CN105263269A - Control method of single-side mask opening hole and plumpness of hole clogging - Google Patents

Control method of single-side mask opening hole and plumpness of hole clogging Download PDF

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Publication number
CN105263269A
CN105263269A CN201510754444.9A CN201510754444A CN105263269A CN 105263269 A CN105263269 A CN 105263269A CN 201510754444 A CN201510754444 A CN 201510754444A CN 105263269 A CN105263269 A CN 105263269A
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CN
China
Prior art keywords
consent
baking
control method
plumpness
carry out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510754444.9A
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Chinese (zh)
Inventor
刘庆辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Pu Ruisen Electronics Co Ltd
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Sichuan Pu Ruisen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Pu Ruisen Electronics Co Ltd filed Critical Sichuan Pu Ruisen Electronics Co Ltd
Priority to CN201510754444.9A priority Critical patent/CN105263269A/en
Publication of CN105263269A publication Critical patent/CN105263269A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a control method of single-side mask opening hole and plumpness of hole clogging. The control method comprises the steps: S1 pre-processing: cleaning a board, removing the impurities and greasy dirt, and then performing sand blasting; S2 clogging holes by using aluminium sheets: according to the required aperture for hole clogging, selecting different bit diameter of the aluminium sheets to clogging the holes; S3 pre-baking: prebaking by placing a substrate in a tunnel baking oven, wherein the pre-baking temperature is 72-78DEG C and the baking time is 35-45min, and standing and cooling after baking; S4 using a film to perform hole position alignment, wherein the film is great than the holes to be clogged by 1-2mil; S5 developing: putting a circuit board in a developer to develop; S6 post-baking: backing the board in a plurality of segments; S7 grinding the board: conveying the circuit board to a non-woven board grinding device to grind the board, wherein the speed is 1.8-2.2m/min and the non-woven grinding roller speed is 200-500rpm; and S8 cleaning the surface: cleaning and drying the surface of the circuit board after board grinding, and then starting the resistance welding process. The control method of single-side mask opening hole and plumpness of hole clogging has the advantages of being high in the plumpness of hole clogging that the plumpness of hole clogging can reach 80% , and satisfying the production requirement for customers.

Description

Opening one side fenestra, consent plumpness control method
Technical field
The present invention relates to wiring board production technology, particularly opening one side fenestra, consent plumpness control method.
Background technology
Printed wiring board, being called for short printed board, is one of vitals of electronics industry.Almost often kind of electronic equipment, little of electronic watch, calculator, arrive computer greatly, communication electronic device, military issue weapons system, as long as there are the electronic devices and components such as integrated circuit, in order to the electric interconnection between them, all will use printed board.In relatively large electronic product research process, the most basic success factor is the design of the printed board of this product, documentation and manufacture.The Design and manufacture quality of printed board directly has influence on quality and the cost of whole product, even causes the success or failure of commercial competition.
Via, in order to reach customer requirement, the necessary consent of via, and require higher to consent plumpness, but existing jack process often cannot meet the demand of client.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, provide a kind of opening one side fenestra, consent plumpness control method, consent plumpness is high, can reach more than 80%, meets the Production requirement of client.
Object of the present invention is achieved through the following technical solutions: opening one side fenestra, consent plumpness control method, comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: consent aperture as requested, select different aluminium flake brills to chew diameter and carry out consent:
When customer requirement consent different pore size size all appears in a model, an aluminium flake can be combined into by above condition; Consent just makes special aeroscopic plate or general-purpose aeroscopic plate+aluminium flake in process, consent scraper select the thick 45 DEG C of corner slickers of 20mm or 20mm thick, scraper angle 10-15 DEG C during consent, speed 1.5-2.5m/min, during silk-screen consent, plumpness will reach 110%, rabbet ink uses surface requirements color and does not add out profit, aluminium flake consent direction: 1. consent need be windowed from one side and be designed non-face consent of windowing; 2. two sides all has one side to window design, selects the face consent of windowing few; 3. negative and positive layout design consent is from component side consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 72 ~ 78 DEG C, and baking time is 35 ~ 45min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 1 ~ 2mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 1.8 ~ 2.2m/min, and adhesive-bonded fabric roller speed is 200 ~ 500rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
In described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 58 ~ 62 DEG C, the baking sheet time is 15 ~ 25min; Second segment: baking sheet temperature is 78 ~ 82 DEG C, the baking sheet time is 15 ~ 25min; 3rd section: baking sheet temperature is 118 ~ 122 DEG C, the baking sheet time is 15 ~ 25min, and the total time of three sections of baking sheets is 60min.
In described step S8, also comprise the step of the wiring board of drying being carried out to QC inspection.
When described consent aperture is more than or equal to 0.65mm and is less than or equal to 0.8mm, use the aluminium flake that add little 0.1mm more overall than finished product aperture to bore and chew.
When described consent aperture is more than or equal to 0.45mm and is less than or equal to 0.6mm, the aluminium flake brill that diameter is 0.45mm is used to chew.
When described consent aperture is more than or equal to 0.25mm and is less than or equal to 0.4mm, the aluminium flake brill that diameter is 0.4mm is used to chew.
The present invention has the following advantages:
1, consent plumpness is high, can reach more than 80%, meets the Production requirement of client.
2, can solve and occur that the IC region half rabbet ink degree of depth is inadequate, client crosses in wave-soldering hole when at paster and produces gas backstreaming, IC is gone out the problem of specifying and pasting part position, can reduce gas backstreaming impulsive force when the degree of depth acquires a certain degree.
Embodiment
Below in conjunction with embodiment, the present invention will be further described, but protection scope of the present invention is not limited to the following stated.
[embodiment 1]:
Opening one side fenestra, consent plumpness control method, comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: when described consent aperture is more than or equal to 0.65mm and is less than or equal to 0.8mm, use the aluminium flake that add little 0.1mm more overall than finished product aperture to bore and chew, carry out consent; When customer requirement consent different pore size size all appears in a model, an aluminium flake can be combined into by above condition; Consent just makes special aeroscopic plate or general-purpose aeroscopic plate+aluminium flake in process, consent scraper select the thick 45 DEG C of corner slickers of 20mm or 20mm thick, scraper angle 10-15 DEG C during consent, speed 1.5-2.5m/min, during silk-screen consent, plumpness will reach 110%, rabbet ink uses surface requirements color and does not add out profit, aluminium flake consent direction: 1. consent need be windowed from one side and be designed non-face consent of windowing; 2. two sides all has one side to window design, selects the face consent of windowing few; 3. negative and positive layout design consent is from component side consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 78 DEG C, and baking time is 35min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 1mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 2.2m/min, and adhesive-bonded fabric roller speed is 500rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
In described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 62 DEG C, the baking sheet time is 20min; Second segment: baking sheet temperature is 78 DEG C, the baking sheet time is 25min; 3rd section: baking sheet temperature is 122 DEG C, the baking sheet time is 15min, and the total time of three sections of baking sheets is 60min.
In described step S8, also comprise the step of the wiring board of drying being carried out to QC inspection.
[embodiment 2]:
Opening one side fenestra, consent plumpness control method, comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: when consent aperture is more than or equal to 0.45mm and is less than or equal to 0.6mm, use the aluminium flake brill that diameter is 0.45mm to chew, carry out consent; When customer requirement consent different pore size size all appears in a model, an aluminium flake can be combined into by above condition; Consent just makes special aeroscopic plate or general-purpose aeroscopic plate+aluminium flake in process, consent scraper select the thick 45 DEG C of corner slickers of 20mm or 20mm thick, scraper angle 10-15 DEG C during consent, speed 1.5-2.5m/min, during silk-screen consent, plumpness will reach 110%, rabbet ink uses surface requirements color and does not add out profit, aluminium flake consent direction: 1. consent need be windowed from one side and be designed non-face consent of windowing; 2. two sides all has one side to window design, selects the face consent of windowing few; 3. negative and positive layout design consent is from component side consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 80 DEG C, and baking time is 40min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 1.5mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 2.0m/min, and adhesive-bonded fabric roller speed is 350rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
In described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 60 DEG C, the baking sheet time is 20min; Second segment: baking sheet temperature is 80 DEG C, the baking sheet time is 20min; 3rd section: baking sheet temperature is 120 DEG C, the baking sheet time is 20min, and the total time of three sections of baking sheets is 60min.
In described step S8, also comprise the step of the wiring board of drying being carried out to QC inspection.
[embodiment 3]:
Opening one side fenestra, consent plumpness control method, comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: when consent aperture is more than or equal to 0.25mm and is less than or equal to 0.4mm, use the aluminium flake brill that diameter is 0.4mm to chew, carry out consent; When customer requirement consent different pore size size all appears in a model, an aluminium flake can be combined into by above condition; Consent just makes special aeroscopic plate or general-purpose aeroscopic plate+aluminium flake in process, consent scraper select the thick 45 DEG C of corner slickers of 20mm or 20mm thick, scraper angle 10-15 DEG C during consent, speed 1.5-2.5m/min, during silk-screen consent, plumpness will reach 110%, rabbet ink uses surface requirements color and does not add out profit, aluminium flake consent direction: 1. consent need be windowed from one side and be designed non-face consent of windowing; 2. two sides all has one side to window design, selects the face consent of windowing few; 3. negative and positive layout design consent is from component side consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 725 DEG C, and baking time is 38min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 1.6mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 1.9m/min, and adhesive-bonded fabric roller speed is 400rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
In described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 561 DEG C, the baking sheet time is 15min; Second segment: baking sheet temperature is 80 DEG C, the baking sheet time is 20min; 3rd section: baking sheet temperature is 120 DEG C, the baking sheet time is 25min, and the total time of three sections of baking sheets is 60min.
In described step S8, also comprise the step of the wiring board of drying being carried out to QC inspection.
[embodiment 4]:
Opening one side fenestra, consent plumpness control method, comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: when consent aperture is more than or equal to 0.25mm and is less than or equal to 0.4mm, use the aluminium flake brill that diameter is 0.4mm to chew, carry out consent; When customer requirement consent different pore size size all appears in a model, an aluminium flake can be combined into by above condition; Consent just makes special aeroscopic plate or general-purpose aeroscopic plate+aluminium flake in process, consent scraper select the thick 45 DEG C of corner slickers of 20mm or 20mm thick, scraper angle 10-15 DEG C during consent, speed 1.5-2.5m/min, during silk-screen consent, plumpness will reach 110%, rabbet ink uses surface requirements color and does not add out profit, aluminium flake consent direction: 1. consent need be windowed from one side and be designed non-face consent of windowing; 2. two sides all has one side to window design, selects the face consent of windowing few; 3. negative and positive layout design consent is from component side consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 72 DEG C, and baking time is 45min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 2mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 1.8m/min, and adhesive-bonded fabric roller speed is 200rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
In described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 58 DEG C, the baking sheet time is 25min; Second segment: baking sheet temperature is 82 DEG C, the baking sheet time is 15min; 3rd section: baking sheet temperature is 118 DEG C, the baking sheet time is 20min, and the total time of three sections of baking sheets is 60min.
In described step S8, also comprise the step of the wiring board of drying being carried out to QC inspection.

Claims (6)

1. opening one side fenestra, consent plumpness control method, is characterized in that: comprise the following steps:
S1, pre-treatment: cleaning plate face, removing impurity greasy dirt, and ensure that plate face is dry, then carry out blasting treatment;
S2, aluminium flake consent: consent aperture as requested, select different aluminium flake brills to chew diameter and carry out consent;
S3, pre-baked: substrate is put into tunnel oven and carry out pre-baked, pre-baked temperature is 72 ~ 78 DEG C, and baking time is 35 ~ 45min, leave standstill cooling after coming out of the stove;
S4, hole point contraposition: use the film of the large 1 ~ 2mil of contrast boring ratio consent to carry out contraposition;
S5, development: wiring board is put into developing machine and develops;
S6, rear roasting: to adopt multistage to carry out baking sheet;
S7, nog plate: wiring board is sent in adhesive-bonded fabric Plate grinder and carry out nog plate, speed is 1.8 ~ 2.2m/min, and adhesive-bonded fabric roller speed is 200 ~ 500rpm;
S8, removing surface: cleaned in the wiring board plate face after nog plate, dry, enter welding resistance operation.
2. opening one side fenestra according to claim 1, consent plumpness control method, is characterized in that: in described step S6, point three sections of baking sheets: first paragraph: baking sheet temperature is 58 ~ 62 DEG C, and the baking sheet time is 15 ~ 25min; Second segment: baking sheet temperature is 78 ~ 82 DEG C, the baking sheet time is 15 ~ 25min; 3rd section: baking sheet temperature is 118 ~ 122 DEG C, the baking sheet time is 15 ~ 25min, and the total time of three sections of baking sheets is 60min.
3. opening one side fenestra according to claim 1, consent plumpness control method, is characterized in that: in described step S8, also comprises the step of the wiring board of drying being carried out to QC inspection.
4. opening one side fenestra according to claim 1, consent plumpness control method, is characterized in that: when described consent aperture is more than or equal to 0.65mm and is less than or equal to 0.8mm, uses the aluminium flake that add little 0.1mm more overall than finished product aperture to bore and chews.
5. opening one side fenestra according to claim 1, consent plumpness control method, is characterized in that: when described consent aperture is more than or equal to 0.45mm and is less than or equal to 0.6mm, uses the aluminium flake brill that diameter is 0.45mm to chew.
6. opening one side fenestra according to claim 1, consent plumpness control method, is characterized in that: when described consent aperture is more than or equal to 0.25mm and is less than or equal to 0.4mm, uses the aluminium flake brill that diameter is 0.4mm to chew.
CN201510754444.9A 2015-11-09 2015-11-09 Control method of single-side mask opening hole and plumpness of hole clogging Pending CN105263269A (en)

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CN201510754444.9A CN105263269A (en) 2015-11-09 2015-11-09 Control method of single-side mask opening hole and plumpness of hole clogging

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916306A (en) * 2016-05-19 2016-08-31 湖北龙腾电子科技有限公司 PCB jack panel segmented panel baking method
CN106550550A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of anti-welding one side windowing via manufacture method
CN107046774A (en) * 2017-03-07 2017-08-15 惠州中京电子科技有限公司 A kind of method of the anti-welding bleeds of improvement PCB
CN110557895A (en) * 2019-10-17 2019-12-10 昆山虹灿光电材料有限公司 Method for selecting ink in large-aperture PCB (printed Circuit Board) selection process
CN112566374A (en) * 2020-11-16 2021-03-26 奥士康科技股份有限公司 Control method for solder mask plug hole of PCB double-sided mechanical back drilling
CN113038728A (en) * 2021-05-27 2021-06-25 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method
CN113677095A (en) * 2021-08-17 2021-11-19 东莞市若美电子科技有限公司 Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging

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JP2004266216A (en) * 2003-03-04 2004-09-24 Cmk Corp Method for sealing through hole
CN101378629A (en) * 2008-09-28 2009-03-04 深圳崇达多层线路板有限公司 Method for processing resistance welding milling point
CN102724818A (en) * 2012-06-29 2012-10-10 奥士康精密电路(惠州)有限公司 Solder mask green ink plugging method
CN103415164A (en) * 2013-08-30 2013-11-27 武汉七零九印制板科技有限公司 Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink

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Publication number Priority date Publication date Assignee Title
JP2004266216A (en) * 2003-03-04 2004-09-24 Cmk Corp Method for sealing through hole
CN101378629A (en) * 2008-09-28 2009-03-04 深圳崇达多层线路板有限公司 Method for processing resistance welding milling point
CN102724818A (en) * 2012-06-29 2012-10-10 奥士康精密电路(惠州)有限公司 Solder mask green ink plugging method
CN103415164A (en) * 2013-08-30 2013-11-27 武汉七零九印制板科技有限公司 Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105916306A (en) * 2016-05-19 2016-08-31 湖北龙腾电子科技有限公司 PCB jack panel segmented panel baking method
CN106550550A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of anti-welding one side windowing via manufacture method
CN107046774A (en) * 2017-03-07 2017-08-15 惠州中京电子科技有限公司 A kind of method of the anti-welding bleeds of improvement PCB
CN110557895A (en) * 2019-10-17 2019-12-10 昆山虹灿光电材料有限公司 Method for selecting ink in large-aperture PCB (printed Circuit Board) selection process
CN112566374A (en) * 2020-11-16 2021-03-26 奥士康科技股份有限公司 Control method for solder mask plug hole of PCB double-sided mechanical back drilling
CN113038728A (en) * 2021-05-27 2021-06-25 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method
CN113038728B (en) * 2021-05-27 2021-08-03 四川英创力电子科技股份有限公司 Printed circuit board via hole half-windowing processing device and processing method
CN113677095A (en) * 2021-08-17 2021-11-19 东莞市若美电子科技有限公司 Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging
CN113677095B (en) * 2021-08-17 2022-05-31 东莞市若美电子科技有限公司 Manufacturing method of circuit board with air guide plate special for hole plugging printing replacing white paper hole plugging

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