a point both ends are toasted, and first
Section setting are as follows: 90 ± 5 DEG C of temperature, 30 ± 5min of time；Second segment setting are as follows: 150 ± 5 DEG C of temperature, 60 ± 5min of time；It (asks
Supplement)；
By aforesaid operations, it can integrate and save the production time 30% and (predominantly reduction installation and debugging catch point net and do over again
Time) more than and qualification rate reach 99.5% or more, effectively solving ink, to enter hole bad, or even enters hole, appearance test without ink
Meet IPC-A-600 standard requirements, silk-screen effect can meet customer requirement.
And according to traditional operating method, product qualification rate is generally 80~90%；
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (8)
1. a kind of pcb board prevents solder mask from entering the method in hole, including the nog plate step, silk-screen step, pre-baked step successively carried out
Suddenly, align step of exposure, development step and bake step afterwards, which is characterized in that further include being arranged in silk-screen step and pre-baked step
Between the vacuum step for detaching air in hole and ink.
2. pcb board according to claim 1 prevents solder mask from entering the method in hole, which is characterized in that described vacuumizes
In step, the time vacuumized is 5~15min；Evacuated pressure: 7.84KPa~11.76KPa.
3. pcb board according to claim 2 prevents solder mask from entering the method in hole, which is characterized in that described vacuumizes
In step, entire pcb board is placed in vacuum environment and carries out vacuum pumping.
4. pcb board according to claim 1 to 3 prevents solder mask from entering the method in hole, which is characterized in that described
It needs to stand pcb board after silk-screen step and carries out vacuum step again for a period of time.
5. pcb board according to claim 4 prevents solder mask from entering the method in hole, which is characterized in that when the described standing
Between be 10-30min.
6. according to claim 1, pcb board described in 2,3 or 5 prevents solder mask from entering the method in hole, which is characterized in that described
Ratio≤10:1 of the diameter of the thickness and hole of pcb board.
7. pcb board according to claim 6 prevents solder mask from entering the method in hole, which is characterized in that the hole it is straight
Diameter is 0.2mm~0.4mm.
8. pcb board according to claim 1 prevents solder mask from entering the method in hole, which is characterized in that the silk-screen step
In rapid, pcb board upper and lower surface is not necessarily to be laid with catch point net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811033993.7A CN109041443A (en) | 2018-09-05 | 2018-09-05 | A kind of pcb board prevents solder mask from entering the method in hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811033993.7A CN109041443A (en) | 2018-09-05 | 2018-09-05 | A kind of pcb board prevents solder mask from entering the method in hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109041443A true CN109041443A (en) | 2018-12-18 |
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ID=64624189
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811033993.7A Pending CN109041443A (en) | 2018-09-05 | 2018-09-05 | A kind of pcb board prevents solder mask from entering the method in hole |
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| CN (1) | CN109041443A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056110A (en) * | 2021-02-26 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Novel machining method for plug-in hole of step groove of window with welded opening resistance |
| CN113068317A (en) * | 2021-03-09 | 2021-07-02 | 深圳市强达电路有限公司 | Back plate solder mask manufacturing method |
| CN113438809A (en) * | 2021-05-13 | 2021-09-24 | 江西景旺精密电路有限公司 | Manufacturing method for improving oil leakage of back drilling hole solder mask plug hole |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
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| CN201479474U (en) * | 2009-08-05 | 2010-05-19 | 天津普林电路股份有限公司 | Air box for removing hole-plugging ink of circuit board |
| CN205232587U (en) * | 2015-12-14 | 2016-05-11 | 东莞生益电子有限公司 | Blow hole machine |
| CN205793660U (en) * | 2016-05-09 | 2016-12-07 | 东莞美维电路有限公司 | PCB plate through hole degreasing unit |
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
-
2018
- 2018-09-05 CN CN201811033993.7A patent/CN109041443A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201479474U (en) * | 2009-08-05 | 2010-05-19 | 天津普林电路股份有限公司 | Air box for removing hole-plugging ink of circuit board |
| CN205232587U (en) * | 2015-12-14 | 2016-05-11 | 东莞生益电子有限公司 | Blow hole machine |
| CN205793660U (en) * | 2016-05-09 | 2016-12-07 | 东莞美维电路有限公司 | PCB plate through hole degreasing unit |
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056110A (en) * | 2021-02-26 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Novel machining method for plug-in hole of step groove of window with welded opening resistance |
| CN113068317A (en) * | 2021-03-09 | 2021-07-02 | 深圳市强达电路有限公司 | Back plate solder mask manufacturing method |
| CN113438809A (en) * | 2021-05-13 | 2021-09-24 | 江西景旺精密电路有限公司 | Manufacturing method for improving oil leakage of back drilling hole solder mask plug hole |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
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Application publication date: 20181218 |