CN108668460B - Circuit board solder mask processing method and circuit board - Google Patents
Circuit board solder mask processing method and circuit board Download PDFInfo
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- CN108668460B CN108668460B CN201710198424.7A CN201710198424A CN108668460B CN 108668460 B CN108668460 B CN 108668460B CN 201710198424 A CN201710198424 A CN 201710198424A CN 108668460 B CN108668460 B CN 108668460B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Abstract
The invention provides a circuit board solder mask processing method and a circuit board, wherein the method comprises the following steps: performing solder mask printing on the circuit board to be processed, and controlling the ink discharge amount to reach the preset proportion of the standard ink discharge amount; standing for a first preset time, and then carrying out short prebaking to control the ink printed on the circuit board to be baked until the ink is solidified; performing solder resist printing again, and controlling the total ink discharge amount to be larger than or equal to the standard ink discharge amount; and standing for a second preset time, and then carrying out short prebaking to ensure that the thickness of the prebaked printing ink meets the requirement. The circuit board solder mask processing method and the circuit board provided by the invention can prevent ink from entering the back drilling hole, do not need to clean the back drilling hole, effectively improve the processing efficiency of the circuit board, have low cost and are easy to realize and popularize.
Description
Technical Field
The invention relates to a circuit board processing technology, in particular to a circuit board solder mask processing method and a circuit board.
Background
With the continuous development of circuit board processing technology, the small hole back drilling process gradually becomes the mainstream of circuit board design, and the outgoing line of the small hole back drilling process provides a new challenge for solder mask processing. Under normal conditions, in order to guarantee the stability of the small hole back drilling to signal transmission, the small hole back drilling is not allowed to have a foreign matter hole blocking phenomenon, and in the back drilling hole that causes printing ink to get into the circuit board extremely easily among the solder mask printing process, in case the hole is blocked by printing ink, the quality of circuit board can greatly reduce.
For the technical problem, the existing solutions are mainly divided into two types: firstly, after the hole is blocked by the ink, the ink in the hole is sucked out by adopting a dust collector or a manual fine needle poking method, and the method is time-consuming, labor-consuming, low in efficiency and difficult to operate in batch; and secondly, the ink in the hole is ablated and gasified by adopting a laser method, the method cannot ensure that the ink in the hole is completely removed, and the laser drilling process has high cost and is not beneficial to popularization.
Disclosure of Invention
The invention provides a circuit board solder mask processing method and a circuit board, which are used for solving the technical problems that time and labor are wasted or the cost is higher in the prior art for cleaning ink from a back drilling hole.
The invention provides a circuit board solder mask processing method, which comprises the following steps:
performing solder mask printing on the circuit board to be processed, and controlling the ink discharge amount to reach the preset proportion of the standard ink discharge amount;
standing for a first preset time, and then carrying out short prebaking to control the ink printed on the circuit board to be baked until the ink is solidified;
performing solder resist printing again, and controlling the total ink discharge amount to be larger than or equal to the standard ink discharge amount;
and standing for a second preset time, and then carrying out short prebaking to ensure that the thickness of the prebaked printing ink meets the requirement.
Further, the circuit board to be processed is subjected to solder mask printing, and the ink amount under control reaches the preset proportion of the ink amount under the standard, including:
covering a 55T ink blocking net on the circuit board;
performing solder mask printing on the circuit board covered with the 55T ink blocking net by using a printing machine table to ensure that the ink consumption is 60% of the standard ink consumption;
wherein the viscosity of the ink is controlled between 60 and 100 dp.s.
Further, before the solder resist printing of the circuit board to be processed, the method further comprises:
arranging corresponding ink blocking points on a 55T screen according to a back drilling hole on a circuit board to be processed, wherein the size of the ink blocking points arranged on the 55T screen is larger than that of the corresponding back drilling hole;
and performing coating, exposure and development operations on the 55T screen printing plate to generate the 55T ink blocking screen.
Further, performing solder resist printing again, and controlling the total ink consumption to be greater than or equal to the standard ink consumption, wherein the method comprises the following steps:
covering a 55T ink blocking net on the circuit board;
performing solder mask printing on the circuit board covered with the 55T ink blocking net by using a printing machine table, so that the total ink consumption of twice solder masks is greater than the standard ink consumption;
wherein the viscosity of the ink is controlled between 60 and 100 dp.s.
Further, the thickness of the ink after the first short prebaking is 15 to 20 microns, and the thickness of the ink after the second short prebaking is 30 to 40 microns.
Further, after standing for a first preset time, performing short prebaking, and controlling the ink printed on the circuit board to be baked until the ink is solidified, the method further comprises the following steps:
and determining the first preset time and the short prebaking time according to the ink discharging amount of the first printing.
Further, after standing still for a first preset time, short prebaking is carried out, and the ink printed on the circuit board is controlled to be baked to be solidified, wherein the method comprises the following steps:
standing for 30-60 minutes to enable the ink to flow to the back drilling edge;
baking the circuit board at a temperature of 70 ℃ for 25 minutes so that the ink printed on the circuit board is baked to be solidified.
The invention also provides a circuit board which is manufactured by adopting the circuit board solder mask processing method.
Further, the thickness of the ink gradually decreases as the distance from the back-drilled hole decreases within a preset range around the back-drilled hole.
Further, the color of the edge part of the ink on the circuit board close to the back drilling hole is lighter than that of other parts of the ink.
According to the circuit board solder mask processing method and the circuit board, the circuit board to be processed is subjected to solder mask printing, the ink amount under control reaches the preset proportion of the ink amount under the standard, short pre-baking is carried out after the circuit board is kept still for the first preset time, the ink printed on the circuit board is controlled to be baked until solidification, then solder mask printing and short pre-baking operation are carried out again, the thickness of the pre-baked ink meets the requirement, the ink can be prevented from entering the back drilling hole, the back drilling hole does not need to be cleaned, the processing efficiency of the circuit board is effectively improved, the cost is low, and the circuit board solder mask processing method and the circuit board are easy to realize and popularize.
Drawings
FIG. 1 is a flow chart of a circuit board solder mask processing method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a back-drilled hole in a circuit board solder mask processing method according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an ink-blocking point in a circuit board solder mask processing method according to an embodiment of the present invention;
fig. 4 is a schematic view illustrating an ink blocking screen disposed on a circuit board in a method for processing solder resist of the circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of ink after the first printing in the method for processing solder mask of circuit board according to an embodiment of the present invention;
fig. 6 is a schematic diagram of ink after standing for a first preset time in the circuit board solder mask processing method according to the first embodiment of the present invention;
fig. 7 is a schematic diagram of ink after the second short pre-baking in the circuit board solder mask processing method according to an embodiment of the present invention.
Reference numerals:
1-circuit board 2-back drilling hole 3-ink blocking net 4-ink blocking point
5-ink 6-copper layer 7-doctor blade
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the embodiments of the present application, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.
Example one
The embodiment of the invention provides a circuit board solder mask processing method. Fig. 1 is a flowchart of a circuit board solder mask processing method according to an embodiment of the present invention. As shown in fig. 1, the method in this embodiment may include:
Specifically, before the solder resist printing is performed on the circuit board 1 to be processed formally, the circuit board may be subjected to a pretreatment, and after the pretreatment, the circuit board may be subjected to a first solder resist printing, and the first solder resist printing may control the ink dropping amount to a preset ratio of the standard ink dropping amount, where the preset ratio may be 60%.
The standard ink-dropping amount refers to the ink-dropping amount which can meet the requirement of the thickness of the ink 5 of the circuit board 1, and for a general circuit board 1, the standard ink-dropping amount can be 25-35 um. In the prior art, the whole solder mask process is only printed once, so that the ink consumption after one-time printing reaches the standard ink consumption, in the embodiment, two times of printing are performed successively, the ink consumption of the first-time printing can be only about 60% of the standard ink consumption, and after the second-time printing, the total ink consumption of the two times of printing reaches the standard ink consumption.
In order to realize the control of the ink consumption, the solder resist printing is performed on the circuit board 1 to be processed in step 101, and the control of the ink consumption to reach the preset ratio of the standard ink consumption may specifically include:
covering a 55T ink blocking net 3 on the circuit board 1; performing solder resist printing on the circuit board 1 covered with the 55T ink blocking net 3 by using a printing machine table to ensure that the ink consumption is 60% of the standard ink consumption; the viscosity of the ink 5 is controlled to be 60 to 100dp.s (minute pascal.s, where dp.s is abbreviated as dpa.s, and 1pa.s is 10 dpa.s).
Wherein, the 55T ink blocking net 3 is the ink blocking net 3 made of 55T screen printing plate. The 1T mesh 2.54, 55T mesh 140, 55T screen is 1 square inch screen with 140 mesh.
The ink consumption of one-time printing is 60% of the standard ink consumption by matching the 55T ink blocking net 3 with the ink 5 with the viscosity of 60 to 100 dp.s.
Preferably, in the printing process, the angle between the scraper 7 of the printing machine platform and the circuit board 1 can be between 10 ° and 15 °, the pressure of the scraper 7 on the circuit board 1 can be between 4 and 6 kg/cm, the speed of the scraper 7 can be between 1 and 4 grids/second, and the ink dropping amount of the first printing can be effectively controlled.
Further, before the solder resist printing of the circuit board 1 to be processed in this step, the method further includes:
according to a back drilling hole 2 on a circuit board 1 to be processed, arranging a corresponding ink blocking point 4 on a 55T screen, wherein the size of the ink blocking point 4 arranged on the 55T screen is larger than that of the corresponding back drilling hole 2; and performing coating, exposure and development operations on the 55T screen printing plate to generate the 55T ink blocking screen 3.
Specifically, before the printing operation is performed, the ink-blocking web 3 may be generated in accordance with the specifications of the wiring board 1 to be processed. The ink blocking points 4 on the ink blocking screen 3 correspond to the back drilled holes 2 on the circuit board 1 one by one, so that the ink blocking points 4 on the ink blocking screen 3 can block the back drilled holes 2 in the printing process and prevent the ink 5 from flowing into the back drilled holes 2.
Preferably, the diameter of the ink-blocking dots 4 on the ink-blocking screen 3 may be larger than the diameter of the back-drilled holes 2, for example, the diameter of the ink-blocking dots 4 on the ink-blocking screen 3 may be the diameter of the corresponding back-drilled holes 2 plus 12 micro inches.
Fig. 2 is a schematic diagram of a back-drilled hole 2 in the circuit board solder mask processing method according to the first embodiment of the present invention. As shown in fig. 2, the oblique line filling part is a circuit board 1, and at least one back-drilled hole 2 is formed in the circuit board 1. Fig. 3 is a schematic view of an ink-blocking dot 4 in the circuit board solder mask processing method according to the first embodiment of the present invention. As shown in fig. 3, the straight filling portion is an ink blocking mesh 3, and ink blocking dots 4 corresponding to the back drilled holes 2 are provided on the ink blocking mesh 3.
Fig. 4 is a schematic view of the ink blocking screen 3 placed on the circuit board 1 in the circuit board solder mask processing method according to the embodiment of the present invention. As shown in fig. 4, since the size of the ink-blocking dots 4 is larger than that of the back-drilled holes 2 in the wiring board 1, the back-drilled holes 2 can be completely hidden.
Fig. 5 is a schematic diagram of ink 5 after first printing in the method for processing solder mask of circuit board according to an embodiment of the present invention. As shown in fig. 5, after the first printing, the ink 5 will penetrate through the ink blocking mesh 3 to reach the copper layer 6 of the circuit board 1 and be uniformly distributed at the positions without the ink blocking dots 4, no ink 5 will drip above the back drilling hole 2 due to the presence of the ink blocking dots 4, and the size of the ink blocking dots 4 is large, so the ink 5 will have a certain distance from the back drilling hole 2 and will not flow into the back drilling hole 2.
And step 102, after standing for a first preset time, performing short prebaking, and controlling the ink 5 printed on the circuit board 1 to be baked until solidification.
Specifically, before step 102, the first preset time may also be determined according to the ink dropping amount of the first printing, and the more the ink dropping amount is, the more the time required for standing is. If the ink dropping amount of the first printing is 60% of the standard ink dropping amount, the first preset time may be 30 to 60 minutes.
In addition, the time for performing the short prebaking in the step can be determined according to the ink dropping amount of the first printing, and the more the ink dropping amount is, the more the prebaking time is required. If the ink dropping amount of the first printing is 60% of the standard ink dropping amount, the first preset time may be about 25 minutes.
Correspondingly, after the step of standing for the first preset time, performing short prebaking to control the ink 5 printed on the circuit board 1 to be baked until solidification may include:
standing for 30 to 60 minutes to allow the ink 5 to flow to the edge of the back drilled hole 2; the wiring board 1 is baked at a temperature of 70 ° for 25 minutes so that the ink 5 printed on the wiring board 1 is baked to solidify. The ink 5 is baked to be solidified, that is, the ink 5 is baked to be semi-hardened, and the ink 5 is preferably not flowed.
Fig. 6 is a schematic diagram of ink 5 after standing for a first preset time in the method for processing solder resist of a circuit board according to an embodiment of the present invention. As shown in fig. 6, the ink 5 has a low viscosity and gradually extends toward the back-drilled hole 2 during the standing process, but the ink 5 does not enter the back-drilled hole 2 even if it partially extends because the size of the ink-blocking dots 4 is large.
In the prior art, since the size of the back drilled hole 2 is consistent with that of the ink blocking point 4, the ink 5 flows into the back drilled hole 2 after standing for a certain period of time, so that the ink 5 in the back drilled hole 2 needs to be treated.
And 103, performing solder mask printing again, and controlling the total ink consumption to be larger than or equal to the standard ink consumption.
In this step, solder resist printing may be performed by using a 55T ink blocking screen 3, or by using ink blocking screens 3 of other specifications, as long as the total ink discharge amount of the two times of printing in step 101 and step 103 is equal to or greater than the standard ink discharge amount.
Preferably, the solder resist printing is performed again in the step, and the controlling of the total ink consumption to be greater than or equal to the standard ink consumption may include:
covering a 55T ink blocking net 3 on the circuit board 1; performing solder mask printing on the circuit board 1 covered with the 55T ink blocking net 3 by using a printing machine table, so that the total ink consumption of twice solder masks is greater than the standard ink consumption; wherein the viscosity of the ink 5 is controlled to be between 60 and 100 dp.s.
In the step, the 55T ink blocking net 3 is continuously utilized for printing operation, so that the net can be prevented from being changed back and forth in the solder mask processing process of the circuit board 1, and the solder mask processing efficiency is improved.
And step 104, after standing for a second preset time, performing short prebaking to enable the thickness of the prebaked ink 5 to meet the requirement.
The second preset time and the second short prebaking time may be respectively the same as or slightly different from the first preset time and the first short prebaking time.
Preferably, the thickness of the ink 5 after the first short pre-baking is 15 to 20 micrometers, and the thickness of the ink 5 after the second short pre-baking is 30 to 40 micrometers, so that after the two short pre-baking, the ink 5 covers the copper layer 6, but does not flow into the back drilling hole 2, and the quality of the circuit board 1 is improved.
Fig. 7 is a schematic diagram of ink 5 after the second short pre-baking in the method for processing solder mask of circuit board according to the embodiment of the present invention. As shown in fig. 7, the edge of the ink 5 gradually flows toward the back-drilled hole 2, and the thickness of the ink 5 gradually decreases as the distance from the back-drilled hole 2 decreases within a certain range around the back-drilled hole 2, and the closer to the back-drilled hole 2, the smaller the thickness of the ink 5, and the farther from the back-drilled hole 2, the larger the thickness of the ink 5. As can be seen by comparing fig. 6 and 7, the thickness of the ink 5 after the second printing and the short prebaking is larger than the thickness of the ink 5 after the first printing.
Meanwhile, the color of the edge part of the ink 5 on the circuit board 1 close to the back drilled hole 2 is lighter than the color of the other parts of the ink 5, that is, the color of the ink 5 within a preset distance around the back drilled hole 2 is lighter than the color of the other parts, and within the preset distance, the closer to the back drilled hole 2, the lighter the color of the ink 5 is, and the farther from the back drilled hole 2, the darker the color of the ink 5 is.
After step 104, other operations, such as exposure, curing, and other subsequent processes, may be performed to manufacture the circuit board 1 that can be used.
In practical application, the operation of one-time printing and prebaking in the prior art can be disassembled into two times, because the ink blocking net 3 with smaller ink amount is used, and the printing is carried out by using the ink 5 with lower viscosity, the ink amount of the first-time printing can be ensured to be only about half of the ink amount printed by the existing method, and the ink 5 after the printing can freely flow to cover the copper layer 6 and can not enter the back drilling hole 2, the first-time standing is carried out for the first time after the first-time printing, then the ink 5 is semi-hardened after the prebaking and then is printed for the second time, the final ink 5 can be more uniform, the ink 5 can be prevented from entering the back drilling hole 2, and the quality of the circuit board 1 is improved.
By utilizing the method provided by the embodiment, the ink blocking net 3 with the same specification can avoid the replacement action of solder resist printing different ink blocking nets 3 for two times, and the problem of hole blocking of the ink 5 in the back drilling hole 2 is simply and efficiently solved by controlling the ingenious matching of the viscosity of the solder resist ink 5 and the design of the ink blocking net 3. Although one-time printing and pre-baking is added, the production standard time of the whole solder mask process is increased by about 90min, but compared with the traditional conventional method, the problem that the solder mask ink 5 enters the back drilling hole 2 is avoided. Compared with the first method, the method reduces the steps of manually removing the ink 5 in the hole and improves the efficiency by over 300 percent. Compared with the second method, the method reduces the number of the printing ink 5 in the hole laser clearing hole, improves the efficiency by 100 percent, improves the qualification rate of the whole quality result by more than 28 percent, and ensures that the processed product meets all the IPC standards.
The circuit board resistance welding processing method provided by the embodiment is characterized in that resistance welding printing is carried out on a circuit board 1 to be processed, the ink amount under control reaches the preset proportion of the ink amount under the standard, short pre-baking is carried out after the circuit board is kept still for the first preset time, the control printing is carried out on the circuit board 1 after baking is carried out to solidification, then resistance welding printing and short pre-baking operation are carried out again, the thickness of the ink 5 after pre-baking meets the requirement, the ink 5 can be prevented from entering a back drilling hole 2, the back drilling hole 2 does not need to be cleaned, the processing efficiency of the circuit board 1 is effectively improved, the cost is low, and the method is easy to realize and popularize.
Example two
The second embodiment of the invention provides a circuit board. The circuit board in this embodiment can be manufactured by the circuit board solder mask processing method described in any of the above embodiments.
The structure and the manufacturing method of the circuit board in this embodiment may refer to the above embodiments, and are not described herein again.
The circuit board that this embodiment provided hinders the welding printing through treating the circuit board of processing, and the control is down the predetermined proportion of china ink volume under the china ink volume reaches the standard, and after the first preset time of stewing, carry out short roast in advance, the control printing is in the printing ink on the circuit board is roast to solidifying, then hinders again and welds printing and short roast operation in advance for the printing ink thickness after roast in advance satisfies the requirement, and the circuit board that obtains at last can avoid printing ink to get into back drilling hole, need not to clear up the operation to back drilling hole, has effectively improved the machining efficiency of circuit board, and the cost is lower, easily realizes and promotes.
Further, the thickness of the ink gradually decreases as the distance from the back-drilled hole decreases within a preset range around the back-drilled hole.
Further, the color of the edge part of the ink on the circuit board close to the back drilling hole is lighter than that of other parts of the ink.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A circuit board solder mask processing method is characterized by comprising the following steps:
performing solder mask printing on the circuit board to be processed, and controlling the ink discharge amount to reach the preset proportion of the standard ink discharge amount;
standing for a first preset time, and then carrying out short prebaking to control the ink printed on the circuit board to be baked until the ink is solidified;
performing solder resist printing again, and controlling the total ink discharge amount to be larger than or equal to the standard ink discharge amount;
standing for a second preset time, and then carrying out short prebaking to enable the thickness of the prebaked printing ink to meet the requirement;
the circuit board of treating processing hinders and welds printing, and the ink volume reaches the predetermined proportion of ink volume under the standard under the control, includes:
covering a 55T ink blocking net on the circuit board;
performing solder mask printing on the circuit board covered with the 55T ink blocking net by using a printing machine table to ensure that the ink consumption is 60% of the standard ink consumption;
wherein the viscosity of the ink is controlled between 60dp.s and 100 dp.s;
the angle between the scraper of the printing machine table and the circuit board to be processed is set to be 10-15 degrees, the pressure of the scraper on the circuit board to be processed is set to be 4-6 kilograms per square centimeter, and the speed of the scraper is set to be 1-4 grids per second;
and performing solder mask printing again, and controlling the total ink consumption to be more than or equal to the standard ink consumption, wherein the steps comprise:
covering a 55T ink blocking net on the circuit board;
performing solder mask printing on the circuit board covered with the 55T ink blocking net by using a printing machine table, so that the total ink consumption of twice solder masks is greater than the standard ink consumption;
wherein the viscosity of the ink is controlled between 60dp.s and 100 dp.s;
after first preset time of stewing, carry out short prebaking, control printing is in ink on the circuit board is baked to solidifying, includes:
standing for 30-60 minutes to enable the ink to flow to the back drilling edge;
and baking the circuit board at the temperature of 70 ℃ for 25 minutes to solidify the ink printed on the circuit board.
2. The method according to claim 1, before the solder resist printing of the circuit board to be processed, further comprising:
arranging corresponding ink blocking points on a 55T screen according to a back drilling hole on a circuit board to be processed, wherein the size of the ink blocking points arranged on the 55T screen is larger than that of the corresponding back drilling hole;
and performing coating, exposure and development operations on the 55T screen printing plate to generate the 55T ink blocking screen.
3. The method according to claim 1, wherein the ink thickness after the first short prebake is 15 to 20 microns and the ink thickness after the second short prebake is 30 to 40 microns.
4. The method according to any one of claims 1 to 3, wherein after the first preset time of standing, performing a short prebaking, and before controlling the ink printed on the circuit board to bake until solidification, further comprises:
and determining the first preset time and the short prebaking time according to the ink discharging amount of the first printing.
5. A circuit board, characterized in that, it is manufactured by the circuit board solder mask processing method of any claim 1-4.
6. A cord plate according to claim 5, wherein the thickness of the ink gradually decreases with decreasing distance from the back-drilled hole within a predetermined range around the back-drilled hole.
7. A wiring board according to claim 5 or 6, wherein the edge portion of the ink on the wiring board near the back-drilled hole is lighter in color than the rest of the ink.
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Effective date of registration: 20220624 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |