CN110958781B - Ink printing method capable of preventing orifice ink from whitening or peeling - Google Patents
Ink printing method capable of preventing orifice ink from whitening or peeling Download PDFInfo
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- CN110958781B CN110958781B CN201911363210.6A CN201911363210A CN110958781B CN 110958781 B CN110958781 B CN 110958781B CN 201911363210 A CN201911363210 A CN 201911363210A CN 110958781 B CN110958781 B CN 110958781B
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- printing
- ink
- copper foil
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- solder mask
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The invention relates to an ink printing method capable of preventing whitening or peeling of ink at an orifice of a chemical gold plate, which comprises the following steps: processing a through hole on the copper foil; coarsening the upper surface of the copper foil and the orifice connecting surface; plugging holes on the roughened upper surface of the copper foil, and filling ink into the through holes; carrying out printing ink solder mask printing on the upper surface of the copper foil after plugging, wherein the printing scraper and the ink knife are in an outer splayed shape, and forming a layer of printing ink wet film on the upper surface of the copper foil after solder mask printing; carrying out solder mask exposure development on the ink wet film subjected to solder mask printing; baking after solder mask exposure. By the method, the generation probability of whitening or stripping of the ink at the orifice on the copper foil is reduced to about 1 percent, so that the rejection rate of the printed circuit board is greatly reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit board production processes, in particular to an ink printing method capable of preventing orifice ink from whitening or peeling.
Background
With the progress and development of industrial technologies, the requirements of factories on PCB boards are more and more stringent. Under the condition that a customer specifies a pre-welding treatment line (sand blasting and brushing) and an ink type, the ink at the opening of the gilding plate with the aspect ratio of more than 6 cannot be whitened and stripped, and the probability of whitening and stripping of the ink at the opening of the copper foil treated by the existing process is about 28% after the copper foil is treated by the gilding process.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide an ink printing method which can reduce the rejection rate of a printed circuit board and can prevent ink at an orifice from whitening or peeling.
According to the technical scheme provided by the invention, the ink printing method capable of preventing the ink at the orifice of the chemical gilding plate from whitening or peeling comprises the following steps:
a. processing a through hole on the copper foil, wherein the inner wall surface of the through hole is connected with the upper surface of the copper foil through an orifice connecting surface with the section shape of circular arc;
b. coarsening the upper surface of the copper foil and the orifice connecting surface, so that the roughness of the upper surface of the copper foil and the roughness Ra of the orifice connecting surface are both controlled to be 0.2-0.3, and a hydrogen bond formed by combining the ink and the upper surface of the copper foil is formed;
c. plugging holes on the upper surface of the roughened copper foil, filling ink into the through holes, controlling the printing speed at 2-4 m/min during plugging, controlling the mesh number of a printing screen plate at 90-110 meshes, controlling the angle of a printing scraper at 4-10 degrees, controlling the pressure of the printing scraper at 0.2-0.3 Mpa, controlling the plugging thickness to be 90-100% of the depth of the through holes, and determining the quality of the orifice ink after gold melting by using the plugging saturation, wherein the ratio of the plugging thickness to the depth of the through holes is called as the plugging saturation;
d. Carrying out printing ink solder mask printing on the upper surface of the copper foil after hole plugging, wherein a printing scraper and an ink knife are in a shape of an outer splayed foot, the printing speed is controlled to be 2-4 m/min, the mesh number of a printing screen plate is controlled to be 90-110 meshes, the angle of the printing scraper is controlled to be 10-20 degrees, the pressure of the printing scraper is controlled to be 0.2-0.3 Mpa, and a layer of printing ink wet film is formed on the upper surface of the copper foil after solder mask printing;
e. performing solder mask exposure development on the ink wet film after solder mask printing, wherein the exposure energy is controlled to be 900-1100 mJ, the exposure energy is low, the orifice ink is not cured, the exposure energy is high, the solvent in the orifice is cured before being fully exerted, and the solvent cannot be completely volatilized;
f. and baking the printed circuit board after solder mask exposure for 135-150 min at 72-110 ℃, so that the orifice can be completely cured only after the solvent in the hole plugging ink in the through hole is completely volatilized.
Preferably, in step a, the copper foil has a thickness of at least 6 times the diameter of the through-hole.
Preferably, in the step b, the upper surface and the orifice connecting surface of the copper foil are roughened by means of sand blasting and brushing, and the linear speed of the sand blasting and brushing is controlled to be 1.5-2.5 m/min.
Preferably, in the step d, the thickness of the ink wet film is controlled to be 25-45 um.
By the method, the generation probability of whitening or stripping of the ink at the orifice on the copper foil is reduced to about 1 percent, so that the rejection rate of the printed circuit board is greatly reduced.
Detailed Description
The present invention is further illustrated by the following examples.
Example 1
An ink printing method capable of preventing whitening or peeling of ink at a gold plate orifice comprises the following steps:
a. processing a through hole with the diameter of 0.25mm on a copper foil with the thickness of 1.8mm, wherein the thickness of the copper foil is 7.2 times of the diameter of the through hole, and the inner wall surface of the through hole is connected with the upper surface of the copper foil through an orifice connecting surface with the cross section in a circular arc shape;
b. simultaneously, coarsening the upper surface and the orifice connecting surface of the copper foil in a sand blasting and brushing way, and controlling the linear speed of the sand blasting and the brushing at 1.5m/min so as to control the roughness Ra of the upper surface of the copper foil and the orifice connecting surface at 0.28;
c. plugging holes on the upper surface of the roughened copper foil, filling ink into the through holes, controlling the printing speed at 2m/min during plugging the holes, controlling the mesh number of a printing screen at 110 meshes, controlling the angle of a printing scraper at 10 degrees, controlling the pressure of the printing scraper at 0.3Mpa, and controlling the thickness of the plugged holes to be 95% of the depth of the through holes;
d. Carrying out printing ink solder mask printing on the upper surface of the copper foil after hole plugging, wherein a printing scraper and an ink knife are in a shape of an outer splayed foot, the printing speed is controlled at 2m/min, the mesh number of a printing screen plate is controlled at 110 meshes, the angle of the printing scraper is controlled at 20 degrees, the pressure of the printing scraper is controlled at 0.3Mpa, a layer of printing ink wet film is formed on the upper surface of the copper foil after solder mask printing, and the thickness of the printing ink wet film is controlled at 25 mu m;
e. performing solder mask exposure development on the ink wet film after solder mask printing, wherein the exposure energy is controlled to be 900 mJ;
f. baking the substrate at 110 deg.C for 135min after solder mask exposure.
After the copper foil treated by the method of example 1 is subjected to the gold plating treatment, the generation probability of the whitening or peeling of the ink at the orifice on the copper foil is reduced to 0.5%, and thus the rejection rate of the printed wiring board is also greatly reduced.
Example 2
An ink printing method capable of preventing whitening or peeling of ink at a gold plate orifice comprises the following steps:
a. processing a through hole with the diameter of 0.25mm on a copper foil with the thickness of 1.8mm, wherein the thickness of the copper foil is 7.2 times of the diameter of the through hole, and the inner wall surface of the through hole is connected with the upper surface of the copper foil through an orifice connecting surface with the cross section in a circular arc shape;
b. simultaneously, coarsening the upper surface and the orifice connecting surface of the copper foil in a sand blasting and brushing way, and controlling the linear speed of the sand blasting and the brushing at 2.5m/min so as to control the roughness Ra of the upper surface of the copper foil and the orifice connecting surface at 0.3;
c. Plugging holes on the upper surface of the roughened copper foil, filling ink into the through holes, controlling the printing speed at 4m/min during plugging the holes, controlling the mesh number of a printing screen plate at 90 meshes, controlling the angle of a printing scraper at 4 degrees, controlling the pressure of the printing scraper at 0.2MPa, and controlling the thickness of the plugged holes to be 97% of the depth of the through holes;
d. and carrying out printing ink solder mask printing on the upper surface of the copper foil after hole plugging, wherein the printing scraper and the ink knife are in a shape of an outer splayed foot, the printing speed is controlled at 4m/min, the mesh number of the printing screen plate is controlled at 90 meshes, the angle of the printing scraper is controlled at 10 degrees, the pressure of the printing scraper is controlled at 0.2Mpa, a layer of printing ink wet film is formed on the upper surface of the copper foil after solder mask printing, and the thickness of the printing ink wet film is controlled at 45 mu m.
e. Performing solder mask exposure development on the ink wet film after solder mask printing, wherein the exposure energy is controlled at 1100 mJ;
f. baking the substrate at 72 ℃ for 150min after solder mask exposure.
After the copper foil treated by the method of example 2 is subjected to the gold plating treatment, the generation probability of the whitening or peeling of the ink at the orifice on the copper foil is reduced to 0.7%, and thus the rejection rate of the printed wiring board is also greatly reduced.
Example 3
An ink printing method capable of preventing whitening or peeling of ink at a gold plate orifice comprises the following steps:
a. Processing a through hole with the diameter of 0.25mm on a copper foil with the thickness of 1.8mm, wherein the thickness of the copper foil is 7.2 times of the diameter of the through hole, and the inner wall surface of the through hole is connected with the upper surface of the copper foil through an orifice connecting surface with the cross section in a circular arc shape;
b. simultaneously, coarsening the upper surface and the orifice connecting surface of the copper foil in a sand blasting and brushing way, and controlling the linear speed of the sand blasting and the brushing at 2m/min so as to control the roughness of the upper surface of the copper foil and the roughness Ra of the orifice connecting surface at 0.2;
c. plugging holes on the upper surface of the roughened copper foil, filling ink into the through holes, controlling the printing speed at 3m/min during plugging the holes, controlling the mesh number of a printing screen plate at 100 meshes, controlling the angle of a printing scraper at 7 degrees, controlling the pressure of the printing scraper at 0.25MPa, and controlling the thickness of the plugged holes to be 92% of the depth of the through holes;
d. and (3) carrying out printing ink solder mask printing on the upper surface of the copper foil after hole plugging, wherein the printing scraper and the ink knife are in a shape of an outer splayed foot, the printing speed is controlled at 3m/min, the mesh number of the printing screen plate is controlled at 100 meshes, the angle of the printing scraper is controlled at 15 degrees, the pressure of the printing scraper is controlled at 0.25MPa, a layer of printing ink wet film is formed on the upper surface of the copper foil after solder mask printing, and the thickness of the printing ink wet film is controlled at 35 um.
e. Performing solder mask exposure development on the ink wet film after solder mask printing, wherein the exposure energy is controlled to be 900-1100 mJ;
f. baking the film at 90 ℃ for 140min after solder mask exposure.
After the copper foil treated by the method of example 1 is subjected to the gold plating treatment, the generation probability of the whitening or peeling of the ink at the orifice on the copper foil is reduced to 0.4%, and thus the rejection rate of the printed wiring board is also greatly reduced.
Claims (4)
1. An ink printing method capable of preventing whitening or peeling of ink at a chemical gold plate orifice is characterized by comprising the following steps:
a. processing a through hole on the copper foil, wherein the inner wall surface of the through hole is connected with the upper surface of the copper foil through an orifice connecting surface with the section shape of circular arc;
b. coarsening the upper surface of the copper foil and the orifice connecting surface, so that the roughness Ra of the upper surface of the copper foil and the orifice connecting surface are controlled to be 0.2-0.3;
c. plugging holes on the upper surface of the roughened copper foil, filling ink into the through holes, controlling the printing speed at 2-4 m/min during plugging the holes, controlling the mesh number of a printing screen plate at 90-110 meshes, controlling the angle of a printing scraper at 4-10 degrees, controlling the pressure of the printing scraper at 0.2-0.3 Mpa, and controlling the thickness of the plugged holes to be 90-100% of the depth of the through holes;
d. Carrying out printing ink solder mask printing on the upper surface of the copper foil after plugging holes, wherein a printing scraper and a printing ink knife form an outer splayed foot, the printing speed is controlled to be 2-4 m/min, the mesh number of a printing screen plate is controlled to be 90-110 meshes, the angle of the printing scraper is controlled to be 10-20 degrees, the pressure of the printing scraper is controlled to be 0.2-0.3 Mpa, and a layer of printing ink wet film is formed on the upper surface of the copper foil after solder mask printing;
e. performing solder mask exposure development on the ink wet film after solder mask printing, wherein the exposure energy is controlled to be 900-1100 mJ;
f. baking the film after solder mask exposure, and baking the film for 135-150 min at 72-110 ℃.
2. The ink printing method capable of preventing ink from whitening or peeling off from a chemical vapor deposition plate orifice according to claim 1, wherein: in the step a, the thickness of the copper foil is at least 6 times of the diameter of the through hole.
3. The ink printing method capable of preventing ink from whitening or peeling off from a chemical vapor deposition plate orifice according to claim 1, wherein: and in the step b, the upper surface of the copper foil and the orifice connecting surface are roughened in a sand blasting and brushing mode, and the linear speed of the sand blasting and brushing is controlled to be 1.5-2.5 m/min.
4. The ink printing method according to claim 1, wherein the method comprises the steps of: in the step d, the thickness of the ink wet film is controlled to be 25-45 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911363210.6A CN110958781B (en) | 2019-12-26 | 2019-12-26 | Ink printing method capable of preventing orifice ink from whitening or peeling |
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| CN201911363210.6A CN110958781B (en) | 2019-12-26 | 2019-12-26 | Ink printing method capable of preventing orifice ink from whitening or peeling |
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| CN110958781B true CN110958781B (en) | 2022-06-10 |
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| CN112654161B (en) * | 2020-12-21 | 2022-07-12 | 高德（无锡）电子有限公司 | Process for reducing use amount of two-dimensional code rework substrate |
| CN113473723A (en) * | 2021-08-05 | 2021-10-01 | 高德（无锡）电子有限公司 | Process for improving hole plugging depression of back drilling hole of printed circuit board |
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| CN103415164B (en) * | 2013-08-30 | 2016-04-27 | 武汉七零九印制板科技有限公司 | A kind of pcb board aperture is greater than the method for 1.0mm via hole ink plugging |
| CN108055776A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of improvement welding resistance consent oil spilling production method |
| CN110267457B (en) * | 2019-05-24 | 2022-03-18 | 惠州市联达金电子有限公司 | Ink screen printing process of thick-copper white solder resist ink PCB |
| CN110582170B (en) * | 2019-10-10 | 2022-04-19 | 高德(江苏)电子科技股份有限公司 | Anti-falling improvement process applied to black ink with glossiness less than 6 |
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Effective date of registration: 20230913 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |
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