CN107995794A - One kind solves welding resistance blind hole and hides oily exposure film production method - Google Patents
One kind solves welding resistance blind hole and hides oily exposure film production method Download PDFInfo
- Publication number
- CN107995794A CN107995794A CN201711094345.8A CN201711094345A CN107995794A CN 107995794 A CN107995794 A CN 107995794A CN 201711094345 A CN201711094345 A CN 201711094345A CN 107995794 A CN107995794 A CN 107995794A
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- film
- wiring board
- exposure
- welding resistance
- catch point
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Welding resistance blind hole is solved the invention discloses one kind and hides oily exposure film production method, is included the following steps：Silk-screen printing, electrostatic spraying, exposure, development and curing；The present invention carries out covering ink by silk-screen printing and electrostatic spraying, two kinds of techniques reach complementary, it can accomplish that ink " zero into hole " requires, multiple welding resistance, exposure is not required in the technique work flow, and then easy to solve the problems, such as that blind hole hides oil during welding resistance, from production efficiency, method of the invention reduces multiple welding resistance, the flow of exposure, it is only necessary to manual silk-screen, electrostatic spraying, an exposure, development, curing；Can be with the service life of prolonged exposure film egative film, cost can effectively be reduced and reduce product rejection, and by making quickly to form oxygen-enriched environment in curing room, while the indoor temperature humidity pressure of curing is monitored and adjusted in real time and is significantly improved with the quality product quality for ensureing polar plate solidification.
Description
Technical field
The present invention relates to circuit board production techniques field, is specially that a kind of welding resistance blind hole that solves hides oily exposure film making side
Method.
Background technology
With the continuous development of world economy, the rhythm of life of people is constantly accelerated, and electronics industry also flies suddenly there occurs prominent
Into development.User to electronic product performance while requiring to be continuously improved, the also term of delivery to electronic product and technology
The solution time limit of problem proposes the requirement of higher.This requires technical staff constantly brings forth new ideas, efficient method is found, accelerates production
The production of product, reduces the production cycle.Blind hole be relative to PCB (in through hole for, i.e., the one end in hole plate one side, separately
One end is in the inside of plate, and not through whole wiring board；Plate face can be achieved and the conducting of some levels in plate acts on.Wiring board exists
Generally required when manufacturing carry out welding resistance processing, i.e., assist side complete wiring drilling and etc. it is rear by paste CVL layers (be bonded
Film-form cover layer) and the mode of silk-screen solder resist material carry out welding resistance processing.Wiring board is on by the processing rear plate body such as drilling
Can be there are open-work, and the step of silk-screen solder resist material generally carries out after pasting CVL layers.It is as shown in Figure 1, saturating on plate body body 1
After hole one end is sealed by CVL layers 3, when the open-work other end carries out silk-screen due to the presence of air in open-work, meeting after the completion of silk-screen
There is the dew undesirable phenomenon in hole, i.e. solder resist material cannot completely fill up open-work, 2 existing defects of solder mask formed, this phenomenon
The welding resistance performance of plate can be seriously affected.In order to overcome drawbacks described above, method general at present is first before silk-screen solder resist material
Consent processing is carried out, such a process increases workload, and cost increased.
So how to design a kind of welding resistance blind hole that solves hides oily exposure film production method, becoming us will currently solve
The problem of.
The content of the invention
The present invention provides a kind of welding resistance blind hole that solves and hides oily exposure film production method, passes through silk-screen printing and electrostatic spraying
Carry out covering ink, two kinds of techniques reach complementary, can accomplish that ink " zero into hole " requires, which need not be more
Secondary welding resistance, exposure, and then easy to solve the problems, such as that blind hole hides oil during welding resistance, from production efficiency, method of the invention is reduced
Multiple welding resistance, the flow of exposure, it is only necessary to which manual silk-screen, electrostatic spraying, an exposure, development, cure；Exposure can be extended
The service life of light film egative film, while personnel's efficiency is improved, flow is reduced, cost can be effectively reduced and reduce product report
It is useless, and by making quickly to form oxygen-enriched environment in curing room, at the same to cure indoor temperature humidity pressure be monitored and
Adjustment is significantly improved with the quality product quality for ensureing polar plate solidification in real time, and welding resistance first-time qualification rate improves 3%, and welding resistance is scrapped
Rate is reduced to 0.1%, can effectively solve the problems, such as in above-mentioned background technology.
To achieve the above object, the present invention provides following technical solution：One kind solves welding resistance blind hole and hides oily exposure film system
Make method, include the following steps：
1) silk-screen printing：The first ink layer of silk-screen printing, specially using the halftone of no catch point, first film
With the corresponding catch point for being used to block the welding resistance no-coverage, the resistance of via hole is contained corresponding to the printed wiring board
No-coverage is welded, second film has corresponding catch point, the resistance of via hole is not contained corresponding to the printed wiring board
No-coverage is welded, second film does not have corresponding catch point, corresponding to the gear of the same via hole of the printed wiring board
Point, the catch point of second film is more unilateral than the corresponding catch point of first film 25.4-50.8 microns small, corresponding to the print
The small size catch point of via hole of the brush circuit board finished product back aperture below 0.6 millimeter, the small size catch point of second film
It is more unilateral than the corresponding small size catch point of first film 25.4 microns small, it is big corresponding to the printed wire board finished product back aperture
It is corresponding bigger than first film in the large scale catch point of 0.6 millimeter of via hole, the large scale catch point of second film
Size catch point is unilateral 50.8 microns small, and the via hole of catch point printed wiring board more corresponding than its of second film is unilateral
More than or equal to 25.4 microns；Then stewing process is carried out to wiring board；
2) electrostatic spraying：The second ink layer of electrostatic spraying, specially sprays wiring board using electrostatic painting process,
Specially wiring board, which is erected on the roller of conveyer belt, is sent into oil spout room, and oil spout is provided with electrostatic generator and spray gun in room,
When wiring board is by immediately below spray gun, electrostatic generator work so that high-pressure electrostatic is carried in wiring board superjacent air space, and is sprayed
For the powder and gas that rifle sprays with high-pressure electrostatic, final ink uniformly falls the surface of assist side, second ink layer
First ink layer is covered, second ink film thickness is 40 μm -50 μm；
3) expose：Wiring board to be exposed is first obtained, the surface of the wiring board to be exposed has photosensitive material；Obtain auxiliary
Exposed part；Exposure：The wiring board to be exposed is placed in the shutter of exposure machine, exposure is covered on the wiring board to be exposed
The auxiliary exposure part, is then arranged at the side of the wiring board to be exposed, is exposed operation by egative film, you can；
4) develop：It will be rinsed well after dry film developing trough working solution completely discharge with tap water；Continue to be followed with deionized water
Ring cleans；Dry film reagent solution is added to dry film developing trough, the dry film developer includes potassium carbonate, is heated to 28-32
℃；Start cycle filter pump；The dry film plate that printed wiring to be developed has exposed is put into the dry film developer, spray leaching
Bubble；The printed wiring board that developed is taken out, is cleaned with tap water, you can；
5) cure：Curing room is first set, pole plate to be solidified is placed in the curing room；By the curing room pressure
It is reduced to negative pressure or vacuum state；Pure oxygen is filled with to the curing room of negative pressure or vacuum state；To described solid full of pure oxygen
Change greenhouse heating；Temperature and Humidity Control is carried out according to polar plate solidification technological requirement to the curing environment of the curing room；Dry pole plate is complete
Into technique.
According to above-mentioned technical proposal, in the step 1), after completing contraposition, each via hole of the printed wiring board
Aperture is covered completely by the catch point of second film, and the welding resistance area of coverage of the printed wiring board is not by second film
Catch point cover.
According to above-mentioned technical proposal, the technological parameter of exposing operation is in the step 3)：Drawn using smooth surface wheat, vacuum
For-(75-85) kPa.
According to above-mentioned technical proposal, auxiliary exposure part is strip, one end of the strip and institute in the step 3)
The vacuum sucking holes mouth contact of shutter is stated, the length of the auxiliary exposure part is more than the side of the wiring board to be exposed, described
The material of auxiliary exposure part is flexible material, and the width of the auxiliary exposure part is 1.0-1.5cm.
According to above-mentioned technical proposal, potassium carbonate is every liter 20-30 grams in the step 4), proportion 1.02-1.05g/
Cm3, the time of the deionized water cleaning is 30 minutes, and the time of the spray immersion is 1-2 minutes, the tap water cleaning
Time be 1-2 minutes.
It is to be passed through steaming to the mode of the curing greenhouse heating full of pure oxygen in the step 5) according to above-mentioned technical proposal
Vapour, and the temperature of the holding curing room is 40 DEG C -50 DEG C, is provided with pressure sensor in the curing room, utilizes the pressure
Force snesor cures indoor pressure and is monitored to described, when it is described cure indoor pressure change more than 5%-20% when into
Row alarm.
According to above-mentioned technical proposal, Temperature Humidity Sensor is provided with the step 5) in curing room, the curing room
Built-in chamber is circle.
Compared with prior art, beneficial effects of the present invention：Covering ink is carried out by silk-screen printing and electrostatic spraying, two
Kind of technique reaches complementary, can accomplish that ink " zero into hole " requires, which is not required multiple welding resistance, exposure, into
And easy to solve the problems, such as that blind hole hides oil during welding resistance, from production efficiency, method of the invention reduces multiple welding resistance, exposure
Flow, it is only necessary to manual silk-screen, electrostatic spraying, one exposure, development, cure；It can be made with prolonged exposure film egative film
With the service life, while personnel's efficiency is improved, reduce flow, can effectively reduced cost and reduce product rejection, and it is solid by making
Change indoor quick formation oxygen-enriched environment, while the indoor temperature humidity pressure of curing is monitored and is adjusted in real time to ensure pole
The cured quality product quality of plate significantly improves, and welding resistance first-time qualification rate improves 3%, and welding resistance scrappage is reduced to 0.1%.
Brief description of the drawings
Attached drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.
In the accompanying drawings：
Fig. 1 is the production process figure of the present invention.
Embodiment
The preferred embodiment of the present invention is illustrated below in conjunction with attached drawing, it will be appreciated that described herein preferred real
Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Embodiment：As shown in Figure 1, the present invention, which provides a kind of welding resistance blind hole that solves, hides oily exposure film production method, including
Following steps：
1) silk-screen printing：The first ink layer of silk-screen printing, specially using the halftone of no catch point, first film
With the corresponding catch point for being used to block the welding resistance no-coverage, the resistance of via hole is contained corresponding to the printed wiring board
No-coverage is welded, second film has corresponding catch point, the resistance of via hole is not contained corresponding to the printed wiring board
No-coverage is welded, second film does not have corresponding catch point, corresponding to the gear of the same via hole of the printed wiring board
Point, the catch point of second film is more unilateral than the corresponding catch point of first film 25.4-50.8 microns small, corresponding to the print
The small size catch point of via hole of the brush circuit board finished product back aperture below 0.6 millimeter, the small size catch point of second film
It is more unilateral than the corresponding small size catch point of first film 25.4 microns small, it is big corresponding to the printed wire board finished product back aperture
It is corresponding bigger than first film in the large scale catch point of 0.6 millimeter of via hole, the large scale catch point of second film
Size catch point is unilateral 50.8 microns small, and the via hole of catch point printed wiring board more corresponding than its of second film is unilateral
More than or equal to 25.4 microns；Then stewing process is carried out to wiring board；
2) electrostatic spraying：The second ink layer of electrostatic spraying, specially sprays wiring board using electrostatic painting process,
Specially wiring board, which is erected on the roller of conveyer belt, is sent into oil spout room, and oil spout is provided with electrostatic generator and spray gun in room,
When wiring board is by immediately below spray gun, electrostatic generator work so that high-pressure electrostatic is carried in wiring board superjacent air space, and is sprayed
For the powder and gas that rifle sprays with high-pressure electrostatic, final ink uniformly falls the surface of assist side, second ink layer
First ink layer is covered, second ink film thickness is 40 μm -50 μm；
3) expose：Wiring board to be exposed is first obtained, the surface of the wiring board to be exposed has photosensitive material；Obtain auxiliary
Exposed part；Exposure：The wiring board to be exposed is placed in the shutter of exposure machine, exposure is covered on the wiring board to be exposed
The auxiliary exposure part, is then arranged at the side of the wiring board to be exposed, is exposed operation by egative film, you can；
4) develop：It will be rinsed well after dry film developing trough working solution completely discharge with tap water；Continue to be followed with deionized water
Ring cleans；Dry film reagent solution is added to dry film developing trough, the dry film developer includes potassium carbonate, is heated to 28-32
℃；Start cycle filter pump；The dry film plate that printed wiring to be developed has exposed is put into the dry film developer, spray leaching
Bubble；The printed wiring board that developed is taken out, is cleaned with tap water, you can；
5) cure：Curing room is first set, pole plate to be solidified is placed in the curing room；By the curing room pressure
It is reduced to negative pressure or vacuum state；Pure oxygen is filled with to the curing room of negative pressure or vacuum state；To described solid full of pure oxygen
Change greenhouse heating；Temperature and Humidity Control is carried out according to polar plate solidification technological requirement to the curing environment of the curing room；Dry pole plate is complete
Into technique.
According to above-mentioned technical proposal, in the step 1), after completing contraposition, each via hole of the printed wiring board
Aperture is covered completely by the catch point of second film, and the welding resistance area of coverage of the printed wiring board is not by second film
Catch point cover.
According to above-mentioned technical proposal, the technological parameter of exposing operation is in the step 3)：Drawn using smooth surface wheat, vacuum
For-(75-85) kPa.
According to above-mentioned technical proposal, auxiliary exposure part is strip, one end of the strip and institute in the step 3)
The vacuum sucking holes mouth contact of shutter is stated, the length of the auxiliary exposure part is more than the side of the wiring board to be exposed, described
The material of auxiliary exposure part is flexible material, and the width of the auxiliary exposure part is 1.0-1.5cm.
According to above-mentioned technical proposal, potassium carbonate is every liter 20-30 grams in the step 4), proportion 1.02-1.05g/
Cm3, the time of the deionized water cleaning is 30 minutes, and the time of the spray immersion is 1-2 minutes, the tap water cleaning
Time be 1-2 minutes.
It is to be passed through steaming to the mode of the curing greenhouse heating full of pure oxygen in the step 5) according to above-mentioned technical proposal
Vapour, and the temperature of the holding curing room is 40 DEG C -50 DEG C, is provided with pressure sensor in the curing room, utilizes the pressure
Force snesor cures indoor pressure and is monitored to described, when it is described cure indoor pressure change more than 5%-20% when into
Row alarm.
According to above-mentioned technical proposal, Temperature Humidity Sensor is provided with the step 5) in curing room, the curing room
Built-in chamber is circle.
Based on above-mentioned, it is an advantage of the current invention that carrying out covering ink, two kinds of techniques by silk-screen printing and electrostatic spraying
Reach complementary, can accomplish that ink " zero into hole " requires, which is not required multiple welding resistance, exposure, and then is easy to
Solve the problems, such as that blind hole hides oil during welding resistance, from production efficiency, method of the invention reduces multiple welding resistance, the stream of exposure
Journey, it is only necessary to manual silk-screen, electrostatic spraying, an exposure, development, curing；Longevity can be used with prolonged exposure film egative film
Life, while personnel's efficiency is improved, flow is reduced, cost can be effectively reduced and reduce product rejection, and by making curing room
Interior quick formation oxygen-enriched environment, while the indoor temperature humidity pressure of curing is monitored and is adjusted in real time to ensure that pole plate is consolidated
The quality product quality of change significantly improves, and welding resistance first-time qualification rate improves 3%, and welding resistance scrappage is reduced to 0.1%.
Finally it should be noted that：The foregoing is merely the preferred embodiment of the present invention, it is not intended to limit the invention, to the greatest extent
Pipe is with reference to the foregoing embodiments described in detail the present invention, and for the technology patient of this area, it still can be with
Modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.It is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on, should be included in the guarantor of the present invention
Within the scope of shield.
Claims (7)
1. one kind solves welding resistance blind hole and hides oily exposure film production method, it is characterised in that：Include the following steps：
1) silk-screen printing：The first ink layer of silk-screen printing, specially has using the halftone of no catch point, first film
The corresponding catch point for being used to block the welding resistance no-coverage, the welding resistance that via hole is contained corresponding to the printed wiring board are non-
Overlay area, second film have corresponding catch point, and the welding resistance that via hole is not contained corresponding to the printed wiring board is non-
Overlay area, second film does not have corresponding catch point, corresponding to the catch point of the same via hole of the printed wiring board, institute
It is more unilateral than the corresponding catch point of first film 25.4-50.8 microns small to state the catch point of second film, corresponding to the track
The small size catch point of via hole of the road board finished product back aperture below 0.6 millimeter, the small size catch point of second film compare institute
It is unilateral 25.4 microns small to state the corresponding small size catch point of first film, is more than corresponding to the printed wire board finished product back aperture
The large scale catch point of 0.6 millimeter of via hole, the corresponding big ruler of the large scale catch point of second film than first film
Very little catch point is unilateral 50.8 microns small, and the via hole of catch point printed wiring board more corresponding than its of second film is unilateral big
In equal to 25.4 microns；Then stewing process is carried out to wiring board；
2) electrostatic spraying：The second ink layer of electrostatic spraying, specially sprays wiring board using electrostatic painting process, specifically
It is erected at for wiring board on the roller of conveyer belt and is sent into oil spout room, oil spout is provided with electrostatic generator and spray gun in room, in circuit
When plate is by immediately below spray gun, electrostatic generator work so that high-pressure electrostatic is carried in wiring board superjacent air space, and spray gun sprays
For the powder and gas gone out with high-pressure electrostatic, final ink uniformly falls the surface of assist side, the second ink layer covering
First ink layer, second ink film thickness are 40 μm -50 μm；
3) expose：Wiring board to be exposed is first obtained, the surface of the wiring board to be exposed has photosensitive material；Obtain auxiliary exposure
Part；Exposure：The wiring board to be exposed is placed in the shutter of exposure machine, covering exposure bottom on the wiring board to be exposed
The auxiliary exposure part, is then arranged at the side of the wiring board to be exposed, is exposed operation by piece, you can；
4) develop：It will be rinsed well after dry film developing trough working solution completely discharge with tap water；Continue to use deionized water circulation cleaning
Wash；Dry film reagent solution is added to dry film developing trough, the dry film developer includes potassium carbonate, is heated to 28-32 DEG C；Open
Dynamic cycle filter pump；The dry film plate that printed wiring to be developed has exposed is put into the dry film developer, spray immersion；Take
Go out the printed wiring board that developed, cleaned with tap water, you can；
5) cure：Curing room is first set, pole plate to be solidified is placed in the curing room；Air pressure in the curing room is reduced
To negative pressure or vacuum state；Pure oxygen is filled with to the curing room of negative pressure or vacuum state；To the curing room full of pure oxygen
Heating；Temperature and Humidity Control is carried out according to polar plate solidification technological requirement to the curing environment of the curing room；Dry pole plate completes work
Skill.
2. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 1) in, complete contraposition after, the aperture of each via hole of the printed wiring board is hidden completely by the catch point of second film
Firmly, and the welding resistance area of coverage of the printed wiring board is not covered by the catch point of second film.
3. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 3) in the technological parameter of exposing operation be：Drawn using smooth surface wheat, vacuum is-(75-85) kPa.
4. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 3) in auxiliary exposure part be strip, one end of the strip is contacted with the vacuum sucking holes mouth of the shutter, described auxiliary
The length of exposed part is helped to be more than the side of the wiring board to be exposed, the material of the auxiliary exposure part is flexible material, described
The width of auxiliary exposure part is 1.0-1.5cm.
5. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 4) in potassium carbonate be every liter 20-30 grams, proportion 1.02-1.05g/cm3, the time of the deionized water cleaning is 30 points
Clock, the time of the spray immersion is 1-2 minutes, and the time of the tap water cleaning is 1-2 minutes.
6. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 5) in the mode of the curing greenhouse heating full of pure oxygen to be passed through steam, and it is 40 to keep the temperature of the curing room
DEG C -50 DEG C, be provided with pressure sensor in the curing room, using the pressure sensor to it is described cure indoor pressure into
Row monitoring, alarms when the indoor pressure change of curing is more than 5%-20%.
7. a kind of welding resistance blind hole that solves hides oily exposure film production method according to claim 1, it is characterised in that：The step
It is rapid 5) in Temperature Humidity Sensor is provided with curing room, the built-in chamber of the curing room is circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094345.8A CN107995794A (en) | 2017-11-09 | 2017-11-09 | One kind solves welding resistance blind hole and hides oily exposure film production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094345.8A CN107995794A (en) | 2017-11-09 | 2017-11-09 | One kind solves welding resistance blind hole and hides oily exposure film production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995794A true CN107995794A (en) | 2018-05-04 |
Family
ID=62030223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711094345.8A Pending CN107995794A (en) | 2017-11-09 | 2017-11-09 | One kind solves welding resistance blind hole and hides oily exposure film production method |
Country Status (1)
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413879A (en) * | 2018-10-26 | 2019-03-01 | 南通深南电路有限公司 | Wiring board welding resistance processing technology |
| CN109475048A (en) * | 2018-11-28 | 2019-03-15 | 惠州中京电子科技有限公司 | A kind of thickness copper pcb board solder resistance process |
| CN110139498A (en) * | 2019-06-06 | 2019-08-16 | 恒赫鼎富(苏州)电子有限公司 | The anti-welding coating technique of flexible circuit board |
| CN113068315A (en) * | 2021-02-26 | 2021-07-02 | 沪士电子股份有限公司 | Method for manufacturing circuit board capable of preventing small-hole and non-hole-blocking ink inlet hole |
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| CN103096633A (en) * | 2011-11-03 | 2013-05-08 | 深南电路有限公司 | Solder resisting method for circuit board |
| CN105355862A (en) * | 2015-12-04 | 2016-02-24 | 浙江海悦自动化机械股份有限公司 | Polar plate curing process |
| CN106604549A (en) * | 2016-12-07 | 2017-04-26 | 广州杰赛科技股份有限公司 | Circuit board and exposure process thereof |
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
| CN107278038A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of dry film developing process for the highly dense circuit of printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096633A (en) * | 2011-11-03 | 2013-05-08 | 深南电路有限公司 | Solder resisting method for circuit board |
| CN105355862A (en) * | 2015-12-04 | 2016-02-24 | 浙江海悦自动化机械股份有限公司 | Polar plate curing process |
| CN107278038A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of dry film developing process for the highly dense circuit of printed wiring board |
| CN106604549A (en) * | 2016-12-07 | 2017-04-26 | 广州杰赛科技股份有限公司 | Circuit board and exposure process thereof |
| CN107148159A (en) * | 2017-07-20 | 2017-09-08 | 深圳中富电路有限公司 | The method for manufacturing printed substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413879A (en) * | 2018-10-26 | 2019-03-01 | 南通深南电路有限公司 | Wiring board welding resistance processing technology |
| CN109475048A (en) * | 2018-11-28 | 2019-03-15 | 惠州中京电子科技有限公司 | A kind of thickness copper pcb board solder resistance process |
| CN110139498A (en) * | 2019-06-06 | 2019-08-16 | 恒赫鼎富(苏州)电子有限公司 | The anti-welding coating technique of flexible circuit board |
| CN113068315A (en) * | 2021-02-26 | 2021-07-02 | 沪士电子股份有限公司 | Method for manufacturing circuit board capable of preventing small-hole and non-hole-blocking ink inlet hole |
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Application publication date: 20180504 |
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