CN112654159A - Method for automatically supplementing and correcting film - Google Patents
Method for automatically supplementing and correcting film Download PDFInfo
- Publication number
- CN112654159A CN112654159A CN202011450071.3A CN202011450071A CN112654159A CN 112654159 A CN112654159 A CN 112654159A CN 202011450071 A CN202011450071 A CN 202011450071A CN 112654159 A CN112654159 A CN 112654159A
- Authority
- CN
- China
- Prior art keywords
- film
- screen
- printing
- offset
- correcting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000001502 supplementing effect Effects 0.000 title description 2
- 238000007639 printing Methods 0.000 claims abstract description 24
- 238000012937 correction Methods 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000012360 testing method Methods 0.000 claims abstract description 10
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 238000011161 development Methods 0.000 claims abstract description 6
- 238000013461 design Methods 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract 1
- 238000012797 qualification Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
The invention relates to the technical field of PCB board manufacturing, and discloses a method for automatically correcting a film, which comprises the following steps of S1, adding a test round point into a 100% film pattern, and pasting the film on a screen to be exposed for exposure and development treatment to manufacture a screen for printing; s2, printing the pattern of the screen on a copper-clad plate, measuring position precision data of printed dots by using an automatic correction machine after etching and stripping, automatically comparing the position precision data with a design, calculating the offset during actual printing, and correcting a film by using software according to the actual offset; and S3, using the corrected data to manufacture a new film and a new screen printing plate, and printing to obtain the circuit board meeting the requirements. According to the invention, the offset of actual printing in the prior art is calculated, and the film is corrected through software, so that the obtained circuit board has high processing precision and high qualification rate, and the economic benefit of production is improved.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a method for automatically correcting a film.
Background
Along with the rapid development of the electronic industry, the precision of the PCB is also higher and higher, the screen printing plate used in the printing method of the single-sided board is made of polyester silk screen, the screen printing plate of the polyester silk screen receives the external force of the glue scraper when printing, the deformation is easily generated, the pattern deformation caused by printing is caused, the position precision is poor, the offset is easily generated when the SMT (surface mount technology) of a client is used, the defect is caused, and the product scrapping is caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a method for automatically correcting a film, which has the advantage of correcting the deviation generated in screen printing and solves the problems that the deviation is easily generated in SMT (surface mount technology) pasting in the prior art, so that the product is scrapped due to the defect.
(II) technical scheme
In order to improve the accuracy of SMT paster and reduce the reject ratio of products, the invention provides the following technical scheme: a method for automatically correcting a film comprises the following steps:
s1, adding a test dot into a 100% film pattern, attaching the film to a screen to be exposed, and carrying out exposure and development treatment to manufacture a screen for printing;
s2, printing the pattern of the screen on a copper-clad plate, measuring position precision data of printed dots by using an automatic correction machine after etching and stripping, automatically comparing the position precision data with a design, calculating the offset during actual printing, and correcting a film by using software according to the actual offset;
and S3, using the corrected data to manufacture a new film and a new screen printing plate, and printing to obtain the circuit board meeting the requirements.
Further, in S1, the film pattern is attached to the screen surface of the screen plate, and water is used as a developing solution in the development process after the exposure.
Further, in S1, the screen to be exposed must be coated before the film pattern is attached.
Further, the test dots in S1 are a plurality of dots with a diameter of 1mm, and are distributed in a rectangular array of 25mm × 25 mm.
(III) advantageous effects
Compared with the prior art, the invention provides a method for automatically correcting the film, which has the following beneficial effects: according to the invention, the test dots are added into 100% of the film pattern, the film pattern is laminated with the coated screen, the screen for printing is manufactured, the pattern of the screen is printed on the copper-clad plate, the position precision data of the printed dots are measured by an automatic correction machine after etching and stripping, the position precision data are automatically compared with the design, the offset during actual printing is calculated, the actual offset is corrected by software, and the corrected film and the screen are printed to obtain the circuit board.
Drawings
FIG. 1 is a diagram of a distribution of test points of a film in an automatic film correction method according to the present invention;
FIG. 2 is a diagram illustrating a circuit board offset of 100% film printing in the method for automatic film correction according to the present invention;
FIG. 3 is a diagram illustrating an offset after a film is corrected according to an automatic film correction method of the present invention;
fig. 4 is a circuit board offset diagram of the film printed circuit board after correction according to the method for automatically correcting the film of the present invention.
In the figure: A. and testing the dots.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Before the automatic correction of the film, a circuit board offset diagram of 100% film printing in the prior art is shown in fig. 2, and the automatic correction of the film is carried out by adopting the following steps:
s1, adding test dots distributed in a rectangular array of 25mm multiplied by 25mm into a 100% film pattern, wherein the diameter of each test dot is 1mm, and attaching the film to the surface of a silk screen of a coated screen to be exposed to perform exposure and development treatment, and using water as developing solution to manufacture the screen for printing, wherein the film is shown in figure 1;
s2, printing the pattern of the screen on a copper-clad plate, measuring position precision data of printed dots by using an automatic correction machine after etching and stripping, automatically comparing the position precision data with a design, calculating the offset during actual printing, and correcting a film by using software according to the actual offset;
and S3, using the corrected data to manufacture a new film and a new screen printing plate, and printing to obtain the circuit board meeting the requirements.
After the film is automatically corrected, the offset diagram is shown in figure 3, the offset diagram of the circuit board printed by the corrected film is shown in figure 4, and the offset diagram in figure 4 shows that the film is automatically corrected by the method, so that the accuracy of SMT (surface mount technology) paster is improved, the precision requirement is met, and the reject ratio of products is reduced.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A method for automatically correcting a film is characterized by comprising the following steps:
s1, adding a test dot into a 100% film pattern, attaching the film to a screen to be exposed, and carrying out exposure and development treatment to manufacture a screen for printing;
s2, printing the pattern of the screen on a copper-clad plate, measuring position precision data of printed dots by using an automatic correction machine after etching and stripping, automatically comparing the position precision data with a design, calculating the offset during actual printing, and correcting a film by using software according to the actual offset;
and S3, using the corrected data to manufacture a new film and a new screen printing plate, and printing to obtain the circuit board meeting the requirements.
2. The method for automatically correcting a film according to claim 1, wherein in S1, the film pattern is attached to the screen surface of the screen plate, and water is used as the developing solution in the developing process after the exposure.
3. The method for automatically correcting a film according to claim 1, wherein in S1, the screen to be exposed must be coated before the film pattern is attached.
4. A method for automatically correcting a film according to claim 1, wherein the test dots in S1 are a plurality of dots with a diameter of 1mm and are distributed in a rectangular array of 25mm × 25 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011450071.3A CN112654159A (en) | 2020-12-09 | 2020-12-09 | Method for automatically supplementing and correcting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011450071.3A CN112654159A (en) | 2020-12-09 | 2020-12-09 | Method for automatically supplementing and correcting film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112654159A true CN112654159A (en) | 2021-04-13 |
Family
ID=75353787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011450071.3A Pending CN112654159A (en) | 2020-12-09 | 2020-12-09 | Method for automatically supplementing and correcting film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112654159A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900987A (en) * | 2022-04-13 | 2022-08-12 | 深圳市瑞邦多层线路板科技有限公司 | High-density circuit board alignment welding structure and production method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142329A (en) * | 1993-06-24 | 1995-06-02 | Hitachi Ltd | Exposure method and aligner and mask |
| CN101117043A (en) * | 2006-08-04 | 2008-02-06 | 株式会社日立工业设备技术 | Silk screen printing device and image recognition contrapositioning method |
| CN102673200A (en) * | 2012-06-08 | 2012-09-19 | 东莞万德电子制品有限公司 | Method for adjusting position of silk-screen character on IMD (in-mould-decoration) sheet |
| CN103182832A (en) * | 2011-12-29 | 2013-07-03 | 上海百嘉电子有限公司 | Process for high-precision screen printing by straight screen printing technology |
| CN104245317A (en) * | 2012-04-27 | 2014-12-24 | 株式会社高永科技 | Method for compensating screen printer, and substrate inspection system using same |
| CN107718918A (en) * | 2017-12-08 | 2018-02-23 | 广州市佳盛印刷有限公司 | A kind of NEW TYPE OF COMPOSITE typography |
| CN110330239A (en) * | 2019-06-29 | 2019-10-15 | 东莞泰升玻璃有限公司 | A kind of processing technology of patterned single side abnormity doubling glass |
| CN110757941A (en) * | 2019-10-25 | 2020-02-07 | 杭州友成电子有限公司 | Lean screen printing plate manufacturing process |
| CN110913601A (en) * | 2019-11-18 | 2020-03-24 | 大连崇达电路有限公司 | Method for manufacturing solder mask translation film |
-
2020
- 2020-12-09 CN CN202011450071.3A patent/CN112654159A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142329A (en) * | 1993-06-24 | 1995-06-02 | Hitachi Ltd | Exposure method and aligner and mask |
| CN101117043A (en) * | 2006-08-04 | 2008-02-06 | 株式会社日立工业设备技术 | Silk screen printing device and image recognition contrapositioning method |
| CN103182832A (en) * | 2011-12-29 | 2013-07-03 | 上海百嘉电子有限公司 | Process for high-precision screen printing by straight screen printing technology |
| CN104245317A (en) * | 2012-04-27 | 2014-12-24 | 株式会社高永科技 | Method for compensating screen printer, and substrate inspection system using same |
| CN102673200A (en) * | 2012-06-08 | 2012-09-19 | 东莞万德电子制品有限公司 | Method for adjusting position of silk-screen character on IMD (in-mould-decoration) sheet |
| CN107718918A (en) * | 2017-12-08 | 2018-02-23 | 广州市佳盛印刷有限公司 | A kind of NEW TYPE OF COMPOSITE typography |
| CN110330239A (en) * | 2019-06-29 | 2019-10-15 | 东莞泰升玻璃有限公司 | A kind of processing technology of patterned single side abnormity doubling glass |
| CN110757941A (en) * | 2019-10-25 | 2020-02-07 | 杭州友成电子有限公司 | Lean screen printing plate manufacturing process |
| CN110913601A (en) * | 2019-11-18 | 2020-03-24 | 大连崇达电路有限公司 | Method for manufacturing solder mask translation film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114900987A (en) * | 2022-04-13 | 2022-08-12 | 深圳市瑞邦多层线路板科技有限公司 | High-density circuit board alignment welding structure and production method |
| CN114900987B (en) * | 2022-04-13 | 2024-02-02 | 峻凌电子(合肥)有限公司 | High-density circuit board alignment welding structure and production method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210413 |
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| RJ01 | Rejection of invention patent application after publication |