CN116567951A - Circuit board preparation method and circuit board - Google Patents

Circuit board preparation method and circuit board Download PDF

Info

Publication number
CN116567951A
CN116567951A CN202310709738.4A CN202310709738A CN116567951A CN 116567951 A CN116567951 A CN 116567951A CN 202310709738 A CN202310709738 A CN 202310709738A CN 116567951 A CN116567951 A CN 116567951A
Authority
CN
China
Prior art keywords
circuit board
solder resist
resist ink
hole
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310709738.4A
Other languages
Chinese (zh)
Inventor
周睿
周进群
吴杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shennan Circuit Co Ltd
Original Assignee
Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to CN202310709738.4A priority Critical patent/CN116567951A/en
Publication of CN116567951A publication Critical patent/CN116567951A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention discloses a preparation method of a circuit board and the circuit board, wherein the preparation method of the circuit board comprises the following steps: s1, filling first solder resist ink into a through hole of a circuit board; s2, baking the circuit board in the step S1 at a first preset temperature to primarily solidify the first solder resist ink in the through hole; s3, performing solder resist, namely printing second solder resist ink on the surface of the circuit board, so that the second solder resist ink covers the whole surface of the circuit board, wherein the viscosity of the second solder resist ink is larger than that of the first solder resist ink; s4, baking the circuit board in the step S3 at a second preset temperature to primarily cure the second solder resist ink. According to the preparation method of the circuit board, the through holes of the circuit board can be effectively filled, the second solder resist ink adjacent to the through holes in the solder resist stage is prevented from flowing into the through holes, the surface flatness of the circuit board is improved, and meanwhile, the circuit board can work normally.

Description

Circuit board preparation method and circuit board
Technical Field
The invention relates to the technical field of circuit boards, in particular to a preparation method of a circuit board and the circuit board.
Background
In the related art, one end of a drill hole on a circuit board is covered by a soft board, and the other end of the drill hole is normally exposed, and the drill hole is in a semi-closed state. When printing the solder resist ink, the air in the borehole has a pressure that prevents the solder resist ink from entering the hole, resulting in no ink in the borehole after printing. Or after printing, the solder resist ink on the open side of the drilled hole flows into the drilled hole due to the fluidity of the solder resist ink, so that the solder resist ink on the surface of the circuit board at the drilled hole becomes thin, and serious residues of the solder resist ink are avoided, thereby affecting the normal use of the circuit board.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a method for manufacturing a circuit board, which can effectively fill the through hole of the circuit board, prevent the second solder resist ink adjacent to the through hole from flowing into the through hole during the solder resist stage, improve the surface flatness of the circuit board, and simultaneously enable the circuit board to work normally.
Another object of the present invention is to provide a circuit board manufactured by the above manufacturing method of a circuit board.
The preparation method of the circuit board according to the embodiment of the first aspect of the invention comprises the following steps: s1, filling first solder resist ink into a through hole of the circuit board;
s2, baking the circuit board in the step S1 at a first preset temperature to primarily cure the first solder resist ink in the through hole;
s3, performing solder mask, namely printing second solder mask ink on the surface of the circuit board, so that the second solder mask ink covers the whole surface of the circuit board, wherein the viscosity of the second solder mask ink is larger than that of the first solder mask ink;
and S4, baking the circuit board in the step S3 at a second preset temperature to primarily cure the second solder resist ink.
According to the preparation method of the circuit board, through hole filling is carried out on the through holes by using the first solder resist ink, primary solidification is carried out on the first solder resist ink, and the viscosity of the first solder resist ink is smaller than that of the second solder resist ink. Therefore, the through holes of the circuit board can be effectively filled, the second solder resist ink adjacent to the through holes in the solder resist stage is prevented from flowing into the through holes, the surface flatness of the circuit board is improved, and meanwhile the circuit board can work normally.
According to some embodiments of the invention, after step S1 and before step S2, further comprises: s2', vacuumizing the through holes to remove bubbles in the first solder resist ink.
According to some embodiments of the invention, step S1 specifically comprises: s11, paving a printing screen on the surface of the circuit board, wherein the printing screen is only provided with through holes, and the through holes are opposite to the through holes of the circuit board;
s12, enabling the first solder resist ink to pass through the through holes and fill the through holes by printing equipment.
According to some embodiments of the invention, the aperture of the through hole is smaller than or equal to the aperture of the through hole.
According to some embodiments of the invention, the first solder resist ink has a viscosity η, wherein the η satisfies: 50Dpa.s is less than or equal to eta is less than or equal to 60Dpa.s.
According to some embodiments of the invention, during a first baking process, the circuit board is baked at the first preset temperature for a first preset time period t, wherein t satisfies: t is more than or equal to 35min and less than or equal to 45min.
According to some embodiments of the invention, the first preset temperature T satisfies: t is more than or equal to 70 ℃ and less than or equal to 75 ℃.
According to some embodiments of the invention, step S4 further comprises: s5, performing exposure and development treatment on the circuit board subjected to the second drying process, and forming a circuit pattern on the surface of the circuit board;
s6, curing, namely baking the circuit board in the step S5 at a third preset temperature, and curing the first solder resist ink and the second solder resist ink.
The circuit board according to the embodiment of the second aspect of the invention is prepared by adopting the preparation method of the circuit board according to the embodiment of the first aspect of the invention.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a flowchart of a method of manufacturing a circuit board according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a circuit board according to another embodiment of the present invention;
fig. 3 is a schematic view of a printing screen according to an embodiment of the present invention.
Reference numerals:
1: printing a screen; 11: and a through hole.
Detailed Description
A method of manufacturing a wiring board according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 3.
As shown in fig. 1 to 3, the method for manufacturing a circuit board according to the embodiment of the first aspect of the present invention includes the following steps:
s1, filling the first solder resist ink into the through hole of the circuit board. At this time, the through holes of the circuit board are prefilled with the first solder resist ink.
S2, baking the circuit board in the step S1 at a first preset temperature to primarily solidify the first solder resist ink in the through hole. Through the step, the first solder resist ink in the through hole is baked and solidified, so that the first solder resist ink can be stably filled in the through hole, and the defect caused by the flowing of the first solder resist ink in the through hole in the subsequent printing process is avoided.
S3, performing solder mask, namely printing second solder mask ink on the surface of the circuit board, so that the whole surface of the circuit board is covered by the second solder mask ink. Therefore, the second solder resist ink can fully cover the surface of the circuit board, so that the flatness of the circuit board is improved, and the circuit pattern can be formed on the surface of the circuit board later.
Wherein the viscosity of the second solder resist ink is greater than the viscosity of the first solder resist ink. Because the through holes on the circuit board are semi-closed through holes, certain gas pressure exists in the through holes, the viscosity of the first solder resist ink needs to be reduced to increase the fluidity of the first solder resist ink to ensure that the first solder resist ink is smoothly filled in the through holes. Therefore, the smoothness of the first solder resist ink entering the through hole can be improved, and the filling efficiency of the first solder resist ink to the through hole is further improved. The viscosity of the second solder resist ink is increased, namely the fluidity of the second solder resist ink is reduced, so that the uneven thickness of the second solder resist ink on the surface of the circuit board can be avoided, and the coverage efficiency of the second solder resist ink on the surface of the circuit board can be effectively improved.
S4, baking the circuit board in the step S3 at a second preset temperature to primarily cure the second solder resist ink. From this, carry out preliminary solidification to second solder resist ink, avoid second solder resist ink to flow on the circuit board surface to promote the stability of second solder resist ink to the covering of circuit board surface, but further solidify the first solder resist ink in the through-hole simultaneously, promote the degree of packing of first solder resist ink to the through-hole.
According to the preparation method of the circuit board, through hole filling is carried out on the through holes by using the first solder resist ink, primary solidification is carried out on the first solder resist ink, and the viscosity of the first solder resist ink is smaller than that of the second solder resist ink. Therefore, the through holes of the circuit board can be effectively filled, the second solder resist ink adjacent to the through holes in the solder resist stage is prevented from flowing into the through holes, the surface flatness of the circuit board is improved, and meanwhile the circuit board can work normally.
According to some embodiments of the invention, referring to fig. 1 and 2, after step S1 and before step S2, further comprising: s2', vacuumizing the through holes to remove bubbles in the first solder resist ink. Therefore, bubbles in the first solder resist ink can be removed, so that the filling degree of the first solder resist ink in the through hole is increased, uneven surfaces of the circuit board caused by sinking of the first ink in the through hole are avoided, and the second solder resist ink is printed on the surfaces of the circuit boards conveniently.
Optionally, the first solder resist ink may be injected into the through hole a small amount and a plurality of times, and/or intermittently vacuuming the through hole to ensure that the first solder resist ink is able to sufficiently fill the through hole.
Further, the step S1 specifically includes:
s11, paving the printing screen 1 on the surface of a circuit board, wherein the printing screen 1 is only provided with through holes 11, and the through holes 11 are opposite to through holes of the circuit board;
s12, filling the first solder resist ink into the through hole through the through hole 11 by the printing apparatus.
In particular, referring to fig. 2 and 3, the size of the printing screen 1 and the size of the wiring board are adapted so that the printing screen 1 can be entirely covered on the surface of the wiring board. The printing screen 1 is formed with a plurality of through holes 11, and the plurality of through holes 11 are respectively opposed to the corresponding through holes, and at this time, the printing screen 1 can communicate with both sides of the printing screen 1 in the thickness direction via the through holes 11. After the printing screen 1 is paved on the surface of the circuit board, the printing equipment fills the first solder resist ink into the through holes 11, and the first solder resist ink can enter the through holes along the through holes 11, so that the first solder resist ink can be accurately filled into the through holes, and the first solder resist ink is prevented from flowing to the rest positions of the circuit board.
Further, the aperture of the through-hole 11 is equal to or smaller than the aperture of the through-hole. When the hole diameter of the through hole 11 is larger than that of the through hole, when the first solder resist ink is filled into the through hole through the through hole 11, the first solder resist ink is easily adhered to at least part of the circuit board, and the flatness of the surface of the circuit board facing the printing screen 1 is reduced, so that the flatness of the subsequent printing of the circuit board is reduced. Thus, by making the aperture of the through hole 11 smaller than or equal to the aperture of the through hole, the first solder resist ink is filled into the through hole through the through hole 11, and at the same time, the first solder resist ink is prevented from adhering to the surface of the circuit board, thereby improving the printing flatness of the circuit board.
According to some embodiments of the invention, the viscosity of the first solder resist ink is η, wherein η satisfies: 50Dpa.s is less than or equal to eta is less than or equal to 60Dpa.s. When eta is less than 50Dpa.s, the viscosity of the first solder resist ink is smaller, the fluidity of the first solder resist ink is larger, and when the first solder resist ink is filled into the through hole, the first solder resist ink flows to other positions of the circuit board; when eta is more than 60Dpa.s, the viscosity of the first solder resist ink is larger, and the fluidity of the first solder resist ink is smaller, so that the first solder resist ink is difficult to flow into the through hole, and the production efficiency is reduced. Therefore, the viscosity of the first solder resist ink is set to be 50Dpa.s is not less than eta is not more than 60Dpa.s, so that the viscosity of the first solder resist ink is more reasonable, the first solder resist ink can smoothly flow into the through hole, the production efficiency is improved, and the first solder resist ink is prevented from flowing to other positions of the circuit board.
According to some embodiments of the invention, during the first baking process, the circuit board is baked at a first preset temperature for a first preset time period t, wherein t satisfies: t is more than or equal to 35min and less than or equal to 45min. When t is less than 35min, the drying time of the first solder resist ink in the through hole is short, and at least part of the curing degree of the first solder resist ink can not reach the curing requirement, so that the first solder resist ink flows in the through hole and flows out of the through hole; when t is more than 45min, the drying time of the first solder resist ink in the through hole is too long, so that the first solder resist ink is excessively cured, and the later development and exposure treatment are not facilitated. Therefore, the first welding-resistant ink can be fully solidified to avoid the first welding-resistant ink flowing in the through hole by setting the first preset time length to be 35min less than or equal to t less than or equal to 45min.
According to some embodiments of the invention, the first preset temperature T satisfies: t is more than or equal to 70 ℃ and less than or equal to 75 ℃. When T is less than 70 ℃, the drying temperature of the first solder resist ink in the through hole is lower, the first preset time length is prolonged, and the process time length for filling the through hole is increased; when T is more than 75 ℃, the drying temperature of the first solder resist ink in the through hole is higher, and the first solder resist ink is easy to be excessively cured. Therefore, the first preset temperature is set to be 70 ℃ to 75 ℃ so that the temperature of the first solder resist ink is more reasonably selected, the first solder resist ink can be cured as soon as possible, the first solder resist ink cannot be excessively cured, and the processing time is reduced. Alternatively, the first preset temperature T may be 70 ℃.
According to some embodiments of the invention, step S4 further comprises:
s5, performing exposure and development treatment on the circuit board subjected to the second drying process, and forming a circuit pattern on the surface of the circuit board;
s6, curing, namely baking the circuit board in the step S5 at a third preset temperature to cure the first solder resist ink and the second solder resist ink.
That is, through the above steps S5 and S6, the circuit board is baked and cured after the desired circuit pattern is formed on the circuit board, whereby the first solder resist ink in the through hole is further cured while the second solder resist ink on the circuit board is further cured, thereby improving the curing effects of the first solder resist ink and the second solder resist ink.
A wiring board (not shown) according to an embodiment of the second aspect of the present invention is manufactured by using the manufacturing method of the wiring board according to the embodiment of the first aspect of the present invention.
According to the circuit board provided by the embodiment of the invention, the flatness of the surface of the circuit board is improved by adopting the preparation method of the circuit board, so that the exposure and development treatment on the circuit board are facilitated.
Other constructions and operations of circuit boards according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it should be understood that the terms "thickness," "upper," "lower," "front," "rear," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. The preparation method of the circuit board is characterized by comprising the following steps:
s1, filling first solder resist ink into a through hole of the circuit board;
s2, baking the circuit board in the step S1 at a first preset temperature to primarily cure the first solder resist ink in the through hole;
s3, performing solder mask, namely printing second solder mask ink on the surface of the circuit board, so that the second solder mask ink covers the whole surface of the circuit board, wherein the viscosity of the second solder mask ink is larger than that of the first solder mask ink;
and S4, baking the circuit board in the step S3 at a second preset temperature to primarily cure the second solder resist ink.
2. The method for manufacturing a circuit board according to claim 1, further comprising, after step S1 and before step S2:
s2', vacuumizing the through holes to remove bubbles in the first solder resist ink.
3. The method for manufacturing a circuit board according to claim 2, wherein step S1 specifically comprises:
s11, paving a printing screen on the surface of the circuit board, wherein the printing screen is only provided with through holes, and the through holes are opposite to the through holes of the circuit board;
s12, enabling the first solder resist ink to pass through the through holes and fill the through holes by printing equipment.
4. The method for manufacturing a circuit board according to claim 3, wherein the aperture of the through hole is equal to or smaller than the aperture of the through hole.
5. The method of manufacturing a circuit board according to claim 1, wherein the viscosity of the first solder resist ink is η, wherein the η satisfies: 50Dpa.s is less than or equal to eta is less than or equal to 60Dpa.s.
6. The method for manufacturing a circuit board according to claim 1, wherein in the first baking process, the circuit board is baked at the first preset temperature for a first preset time period t, wherein t satisfies: t is more than or equal to 35min and less than or equal to 45min.
7. The method for manufacturing a circuit board according to claim 1, wherein the first preset temperature T satisfies: t is more than or equal to 70 ℃ and less than or equal to 75 ℃.
8. The method for manufacturing a circuit board according to claim 1, further comprising, after step S4:
s5, performing exposure and development treatment on the circuit board subjected to the second drying process, and forming a circuit pattern on the surface of the circuit board;
s6, curing, namely baking the circuit board in the step S5 at a third preset temperature, and curing the first solder resist ink and the second solder resist ink.
9. A wiring board characterized by being prepared by the method for preparing a wiring board according to any one of claims 1 to 8.
CN202310709738.4A 2023-06-15 2023-06-15 Circuit board preparation method and circuit board Pending CN116567951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310709738.4A CN116567951A (en) 2023-06-15 2023-06-15 Circuit board preparation method and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310709738.4A CN116567951A (en) 2023-06-15 2023-06-15 Circuit board preparation method and circuit board

Publications (1)

Publication Number Publication Date
CN116567951A true CN116567951A (en) 2023-08-08

Family

ID=87498369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310709738.4A Pending CN116567951A (en) 2023-06-15 2023-06-15 Circuit board preparation method and circuit board

Country Status (1)

Country Link
CN (1) CN116567951A (en)

Similar Documents

Publication Publication Date Title
CN105101661B (en) The production method of printed wiring board ink plugging
CN102802357A (en) Method for preventing solder mask of singleside-windowed PCB (Printed Circuit Board) from oil leakage
CN106341950A (en) Circuit board manufacturing method adopting resin plugging
CN107683023A (en) The method of aperture bleed when preventing high-temperature baking after printed substrate via hole consent
JP2000208911A (en) Manufacture of mounting substrate with solder resist layer formed with bump on electrode pad
CN102917542A (en) Method for manufacturing copper PCB (Printed Circuit Board) circuit
CN104640376A (en) Circuit board plug hole forming method
CN106982512A (en) A kind of bad reworking method of circuit board finished product welding resistance consent
CN103152992A (en) Solder mask printing method of thick copper plate
JP3198273B2 (en) Filling method of liquid viscous material
CN108513451A (en) A kind of production method of the wiring board through-hole solder mask consent depth more than 80%
CN104869758A (en) Method for making solder-resisting layer on PCB sheet
CN110740578B (en) Circuit board taphole screen printing solder mask process
CN108668440A (en) A kind of bad reworking method of circuit board finished product welding resistance consent
CN116567951A (en) Circuit board preparation method and circuit board
JP2000082714A (en) Electronic component and manufacture thereof
CN110324990B (en) Method for printing conductive resin in blind hole of conductive substrate
CN112954902B (en) Circuit board copper paste hole plugging method
CN113194604A (en) PCB substrate and production method thereof
CN110113877B (en) Method for manufacturing metal-based circuit board by laser cutting method
JP5263009B2 (en) Substrate manufacturing method
KR101942948B1 (en) Method of Preparing Printed Circuit Board By Using Solder Resist Ink
TW201906515A (en) Fabrication method of circuit board
CN113543483B (en) Solder resist hole plugging method for printed circuit board
US20060087031A1 (en) Assembly and method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination