CN105228348A - Ultra-long circuit board drilling method - Google Patents
Ultra-long circuit board drilling method Download PDFInfo
- Publication number
- CN105228348A CN105228348A CN201510508784.3A CN201510508784A CN105228348A CN 105228348 A CN105228348 A CN 105228348A CN 201510508784 A CN201510508784 A CN 201510508784A CN 105228348 A CN105228348 A CN 105228348A
- Authority
- CN
- China
- Prior art keywords
- location hole
- circuit board
- ultra
- axle
- drilling method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
A kind of ultra-long circuit board drilling method, comprise: step 1, use X ray target-shooting machine gets the first location hole, the second location hole, the 3rd location hole and the 4th location hole required for boring on circuit boards, and the first location hole and the 3rd location hole are relatively arranged, the second location hole and the 4th location hole are relatively arranged; Step 2, utilize the first location hole, the second location hole and the 4th location hole to be fixed on the processing table top of rig by circuit board, and utilize the region near the first location hole side of the line of the first axle processing between the second location hole and the 4th location hole of rig; Step 3, utilizes the second location hole, the 3rd location hole and the 4th location hole to be fixed on by circuit board on processing table top, and utilizes the region near the 3rd location hole side of the line of the second axle processing between the second location hole and the 4th location hole of rig.The present invention can use conventional drill to carry out processing super long plate, and can enhance productivity, reduces equipment cost.
Description
Technical field
The present invention relates to circuit board manufacture field, particularly a kind of ultra-long circuit board drilling method.
Background technology
In PCB industry, length is more than the plate of 24inch, and we are called overlength plate.This kind of overlength plate is met by general little company, directly refuses single process, because impotentia meets customer requirement in digital control hole drilling.For the company that some are large, the general machine adopting large processing table top, manufactures, virtually just adds production cost like this.The present invention adopts double fragmentation to process, uses the mode sharing location hole to make, and completely solves size large, the problem of difficult processing.
Large scale backboard is the trend of following PCB industry, but in industry, many companies cannot meet or have no idea to solve the processing requirement of this type of plate.Can make in time, also there is equipment cost high, the production cycle is long, and flow process is complicated, and needing professional and technical personnel to follow up can make, and cannot accomplish conventional batch production.
Summary of the invention
The invention provides one can use conventional drill to carry out processing super long plate, and can enhance productivity, reduces equipment cost, and workable ultra-long circuit board drilling method.
For solving the problem, as one aspect of the present invention, provide a kind of ultra-long circuit board drilling method, comprise: step 1, use X ray target-shooting machine gets the first location hole required for boring on circuit boards, second location hole, 3rd location hole and the 4th location hole, circuit board comprises effective graphics field, first location hole, second location hole, 3rd location hole and the 4th location hole are corresponding with the four edges of circuit board respectively to be arranged and is positioned at the outside in active graphical region, and the first location hole and the 3rd location hole are relatively arranged, second location hole and the 4th location hole are relatively arranged, step 2, utilize the first location hole, the second location hole and the 4th location hole to be fixed on the processing table top of rig by circuit board, and utilize the region near the first location hole side of the line of the first axle processing between the second location hole and the 4th location hole of rig, step 3, utilizes the second location hole, the 3rd location hole and the 4th location hole to be fixed on by circuit board on processing table top, and utilizes the region near the 3rd location hole side of the line of the second axle processing between the second location hole and the 4th location hole of rig.
Preferably, in step 2, when the first axle work, the second axle is in closed condition.
Preferably, in step 3, when the second axle work, the first axle is in closed condition.
Preferably, step 2 and step 2 use different processing control procedure to control.
Preferably, the length of ultra-long circuit board is greater than 24 inches.
Preferably, also comprise before step 1: sawing sheet step, is cut into predetermined processing dimension by central layer; Interior photoimaging, makes inner conductor by wire pattern on central layer; Lamination, is pressed into a multilayer circuit board by the central layer of multilayer by adhesive sheet.
Use the technical scheme in the present invention, conventional drill can be used to carry out processing super long plate, and can enhance productivity, reduce equipment cost, and workable, can normally produce without the need to professional and technical personnel.
Accompanying drawing explanation
Fig. 1 schematically shows the structural representation of circuit board;
Fig. 2 schematically shows the position relationship schematic diagram of first to fourth location hole on circuit board;
Fig. 3 schematically shows schematic diagram during processing the first side;
Fig. 4 schematically shows schematic diagram during processing the second side.
Reference numeral in figure: 1, circuit board; 2, the first location hole; 3, the second location hole; 4, the 3rd location hole; 5, the 4th location hole; 6, active graphical region; 7, table top is processed; 8, the first axle; 9, the second axle.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
Please refer to Fig. 1 to Fig. 4, the invention provides a kind of ultra-long circuit board drilling method, comprising:
Step 1, as shown in Figure 2, use X ray target-shooting machine gets the first location hole 2, second location hole 3, the 3rd location hole 4 and the 4th location hole 5 required for boring on the circuit card 1, circuit board 1 comprises effective graphics field 6, first location hole 2, second location hole 3, the 3rd location hole 4 and the 4th location hole 5 are corresponding with the four edges of circuit board 1 respectively to be arranged and is positioned at the outside in active graphical region 6, and the first location hole 2 and the 3rd location hole 4 are relatively arranged, the second location hole 3 and the 4th location hole 5 are relatively arranged;
Step 2, as shown in Figures 2 and 3, utilize the first location hole 2, second location hole 3 and the 4th location hole 5 to be fixed on the processing table top 7 of rig by circuit board 1, and utilize the first axle 8 of rig to process the region near the first location hole 2 side of the line between the second location hole 3 and the 4th location hole 5; Wherein, the hole that the circle in Fig. 2 is formed when representing first time boring in step 2.
Step 3, as shown in Figures 2 and 4, utilize the second location hole 3, the 3rd location hole 4 and the 4th location hole 5 to be fixed on by circuit board 1 on processing table top 7, and utilize the second axle 9 of rig to process the region near the 3rd location hole 4 side of the line between the second location hole 3 and the 4th location hole 5.Wherein, the hole that the triangle in Fig. 2 is formed when representing second time boring in step 3.
In prior art, when drill process, under normal circumstances, only three holes are bored.Owing to have employed technique scheme, overlength twist drill hole machines by the present invention at twice, like this, only need to use 2 conventional axle rigs to produce, and add man-hour shared second and the 4th location hole for twice, thus improve position, the hole precision of twice processing, Shi Ge manufacturer can accomplish to produce this kind of overlength plate in batches.
Use the technical scheme in the present invention, conventional drill can be used to carry out processing super long plate, and can enhance productivity, reduce equipment cost, and workable, can normally produce without the need to professional and technical personnel.
Preferably, in step 2, when the first axle 8 works, the second axle 9 is in closed condition.
Preferably, in step 3, when the second axle 9 works, the first axle 8 is in closed condition.
Preferably, step 2 and step 2 use different processing control procedure to control.
Preferably, the length of ultra-long circuit board is greater than 24 inches.
Preferably, also comprise before step 1: sawing sheet step, is cut into predetermined processing dimension by central layer; Interior photoimaging, makes inner conductor by wire pattern on central layer; Lamination, is pressed into a multilayer circuit board by the central layer of multilayer by adhesive sheet.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a ultra-long circuit board drilling method, is characterized in that, comprising:
Step 1, the first location hole (2) required for boring is got at circuit board (1) upper use X ray target-shooting machine, second location hole (3), 3rd location hole (4) and the 4th location hole (5), described circuit board (1) comprises effective graphics field (6), described first location hole (2), described second location hole (3), described 3rd location hole (4) and the 4th location hole (5) are corresponding with the four edges of described circuit board (1) respectively to be arranged and is positioned at the outside of described active graphical region (6), and described first location hole (2) and described 3rd location hole (4) are relatively arranged, described second location hole (3) and described 4th location hole (5) are relatively arranged,
Step 2, utilize described first location hole (2), described second location hole (3) and described 4th location hole (5) to be fixed on the processing table top (7) of rig by described circuit board (1), and utilize first axle (8) of described rig to process the region of close described first location hole (2) side of the line be positioned between described second location hole (3) and described 4th location hole (5);
Step 3, utilize described second location hole (3), described 3rd location hole (4) and described 4th location hole (5) to be fixed on described processing table top (7) by described circuit board (1), and utilize second axle (9) of described rig to process the region of close described 3rd location hole (4) side of the line be positioned between described second location hole (3) and described 4th location hole (5).
2. ultra-long circuit board drilling method according to claim 1, is characterized in that, in described step 2, when described first axle (8) work, described second axle (9) is in closed condition.
3. according to the super work circuit boring processing method described in claim 1 to 2, it is characterized in that, in described step 3, when described second axle (9) work, described first axle (8) is in closed condition.
4. the ultra-long circuit board drilling method according to claims 1 to 3, is characterized in that, described step 2 and described step 2 use different processing control procedure to control.
5. ultra-long circuit board drilling method according to claim 1, is characterized in that, the length of described ultra-long circuit board is greater than 24 inches.
6. ultra-long circuit board drilling method according to claim 1, is characterized in that, also comprises before step 1:
Sawing sheet step, is cut into predetermined processing dimension by central layer;
Interior photoimaging, makes inner conductor by wire pattern on described central layer;
Lamination, is pressed into a multilayer circuit board by the described central layer of multilayer by adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510508784.3A CN105228348B (en) | 2015-08-19 | 2015-08-19 | Ultra-long circuit board drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510508784.3A CN105228348B (en) | 2015-08-19 | 2015-08-19 | Ultra-long circuit board drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105228348A true CN105228348A (en) | 2016-01-06 |
| CN105228348B CN105228348B (en) | 2018-09-11 |
Family
ID=54996940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510508784.3A Active CN105228348B (en) | 2015-08-19 | 2015-08-19 | Ultra-long circuit board drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105228348B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021068400A1 (en) * | 2019-10-10 | 2021-04-15 | 惠州市金百泽电路科技有限公司 | Method for manufacturing ultra-long multilayer board by drilling and positioning |
| CN114535645A (en) * | 2022-03-22 | 2022-05-27 | 上海橙瓴自动化有限公司 | Method for realizing super-large area machining by using multi-axis printed circuit board drilling machine tool |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11347766A (en) * | 1998-06-02 | 1999-12-21 | Sumitomo Heavy Ind Ltd | Laser drilling equipment and its method |
| CN2621100Y (en) * | 2003-06-19 | 2004-06-23 | 深圳市大族数控科技有限公司 | PCB six-bit drilling machine |
| CN1593824A (en) * | 2003-12-03 | 2005-03-16 | 联能科技（深圳）有限公司 | Array method for drill spindles of printed circuit board drilling machine or forming machine |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
-
2015
- 2015-08-19 CN CN201510508784.3A patent/CN105228348B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11347766A (en) * | 1998-06-02 | 1999-12-21 | Sumitomo Heavy Ind Ltd | Laser drilling equipment and its method |
| CN2621100Y (en) * | 2003-06-19 | 2004-06-23 | 深圳市大族数控科技有限公司 | PCB six-bit drilling machine |
| CN1593824A (en) * | 2003-12-03 | 2005-03-16 | 联能科技（深圳）有限公司 | Array method for drill spindles of printed circuit board drilling machine or forming machine |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN103079353A (en) * | 2012-12-27 | 2013-05-01 | 深圳市博敏电子有限公司 | Method for improving overlength high frequency circuit board hole site working accuracy |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021068400A1 (en) * | 2019-10-10 | 2021-04-15 | 惠州市金百泽电路科技有限公司 | Method for manufacturing ultra-long multilayer board by drilling and positioning |
| CN114535645A (en) * | 2022-03-22 | 2022-05-27 | 上海橙瓴自动化有限公司 | Method for realizing super-large area machining by using multi-axis printed circuit board drilling machine tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105228348B (en) | 2018-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105338746B (en) | A kind of circuit panel forming method of no positioning hole | |
| CN103369836B (en) | Drilling harmomegathus method and apparatus | |
| CN102009198A (en) | Method for manufacturing PCB short slot | |
| CN104259502B (en) | The short slotted eye processing method of pcb board | |
| CN102612259A (en) | Drilling short slot for printed circuit board | |
| CN207099441U (en) | A kind of printed circuit board laser drill special backing plate | |
| CN104768338A (en) | PCB edge semi-hole metallization manufacturing process | |
| CN104582330B (en) | The production method of the ATE plates of buried blind via structure | |
| CN102917540B (en) | Printed wiring board selectivity hole copper minimizing technology | |
| CN104476616A (en) | Manufacturing method of slot of printed-circuit board | |
| CN105228348A (en) | Ultra-long circuit board drilling method | |
| CN105307396B (en) | The manufacturing method of PCB containing square hole | |
| CN104812174A (en) | Prepreg blind hole and slot forming method | |
| CN202721895U (en) | Stepped structure of high-frequency stepped plate | |
| CN105682363A (en) | Fabrication method of PCB with metalized plate edges | |
| CN110167268B (en) | Drilling switching method for two pin plate | |
| CN101945532B (en) | Contour machining hole for printed circuit board | |
| CN107486892B (en) | PCB drilling positioning method | |
| CN103286455B (en) | Method for preventing repeated laser on flexible printed circuit board | |
| US20150286767A1 (en) | Circuit layout method and circuit layout apparatus | |
| CN108513444A (en) | A kind of overlength plate pattern-producing method | |
| CN103561543A (en) | PCB countersunk groove processing method | |
| CN205987555U (en) | PCB plate height precision drilling positioner | |
| CN110740591B (en) | Blind hole processing method of multilayer printed board | |
| CN103353914A (en) | Method for examining PCB efficiently |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Applicant after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Applicant before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
|
| COR | Change of bibliographic data | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |