CN112654161B - Process for reducing use amount of two-dimensional code rework substrate - Google Patents
Process for reducing use amount of two-dimensional code rework substrate Download PDFInfo
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- CN112654161B CN112654161B CN202011522896.1A CN202011522896A CN112654161B CN 112654161 B CN112654161 B CN 112654161B CN 202011522896 A CN202011522896 A CN 202011522896A CN 112654161 B CN112654161 B CN 112654161B
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- dimensional code
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
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- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a process for reducing the use amount of a two-dimensional code rework substrate, which comprises the following steps: a. two-dimensional code reworking negative film: designing a two-dimensional code rework negative plate; b. pretreatment of solder resist: cleaning the circuit board by ultrasonic waves; c. solder mask printing: placing the cleaned circuit board on a printing machine table for printing, wherein a printing scraper and an ink knife need to be in a splayed shape; d. solder mask exposure: placing the printed circuit board under ultraviolet light for exposure, and pasting the two-dimensional code rework substrate on the circuit board; e. solder mask development: and washing the exposed circuit board by developing liquid medicine to obtain the product. The process for reducing the usage amount of the two-dimensional code reworking negative film adds the rectangular black negative films which are 100 mils longer than the two-dimensional code area on the exposure negative film, the rectangular black negative films can be repeatedly used and can be changed according to the position change of the two-dimensional code on a printed product, the operation is simple, the flow is simple, and the usage amount of the negative films and the scrappage caused by poor reworking are greatly reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a process for reducing the use amount of a two-dimensional code rework substrate.
Background
With the development of the industrial technology, the requirements of customers on products are more and more strict, the problem of matching of the surface tension of a dry film and the surface tension of ink is uniformly troubled for PCB manufacturers, particularly for some bright-face inks with the surface tension lower than 32, the dry film falling phenomenon is the phenomenon of pen and pen, so that a plurality of manufacturers cannot use the bright-face inks, the film stripping process is increased, time and labor are wasted, and the risks of whitening of the ink and scrapping of ink falling are easily caused.
Disclosure of Invention
The invention aims to overcome and supplement the defects in the prior art, and provides a process for reducing the use amount of a two-dimension code reworking substrate, which can meet the requirements of any two-dimension code reworking material number, avoid scrappage caused by poor reworking of the two-dimension code in a factory, and reduce the scrappage of reworking of the two-dimension code of the whole factory by 0.15 percent, wherein the technical scheme adopted by the invention is as follows:
a process for reducing the use amount of a two-dimensional code rework substrate is disclosed, wherein: the method comprises the following steps:
a. two-dimensional code reworking negative film: designing a two-dimensional code rework negative plate;
b. pretreatment of solder resist: cleaning the circuit board by ultrasonic waves;
c. solder mask printing: placing the cleaned circuit board on a printing machine table for printing, wherein a printing scraper and an ink knife need to be in a splayed shape;
d. solder mask exposure: placing the printed circuit board under ultraviolet light for exposure, and pasting the two-dimensional code rework substrate on the circuit board;
e. solder mask development: and washing the exposed circuit board by developing liquid medicine to obtain the product.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: the step a of the two-dimension code reworking negative film comprises a first negative film, a second negative film arranged on the first negative film and a two-dimension code area arranged on the second negative film.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: the length-width ratio two-dimensional code area of the second negative film is 100 mils larger than the width of the second negative film.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: and c, in the step b, the washing vibration frequency is 24-26HZ, and the linear speed is 2.0-3.0 m/min.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: and c, printing at the speed of 2-4 m/min, at the angle of 0-20 ℃ and under the pressure of 0.2-0.3 MPa.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: the screen printing plate printed in the step c is 300 meshes, and the ink amount is 18 cm3/m2。
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: the exposure energy grid of the step d is 9-11.
Preferably, the process for reducing the usage amount of the two-dimensional code rework substrate comprises the following steps: the developing point of the step e is 30-50%, and the developing linear speed is 3-4 m/min.
The invention has the advantages that:
the invention relates to a process for reducing the use amount of a two-dimensional code reworking substrate, which is characterized in that rectangular black substrates which are 100 mils larger than the two-dimensional code area in length and width are added on an exposure substrate, the rectangular black substrates can be reused and can change according to the position change of two-dimensional codes on printed products, the position deviation of the same material number laser two-dimensional code area is more, the substrate needs to be applied every production time, the old substrate cannot be reused, the use amount of the two-dimensional code reworking substrate is reduced, and the process is characterized in that the rectangular black substrates which are 100 mils larger than the two-dimensional code area in length and width are added on the exposure substrate; simple operation and simple flow, and greatly reduces the usage amount of the negative and the scrap caused by bad reworking.
Drawings
FIG. 1 is a schematic structural diagram of a two-dimensional code rework substrate of the invention.
Detailed Description
The invention is further illustrated by the following specific figures and examples.
Example 1
A process for reducing the use amount of a two-dimensional code rework substrate is disclosed, wherein: the method comprises the following steps:
a. two-dimensional code reworking negative film: designing a two-dimensional code reworking negative film, wherein the two-dimensional code reworking negative film shown in figure 1 comprises a first negative film 3, a second negative film 1 arranged on the first negative film and a two-dimensional code area 2 arranged on the second negative film, and the length and width of the two-dimensional code area 2 with the length-width ratio of the second negative film 1 are 100 mils larger;
b. pretreatment of solder resist: the circuit board is cleaned by ultrasonic wave, the washing vibration frequency is 24HZ, and the linear velocity is 2.0 m/min;
c. solder mask printing: placing the cleaned circuit board on a printer table for printing, wherein the screen printing plate is 300 meshes, and the printing ink amount is 18 cm3/m2The printing scraper and the ink knife need to be splayed, the requirement that the thickness of the ink is within the specification of a client after the product is reworked can be met, the most main factors are the opening size, the printing speed is 2m/min, the angle of the printing scraper is 0 degrees, and the pressure of the printing scraper is 0.2 MPa;
d. solder mask exposure: placing the printed circuit board under ultraviolet light for exposure, wherein the exposure energy grid is 9, and sticking the two-dimensional code reworking negative film on the circuit board;
e. solder mask development: and (3) washing the exposed circuit board by using a developing solution, wherein the developing point is 30%, the developing linear speed is 3m/min, and the ink is prevented from falling off to obtain the product.
Example 2
A process for reducing the use amount of a two-dimensional code rework substrate is disclosed, wherein: the method comprises the following steps:
a. two-dimensional code reworking negative film: designing a two-dimensional code reworking negative film, wherein the two-dimensional code reworking negative film shown in figure 1 comprises a first negative film 3, a second negative film 1 arranged on the first negative film and a two-dimensional code area 2 arranged on the second negative film, and the length and width of the two-dimensional code area 2 with the length-width ratio of the second negative film 1 are 100 mils larger;
b. pretreatment of solder resist: the circuit board is cleaned by ultrasonic, the washing vibration frequency is 25HZ, and the linear velocity is 2.5 m/min;
c. solder mask printing: placing the cleaned circuit board on a printer table for printing, wherein the screen printing plate is 300 meshes, and the printing ink amount is 18 cm3/m2The printing scraper and the ink knife need to be splayed, the requirement that the thickness of the ink is within the specification of a client after the product is reworked can be met, the most main factor is the opening size, the printing speed is 3m/min, the angle of the printing scraper is 10 degrees, and the pressure of the printing scraper is 0.22 MPa;
d. solder mask exposure: exposing the printed circuit board under ultraviolet light with an exposure energy grid of 10, and pasting the two-dimensional code rework substrate on the circuit board;
e. solder mask development: and (3) washing the exposed circuit board by developing liquid medicine, wherein the developing point is 40%, the developing linear speed is 3.5m/min, and the ink is prevented from falling off to obtain the product.
Example 3
A process for reducing the use amount of a two-dimensional code rework substrate is disclosed, wherein: the method comprises the following steps:
a. the two-dimensional code reworks film: designing a two-dimensional code reworking negative film, wherein the two-dimensional code reworking negative film shown in figure 1 comprises a first negative film 3, a second negative film 1 arranged on the first negative film and a two-dimensional code area 2 arranged on the second negative film, and the length and width of the two-dimensional code area 2 with the length-width ratio of the second negative film 1 are 100 mils larger;
b. pretreatment of solder resist: the circuit board is cleaned by ultrasonic, the washing vibration frequency is 26HZ, and the linear velocity is 3.0 m/min;
c. solder mask printing: placing the cleaned circuit board on a printing machine tablePrinting with a screen of 300 meshes and an ink amount of 18 cm3/m2The printing scraper and the ink knife need to be splayed, the requirement that the thickness of the ink is within the specification of a client after the product is reworked can be met, the most main factor is the opening size, the printing speed is 4m/min, the angle of the printing scraper is 20 degrees, and the pressure of the printing scraper is 0.3 MPa;
d. solder mask exposure: exposing the printed circuit board under ultraviolet light with an exposure energy grid of 11, and pasting the two-dimensional code rework substrate on the circuit board;
e. solder mask development: and (3) washing the exposed circuit board by developing liquid medicine, wherein the developing point is 50%, the developing linear speed is 4m/min, and the ink is prevented from falling off to obtain the product.
The invention relates to a process for reducing the use amount of a two-dimensional code reworking substrate, which is characterized in that rectangular black substrates which are 100 mils larger than the two-dimensional code area in length and width are added on an exposure substrate, the rectangular black substrates can be reused and can change according to the position change of two-dimensional codes on printed products, the position deviation of the same material number laser two-dimensional code area is more, the substrate needs to be applied every production time, the old substrate cannot be reused, the use amount of the two-dimensional code reworking substrate is reduced, and the process is characterized in that the rectangular black substrates which are 100 mils larger than the two-dimensional code area in length and width are added on the exposure substrate; simple operation and simple flow, and greatly reduces the usage amount of the negative and the scrap caused by bad reworking.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention is described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (6)
1. The technology for reducing the use amount of the two-dimensional code rework substrate is characterized by comprising the following steps of: the method comprises the following steps:
a. two-dimensional code reworking negative film: designing a two-dimensional code rework negative plate;
b. pretreatment of solder resist: cleaning the circuit board by ultrasonic waves;
c. solder mask printing: placing the cleaned circuit board on a printing machine table for printing, wherein a printing scraper and an ink knife need to be in a splayed shape;
d. solder mask exposure: placing the printed circuit board under ultraviolet light for exposure, and pasting the two-dimensional code rework substrate on the circuit board;
e. solder mask development: washing the exposed circuit board by developing liquid medicine to obtain a product;
the two-dimension code reworking negative plate comprises a first negative plate, a second negative plate arranged on the first negative plate and a two-dimension code area arranged on the second negative plate;
the length-width ratio of the two-dimensional code area of the second bottom plate is 100mil larger.
2. The process for reducing the use amount of the two-dimensional code rework substrate according to claim 1, wherein: and c, in the step b, the washing vibration frequency is 24-26HZ, and the linear speed is 2.0-3.0 m/min.
3. The process for reducing the use amount of the two-dimensional code rework substrate according to claim 1, wherein: and c, printing at a speed of 2-4 m/min, at an angle of 0-20 degrees and under a pressure of 0.2-0.3 MPa.
4. The process for reducing the use amount of the two-dimensional code rework substrate according to claim 1, wherein: the screen printing plate printed in the step c is 300 meshes, and the ink amount is 18 cm3/m2。
5. The process for reducing the use amount of the two-dimensional code rework substrate according to claim 1, wherein: the exposure energy grid of the step d is 9-11.
6. The process for reducing the use amount of the two-dimensional code rework substrate according to claim 1, wherein: the developing point of the step e is 30-50%, and the developing linear speed is 3-4 m/min.
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| CN202011522896.1A CN112654161B (en) | 2020-12-21 | 2020-12-21 | Process for reducing use amount of two-dimensional code rework substrate |
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| CN202011522896.1A CN112654161B (en) | 2020-12-21 | 2020-12-21 | Process for reducing use amount of two-dimensional code rework substrate |
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| CN112654161B true CN112654161B (en) | 2022-07-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046003A (en) * | 2009-08-25 | 2011-03-10 | Canon Finetech Inc | Two-dimensional code generation system, two-dimensional code generation program and inkjet recorder |
| WO2018188351A1 (en) * | 2017-04-13 | 2018-10-18 | 华南理工大学 | Double-layer overprinted photo-responsive two-dimensional code and preparation method therefor |
| CN110958781A (en) * | 2019-12-26 | 2020-04-03 | 高德（无锡）电子有限公司 | Ink printing method capable of preventing orifice ink from whitening or peeling |
| CN111479402A (en) * | 2020-05-27 | 2020-07-31 | 高德（江苏）电子科技有限公司 | Process for improving ink in high aspect ratio Via holes |
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- 2020-12-21 CN CN202011522896.1A patent/CN112654161B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011046003A (en) * | 2009-08-25 | 2011-03-10 | Canon Finetech Inc | Two-dimensional code generation system, two-dimensional code generation program and inkjet recorder |
| WO2018188351A1 (en) * | 2017-04-13 | 2018-10-18 | 华南理工大学 | Double-layer overprinted photo-responsive two-dimensional code and preparation method therefor |
| CN110958781A (en) * | 2019-12-26 | 2020-04-03 | 高德（无锡）电子有限公司 | Ink printing method capable of preventing orifice ink from whitening or peeling |
| CN111479402A (en) * | 2020-05-27 | 2020-07-31 | 高德（江苏）电子科技有限公司 | Process for improving ink in high aspect ratio Via holes |
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Effective date of registration: 20230830 Address after: No. 32 Chunhui Middle Road, Yunlin Street, Xishan District, Wuxi City, Jiangsu Province, 214101 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: Gultech (Wuxi) Electronics Co.,Ltd. |
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