CN109475048A - A kind of thickness copper pcb board solder resistance process - Google Patents
A kind of thickness copper pcb board solder resistance process Download PDFInfo
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- CN109475048A CN109475048A CN201811437349.6A CN201811437349A CN109475048A CN 109475048 A CN109475048 A CN 109475048A CN 201811437349 A CN201811437349 A CN 201811437349A CN 109475048 A CN109475048 A CN 109475048A
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- China
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- catch point
- windowing
- pcb board
- solder resistance
- window size
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of thick copper pcb board solder resistance process, which is characterized in that comprising the following specific steps S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification；S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.The thick copper plate solder resistance printing made by the method for the invention, oil is thick and quality may conform to production requirement, finds no oil by properties test and layering is bad, meet quality requirements.
Description
Technical field
The invention belongs to PCB processing technique fields, and in particular to a kind of thickness copper pcb board solder resistance process.
Background technique
With the coil plate of wireless charging and the rise of all kinds of power supply products, the quality requirements of product are constantly mentioned
Height, appearance property aspect are all constantly being upgraded, and client is more demanding to ink thickness；To copper thickness >=3OZ or more thickness
Copper sheet route turning oil thickness 15UM ± 5UM, line face oil thickness need >=20UM, the thick copper sheet more highlighted is in terms of oily thickness using existing
Technology is unable to satisfy requirement at all, to meet customer need, existing processing technology be easy because copper thickness it is too thick caused by lower oil not
It is good, it can not ensure the requirement of product quality.
Summary of the invention
In view of this, the present invention, which gives, provides a kind of thick copper pcb board solder resistance process, the thick copper sheet made by the method for the invention
Anti-welding printing, oil is thick and quality may conform to production requirement, falls oil by properties test discovery and layering is bad, full
Sufficient quality requirements.
The technical solution of the present invention is as follows: a kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 20-40min at 120-180 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2mil catch point at least bigger than anti-welding film window size, hole window size is than anti-welding film windowing ruler
Very little small at least≤5mil catch point, the film size≤7mil, i.e., anti-welding film windowing increase on the basis of former window size
2mil catch point.The case where for no copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.5-1mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 150-200cc.
By the method for the invention can the thick copper plate solder resistance production of successful mass production 3OZ or more, can make by the method for the invention
Make quality and preferably print product, and solve because copper thickness it is too thick caused by lower oil it is bad, make by the method for the invention
The printing of thick copper plate solder resistance, oil is thick and quality may conform to production requirement, by properties test discovery fall oil and point
Layer is bad, meets quality requirements.
Invention fills substrate using first time to be used in anti-welding printing process for the production method of the thick copper of 3OZ or more
Catch point wire mark brush, copper face and route windowing processing+second spraying production mode are made, can effectively solve because copper thicker than
Height, ink are unable to fully fill full generated lower oily bad and reveal copper.Operation of the present invention is convenient, safety is higher；And it makes
It is simple to make method, PCB processing enterprise can complete.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with embodiment, it is clear that described reality
Applying example is only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment 1
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 20min at 120 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2mil catch point at least bigger than anti-welding film window size, hole window size is than anti-welding film windowing ruler
Very little small at least≤5mil catch point, the film size≤7mil, i.e., anti-welding film windowing increase on the basis of former window size
2mil catch point.The case where for no copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.5mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 150cc.
By the method for the invention can the thick copper plate solder resistance production of successful mass production 3OZ or more, can make by the method for the invention
Make quality and preferably print product, and solve because copper thickness it is too thick caused by lower oil it is bad, make by the method for the invention
The printing of thick copper plate solder resistance, oil is thick and quality may conform to production requirement, by properties test discovery fall oil and point
Layer is bad, meets quality requirements.
Embodiment 2
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 40min at 180 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2mil catch point at least bigger than anti-welding film window size, hole window size is than anti-welding film windowing ruler
Very little small at least≤5mil catch point, the film size≤7mil, i.e., anti-welding film windowing increase on the basis of former window size
2mil catch point.The case where for no copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 1mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 200cc.
Embodiment 3
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 300min at 150 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2mil catch point at least bigger than anti-welding film window size, hole window size is than anti-welding film windowing ruler
Very little small at least≤5mil catch point, the film size≤7mil, i.e., anti-welding film windowing increase on the basis of former window size
2mil catch point.The case where for no copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.7mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 170cc.
Embodiment 4
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 36min at 160 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2mil catch point bigger than anti-welding film window size, hole window size are smaller than anti-welding film window size
5mil catch point, the film increase 2mil catch point having a size of 7mil, i.e., the anti-welding film windowing on the basis of former window size.For
The case where without copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.8mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 165cc.
Embodiment 5
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 25min at 140 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 2.5mil catch point bigger than anti-welding film window size, hole window size is than anti-welding film window size
Small 4.5mil catch point, the film increase 2mil catch point having a size of 7mil, i.e., the anti-welding film windowing on the basis of former window size.
The case where for no copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.6mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 185cc.
Embodiment 6
A kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification, the solidification
Technique is to process 32min at 170 DEG C；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
Further, in the step S1, catch point net is filled out in print substrate process, hole window size and anti-welding film windowing ruler
Very little equal big or hole window size 3mil catch point bigger than anti-welding film window size, hole window size are smaller than anti-welding film window size
4mil catch point, the film increase 2mil catch point having a size of 7mil, i.e., the anti-welding film windowing on the basis of former window size.For
The case where without copper hole, anti-welding film windowing is than the big unilateral 2mil catch point that drills.
Further, in the step S1, the substrate regions of catch point cable road catch point increase unilateral 8mil.
Further, in the step S1, catch point net substrate area is designed as the area Quan Xiayou, and the film is black area.
Further, in the step S1, first time exposure technology is that substrate fills exposure film.
Further, in the step S1, all PAD of first time exposure technology and hole windowing are in normally windowing 5mil
Unilateral 0.9mil is increased on size basis, and it is biggish ladder-like to can avoid the hole for avoiding multi-pass operation from being windowing generation.
Further, in the step S1, all routes of first time exposure technology and copper face do windowing processing, window size
Offset when normally windowing 5mil size basis subtracts dry film production.I.e. such as dry film compensation is unilateral 3.5mil, then data
It is designed as reducing the windowing of unilateral 3.5mil in regular link data.
Further, in the step S2, visual route is made without redness phenomenon as criterion of acceptability using initial workpiece when spraying.
Further, in the step S2, spraying ink supply amount is 190cc.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (9)
1. a kind of thickness copper pcb board solder resistance process, which is characterized in that comprising the following specific steps
S1. silk-screen: pre-treatment nog plate → catch point net fills out print substrate → pre-baked → first time exposure → development → solidification；
S2. it sprays: pre-treatment nog plate → spraying → pre-baked → second of exposure → development.
2. thickness copper pcb board solder resistance process according to claim 1, which is characterized in that in the step S1, catch point net fills out print
In substrate process, hole window size and anti-welding film window size etc. be big or hole window size at least than anti-welding film window size
Big 2mil catch point, hole window size is smaller at least than anti-welding film window size≤5mil catch point, the film size≤7mil.
3. thickness copper pcb board solder resistance process according to claim 2, which is characterized in that in the step S1, catch point cable road
The substrate regions of catch point increase unilateral 8mil.
4. thickness copper pcb board solder resistance process according to claim 3, which is characterized in that in the step S1, catch point net substrate
Area is designed as the area Quan Xiayou, and the film is black area.
5. thickness copper pcb board solder resistance process according to claim 4, which is characterized in that in the step S1, expose for the first time
Technique is that substrate fills exposure film.
6. thickness copper pcb board solder resistance process according to claim 5, which is characterized in that in the step S1, expose for the first time
All PAD of technique and hole windowing increase unilateral 0.5-1mil on normally windowing 5mil size basis.
7. thickness copper pcb board solder resistance process according to claim 6, which is characterized in that in the step S1, expose for the first time
All routes of technique and copper face do windowing processing, benefit of the window size when normally windowing 5mil size basis subtracts dry film production
Repay value.
8. thickness copper pcb board solder resistance process according to claim 1, which is characterized in that in the step S2, with head when spraying
It is criterion of acceptability that part, which makes visual route without redness phenomenon,.
9. thickness copper pcb board solder resistance process according to claim 8, which is characterized in that in the step S2, spray ink supply amount
For 150-200cc.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811437349.6A CN109475048A (en) | 2018-11-28 | 2018-11-28 | A kind of thickness copper pcb board solder resistance process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811437349.6A CN109475048A (en) | 2018-11-28 | 2018-11-28 | A kind of thickness copper pcb board solder resistance process |
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| CN109475048A true CN109475048A (en) | 2019-03-15 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN107995794A (en) * | 2017-11-09 | 2018-05-04 | 建业科技电子（惠州）有限公司 | One kind solves welding resistance blind hole and hides oily exposure film production method |
-
2018
- 2018-11-28 CN CN201811437349.6A patent/CN109475048A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN102523696A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Solder resist manufacturing method of thick copper plate |
| CN106304671A (en) * | 2016-08-30 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of method for circuit board making soldering-resistance layer |
| CN107995794A (en) * | 2017-11-09 | 2018-05-04 | 建业科技电子（惠州）有限公司 | One kind solves welding resistance blind hole and hides oily exposure film production method |
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Application publication date: 20190315 |