CN104411119A - Method for processing reddening of circuit board solder mask conducting holes - Google Patents
Method for processing reddening of circuit board solder mask conducting holes Download PDFInfo
- Publication number
- CN104411119A CN104411119A CN201410593155.0A CN201410593155A CN104411119A CN 104411119 A CN104411119 A CN 104411119A CN 201410593155 A CN201410593155 A CN 201410593155A CN 104411119 A CN104411119 A CN 104411119A
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- CN
- China
- Prior art keywords
- welding via
- wiring board
- rubescent
- processing method
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a method for processing reddening of circuit board solder mask conducting holes. The method comprises the following steps: (1), according to aperture size of the solder mask conducting holes of a circuit board which is returned for washing and reworking, manufacturing a corresponding screen; (2), uniformly coating printing ink on the screen; (3), prebaking; (4), exposing and solidifying; (5), developing; and (6) baking. According to the invention, the 48T screen for coating is utilized to cooperate with the printing ink with the viscosity of 120 to 150 dpa.s, such that the printing ink is firmly adhered to a corresponding position of the circuit board, printing ink bubbles are prevented, and the aligning time of the solder mask conducting holes during printing of the screen is reduced; the work efficiency is enhanced, the time for processing the reddening of the solder mask conducting holes is shortened, and the processing process is optimized; and at the same time, waste of the printing ink is effectively reduced during a reworking process, the production cost is decreased, and the quality of the circuit board after reworking is improved.
Description
Technical field
The invention belongs to wiring board technical field of producing, be specifically related to the processing method that the anti-welding via of a kind of wiring board is rubescent.
Background technology
At present, in conventional wiring board production technology, needing to print one deck anti-solder ink in the circuit board, for preventing the soldered upper wiring board in position not needing to weld, playing the protective effect of wiring board till now.But in the anti-welding printing process of wiring board, because consent is not full, rabbet ink is completely not through to the back side, easily cause jack position part via hole rubescent, exceeding quality and permit receipts standard, cause batch to move back and wash heavy industry, after doing over again, carrying out next step production from newly putting into next step operation.And carry out moving back the process complexity of washing heavy industry, treatment effeciency poor efficiency for the rubescent needs of the anti-welding via of those wiring boards in existing line plate technique, and waste ink, add the production cost of enterprise.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is the processing method that a kind of operating efficiency is high, the anti-welding via of wiring board of minimizing ink waste is rubescent.
In order to solve the problems of the technologies described above, the present invention adopts following scheme to realize: the processing method that the anti-welding via of a kind of wiring board is rubescent, comprises the steps:
(1) corresponding half tone is made according to the pore size moving back the anti-welding via washing the wiring board of doing over again;
(2) ink is coated on half tone uniformly;
(3) pre-baked;
(4) exposure curing;
(5) develop;
(6) toast.
As improvement of the present invention, the half tone employing order number described in step (1) is that the screen cloth of 48T is made.
As improvement of the present invention, the diameter 6mil larger than the diameter of anti-welding via crossing ink hole corresponding with wiring board anti-welding via position in described screen cloth.
As improvement of the present invention, the ink viscosity described in step (2) controls at 120 ~ 150dpa.s.
As improvement of the present invention, pre-baked condition control described in step (3) is: temperature is: 70 ~ 80 DEG C, and the time is: 15 ~ 20min.
As improvement of the present invention, described in step (4), the concrete steps of exposure curing are: use the negative film blast hole film that the anti-welding via of jack position and the ink on limit, hole are passed through exposure curing.
As improvement of the present invention, the described negative film blast hole film is provided with the exposure hole corresponding with anti-welding via position, the diameter 4mil larger than the diameter of anti-welding via of exposure hole.
As improvement of the present invention, the condition control of baking in step (6) is: temperature is: 150 ~ 160 DEG C, and the time is: 58 ~ 68min.
Compared with prior art, the present invention by use 48T half tone coating and viscosity be 120 ~ 150dpa.s ink cooperation, make ink be tightly adhered to the corresponding position of wiring board, prevent bubbles of ink, decrease the position aligning time of anti-welding via during screen painting; Improve operating efficiency, decrease the processing time that the anti-welding via of wiring board is rubescent, optimize treatment process; Effectively can reduce the waste of ink in process of rework, save production cost, the anti-welding via after process is smooth and regular, improves the quality of anti-welding via simultaneously, improve wiring board do over again after quality.
Embodiment
In order to allow those skilled in the art understand technical scheme of the present invention better, below in conjunction with specific embodiment, the present invention is further elaborated.
The processing method that the anti-welding via of wiring board is rubescent, comprises the steps:
(1) corresponding half tone is made according to the pore size moving back the anti-welding via washing the wiring board of doing over again.Half tone employing order number is that the screen cloth of 48T is made, and can prevent from producing bubble in printing process.Half tone was provided with ink hole, and the position in this ink hole is corresponding with the position of the anti-welding via on wiring board, and crosses the diameter 6mil larger than the diameter of anti-welding via in ink hole.Anti-welding via, from half tone crossing ink hole by being printed on wiring board, and to cover, to reduce the waste of ink by ink completely.
(2) wiring board that anti-welding via is rubescent is placed on coating machine, and the half tone made in logical step (1) by Ink Application in the circuit board.In order to make ink better adhere in the circuit board, improve ink adhesive force in the circuit board, control at 120 ~ 150dpa.s by the viscosity of ink in production process, its medium viscosity is the best results of 140dpa.s, and performance is best.
(3) pre-baked.Coated wiring board being put into baking oven pre-baked, by the solvent evaporation on ink, making film reach the state of not sticky end sheet when exposing, so that operation below carries out processing process.The condition of preexamination controls: temperature is: 70 ~ 80 DEG C, and the time is: 15 ~ 20min.It is 73 DEG C that wherein pre-baked temperature controls, and the time of baking is 15min, makes the finger on wiring board touch dry and comfortable degree and aridity is applicable to, modest viscosity, can not produce adhesion when pasting the negative film blast hole film.
(4) exposure curing.Use the negative film blast hole film that the ink on the anti-welding via of jack position and limit, hole is passed through exposure curing, improve the electrical property of wiring board.When adopting negative film exposure film exposure curing, the negative film blast hole film is provided with the exposure hole corresponding with anti-welding via position, the diameter 4mil larger than the diameter of anti-welding via of exposure hole, can leave the spacing of 4mil on the anti-welding via limit of wiring board after making exposure curing.
(5) develop.Unexposed ink is removed, leaves the ink needing to retain.Make the aperture of anti-welding via smooth and regular.
(6) toast.Wiring board is put into baking oven and carries out baking-curing, heat ink is hardened becomes molecule crosslinked state, to reach final Physical properties of coating film and voltinism.The condition of baking controls: temperature is: 150 ~ 160 DEG C, and the time is: 58 ~ 68min.It is 154 DEG C that wherein pre-baked temperature controls, and the time of baking is 60min, descends the best, after baking, can reach good anti-welding effect.
Above-described embodiment is only wherein specific implementation of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these apparent replacement forms all belong to protection scope of the present invention.
Claims (8)
1. the processing method that the anti-welding via of wiring board is rubescent, is characterized in that, comprise the steps:
(1) corresponding half tone is made according to the pore size moving back the anti-welding via washing the wiring board of doing over again;
(2) ink is coated on half tone uniformly;
(3) pre-baked;
(4) exposure curing;
(5) develop;
(6) toast.
2. the processing method that the anti-welding via of wiring board according to claim 1 is rubescent, is characterized in that, the half tone employing order number described in step (1) is that the screen cloth of 48T is made.
3. the processing method that the anti-welding via of wiring board according to claim 2 is rubescent, is characterized in that, the diameter 6mil larger than the diameter of anti-welding via crossing ink hole corresponding with wiring board anti-welding via position in described screen cloth.
4. the processing method that the anti-welding via of wiring board according to claim 1 is rubescent, is characterized in that, the ink viscosity described in step (2) controls at 120 ~ 150dpa.s.
5. the processing method that the anti-welding via of wiring board according to claim 1 is rubescent, is characterized in that, pre-baked condition control described in step (3) is: temperature is: 70 ~ 80 DEG C, and the time is: 15 ~ 20min.
6. the processing method that the anti-welding via of wiring board according to claim 1 is rubescent, it is characterized in that, described in step (4), the concrete steps of exposure curing are: use the negative film blast hole film that the anti-welding via of jack position and the ink on limit, hole are passed through exposure curing.
7. the processing method that the anti-welding via of wiring board according to claim 6 is rubescent, is characterized in that, the described negative film blast hole film is provided with the exposure hole corresponding with anti-welding via position, the diameter 4mil larger than the diameter of anti-welding via of exposure hole.
8. the processing method that the anti-welding via of wiring board according to claim 1 is rubescent, is characterized in that, the condition control of baking in step (6) is: temperature is: 150 ~ 160 DEG C, and the time is: 58 ~ 68min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410593155.0A CN104411119A (en) | 2014-10-30 | 2014-10-30 | Method for processing reddening of circuit board solder mask conducting holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410593155.0A CN104411119A (en) | 2014-10-30 | 2014-10-30 | Method for processing reddening of circuit board solder mask conducting holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411119A true CN104411119A (en) | 2015-03-11 |
Family
ID=52648699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410593155.0A Pending CN104411119A (en) | 2014-10-30 | 2014-10-30 | Method for processing reddening of circuit board solder mask conducting holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411119A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550550A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of anti-welding one side windowing via manufacture method |
| CN106982512A (en) * | 2017-05-22 | 2017-07-25 | 博敏电子股份有限公司 | A kind of bad reworking method of circuit board finished product welding resistance consent |
| CN109257878A (en) * | 2018-09-21 | 2019-01-22 | 珠海杰赛科技有限公司 | A kind of method of welding resistance consent |
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5210940A (en) * | 1990-07-24 | 1993-05-18 | Nippon Cmk Corp. | Method of producing a printed circuit board |
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102510664A (en) * | 2011-10-18 | 2012-06-20 | 东莞生益电子有限公司 | Method for solving thin oil of circuit of PCB (printed circuit board) |
-
2014
- 2014-10-30 CN CN201410593155.0A patent/CN104411119A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5210940A (en) * | 1990-07-24 | 1993-05-18 | Nippon Cmk Corp. | Method of producing a printed circuit board |
| CN102378499A (en) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Method for manufacturing window plug holes at two sides during PCB (Printed Circuit Board) resistance welding |
| CN102510664A (en) * | 2011-10-18 | 2012-06-20 | 东莞生益电子有限公司 | Method for solving thin oil of circuit of PCB (printed circuit board) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550550A (en) * | 2016-10-26 | 2017-03-29 | 广东骏亚电子科技股份有限公司 | A kind of anti-welding one side windowing via manufacture method |
| CN106982512A (en) * | 2017-05-22 | 2017-07-25 | 博敏电子股份有限公司 | A kind of bad reworking method of circuit board finished product welding resistance consent |
| CN109257878A (en) * | 2018-09-21 | 2019-01-22 | 珠海杰赛科技有限公司 | A kind of method of welding resistance consent |
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20150311 |