CN107949177B - Method for manufacturing printed circuit by full addition - Google Patents
Method for manufacturing printed circuit by full addition Download PDFInfo
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- CN107949177B CN107949177B CN201711251977.0A CN201711251977A CN107949177B CN 107949177 B CN107949177 B CN 107949177B CN 201711251977 A CN201711251977 A CN 201711251977A CN 107949177 B CN107949177 B CN 107949177B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a printed circuit by full addition, which comprises the following steps: providing a conductive via on a substrate; printing screen printing insulating materials through an insulating support layer to form the insulating support layer on the substrate; a circuit pattern is formed on the substrate by printing a conductive paste through the conductive layer. The method for manufacturing the circuit board through screen printing addition can greatly reduce the process steps, reduce the material usage, save the field and the working hours, reduce the environmental pollution, improve the reliability and the yield of the product and increase the economic benefit.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a printed circuit by full addition.
Background
The traditional circuit board production process is a subtraction process: the conductive circuit is formed by printing a circuit pattern on a copper foil by using etching-resistant ink through a selective exposure and development method, removing most of the copper foil which is not covered with the etching-resistant ink by using a corrosive agent, and stripping the etching-resistant ink covered on the circuit by using different corrosive agents to form the conductive circuit; the insulating layer between the circuit layers is formed by a heating and pressing method, does not have a conductive through hole, needs to be drilled at the later stage and is metalized by electroplating or chemical plating holes; the solder mask ink also leaves solder joints by selective exposure and development.
From the aspect of materials, most or all of the copper foil and the etching-resistant ink used in the subtractive process are removed; and a large amount of a developer, a corrosive agent, and the like, which are toxic and harmful chemicals, are required to form the conductive pattern and the solder resist pattern.
As seen from the process aspect, exposure, development, etching and hole metallization require a lot of equipment, labor and space, and the production cycle is extended. These add significant cost and pose a serious environmental hazard. The insulating layer directly covers the circuit layer, the circuit layer has no other support, the circuit layer is easy to displace in the pressing process, the circuit board is not flat, and the circuit is bent, so that the reliability and yield of the product are reduced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a printed circuit board by full addition, which manufactures the circuit board by screen printing addition and solves the problems of complex process steps, material waste, labor hour consumption, large environmental pollution, poor product reliability and poor yield of the prior art.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a method of full-additive manufacturing of printed circuits, comprising the steps of: providing a conductive via on a substrate; printing screen printing insulating materials through an insulating support layer to form the insulating support layer on the substrate; a circuit pattern is formed on the substrate by printing a conductive paste through the conductive layer.
Further, the method also comprises the following steps: printing a screen printing solder resist material through the solder resist layer to form the solder resist layer on the circuit pattern; and printing screen printing ink through the marking layer to form characters or/and marks on the solder mask layer.
Further, an insulating support layer is complementary to the circuit pattern, and the insulating support layer serves to support and protect the circuit pattern.
Further, the printing and screen printing of the insulating material through the insulating support layer to form the insulating support layer on the substrate includes the following steps: covering the insulating support layer printing silk screen on the surface of the substrate; adding an insulating material to the insulating support layer printing screen; spreading an insulating material on the printing silk screen of the insulating support layer by using a scraper so that the insulating material penetrates through the printing silk screen of the insulating support layer to form the insulating support layer on the substrate; the insulating support layer is cured on the substrate by photo-irradiation and/or thermal curing of the insulating support layer. The insulating support layer is provided with a concave pattern; and filling the conductive paste into the recessed pattern to form a circuit pattern.
Further, the method for forming a circuit pattern on a substrate by printing and screen printing conductive paste through a conductive layer includes the steps of: covering a conductive layer printing silk screen on the surface of the substrate on which the insulating support layer is positioned; adding a conductive paste to the conductive layer printing screen; spreading the conductive paste on the conductive layer printing silk screen by using a scraper, so that the conductive paste penetrates through the conductive layer printing silk screen to form a circuit pattern in the recessed pattern of the insulating supporting layer on the substrate; the circuit pattern is cured on the substrate by light irradiation and/or heat curing of the circuit pattern.
Further, the method also comprises the following steps: repeatedly and circularly executing the steps of printing and printing the conductive paste through the conductive layer, forming the circuit pattern on the substrate and printing the conductive paste through the conductive layer, and forming the circuit pattern on the substrate for a plurality of times, so that a plurality of circuit layers consisting of the insulating support layer and the circuit pattern are formed on the surface of the substrate; printing an insulating layer on the circuit layer of each layer through an insulating layer printing silk screen; the insulating support layer printing silk screen, the conducting layer printing silk screen and the insulating layer printing silk screen are respectively provided with a conducting through hole printing-free pattern, and the conducting through hole printing-free pattern is used for preventing the position of the conducting through hole from being printed; and printing the conductive paste into the conductive through holes by using the conductive through hole conduction silk screen to form electric connection between the circuit layers of different layers.
Further, the insulating support layer printing screen and the conducting layer printing screen are provided with conducting through hole printing-free patterns, and the conducting through hole printing-free patterns prevent the positions of the conducting through holes from being printed during printing.
Further, the substrate is made of an insulating material.
Further, the substrate is made of a resin material.
A method of full-additive manufacturing of printed circuits, comprising the steps of: printing screen printing insulating materials through an insulating support layer to form the insulating support layer on the substrate; the printing silk screen of the insulating support layer is provided with a conductive through hole printing-free pattern, and the conductive through hole printing-free pattern enables the insulating material to form a conductive through hole reserved position on the substrate; drilling a conductive through hole at the reserved position of the conductive through hole on the substrate through a drill bit; printing and printing conductive paste through the conductive layer to form a circuit pattern on the substrate; the conductive layer printing silk screen is provided with a conductive through hole printing-free pattern; the circuit pattern is complementary with the insulating support layer, and the insulating support layer is used for supporting and protecting the circuit pattern; filling an insulating filling material into the conductive through hole; printing a screen printing solder resist material through the solder resist layer to form the solder resist layer on the circuit pattern; and printing screen printing ink through the marking layer to form characters or/and marks on the solder mask layer.
The invention has the beneficial effects that:
the method for manufacturing the circuit board through screen printing addition can greatly reduce the process steps, reduce the material usage, save the field and the working hours, reduce the environmental pollution, improve the reliability and the yield of the product and increase the economic benefit.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of the present invention.
Fig. 2 is a schematic flow chart of another embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a circuit board manufactured by the invention.
Detailed Description
The invention is further illustrated below with reference to the figures and examples.
As shown in fig. 1, a method of full-additive manufacturing of a printed circuit comprises the steps of:
s11: conductive vias are provided on the substrate. The substrate is made of an insulating material; preferably, the substrate is made of a resin material.
S12: the insulating support layer is formed on the substrate by printing a screen printing insulating material through the insulating support layer.
S13: a circuit pattern is formed on the substrate by printing a conductive paste through the conductive layer.
The insulating support layer is complementary with the circuit pattern and is used for supporting and protecting the circuit pattern; that is, the insulating support layer allows a recessed pattern of a circuit pattern to be formed on the surface of the substrate, and the conductive layer printing screen fills the conductive paste in the recessed pattern; and forming a circuit pattern after the conductive paste is cured under the support of the concave pattern. The insulating support layer printing silk screen and the conducting layer printing silk screen are provided with conducting through hole printing-free patterns, and the conducting through hole printing-free patterns prevent the positions of the conducting through holes from being printed during printing.
S14: a solder resist material is screen printed by the solder resist layer, and the solder resist layer is formed on the circuit pattern.
S15: and printing screen printing ink through the marking layer to form characters or/and marks on the solder mask layer.
Screen printing belongs to stencil printing and is known as four major printing methods together with lithographic, embossing and gravure printing. The stencil printing includes stencil printing, spray printing, screen printing, etc. The principle of stencil printing is that when a printing plate (a paper film plate or a plate base of other plates is provided with holes through which ink and other materials can pass) is printed, the ink is transferred to a printing stock (paper, ceramics and the like) through the holes of the stencil plate by certain pressure to form images or characters.
When printing, the material such as ink is transferred to the printing stock through the meshes of the image-text part by the extrusion of the scraper, and the image-text is formed like the original manuscript. The screen printing equipment is simple, the operation is convenient, the printing and the plate making are simple and easy, the cost is low, and the adaptability is strong.
Specifically, step S12 includes the steps of:
s121: an insulating support layer is printed silk-screened over the substrate surface.
S122: an insulating material is added to the insulating support layer printing screen.
S123: and spreading the insulating material on the printing silk screen of the insulating support layer by adopting a scraper so that the insulating material penetrates through the printing silk screen of the insulating support layer to form the insulating support layer on the substrate.
S124: the insulating support layer is cured on the substrate by photo-irradiation and/or thermal curing of the insulating support layer.
Specifically, step S3 includes the steps of:
s131: a conductive layer printing screen is laid over the surface of the substrate on which the insulating support layer is located.
S132: the conductive paste is added to the conductive layer printing screen.
S133: and spreading the conductive paste on the conductive layer printing silk screen by using a scraper so that the conductive paste penetrates through the conductive layer printing silk screen to form a circuit pattern in the recessed pattern of the insulating supporting layer on the substrate.
S134: the circuit pattern is cured on the substrate by light irradiation and/or heat curing of the circuit pattern.
In another embodiment, the following steps are further included between step S13 and step S14:
s101: the steps S12 and S13 are repeatedly and cyclically performed several times so that several circuit layers composed of an insulating support layer and a circuit pattern are formed on the surface of the substrate. And printing an insulating layer on the circuit layer of each layer through an insulating layer printing screen.
The insulating support layer printing silk screen, the conducting layer printing silk screen and the insulating layer printing silk screen are respectively provided with a conducting through hole printing-free pattern, and the conducting through hole printing-free pattern is used for preventing the position of the conducting through hole from being printed.
S102: and printing the conductive paste into the conductive through holes by using the conductive through hole conduction silk screen to form electric connection between the circuit layers of different layers.
In another embodiment, shown in fig. 2, a method of full additive manufacturing of a printed circuit comprises the steps of:
s21: the insulating support layer is formed on the substrate by printing a screen printing insulating material through the insulating support layer.
The substrate is made of an insulating material; preferably, the substrate is made of a resin material. The printing silk screen of the insulating support layer is provided with a conductive through hole printing-free pattern, and the conductive through hole printing-free pattern enables the insulating material to form a conductive through hole reserved position on the substrate.
S22: and drilling the conductive through hole at the reserved position of the conductive through hole on the substrate by a drill.
S23: a circuit pattern is formed on the substrate by printing a conductive paste through the conductive layer.
The conductive layer printing screen has a conductive through hole print-free pattern. The circuit pattern is complementary with the insulating support layer, and the insulating support layer is used for supporting and protecting the circuit pattern; that is, the insulating support layer allows a recessed pattern of a circuit pattern to be formed on the surface of the substrate, and the conductive layer printing screen fills the conductive paste in the recessed pattern to form the circuit pattern.
S24: and filling an insulating filling material into the conductive through holes. Preferably, the insulating filling material is a resin material.
S25: a solder resist material is screen printed by the solder resist layer, and the solder resist layer is formed on the circuit pattern.
S26: and printing screen printing ink through the marking layer to form characters or/and marks on the solder mask layer.
Specifically, the substrate is printed on one side or both sides.
The invention manufactures the circuit board by screen printing addition, thereby greatly reducing the process steps, reducing the material usage, saving the field and the working hour, reducing the environmental pollution, improving the reliability and the yield of the product and increasing the economic benefit. As shown in fig. 3, a schematic diagram of a circuit board structure manufactured by the present invention is shown, wherein the reference numerals are respectively: the circuit board comprises a substrate 1, a circuit layer 2, an insulating layer 3, a solder mask layer 4, a conductive through hole 10 and a through hole 20 formed by a printing-free pattern of the conductive through hole.
What has been described above is only a preferred embodiment of the present invention, and the present invention is not limited to the above examples. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the basic concept of the present invention are to be considered as included within the scope of the present invention.
Claims (6)
1. A method of full-additive manufacturing of printed circuits, comprising the steps of:
providing a conductive via on a substrate;
printing a screen printing insulating material through an insulating support layer to form the insulating support layer on the substrate;
forming a circuit pattern on the substrate by printing a conductive paste through a conductive layer; the insulating support layer is complementary with the circuit pattern and is used for supporting and protecting the circuit pattern;
repeatedly and circularly executing the steps of printing and screen printing an insulating material through an insulating support layer, forming the insulating support layer on the substrate and printing and screen printing a conductive paste through a conductive layer, and forming a circuit pattern on the substrate for a plurality of times, so that a plurality of circuit layers consisting of the insulating support layer and the circuit pattern are formed on the surface of the substrate; printing an insulating layer on the circuit layer of each layer through an insulating layer printing silk screen; the insulating support layer printing silk screen, the conducting layer printing silk screen and the insulating layer printing silk screen are respectively provided with a conducting through hole printing-free pattern, and the conducting through hole printing-free pattern is used for preventing the position of the conducting through hole from being printed;
printing the conductive paste into the conductive through holes by using a conductive through hole conduction silk screen to form electric connection between the circuit layers of different layers;
printing a screen printing solder resist material through a solder resist layer to form the solder resist layer on the circuit pattern;
and printing screen printing ink through the marking layer, and forming characters or/and marks on the solder mask layer.
2. A method of full-additive manufacturing of a printed circuit according to claim 1, wherein said printing of screen-printed insulating material through an insulating support layer, forming an insulating support layer on said substrate, comprises the steps of:
covering the insulating support layer printing screen on the substrate surface;
adding the insulating material to the insulating layer-supporting printing screen;
spreading the insulating material on the printing silk screen of the insulating support layer by using a scraper so that the insulating material penetrates through the printing silk screen of the insulating support layer to form the insulating support layer on the substrate;
curing the insulating support layer on the substrate by photo-irradiation and/or thermal curing of the insulating support layer; the insulating support layer is provided with a concave pattern;
and filling conductive paste into the recessed pattern to form the circuit pattern.
3. The method of full-additive manufacturing of printed circuits according to claim 1,
the method for forming a circuit pattern on the substrate by printing and screen printing conductive paste through a conductive layer comprises the following steps:
covering the conductive layer printing screen on the surface of the substrate on which the insulating support layer is located;
adding the conductive paste to the conductive layer printing screen;
spreading the conductive paste on the conductive layer printing silk screen by using a scraper so that the conductive paste penetrates through the conductive layer printing silk screen to form the circuit pattern in the recessed pattern of the insulating support layer on the substrate;
curing the circuit pattern on the substrate by photo-irradiating and/or thermally curing the circuit pattern.
4. The method of full-additive manufacturing of printed circuits according to claim 1, wherein said substrate is made of an insulating material.
5. The method of full-additive manufacturing of printed circuits according to claim 4, wherein said substrate is made of a resin material.
6. A method of full-additive manufacturing of printed circuits, comprising the steps of:
printing screen printing insulating materials through an insulating support layer to form the insulating support layer on the substrate;
the insulating support layer is provided with a conductive through hole printing-free pattern on the printing screen, and the conductive through hole printing-free pattern enables the insulating material to form a conductive through hole reserved position on the substrate;
drilling a conductive through hole at the conductive through hole reserved position on the substrate;
forming a circuit pattern on the substrate by printing a conductive paste through a conductive layer;
the conductive layer printing screen is provided with the conductive through hole printing-free pattern; the circuit pattern is complementary with the insulating support layer, and the insulating support layer is used for supporting and protecting the circuit pattern;
printing conductive paste into the conductive through-holes using the conductive through-hole conduction screen;
printing a screen printing solder resist material through a solder resist layer to form the solder resist layer on the circuit pattern; and printing screen printing ink through the marking layer, and forming characters or/and marks on the solder mask layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711251977.0A CN107949177B (en) | 2017-12-01 | 2017-12-01 | Method for manufacturing printed circuit by full addition |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711251977.0A CN107949177B (en) | 2017-12-01 | 2017-12-01 | Method for manufacturing printed circuit by full addition |
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| Publication Number | Publication Date |
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| CN107949177A CN107949177A (en) | 2018-04-20 |
| CN107949177B true CN107949177B (en) | 2020-04-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109524310A (en) * | 2018-10-11 | 2019-03-26 | 中国电子科技集团公司第四十三研究所 | A kind of ltcc substrate cofiring welding resistance layer manufacturing method thereof |
| CN114005848B (en) * | 2020-07-28 | 2024-09-03 | 合肥鑫晟光电科技有限公司 | Driving backboard, manufacturing method thereof, backlight module and display device |
| CN112672531B (en) * | 2020-11-30 | 2023-10-24 | 江门荣信电路板有限公司 | Double-sided processing method of PCB single-sided substrate |
| CN113692126A (en) * | 2021-08-16 | 2021-11-23 | 北京梦之墨科技有限公司 | Circuit board, manufacturing method thereof and printing equipment |
| CN114007346A (en) * | 2021-10-26 | 2022-02-01 | 武汉天喻信息产业股份有限公司 | Multilayer circuit board manufacturing method and multilayer circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3879682B2 (en) * | 2003-03-10 | 2007-02-14 | 株式会社デンソー | Circuit board manufacturing method |
| JP5183540B2 (en) * | 2009-03-23 | 2013-04-17 | 太陽ホールディングス株式会社 | Curable resin composition, dry film and printed wiring board using the same |
| CN102933036B (en) * | 2012-11-08 | 2016-08-03 | 广东生益科技股份有限公司 | Method for producing circuit board |
| CN204131823U (en) * | 2014-08-15 | 2015-01-28 | 西安明科微电子材料有限公司 | Novel high heat-conduction circuit board |
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