CN1925087A - Thick film type fuse and the manufacture thereof - Google Patents
Thick film type fuse and the manufacture thereof Download PDFInfo
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- CN1925087A CN1925087A CNA2006101289315A CN200610128931A CN1925087A CN 1925087 A CN1925087 A CN 1925087A CN A2006101289315 A CNA2006101289315 A CN A2006101289315A CN 200610128931 A CN200610128931 A CN 200610128931A CN 1925087 A CN1925087 A CN 1925087A
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Abstract
This invention provides one film safety fuse process method, which comprises the following steps: providing insulation base with level and vertical tanks on front surface; dividing insulation cover into several rectangular units; forming back electrode on back of insulation base; forming positive electrode on front surface of insulator; separately forming melt metal layer on both sides of insulation base; cutting the insulation base along vertical direction; forming terminal electrode on end of both base; cutting each base into several rectangle units to form end electrode.
Description
Technical field
The present invention relates to a kind of thick film sheet type fuse and manufacture method thereof, this fuse be used to pack into circuit or other circuit of printed circuit board (PCB) are to protect these circuit.More particularly, the present invention relates to a kind of thick film sheet type fuse and manufacture method thereof of on insulated substrate, utilizing thick film technology to form metal fuse-link layer and protective layer.
Background technology
Known have multiple blade fuse to be used, and the fuse-link layer of these blade fuses is to generate with the thin-film technique sputter.The film blade fuse comprises a rectangle insulating substrate; the termination electrode that forms required metal fuse-link layer in the above and be connected with the fuse-link layer, and the protective layer that is covered with the fuse-link layer that forms in the above in order to protect the fuse-link layer in the formation of fuse-link layer two ends.
A kind of existing structure of above-mentioned film blade fuse as shown in Figure 1; it comprises: insulating substrate 100; substrate lower surface two back electrodes 101, area is less than thermal insulation layer 102, the second metal levels 103 of substrate on the substrate; the first metal layer 105 is a copper metal layer; top layer metallic layer 107 is the tin metal layer, first protective layer, 108, the second protective layers 109; electrode 110 in the termination, termination electrode 111.
The manufacture method of above-mentioned film blade fuse comprises the steps: as shown in Figure 2
A: substrate 100 is provided, and material is Al
2O
3
B: form back electrode
As shown in Figure 3, form two backplates 101 in the and arranged on left and right sides of substrate 100 lower surfaces, material is a silver (Ag);
C: form thermal insulation layer
As shown in Figure 4, form thermal insulation layer 102 in substrate 100 upper face center, its area is less than substrate 100, and material is a silastic;
D: form second metal level
As shown in Figure 5, form second metal level 103 of covering substrate 100 upper surfaces in the thin film deposition mode, material is titanium-tungsten (TiW), copper (Cu);
E: form the first photoetching resist layer
As shown in Figure 6, on second metal level 103, form the first photoetching resist layer 104;
F: exposure imaging
As Fig. 7, shown in Figure 8, the first photoresist layer 104 is carried out exposure imaging, remove the and arranged on left and right sides in the first photoresist layer 104 and be connected the mid portion of both sides, make part second metal level 103 of the first metal layer 105 correspondence positions that preparation forms exposed;
G: form second metal level
As shown in Figure 9, substrate 100 is positioned in the electroplating bath, on the second exposed metal level 103, forms the first metal layer 105;
H: remove the remaining first photoresist layer
As shown in figure 10, with the unwanted first photoresist layer 104, make former second metal level 103 that is covered by the first photoresist layer 104 exposed
I: etching second metal level
As shown in figure 11, etching removes second metal level, 103 exposed parts that do not covered by the first metal layer 105;
J: form the second photoresist layer 106;
As shown in figure 12, on exposed substrate 100, thermal insulation layer 102, second metal level 103, the first metal layer 105, form the second photoresist layer 106;
K: exposure imaging
As shown in figure 13, carry out exposure imaging, the second photoresist layer, the 106 remaining two second photoresist layer piece 1061 that covers the first metal layer 105 two side ends make the mid portion of the first metal layer 105 exposed fully;
L: form top layer metallic layer
As shown in figure 14, exposed part electroplating topping metal level 107 in the middle of the first metal layer 105;
M: remove the second photoresist layer piece 1061;
As shown in figure 15, except that removing the second photoresist layer piece 1061
N: form first protective layer
As shown in figure 16, form first protective layer 108 that covers the fuse-link layer at least with silastic;
O: form second protective layer
As shown in figure 16, form second protective layer 109 with epoxy resin;
P: form electrode in the termination
As shown in figure 17, form electrode 110 in the termination with sputtering way at the left and right end face of substrate 100;
Q: form termination electrode
As shown in figure 18, form termination electrode 111 in the barrel plating mode.
There is following problem in blade fuse processing procedure in above-mentioned thin-film technique manufacturing:
A, manufacture process are complicated, and the time is more tediously long.
Above-mentioned blade fuse fuse-link layer is made up of the three-layer metal body, second metal level generates with thin film deposition processes, and the first metal layer and top layer metallic layer must form mask through photoetching method respectively, generate by plating mode again, also need remove photoresist layer at last.Complicated operation relates to technologies such as film, photoetching, plating simultaneously, difficult control, and processing procedure is also longer.
Will generate first protective layer and the material that material is a silastic in addition on the fuse-link layer respectively is second protective layer of epoxy resin, causes processing procedure to shorten.
B, manufacturing cost are higher.
Because above-mentioned processing procedure comprises a plurality of flow processs, material therefor and cost of labor are all more, cause higher the regretting of manufacturing cost.
Summary of the invention
The purpose of this invention is to provide a kind of effective shortening processing procedure time, reduce the thick film sheet type fuse and the manufacture method thereof of manufacturing cost.
An aspect of of the present present invention provides a kind of manufacture method of thick film sheet type fuse, comprises step:
A, provide and have reverse side and positive insulating substrate, the front of insulating substrate has horizontal and vertical grooving, thereby insulating substrate is divided into a plurality of rectangular elements;
B, form back electrode respectively in each rectangular element both sides of the reverse side of insulating substrate;
C, form front electrode respectively in each rectangular element both sides in the front of insulating substrate;
D, form the fuse-link metal level that connects the both sides front electrode respectively on each rectangular element in the front of insulating substrate, fuse-link metal level part respectively covers the front electrode of each rectangular element both sides;
E, on each rectangular element in the front of insulating substrate, form the insulating protective layer that covers the fuse-link metal level respectively;
F, with insulating substrate longitudinally grooving be divided into many substrates;
G, on the end faces of both sides of each bar substrate, form electrode in the termination respectively;
H, each bar substrate is divided into a plurality of rectangular elements along horizontal grooving; And
I, utilization are electroplated and form the termination electrode that covers electrode in back electrode, front electrode and the termination respectively on each rectangular elements,
Wherein, the order between step B, C and the D can be adjusted arbitrarily.
Another aspect of the present invention provides a kind of thick film sheet type fuse that adopts above-mentioned manufacture method to make.
The present invention compared with prior art, the formation of fuse-link metal level need only a step, and only prints layer protective layer.Manufacturing process is simple, only relates to thick-film technique, sputtering technology, electroplating technology, and processing ease effectively shortens processing procedure and reduced manufacturing cost.
Description of drawings
Following with reference to accompanying drawing, by preferred embodiment the present invention is further described, wherein:
Fig. 1 is a kind of structural representation of existing film blade fuse;
Fig. 2 is the schematic flow sheet of existing film chip fuse manufacture method;
Fig. 3-18 is respectively the structural representation of existing film blade fuse in the different fabrication stages;
Figure 19 is the schematic perspective view of thick film sheet type fuse of the present invention;
Figure 20 is the schematic flow sheet of thick film sheet type fuse manufacture method of the present invention;
Figure 21 is the structural representation of thick film sheet type fuse of the present invention;
Figure 22 is a floor map of making the ceramic substrate of thick film sheet type fuse of the present invention;
Figure 23 is that backplate is at on-chip distribution schematic diagram;
Figure 24 is that front electrode is at on-chip distribution schematic diagram;
Figure 25 is that metal film fusing conductive strips are at on-chip distribution schematic diagram;
Figure 26 is protective layer and is marked at on-chip distribution schematic diagram;
Figure 27 and Figure 28 are respectively the disjunction schematic diagrames of band grooving substrate.
Embodiment
As shown in figure 21, thick film sheet type fuse of the present invention comprises: insulating substrate (Al
2O
3) 200; substrate lower surface two backplates 201; substrate upper surface two front electrodes 202; the fuse-link metal level 203 that is formed at substrate upper surface and is connected with front electrode; a protective layer 204 that is formed on the fuse-link layer; be formed at the mark layer 205 on the protective layer, the termination electrode 206 of substrate side, the target at substrate two ends and external electrode 207.
The present invention uses thick film screen printing technology to form a pair of backplate 201 and front electrode 202 on insulating substrate, wherein the material of back electrode 201 is a silver (Ag), the material of front electrode 202 is silver (Ag) or silver (Ag), palladium (Pd) alloy, behind super-dry, sintering, forms and stablizes rete.
Thick film screen printing technology is by screen printing mode, by mesh slurry is deposited on the insulating substrate equably, to obtain desired pattern with certain thickness and shape.The then decision of the mask graph below silk screen of this pattern.Generally, may be summarized to be four steps: graphic designs, system net, printing, oven dry.
Form the fuse-link metal level, the material of metallic diaphragm material preferably but be not to be selected from silver (Ag), palladium (Pd) and alloy type metal thereof unlimitedly.Form the fuse-link metal level on the same utilization thick film screen printing technology insulating substrate, link to each other with front electrode, but not exclusively cover front electrode.This step can with backplate, front electrode sintering simultaneously, form and stablize rete; Also can adjust the execution order of above step according to design requirement.
Protective layer can be selected resin material or glass material, forms the rete that covers whole fuse-link metal level with thick film screen printing technology on the fuse-link metal level equally, and exposes the part front electrode of substrate two side ends.
In order to distinguish different fuse electric current products, can select the typographic(al) mark layer, mark layer is printed on the protective layer, with protective layer co-sintered or curing.
Utilize the plane to soak envelope technology and be stained with elargol, form electrode in the termination in the substrate both ends of the surface; Or with the both ends of the surface formation nichrome film of sputtering way at substrate.
Form the termination electrode that covers electrode in the back of the body, front electrode, the termination with plating mode at the substrate two ends, termination electrode is made up of double layer of metal, and wherein the material of target is the nickel metal, and the outer electrode material is a tin metal.
Thick film sheet type fuse manufacture method of the present invention specifically may further comprise the steps as shown in figure 20:
A, provide substrate
As shown in figure 22, select for use to have laterally (A1) and the vertically substrate 200 of grooving (A2), these groovings help the back operation that it is divided into the junior unit of rectangle, and the substrate material is Al
2O
3
B, formation back electrode
As shown in figure 23, the mode printing conductive slurry with silk screen printing forms back electrode figure 201, electrocondution slurry material argentiferous (Ag) on each unit of reverse side of ceramic substrate grooving face;
C, sintering
To put into the sintering kiln roasting with first product, this step also can be carried out jointly with step e;
D, formation front electrode
As shown in figure 24, the printed conductor slurry forms front electrode 202 on each unit of ceramic substrate grooving face;
E, sintering
Above semi-finished product are put into the sintering kiln roasting, to form functional film layer; This step also can be carried out jointly with step F;
F, formation fuse-link metal level
As shown in figure 25, at the front of above product (grooving face) printing fuse-link metal level 203; This part is the core of fuse, selects the composition of metal film or reaches requirement by the thickness of controlling metallic diaphragm according to different rated current, and the metal film main component is silver (Ag), palladium (Pd), plumbous (Pb) etc.; Rete print request thickness is even, and error is no more than ± 1 μ m; The fuse-link metal level links to each other with front electrode 202, and exposes front electrode in the two side ends of substrate.
G, sintering
Above semi-finished product are put into the sintering kiln roasting;
H, laser resistor trimming
Above semi-finished product can be adjusted the resistance of its fuse-link metal level by the laser reconditioning method, so that the consistency between product and the product reaches higher requirement, satisfy different blowout current requirements simultaneously; Also can not carry out this step, control the resistance of fuse at certain scope (step P) by the sorting mode at last.
I, formation protective layer
As shown in figure 26, printing protective layer 204 and rated current mark 205 on the fusing conductive strips position of above product.Protective layer can be glass paste or resin slurry, and marker material is corresponding with it.Protective layer covers the fuse-link metal level fully.
J, sintering or curing
In high temperature or low temperature kiln roasting or curing;
K, once cut apart
As shown in figure 27, utilize vertical grooving A1 of ceramic substrate itself, substrate is broken into two with one's hands into strips;
Electrode in L, the formation termination
On the left and right end face of strip product, soak and seal up conductive silver paste, form electrode 206 in the termination; Or with sputtering way formation nickel chromium triangle metallic diaphragm;
M, secondary splitting
As shown in figure 28, utilize the horizontal grooving A2 of ceramic substrate itself, the jackknifing of strip product is become single junior unit;
N, sintering or curing
In high temperature or low temperature kiln roasting or curing;
O, formation termination electrode
The product process of junior unit is electroplated, and the surface of electrode 206 forms the termination electrode of two-layer coating (target and outer electrode 207) in back electrode 201, front electrode 202 and termination, the purpose that plays anti-weldering and can weld; Termination electrode two-layer coating from the inside to the outside is respectively nickel metal film and tin metal film.
P, sorting, warehouse-in.
It will be appreciated by those skilled in the art that above-mentioned execution mode only works the effect of the present invention of explaining, and not should be understood to any restriction that it is made.For example, as required, the order between set-up procedure B, D and the F arbitrarily.
Claims (10)
1. the manufacture method of a thick film sheet type fuse comprises step:
A, provide and have reverse side and positive insulating substrate, the front of insulating substrate has horizontal and vertical grooving, thereby insulating substrate is divided into a plurality of rectangular elements;
B, form back electrode respectively in each rectangular element both sides of the reverse side of insulating substrate;
C, form front electrode respectively in each rectangular element both sides in the front of insulating substrate;
D, form the fuse-link metal level that connects the both sides front electrode respectively on each rectangular element in the front of insulating substrate, fuse-link metal level part respectively covers the front electrode of each rectangular element both sides;
E, on each rectangular element in the front of insulating substrate, form the insulating protective layer that covers the fuse-link metal level respectively;
F, with insulating substrate longitudinally grooving be divided into many substrates;
G, on the end faces of both sides of each bar substrate, form electrode in the termination respectively;
H, each bar substrate is divided into a plurality of rectangular elements along horizontal grooving; And
I, utilization are electroplated and form the termination electrode that covers electrode in back electrode, front electrode and the termination respectively on each rectangular elements,
Wherein, the order between above-mentioned steps B, C and the D can be adjusted arbitrarily.
2. manufacture method according to claim 1 is characterized in that, also comprises the step of sintering insulated substrate between step B and step C.
3. manufacture method according to claim 1 is characterized in that, also comprises the step of sintering insulated substrate between step C and step D.
4. manufacture method according to claim 1 is characterized in that, also comprises the step of sintering insulated substrate between step D and step e.
5. manufacture method according to claim 1 is characterized in that, also comprises step between step D and step e: utilize the laser reconditioning method to adjust the resistance of fuse-link metal level.
6. manufacture method according to claim 1 is characterized in that, also comprises sintering or the step of solidifying insulating substrate between step e and step F.
7. manufacture method according to claim 1 is characterized in that, in step G, by soaking the envelope electrocondution slurry or adopting sputtering way to form electrode in the termination respectively on the end faces of both sides of each bar substrate.
8. manufacture method according to claim 1 is characterized in that, also comprises sintering or the step of solidifying insulating substrate between step H and step I.
9. manufacture method according to claim 1 is characterized in that, in step I, termination electrode is formed by two-layer coating, and two-layer coating is respectively nickel metal film and tin metal film from the inside to the outside.
10. a thick film sheet type fuse is characterized in that, adopts one of claim 1-9 described manufacture method to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101289315A CN100555500C (en) | 2006-09-04 | 2006-09-04 | Thick film sheet type fuse and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101289315A CN100555500C (en) | 2006-09-04 | 2006-09-04 | Thick film sheet type fuse and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1925087A true CN1925087A (en) | 2007-03-07 |
| CN100555500C CN100555500C (en) | 2009-10-28 |
Family
ID=37817661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101289315A Expired - Fee Related CN100555500C (en) | 2006-09-04 | 2006-09-04 | Thick film sheet type fuse and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100555500C (en) |
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| WO2010060275A1 (en) * | 2008-11-25 | 2010-06-03 | 南京萨特科技发展有限公司 | Multilayer chip fuse and method of making the same |
| CN101933113A (en) * | 2009-03-30 | 2010-12-29 | 釜屋电机株式会社 | Chip fuse and method of manufacturing same |
| CN101542670B (en) * | 2007-08-08 | 2012-06-20 | 釜屋电机株式会社 | Chip fuse and its manufacturing method |
| CN102646550A (en) * | 2012-04-20 | 2012-08-22 | 中国振华集团云科电子有限公司 | Plate fuse and manufacturing method therefor |
| CN102915816A (en) * | 2012-09-28 | 2013-02-06 | 广东风华高新科技股份有限公司 | Anti-jamming and overvoltage and overcurrent protection sheet type component and manufacturing method thereof |
| CN103208401A (en) * | 2013-04-01 | 2013-07-17 | Aem科技(苏州)股份有限公司 | Circuit protection device and manufacturing method thereof |
| CN104025242A (en) * | 2011-10-19 | 2014-09-03 | 保险丝公司 | Composite Fuse Element And Method Of Making |
| CN104813433A (en) * | 2012-09-28 | 2015-07-29 | 釜屋电机株式会社 | Chip fuse and manufacturing method therefor |
| CN114464509A (en) * | 2022-02-25 | 2022-05-10 | 中国振华集团云科电子有限公司 | Surface-mounted thick film fuse structure and manufacturing method thereof |
| CN117524810A (en) * | 2024-01-03 | 2024-02-06 | 芯体素(杭州)科技发展有限公司 | Overcurrent protector for integrated circuit |
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2006
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| CN101542670B (en) * | 2007-08-08 | 2012-06-20 | 釜屋电机株式会社 | Chip fuse and its manufacturing method |
| WO2010060275A1 (en) * | 2008-11-25 | 2010-06-03 | 南京萨特科技发展有限公司 | Multilayer chip fuse and method of making the same |
| US8957755B2 (en) | 2008-11-25 | 2015-02-17 | Nanjing Sart Science & Technology Development Co., Ltd. | Multi-layer blade fuse and the manufacturing method thereof |
| CN101933113B (en) * | 2009-03-30 | 2015-03-11 | 釜屋电机株式会社 | Chip fuse and method of manufacturing same |
| CN101933113A (en) * | 2009-03-30 | 2010-12-29 | 釜屋电机株式会社 | Chip fuse and method of manufacturing same |
| US10134556B2 (en) | 2011-10-19 | 2018-11-20 | Littelfuse, Inc. | Composite fuse element and method of making |
| CN104025242A (en) * | 2011-10-19 | 2014-09-03 | 保险丝公司 | Composite Fuse Element And Method Of Making |
| CN102646550A (en) * | 2012-04-20 | 2012-08-22 | 中国振华集团云科电子有限公司 | Plate fuse and manufacturing method therefor |
| CN102646550B (en) * | 2012-04-20 | 2015-07-08 | 中国振华集团云科电子有限公司 | Plate fuse and manufacturing method therefor |
| CN102915816A (en) * | 2012-09-28 | 2013-02-06 | 广东风华高新科技股份有限公司 | Anti-jamming and overvoltage and overcurrent protection sheet type component and manufacturing method thereof |
| CN104813433A (en) * | 2012-09-28 | 2015-07-29 | 釜屋电机株式会社 | Chip fuse and manufacturing method therefor |
| CN102915816B (en) * | 2012-09-28 | 2015-10-28 | 广东风华高新科技股份有限公司 | Anti-interference with overvoltage, overcurrent protection chip component and manufacture method thereof |
| CN104813433B (en) * | 2012-09-28 | 2017-10-24 | 釜屋电机株式会社 | The manufacture method of chip fuse and chip fuse |
| US9852868B2 (en) | 2012-09-28 | 2017-12-26 | Kamaya Electric Co., Ltd. | Chip fuse and manufacturing method therefor |
| CN103208401B (en) * | 2013-04-01 | 2014-12-17 | Aem科技(苏州)股份有限公司 | Circuit protection device and manufacturing method thereof |
| CN103208401A (en) * | 2013-04-01 | 2013-07-17 | Aem科技(苏州)股份有限公司 | Circuit protection device and manufacturing method thereof |
| CN114464509A (en) * | 2022-02-25 | 2022-05-10 | 中国振华集团云科电子有限公司 | Surface-mounted thick film fuse structure and manufacturing method thereof |
| CN117524810A (en) * | 2024-01-03 | 2024-02-06 | 芯体素(杭州)科技发展有限公司 | Overcurrent protector for integrated circuit |
| CN117524810B (en) * | 2024-01-03 | 2024-04-05 | 芯体素(杭州)科技发展有限公司 | Overcurrent protector for integrated circuit |
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|---|---|
| CN100555500C (en) | 2009-10-28 |
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Granted publication date: 20091028 Termination date: 20170904 |