CN106982517A - A kind of method that use thermosetting ink prints PCB welding resisting layers - Google Patents
A kind of method that use thermosetting ink prints PCB welding resisting layers Download PDFInfo
- Publication number
- CN106982517A CN106982517A CN201710386235.2A CN201710386235A CN106982517A CN 106982517 A CN106982517 A CN 106982517A CN 201710386235 A CN201710386235 A CN 201710386235A CN 106982517 A CN106982517 A CN 106982517A
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- China
- Prior art keywords
- silk
- thermosetting ink
- screen plate
- welding resisting
- pcb
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
Abstract
Present invention system provides a kind of method that use thermosetting ink prints PCB welding resisting layers, comprises the following steps：The foreign matters such as oxide, rubbish on a, nog plate, removal pcb board face；B, making silk-screen plate, apply last layer photoresists, the film are placed on silk-screen plate, expose, and pattern transfer is on silk-screen plate, development；C, installation silk-screen plate；D, allotment thermosetting ink, reinforce agent into thermosetting ink and diluent stir；E, printing, Semi-automatic printer are bitten deployed thermosetting ink in PCB plate face by silk-screen plate with scraper；F, baking, oven cooking cycle, thermosetting ink solidification formation welding resisting layer are put into by the PCB printed；G, examination board.The present invention bites thermosetting ink on pcb board face by silk-screen plate, directly heats and solidify to form welding resisting layer, and effect fully achieves traditional handicraft and makes the quality requirements of the welding resisting layer obtained, and can effectively reduce production cost, improves production efficiency.
Description
Technical field
The present invention relates to PCB print fields, a kind of method that use thermosetting ink prints PCB welding resisting layers is specifically disclosed.
Background technology
PCB full name printed circuit board (PCB)s, PCB make mainly include sawing sheet, drilling, sink copper, image transfer, graphic plating, take off
Film, etching, green oil, character, plating golden finger, shaping, test and inspection eventually.
Traditional image transfer step first carries out nog plate processing to PCB, makes silk-screen plate, and harness cord half tone prints on pcb board
One layer of photosensitive-ink of brush, progress is pre-baked, static, and the film for designing figure is placed on PCB, is exposed by exposure machine alignment,
Unnecessary figure is removed by developer spray again, surface welding resisting layer is obtained.Traditional image branch mode often prints one piece of PCB
Plate is accomplished by carrying out the step of print photosensitive-ink, pre-baked, printing, static, contraposition, exposure, development, wherein needing using printing
The equipment such as machine, pre- baking box, exposure machine, developing machine, at the same every equipment need to consume corresponding water power, cost of labor, material and
Time, not only PCB Production Time is long, while cost is high.
The content of the invention
Based on this, it is necessary to for prior art problem there is provided a kind of method that use thermosetting ink prints PCB welding resisting layers,
Directly anti-welding figure is bitten on PCB surface by silk-screen plate using thermosetting ink, is done directly by baking box electrothermal solidifying
The making of welding resisting layer, technological process is short, and fabrication cycle is short, saves material, water power, artificial, low manufacture cost.
To solve prior art problem, the method that the present invention disclose a kind of use thermosetting ink printing PCB welding resisting layers, including with
Lower step：
A, nog plate, remove the foreign matters such as oxide, rubbish on pcb board face, are roughened pcb board face, then cleaned, dried, it is quiet
Only；
B, making silk-screen plate, one layer of photoresists are uniformly coated with silk-screen plate, the designed film is placed on silk-screen plate, passed through
Exposure machine is exposed, and is made pattern transfer on silk-screen plate, is developed by developer solution, and clear water is cleaned and dried, and is obtained
Obtain silk-screen plate；
C, installation silk-screen plate, silk-screen plate is arranged on Semi-automatic printer by PIN nails；
D, allotment thermosetting ink, reinforce agent into thermosetting ink and diluent stir；
E, printing, Semi-automatic printer are bitten deployed thermosetting ink in PCB plate face by silk-screen plate with scraper, quiet
Only 30-60min；
F, baking, oven cooking cycle is put into by the PCB printed, and baking temperature is 150-160 DEG C, and baking time is 50-60min,
Thermosetting ink solidification formation welding resisting layer；
Whether the welding resisting layer formed on g, examination board, detection pcb board face meets the requirements.
Further, in step a, the mesh number of polish-brush is 320 or 500 mesh.
Further, in step a, nog plate speed is 2-3m/min, and wear scar width is 10-15mm.
Further, in step a, before being cleaned after nog plate, the broken experiment of water-filling is entered to pcb board face and is more than 15s.
Further, in step b, the tension force of silk-screen plate is 25-30PAS, and mesh number is 130-160 mesh.
Further, in step b, the windowing of silk-screen plate is more than 5mil, and the windowed thread of silk-screen plate is away from more than 3mil.
Further, in step d, thermosetting ink uses BK-3-1 ink.
Further, in step e, squeegee pressure is 5-6kg/cm2。
Further, in step e, print speed printing speed is 50-60Hz.
Further, in step e, scraper hardness is 75 degree, and blade width is 9-11mm, and scraper angle is 45-75 degree.
Beneficial effects of the present invention are：The present invention discloses a kind of method that use thermosetting ink prints PCB welding resisting layers, by thermosetting
Ink is bitten on pcb board face by silk-screen plate, directly heats and solidify to form welding resisting layer, and effect fully achieves traditional handicraft
The quality requirements of the welding resisting layer obtained are made, and the method for the present invention saves contraposition, exposure, develop required material, water
Electricity, artificial and time, production cost can be effectively reduced, more than half can drop in production cost, while production can be effectively improved
Efficiency.
Embodiment
For the feature, technological means and the specific purposes reached, function of the present invention can be further appreciated that, with reference to
Embodiment is described in further detail to the present invention.
The embodiment of the present invention discloses a kind of method that use thermosetting ink prints PCB welding resisting layers, comprises the following steps：
A, nog plate, remove the foreign matters such as oxide, rubbish on pcb board face, are roughened pcb board face, then cleaned, dried, it is quiet
Only；
B, making silk-screen plate, one layer of photoresists are uniformly coated with silk-screen plate, the designed film is placed on silk-screen plate, passed through
Exposure machine is exposed, and is made pattern transfer on silk-screen plate, is developed by developer solution, and clear water is cleaned and dried, and is obtained
Obtain silk-screen plate；
C, installation silk-screen plate, silk-screen plate is arranged on Semi-automatic printer by PIN nails；
D, allotment thermosetting ink, reinforce agent into thermosetting ink and diluent stir；
E, printing, Semi-automatic printer are bitten deployed thermosetting ink in PCB plate face by silk-screen plate with scraper, quiet
Only 30-60min；
F, baking, oven cooking cycle is put into by the PCB printed, and baking temperature is 150-160 DEG C, and baking time is 50-60min,
Thermosetting ink solidification formation welding resisting layer；
Whether the welding resisting layer formed on g, examination board, detection pcb board face meets the requirements.
Thermosetting ink is mainly made up of resin, plasticizer, auxiliary agent etc., and the coating of thermosetting ink has to pass through high-temperature baking
Ink solidification can be molded, thermosetting ink have the advantages that it is simple, convenient, be easy to preserve, it is environment friendly and pollution-free.
The present invention directly bites thermosetting ink on pcb board face by silk-screen plate, directly heats and solidify to form welding resisting layer,
Effect fully achieves the quality requirements that traditional handicraft makes the welding resisting layer obtained, and the method for the present invention is saved pair
Material, water power needed for position, exposure, development, artificial and time, production cost can be effectively reduced, half can drop in production cost
More than, while production efficiency can be effectively improved.
Based on above-described embodiment, in step a, the polish-brush used is pin brush, and the mesh number of polish-brush is 320 or 500 mesh, nog plate speed
Spend for 2-3m/min, wear scar width is 10-15mm, before cleaning after nog plate, water-filling is entered to pcb board face break experiment to be more than
15s, the broken experiment of water, which refers to duck in drink PCB to then pick up, to be come, and is calculated the time of water break, is for testing pcb board face
It is no sufficiently coarse.
Based on above-described embodiment, in step a, the washing pressure that cleaning pcb board face is used is 2-3kg/cm2, drying temperature
For 90-110 DEG C, quiescent time is 15-120min.
Based on above-described embodiment, in step b, the tension force of silk-screen plate is 25-30PAS, and mesh number is 130-160 mesh, preferably
Ground, silk-screen plate mesh number is 150 mesh, and the windowing of silk-screen plate is more than 5mil, and the windowed thread of silk-screen plate is away from more than 3mil.
Based on above-described embodiment, in step c, the place of silk-screen will be needed on the silk-screen hole alignment pcb board face of silk-screen plate.
Based on above-described embodiment, in step d, thermosetting ink uses BK-3-1 ink, and diluent is added by 1-3% volume ratio
Plus, mixing time is 15-30min.
Based on above-described embodiment, in step e, using flying horse board scraper, scraper hardness is 75 degree, and blade width is 9-
11mm, scraper angle is 45-75 degree；Scraper moves to opposite side from the side of silk-screen plate, and thermosetting ink is passed through into silk-screen plate
Mesh is uniformly bitten, and squeegee pressure is 5-6kg/cm2, print speed printing speed is 50-60Hz, static 30-60min after printing.
Based on above-described embodiment, in step f, it is preferable that baking temperature is 150 DEG C, baking time is 60min.
Based on above-described embodiment, in step g, detection is substantially carried out thermal shock experiment, checks pcb board face whether there is ink layering
The problems such as bubbling, whether there is ink contamination, have unbiased hole.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of method that use thermosetting ink prints PCB welding resisting layers, it is characterised in that comprise the following steps：
A, nog plate, remove the foreign matters such as oxide, rubbish on pcb board face, are roughened pcb board face, then cleaned, dried, it is quiet
Only；
B, making silk-screen plate, one layer of photoresists are uniformly coated with silk-screen plate, the designed film is placed on silk-screen plate, passed through
Exposure machine is exposed, and is made pattern transfer on silk-screen plate, is developed by developer solution, and clear water is cleaned and dried, and is obtained
Obtain silk-screen plate；
C, installation silk-screen plate, silk-screen plate is arranged on Semi-automatic printer by PIN nails；
D, allotment thermosetting ink, reinforce agent into thermosetting ink and diluent stir；
E, printing, Semi-automatic printer are bitten deployed thermosetting ink in PCB plate face by silk-screen plate with scraper, quiet
Only 30-60min；
F, baking, oven cooking cycle is put into by the PCB printed, and baking temperature is 150-160 DEG C, and baking time is 50-60min,
Thermosetting ink solidification formation welding resisting layer；
Whether the welding resisting layer formed on g, examination board, detection pcb board face meets the requirements.
2. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step a
In, the mesh number of polish-brush is 320 or 500 mesh.
3. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step a
In, nog plate speed is 2-3m/min, and wear scar width is 10-15mm.
4. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step a
In, before being cleaned after nog plate, the broken experiment of water-filling is entered to pcb board face and is more than 15s.
5. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step b
In, the tension force of silk-screen plate is 25-30PAS, and mesh number is 130-160 mesh.
6. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step b
In, the windowing of silk-screen plate is more than 5mil, and the windowed thread of silk-screen plate is away from more than 3mil.
7. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step d
In, thermosetting ink uses BK-3-1 ink.
8. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step e
In, squeegee pressure is 5-6kg/cm2。
9. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step e
In, print speed printing speed is 50-60Hz.
10. the method that a kind of use thermosetting ink according to claim 1 prints PCB welding resisting layers, it is characterised in that step e
In, scraper hardness is 75 degree, and blade width is 9-11mm, and scraper angle is 45-75 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710386235.2A CN106982517A (en) | 2017-05-26 | 2017-05-26 | A kind of method that use thermosetting ink prints PCB welding resisting layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710386235.2A CN106982517A (en) | 2017-05-26 | 2017-05-26 | A kind of method that use thermosetting ink prints PCB welding resisting layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106982517A true CN106982517A (en) | 2017-07-25 |
Family
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Family Applications (1)
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|---|---|---|---|
| CN201710386235.2A Pending CN106982517A (en) | 2017-05-26 | 2017-05-26 | A kind of method that use thermosetting ink prints PCB welding resisting layers |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108116031A (en) * | 2017-12-29 | 2018-06-05 | 东莞市合鼎电路有限公司 | A kind of wiring board text printout method |
| CN109587965A (en) * | 2018-11-21 | 2019-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of processing method controlling pcb board character white oil block thickness |
| CN109624488A (en) * | 2019-02-28 | 2019-04-16 | 业成科技（成都）有限公司 | Wire mark ejecting device |
| CN110379576A (en) * | 2019-07-25 | 2019-10-25 | 东莞福哥电子有限公司 | A kind of resistor body printing process of more resistance values |
| CN110421987A (en) * | 2019-07-25 | 2019-11-08 | 东莞福哥电子有限公司 | One kind having of different shapes equal valued resistors printing process |
| CN110856368A (en) * | 2019-11-22 | 2020-02-28 | 东莞市鸿运电子有限公司 | White oil solder resist UV (ultraviolet) process |
| CN111565519A (en) * | 2020-06-02 | 2020-08-21 | 锡凡半导体无锡有限公司 | Printing non-photosensitive etching process |
| CN113573502A (en) * | 2021-07-28 | 2021-10-29 | 深圳市安元达电子有限公司 | Method for manufacturing PCB or FPC precise bonding pad |
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| CN1544550A (en) * | 2003-11-21 | 2004-11-10 | 大化集团有限责任公司 | Hot curing solder resistant printing-ink composition |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
| CN104883825A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Method for making solder mask layer on circuit board |
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Patent Citations (4)
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| JPH10335831A (en) * | 1997-05-23 | 1998-12-18 | Samsung Aerospace Ind Ltd | Multilayered wiring board and its manufacture |
| CN1544550A (en) * | 2003-11-21 | 2004-11-10 | 大化集团有限责任公司 | Hot curing solder resistant printing-ink composition |
| CN104047041A (en) * | 2013-03-15 | 2014-09-17 | 深圳市九和咏精密电路有限公司 | Preparation method for printed circuit board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108116031A (en) * | 2017-12-29 | 2018-06-05 | 东莞市合鼎电路有限公司 | A kind of wiring board text printout method |
| CN109587965A (en) * | 2018-11-21 | 2019-04-05 | 奥士康精密电路（惠州）有限公司 | A kind of processing method controlling pcb board character white oil block thickness |
| CN109624488A (en) * | 2019-02-28 | 2019-04-16 | 业成科技（成都）有限公司 | Wire mark ejecting device |
| CN110379576A (en) * | 2019-07-25 | 2019-10-25 | 东莞福哥电子有限公司 | A kind of resistor body printing process of more resistance values |
| CN110421987A (en) * | 2019-07-25 | 2019-11-08 | 东莞福哥电子有限公司 | One kind having of different shapes equal valued resistors printing process |
| CN110421987B (en) * | 2019-07-25 | 2021-08-10 | 东莞福哥电子有限公司 | Equal-resistance resistor printing method with different shapes |
| CN110379576B (en) * | 2019-07-25 | 2021-12-07 | 东莞福哥电子有限公司 | Multi-resistance resistor body printing method |
| CN110856368A (en) * | 2019-11-22 | 2020-02-28 | 东莞市鸿运电子有限公司 | White oil solder resist UV (ultraviolet) process |
| CN111565519A (en) * | 2020-06-02 | 2020-08-21 | 锡凡半导体无锡有限公司 | Printing non-photosensitive etching process |
| CN113573502A (en) * | 2021-07-28 | 2021-10-29 | 深圳市安元达电子有限公司 | Method for manufacturing PCB or FPC precise bonding pad |
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Application publication date: 20170725 |
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| RJ01 | Rejection of invention patent application after publication |