CN108513444A - A kind of overlength plate pattern-producing method - Google Patents
A kind of overlength plate pattern-producing method Download PDFInfo
- Publication number
- CN108513444A CN108513444A CN201810697780.8A CN201810697780A CN108513444A CN 108513444 A CN108513444 A CN 108513444A CN 201810697780 A CN201810697780 A CN 201810697780A CN 108513444 A CN108513444 A CN 108513444A
- Authority
- CN
- China
- Prior art keywords
- hole
- overlength plate
- overlength
- group
- producing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention provides a kind of overlength plate pattern-producing method, which is characterized in that includes step in detail below：Substrate is cut into and requires processing dimension by S1. sawing sheet；S2. it drills, location hole is drilled out on overlength plate；Overlength plate is done cleaning and roughening treatment by S3. circuit pre-treatment；S4. dry film is pasted；S5.LDI graphic makings.The present invention is in such a way that the location hole of subsection setup is by overlength plate segmental machining, solve the problems, such as that the processing of overlength plate is inconvenient in the prior art, it is innovated simultaneously by the optimization of location hole setting method, realize the processing of overlength plate precise positioning, and directly make figure on overlength plate, it is simple to operation, it is suitable for large range promotion use.
Description
Technical field
The invention belongs to wiring boards to process preparing technical field, and in particular to a kind of overlength plate pattern-producing method.
Background technology
At present in printed wiring board industry, single side size is more than that the working plate of 24inch is known as overlength plate, because size is more than
Rotine exposure machine and LDI equipment processing abilities, many companies can not order production or external coordination look for big processing countertop fixture system
Make.Which results in the increases of the limitation of the scope of business and production cost.
Invention content
In view of this, the present invention provides a kind of overlength plate pattern-producing method, the present invention solve overlength plate LDI equipment without
Method directly makes the problem of figure, and simple to operation.
The technical scheme is that：A kind of overlength plate pattern-producing method, which is characterized in that comprising walking in detail below
Suddenly：
Substrate is cut into and requires processing dimension by S1. sawing sheet；
S2. it drills, location hole is drilled out on overlength plate；
Overlength plate is done cleaning and roughening treatment by S3. circuit pre-treatment；
S4. dry film is pasted；
S5.LDI graphic makings.
Further, in step S2, at least 3 groups of location holes, the number of every group of location hole are specially drilled out on overlength plate
It is 2-4.
Further, in step S2, the overlength plate includes the symmetrically arranged region " A " and the region " B ", the drillman
Skill specifically includes following steps：
A. drilling bore hole 1, hole 2, hole 3, hole 4, hole 5, hole 6 totally six location holes on working plate；
B. hole 3, hole 4, hole 5, hole 6 is used to position drilling bore hole 7,8 two, hole location hole；
C. it uses hole 1, hole 2, hole 3,4 four, hole location hole to position, makes the figure in the region overlength plate " A "；
D. it uses hole 5, hole 6, hole 7,8 four, hole location hole to position, makes the figure in the region overlength plate " B ".
Further, the hole 1, hole 2 are the first hole group, and the hole 3, hole 4 are the second hole group, and the hole 5, hole 6 are the
Three hole groups, the hole 7, hole 8 are the 4th hole group.
Further, first hole group, the second hole group are symmetrically set in the intermediate region both sides of the overlength plate.
Further, third hole group, the 4th hole group are symmetrically set in the both sides of the overlength plate.
Further, the third hole is mounted on the side in the region " A ", and the 4th hole is mounted on the side in the region " B ".
In the present invention, in such a way that the location hole of subsection setup is by overlength plate segmental machining, by drilling out more set positioning
Hole realizes that figure substep makes, and solves the problems, such as overlength plate processing inconvenience in the prior art, while passing through location hole setting side
The optimization of method is innovated, and realizes the processing of overlength plate precise positioning, and directly make figure on overlength plate, simple to operation, is fitted
Conjunction is promoted the use of on a large scale.
Description of the drawings
Fig. 1 is the schematic diagram of processing super long plate of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment
A kind of overlength plate pattern-producing method, which is characterized in that include step in detail below：
Substrate is cut into and requires processing dimension by S1. sawing sheet；
S2. it drills, location hole is drilled out on overlength plate；
Overlength plate is done cleaning and roughening treatment by S3. circuit pre-treatment；
S4. dry film is pasted；
S5.LDI graphic makings.
Further, in step S2, at least 3 groups of location holes, the number of every group of location hole are specially drilled out on overlength plate
It is 2-4.
Further, in step S2, the overlength plate includes the symmetrically arranged region " A " and the region " B ", the drillman
Skill specifically includes following steps：
A. drilling bore hole 1, hole 2, hole 3, hole 4, hole 5, hole 6 totally six location holes on working plate；
B. hole 3, hole 4, hole 5, hole 6 is used to position drilling bore hole 7,8 two, hole location hole；
C. it uses hole 1, hole 2, hole 3,4 four, hole location hole to position, makes the figure in the region overlength plate " A "；
D. it uses hole 5, hole 6, hole 7,8 four, hole location hole to position, makes the figure in the region overlength plate " B ".
Further, the hole 1, hole 2 are the first hole group, and the hole 3, hole 4 are the second hole group, and the hole 5, hole 6 are the
Three hole groups, the hole 7, hole 8 are the 4th hole group.
Further, first hole group, the second hole group are symmetrically set in the intermediate region both sides of the overlength plate.
Further, third hole group, the 4th hole group are symmetrically set in the both sides of the overlength plate.
Further, the third hole is mounted on the side in the region " A ", and the 4th hole is mounted on the side in the region " B ".
In the present invention, in such a way that the location hole of subsection setup is by overlength plate segmental machining, by drilling out more set positioning
Hole realizes that figure substep makes, and solves the problems, such as overlength plate processing inconvenience in the prior art, while passing through location hole setting side
The optimization of method is innovated, and realizes the processing of overlength plate precise positioning, and directly make figure on overlength plate, simple to operation, is fitted
Conjunction is promoted the use of on a large scale.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.It is noted that the technical characteristic not being described in detail in the present invention, it can be by appointing
One prior art is realized.
Claims (7)
1. a kind of overlength plate pattern-producing method, which is characterized in that include step in detail below：
Substrate is cut into and requires processing dimension by S1. sawing sheet；
S2. it drills, location hole is drilled out on overlength plate；
Overlength plate is done cleaning and roughening treatment by S3. circuit pre-treatment；
S4. dry film is pasted；
S5.LDI graphic makings.
2. a kind of overlength plate pattern-producing method according to claim 1, which is characterized in that in step S2, specially exist
At least 3 groups of location holes are drilled out on overlength plate, the number of every group of location hole is 2-4.
3. a kind of overlength plate pattern-producing method according to claim 1, which is characterized in that in step S2, the overlength
Plate includes the symmetrically arranged region " A " and the region " B ", and the bore process specifically includes following steps：
A. drilling bore hole 1, hole 2, hole 3, hole 4, hole 5, hole 6 totally six location holes on working plate；
B. hole 3, hole 4, hole 5, hole 6 is used to position drilling bore hole 7,8 two, hole location hole；
C. it uses hole 1, hole 2, hole 3,4 four, hole location hole to position, makes the figure in the region overlength plate " A "；
D. it uses hole 5, hole 6, hole 7,8 four, hole location hole to position, makes the figure in the region overlength plate " B ".
4. a kind of overlength plate pattern-producing method according to claim 3, which is characterized in that the hole 1, hole 2 are first
Hole group, the hole 3, hole 4 are the second hole group, and the hole 5, hole 6 are third hole group, and the hole 7, hole 8 are the 4th hole group.
5. a kind of overlength plate pattern-producing method according to claim 4, which is characterized in that first hole group, second
Hole group is symmetrically set in the intermediate region both sides of the overlength plate.
6. a kind of overlength plate pattern-producing method according to claim 4, which is characterized in that third hole group, the 4th
Hole group is symmetrically set in the both sides of the overlength plate.
7. a kind of overlength plate pattern-producing method according to claim 6, which is characterized in that the third hole is mounted on
The side in the region " A ", the 4th hole are mounted on the side in the region " B ".
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697780.8A CN108513444A (en) | 2018-06-29 | 2018-06-29 | A kind of overlength plate pattern-producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697780.8A CN108513444A (en) | 2018-06-29 | 2018-06-29 | A kind of overlength plate pattern-producing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108513444A true CN108513444A (en) | 2018-09-07 |
Family
ID=63404003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810697780.8A Pending CN108513444A (en) | 2018-06-29 | 2018-06-29 | A kind of overlength plate pattern-producing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108513444A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785012A (en) * | 2019-10-10 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Drilling and positioning manufacturing method for ultra-long multilayer board |
| CN112105164A (en) * | 2020-10-26 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Any Layer outer Layer 4 segmentation exposure alignment method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101282617A (en) * | 2007-04-04 | 2008-10-08 | 王定锋 | Flexible printed circuit board of complete winding non-intermittence circuit as well as manufacturing technique |
| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
| CN105101653A (en) * | 2015-09-17 | 2015-11-25 | 安捷利电子科技（苏州）有限公司 | Preparation method of ultra-long flexible circuit board |
| CN206237686U (en) * | 2016-12-14 | 2017-06-09 | 珠海精毅电路有限公司 | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device |
-
2018
- 2018-06-29 CN CN201810697780.8A patent/CN108513444A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101282617A (en) * | 2007-04-04 | 2008-10-08 | 王定锋 | Flexible printed circuit board of complete winding non-intermittence circuit as well as manufacturing technique |
| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
| CN105101653A (en) * | 2015-09-17 | 2015-11-25 | 安捷利电子科技（苏州）有限公司 | Preparation method of ultra-long flexible circuit board |
| CN206237686U (en) * | 2016-12-14 | 2017-06-09 | 珠海精毅电路有限公司 | A kind of one side overlength, ultra-thin internal layer circuit plate positioning device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785012A (en) * | 2019-10-10 | 2020-02-11 | 惠州市金百泽电路科技有限公司 | Drilling and positioning manufacturing method for ultra-long multilayer board |
| CN112105164A (en) * | 2020-10-26 | 2020-12-18 | 广东科翔电子科技股份有限公司 | Any Layer outer Layer 4 segmentation exposure alignment method |
| CN112105164B (en) * | 2020-10-26 | 2021-08-06 | 广东科翔电子科技股份有限公司 | Any Layer outer Layer 4 segmentation exposure alignment method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180907 |