CN106304671A - A kind of method for circuit board making soldering-resistance layer - Google Patents
A kind of method for circuit board making soldering-resistance layer Download PDFInfo
- Publication number
- CN106304671A CN106304671A CN201610771779.6A CN201610771779A CN106304671A CN 106304671 A CN106304671 A CN 106304671A CN 201610771779 A CN201610771779 A CN 201610771779A CN 106304671 A CN106304671 A CN 106304671A
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- time
- silk
- screen
- ink
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a kind of method for circuit board making soldering-resistance layer, comprise the following steps successively: after the silk-screen → silk-screen of consent before the silk-screen → evacuation of welding resistance pre-treatment → for the first time → the most pre-baked → exposure → development for the first time → rear roasting → welding resistance pre-treatment → welding resistance → for the second time, stand → the most pre-baked → second time exposure → development → rear roasting → lower operation, wherein, silk-screen uses mute green ink for the first time, and silk-screen uses white ink for the second time.Mute mask green ink surface roughness is big, and strong with white ink tack, mute mask green ink toughness is better than white oil.For the first time after silk-screen mute mask green ink second time silk-screen white oil, white oil is wrinkle resistant, does not affect properties of product, improve the quality of product while improving product appearance.
Description
Technical field
The present invention relates to a kind of process for manufacturing circuit board, refer in particular to a kind of method for circuit board making soldering-resistance layer.
Background technology
In existing process for manufacturing circuit board, to thick copper coin (having electroplated copper thickness >=70 μm before welding resistance) and solder mask
For color is the circuit board of white, welding resistance need to be made by 2 welding resistance flow processs, but owing to white oil characteristic ink is crisp, poor toughness with
And pasta poor adhesive force after high-temperature baking, easily occur after secondary silk-screen that ink is wrinkling and fall oil problem.Existing procedure: before welding resistance
Process → silk-screen → evacuation → the most pre-baked → exposure → development for the first time → rear roasting → welding resistance pre-treatment → resistance for the first time
→ the most pre-baked → second time exposure → development → rear roasting → lower operation is stood after the silk-screen → silk-screen of consent → for the second time before weldering,
Ink used by twice silk-screen is all white ink.
Summary of the invention
The technical problem to be solved in the present invention is: white oil characteristic ink is crisp, poor toughness, and secondary silk-screen rear substrate region easily goes out
The existing wrinkling problem of ink；After white ink high-temperature baking, ink pellet surface is shunk compactness and is strengthened, pasta poor adhesive force, secondary silk
Easily occurs oil problem after print.
In order to solve the problems referred to above, present invention employs a kind of novel method for circuit board making soldering-resistance layer, successively
Comprise the following steps: welding resistance pre-treatment → silk-screen → evacuation → the most pre-baked → exposure → development for the first time for the first time → after
Stand after the silk-screen → silk-screen of consent before roasting → welding resistance pre-treatment → welding resistance → for the second time → the most pre-baked → second time exposure →
Development → rear roasting → lower operation, wherein, described first time silk-screen uses mute green ink, and described second time silk-screen uses white oil
Ink.
Further, described first time silk-screen is circuit local silk-screen, and described second time silk-screen is plate face entirety silk-screen.
Further, in the exposure of described first time, the specification that film welding resistance is windowed is more than the film in the exposure of described second time
Welding resistance window specification.
Further, in the exposure of described first time, the specification that film welding resistance is windowed is Sino-Philippines compared to the exposure of described second time
Specification that woods welding resistance is windowed is monolateral increases 0.05-0.1mm.
Further, in described first time silk-screen, silk-screen mesh number 36T or 39T, ink viscosity 60-80dpa.s, wet film
Thickness management and control is in 30-40 μm.
Further, in described second time silk-screen, silk-screen mesh number 36T or 39T, ink viscosity 80-100dpa.s, wet film
Thickness management and control is in 40-50 μm.
Further, in described development step, develop cylinder two-way pressure 1.0 ± 0.2kg/cm2, mute green ink speed is
4.5m/min, white ink speed is 2.7m/min.
Further, before described welding resistance in consent step, use white ink (not increasing profit) or white oil special jack
Ink.
Further, described first time is pre-baked is pre-baked 38min at vertical oven 75 DEG C, the most pre-baked for vertical roasting
Pre-baked 48min at stove or tunnel oven 75 DEG C.
Further, described pre-treatment is pin brush and volcanic ash nog plate, nog plate speed 3.4m/min, described vacuum step
In carry out 10min evacuation process, or stand 1-2h, preferably 90min, in described first time and second time step of exposure, exposure
Energy progression 9-11 lattice, can make to confirm concrete exposure energy with light copper coin.
In this programme, silk-screen uses mute green ink for the first time, and silk-screen uses white ink for the second time.Mute mask green ink surface
Roughness is big, and strong with white ink tack, mute mask green ink toughness is better than white oil.Silk-screen mute mask green ink second time silk-screen for the first time
After white oil, white oil is wrinkle resistant, does not affect properties of product, improve the quality of product while improving product appearance.
Detailed description of the invention
By describing the technology contents of the present invention, structural feature in detail, being realized purpose and effect, below in conjunction with embodiment
It is explained in detail.
A kind of novel method for circuit board making soldering-resistance layer, comprises the following steps: welding resistance pre-treatment → the first successively
Consent before secondary silk-screen → evacuation → the most pre-baked → first time exposure → development → rear roasting → welding resistance pre-treatment → welding resistance →
→ the most pre-baked → second time exposure → development → rear roasting → lower operation is stood for the second time after silk-screen → silk-screen, wherein, described
Silk-screen uses mute green ink for the first time, and as held the mute green ink of big H-9100Mg31 model, described second time silk-screen uses
White ink.White ink belongs to the solder mask that in industry, this technique is conventional.Because mute mask green ink surface roughness is big, and in vain
Color ink tack is strong, and mute mask green ink toughness is better than white oil.For the first time after silk-screen mute mask green ink second time silk-screen white oil, white oil is not
Wrinkling, do not affect properties of product while improving product appearance.This technique is applicable to have thick copper coin and (has electroplated before welding resistance
Become copper thickness >=70 μm) and circuit board that solder mask color is white, because when the thinner thickness of copper coin time, need to adopt for general
With a silk-screen, also would not there is so-called white oil characteristic ink more crisp, poor toughness, secondary silk-screen rear substrate region is easy
Occur that ink is wrinkling and after white ink high-temperature baking, ink pellet surface is shunk compactness and strengthened, pasta poor adhesive force, secondary silk
Easily occurs oil etc. problem after print.
Preferably, described first time silk-screen is circuit local silk-screen, and described second time silk-screen is plate face entirety silk-screen.We
In method, silk-screen is divided into twice and carrying out, and circuit pack the most only carries out the silk-screen of local for the first time, the most first uses mute green ink
Circuit pack is carried out local silk-screen, uses white ink that plate face entirety is carried out silk-screen the most again, ultimately form optimal resistance
Weldering film.
Preferably, in the exposure of described first time, the specification that film welding resistance is windowed is more than the film in the exposure of described second time
Welding resistance is windowed specification.I.e. when using mute green ink to carry out silk-screen for the first time, welding resistance is windowed out bigger, and white using
When color ink carries out second time silk-screen, welding resistance is windowed out more relatively small.This technological design so that in the place's of windowing second time
White oil in silk-screen can cover the mute mask green ink in first time silk-screen.So, for overall outward appearance, top layer is all
The soldering-resistance layer that white ink is formed, the soldering-resistance layer that mute green ink is formed then is completely covered on the resistance that white ink is formed
Below weldering film.So that the outward appearance of whole circuit board is relatively uniform.
Preferably, in the exposure of described first time, the specification that film welding resistance is windowed is compared to the film in the exposure of described second time
Specification that welding resistance is windowed is monolateral increases 0.05-0.1mm.This design, is for the concrete difference of twice specification of windowing,
In actual production, can further determine that, according to the feature of circuit board own specifications, the concrete difference windowed twice.If twice
The difference of specification of windowing is the least, may cause after development, and the soldering-resistance layer that white ink is formed fails completely by mute green oil
Ink covers.If but the size heterogeneity windowed is excessive in double exposure, i.e. it is meant that exposure for the first time is windowed greatly can cause the
Two layers of ink depression, ink thickness does not reaches customer requirement.
Preferably, in described first time silk-screen, silk-screen mesh number 36T or 39T, ink viscosity 60-80dpa.s, wet coating thickness
Degree management and control is in 30-40 μm.In described second time silk-screen, silk-screen mesh number 36T or 39T, ink viscosity 80-100dpa.s, wet film
Thickness management and control is in 40-50 μm.
Preferably, in described development step, develop cylinder two-way pressure 1.0 ± 0.2kg/cm2, mute green ink speed is
4.5m/min, white ink speed is 2.7m/min, it is contemplated herein that the difference of the self property to two kinds of ink, so in speed
On the most difference.
Preferably, before described welding resistance in consent step, use white ink (not increasing profit) or white oil special jack oil
Ink.Described first time is pre-baked is pre-baked 38min at vertical oven 75 DEG C, the most pre-baked for vertical oven or tunnel oven 75
Pre-baked 48min at DEG C.
Preferably, described pre-treatment is pin brush and volcanic ash nog plate, and nog plate speed 3.4m/min, in described vacuum step
Carry out 10min evacuation process, or stand 1-2h, preferably 90min, in described first time and second time step of exposure, expose energy
Range number 9-11 lattice, can make to confirm concrete exposure energy with light copper coin.
In this programme, silk-screen uses mute green ink for the first time, and silk-screen uses white ink for the second time.Mute mask green ink surface
Roughness is big, and strong with white ink tack, mute mask green ink toughness is better than white oil.Silk-screen mute mask green ink second time silk-screen for the first time
After white oil, white oil is wrinkle resistant, does not affect properties of product while improving product appearance.Thus solve base after welding resistance secondary silk-screen
Material region easily occurs that ink is wrinkling and falls the problems such as oil.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology necks
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (10)
1. one kind is the method for circuit board making soldering-resistance layer, it is characterised in that: comprise the following steps successively: welding resistance pre-treatment → the
Consent before silk-screen → evacuation → the most pre-baked → exposure → development for the first time → rear roasting → welding resistance pre-treatment → welding resistance
→ stand → the most pre-baked → second time exposure → development → rear roasting → lower operation for the second time after silk-screen → silk-screen, described first
Secondary silk-screen uses mute green ink, and described second time silk-screen uses white ink.
2. it is the method for circuit board making soldering-resistance layer as claimed in claim 1, it is characterised in that: described first time silk-screen is line
Road bureau's portion's silk-screen, described second time silk-screen is plate face entirety silk-screen.
3. it is the method for circuit board making soldering-resistance layer as claimed in claim 2, it is characterised in that: in the exposure of described first time,
During the specification that film welding resistance is windowed exposes more than described second time, the welding resistance of the film is windowed specification.
4. it is the method for circuit board making soldering-resistance layer as claimed in claim 3, it is characterised in that: in the exposure of described first time,
The specification that film welding resistance is windowed is monolateral compared to the specification that film welding resistance in the exposure of described second time is windowed increases 0.05-
0.1mm。
5. it is the method for circuit board making soldering-resistance layer as claimed in claim 4, it is characterised in that: in described first time silk-screen,
Silk-screen mesh number 36T or 39T, ink viscosity 60-80dpa.s, wet-film thickness management and control is in 30-40 μm.
6. it is the method for circuit board making soldering-resistance layer as claimed in claim 5, it is characterised in that: in described second time silk-screen,
Silk-screen mesh number 36T or 39T, ink viscosity 80-100dpa.s, wet-film thickness management and control is in 40-50 μm.
7. it is the method for circuit board making soldering-resistance layer as claimed in claim 6, it is characterised in that: in described development step, aobvious
Shadow cylinder two-way pressure 1.0 ± 0.2kg/cm2, mute green ink speed is 4.5m/min, and white ink speed is 2.7m/min.
8. it is the method for circuit board making soldering-resistance layer as claimed in claim 7, it is characterised in that: consent step before described welding resistance
In, use white ink (not increasing profit) or white oil special jack ink.
9. be as claimed in claim 8 the method for circuit board making soldering-resistance layer, it is characterised in that: described first time is pre-baked be
Pre-baked 38min at vertical oven 75 DEG C, the most pre-baked for pre-baked 48min at vertical oven or tunnel oven 75 DEG C.
10. it is the method for circuit board making soldering-resistance layer as claimed in claim 9, it is characterised in that: described pre-treatment is pin brush
With volcanic ash nog plate, nog plate speed 3.4m/min, described vacuum step carries out 10min evacuation process, or stands 1-2h,
In preferably 90min, described first time and second time step of exposure, exposure energy progression 9-11 lattice, can make to confirm tool with light copper coin
The exposure energy of body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610771779.6A CN106304671A (en) | 2016-08-30 | 2016-08-30 | A kind of method for circuit board making soldering-resistance layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610771779.6A CN106304671A (en) | 2016-08-30 | 2016-08-30 | A kind of method for circuit board making soldering-resistance layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304671A true CN106304671A (en) | 2017-01-04 |
Family
ID=57675928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610771779.6A Pending CN106304671A (en) | 2016-08-30 | 2016-08-30 | A kind of method for circuit board making soldering-resistance layer |
Country Status (1)
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937487A (en) * | 2017-04-21 | 2017-07-07 | 广东依顿电子科技股份有限公司 | Two kinds of methods of ink of silk-screen on wiring board |
| CN107509314A (en) * | 2017-06-30 | 2017-12-22 | 奥士康精密电路（惠州）有限公司 | A kind of preparation method of anti-welding white green dual-colored LED lamp batten |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
| CN109475048A (en) * | 2018-11-28 | 2019-03-15 | 惠州中京电子科技有限公司 | A kind of thickness copper pcb board solder resistance process |
| CN109475046A (en) * | 2018-12-17 | 2019-03-15 | 汕头凯星印制板有限公司 | A kind of production method and its printed board of the copper printed board of solder mask pore-free thickness |
| CN109484050A (en) * | 2018-10-26 | 2019-03-19 | 蓝思科技（长沙）有限公司 | A kind of film silk screen printing process |
| CN110012607A (en) * | 2019-04-28 | 2019-07-12 | 胜华电子（惠阳）有限公司 | A kind of 8K television set height highlights oily mainboard leveling and screen printing method |
| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
| CN110267457A (en) * | 2019-05-24 | 2019-09-20 | 惠州市联达金电子有限公司 | A kind of ink silk screen printing technique of thickness copper white solder mask pcb board |
| CN110809372A (en) * | 2019-10-16 | 2020-02-18 | 大连崇达电路有限公司 | Manufacturing method for improving solder resist white oil dropping |
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
| CN112533393A (en) * | 2020-12-04 | 2021-03-19 | 广州兴森快捷电路科技有限公司 | PCB solder mask method, PCB solder mask system and storage medium |
| CN112822841A (en) * | 2020-12-09 | 2021-05-18 | 广东科翔电子科技股份有限公司 | Manufacturing method of storage type carrier plate |
| CN113141716A (en) * | 2021-04-21 | 2021-07-20 | 深圳市祺利电子有限公司 | Manufacturing method of circuit board half plug hole |
| CN113556881A (en) * | 2021-07-22 | 2021-10-26 | 浙江罗奇泰克科技股份有限公司 | PCB solder mask white oil photoetching process capable of eliminating pencil marks |
| CN113747674A (en) * | 2021-08-31 | 2021-12-03 | 智恩电子(大亚湾)有限公司 | Thick copper plate printing method and ink |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
| CN116685071A (en) * | 2023-06-07 | 2023-09-01 | 江苏博敏电子有限公司 | Solder resist manufacturing method for improving backlight reflectivity |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937487A (en) * | 2017-04-21 | 2017-07-07 | 广东依顿电子科技股份有限公司 | Two kinds of methods of ink of silk-screen on wiring board |
| CN107509314A (en) * | 2017-06-30 | 2017-12-22 | 奥士康精密电路（惠州）有限公司 | A kind of preparation method of anti-welding white green dual-colored LED lamp batten |
| CN109152235A (en) * | 2018-10-09 | 2019-01-04 | 珠海杰赛科技有限公司 | A kind of printing method of circuit board |
| CN109484050A (en) * | 2018-10-26 | 2019-03-19 | 蓝思科技（长沙）有限公司 | A kind of film silk screen printing process |
| CN109475048A (en) * | 2018-11-28 | 2019-03-15 | 惠州中京电子科技有限公司 | A kind of thickness copper pcb board solder resistance process |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
| CN109475046A (en) * | 2018-12-17 | 2019-03-15 | 汕头凯星印制板有限公司 | A kind of production method and its printed board of the copper printed board of solder mask pore-free thickness |
| WO2020124949A1 (en) * | 2018-12-17 | 2020-06-25 | 汕头凯星印制板有限公司 | Method for manufacturing thick copper printed board with no pores in solder resist ink and printed board manufactured thereby |
| CN110012607A (en) * | 2019-04-28 | 2019-07-12 | 胜华电子（惠阳）有限公司 | A kind of 8K television set height highlights oily mainboard leveling and screen printing method |
| CN110267457B (en) * | 2019-05-24 | 2022-03-18 | 惠州市联达金电子有限公司 | Ink screen printing process of thick-copper white solder resist ink PCB |
| CN110267457A (en) * | 2019-05-24 | 2019-09-20 | 惠州市联达金电子有限公司 | A kind of ink silk screen printing technique of thickness copper white solder mask pcb board |
| CN110072339A (en) * | 2019-05-31 | 2019-07-30 | 高德（无锡）电子有限公司 | The design method of welding resistance consent under two kinds of PCB single side different ink type ink |
| CN110809372A (en) * | 2019-10-16 | 2020-02-18 | 大连崇达电路有限公司 | Manufacturing method for improving solder resist white oil dropping |
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
| CN112533393A (en) * | 2020-12-04 | 2021-03-19 | 广州兴森快捷电路科技有限公司 | PCB solder mask method, PCB solder mask system and storage medium |
| CN112533393B (en) * | 2020-12-04 | 2022-04-19 | 广州兴森快捷电路科技有限公司 | PCB solder mask method, PCB solder mask system and storage medium |
| CN112822841A (en) * | 2020-12-09 | 2021-05-18 | 广东科翔电子科技股份有限公司 | Manufacturing method of storage type carrier plate |
| CN112822841B (en) * | 2020-12-09 | 2022-07-15 | 广东科翔电子科技股份有限公司 | Manufacturing method of storage type carrier plate |
| CN113141716A (en) * | 2021-04-21 | 2021-07-20 | 深圳市祺利电子有限公司 | Manufacturing method of circuit board half plug hole |
| CN113556881A (en) * | 2021-07-22 | 2021-10-26 | 浙江罗奇泰克科技股份有限公司 | PCB solder mask white oil photoetching process capable of eliminating pencil marks |
| CN113747674A (en) * | 2021-08-31 | 2021-12-03 | 智恩电子(大亚湾)有限公司 | Thick copper plate printing method and ink |
| CN113966101A (en) * | 2021-12-21 | 2022-01-21 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
| CN116685071A (en) * | 2023-06-07 | 2023-09-01 | 江苏博敏电子有限公司 | Solder resist manufacturing method for improving backlight reflectivity |
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Application publication date: 20170104 |