CN107160108B - A kind of processing method and Standard pallet of automation equipment Standard pallet - Google Patents
A kind of processing method and Standard pallet of automation equipment Standard pallet Download PDFInfo
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- CN107160108B CN107160108B CN201710471589.7A CN201710471589A CN107160108B CN 107160108 B CN107160108 B CN 107160108B CN 201710471589 A CN201710471589 A CN 201710471589A CN 107160108 B CN107160108 B CN 107160108B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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Abstract
The invention discloses a kind of automation equipment Standard pallet processing method and the Standard pallets made by it, this method includes product layering, sublayer processing, integral solder and product shaping: where the product layering includes: the specific structure parameter for being divided into several sublayers according to the structure of final Standard pallet product and determining each sublayer；Sublayer processing includes: coating photoresists, exposure, development, pretreatment, etching and demoulding；The step of integral solder includes: positioning and vacuum diffusion welding；The step of product shaping includes: milling and pickling.This method can reduce whole processing cost, and can also have good reducing effect for the machining deformation amount of part in process.
Description
Technical field
The invention belongs to equipment manufacture fields, and in particular to a kind of processing method of the Standard pallet of automation equipment with
And the Standard pallet made by it.
Background technique
Standard pallet is common component in automation equipment, especially for precision instrument manufacture field, due to itself plus
The product or part of work be all have in special structure but size be it is lesser, in the fabrication process and manufacture complete with
It is required to complete circulation in the case where Standard pallet helps during cleaning and detection afterwards etc..
Pallet in the prior art is processed generally by the equipment of machining center, i.e., not with a monolith
Become rusty steel board, is processed by rushing the means such as pricker to it, processes hole in the place of needs.This method process-cycle length,
The machining deformation amount of cost of manufacture height and final products is larger.
Summary of the invention
The purpose of the present invention is to provide a kind of automation equipment Standard pallets at low cost, part machining deformation amount is small
Processing method and the Standard pallet made by it.
In order to achieve the above object, scheme of the present invention are as follows:
A kind of automation equipment Standard pallet processing method, this method include product layering, sublayer processing, integral solder with
And product shaping and etc.:
Product layering includes: to be divided into several sublayers and true according to the structure of final Standard pallet product
The specific structure parameter of fixed each sublayer；
Sublayer processing the following steps are included:
S21 coats photoresists: photoresists are coated in each sublayer；
S22 exposure: processing is exposed to each sublayer by printer and egative film, the egative film is layered according to product
The step of in the specific structure parameter of each sublayer that is divided into and make；Preferably, conditions of exposure are as follows: 2000W high-pressure mercury
Lamp, lamp is away from 75cm, and the time for exposure 30 seconds；
S23 development: the sublayer after exposure-processed is placed in the developing water that development water depth is more than its thickness and is developed
Processing；Preferably, developing time about needs 1 minute；
S24 pretreatment: the sublayer after development is sufficiently cleaned to remove developer solution；
S25 etching: the sublayer after cleaning is immersed in etching solution and is etched, is taken out after the completion of to be etched；
S26 demoulding: the sublayer after etching is impregnated in liquid parting to slough the photoresists for being attached to sub-layer surface attachment；
Preferably, being impregnated under room temperature about 3 minutes；
The integral solder the following steps are included:
S31 positioning: each sublayer after segmentation is laminated according to its belonging positions and is placed, and adjusts the relative position between each sublayer
Relationship, the structure after keeping it stacked are identical as the integral product structure before segmentation；Each sublayer after stacked placement constitutes one
Welding unit；
S32 vacuum diffusion welding: the welding unit obtained after positioning is placed in vacuum diffusion bonding furnace and carries out diffusion in vacuum
Welding is to produce product blank；One preferred welding condition are as follows: 900 DEG C, 20Mpa, 0.015pa, 24 hours are cooled to the furnace
It is taken out after room temperature；
The product shaping includes:
S41 milling: milling shaping is carried out by least part size of the machining center to product blank, meets it more
Structural Design Requirement；
S42 pickling: milling treated product blank is subjected to pickling to remove the burr that processing generates, is obtained final
Standard pallet product.
The processing method of Standard pallet is processed change directly by original monolith plate as layering processing by this method.Knowing
Divide sublayer in the case where dawn final product structure to be easily achieved, and the exposure film that can make each sublayer accordingly is standby
With；For each sublayer, leads to overetched method and process corresponding structure；Diffusion in vacuum will be passed through after the stacked positioning of each sublayer again
The complete blank of welding fabrication；Shape correction finally is carried out so that its structure meets design requirement to blank again.This method can be with
Whole processing cost is reduced, and there can also be good reducing effect for the machining deformation amount of part in process.
Preferably, it is average segmentation or unequal segmentation that each sublayer is divided in the step of product is layered.The tool of segmentation
Body mode depends on the structure of product, and in general, average segmentation is conducive to unified material purchases, main without average segmentation
It is targetedly to be split for the architectural characteristic generated, so as to avoid putting down so that the processing of each sublayer is more convenient
It might have biggish re-shaping exercise amount in the later period when dividing.Preferably, average segmentation can be selected for stainless steel materials
Method, every sublayer with a thickness of 0.5mm；Plate preliminary treatment (buying and preparatory processing) and following process work can be taken into account in this way
Skill.
It preferably, is to coat photoresists and spraying or being coated in the step of S21 coating photoresists.Spraying and
Coating is two kinds of coating effects preferably and realizes convenient technique, is suitable for the present invention and uses.
Preferably, the step of S23 develops is using positive photoresist development or negtive photoresist development.It can be real by different developer solutions
Existing positive photoresist development or negtive photoresist development, two kinds of visualization ways can finally realize goal of the invention of the invention.
Preferably, use ferric trichloride as etching solution in the step of S25 is etched.More preferably, etching condition are as follows: three
Ferric chloride concn 2g/cm3, 40 DEG C of etch temperature, 80 μ of etching speed/min, etching period about 4 minutes.
Preferably, further include the steps that welding several anchor points in each sublayer side in the step of S31 is positioned.Positioning
The relative position of each sublayer is fixed up by point, and setting anchor point can be carried to avoid each welding unit having had good positioning
During Diffusion Welding furnace, during soldering furnace pressurization or each sublayer occurs relative position and makes final in welding process
The size of product is deviated；Preferably, anchor point uses laser welding.
Preferably, which is characterized in that further include the steps that dusting in the step of S31 is positioned, after stacked positioning
High temperature resistant powder (such as ceramic powder) is sprayed in the upper and lower surfaces of welding unit to be isolated in welding；It is described resistance to
High temperature powder keeps stable in the welding process.In actual production, in order to improve yield, welds appropriate to the occasion use and in high volume weld simultaneously
It connects, is accidentally welded between the upper and lower surfaces to prevent different welding units in welding, the upper surface and following table in each welding unit
High temperature resistant powder is sprayed on face to be isolated, and is mistakenly welded together to avoid the sublayer for belonging to different welding units.
Preferably, further include the steps that wire mark photoresist in the step of step S21 coating photoresists, pass through solarization
Photoresist wire mark is carried out baking processing on photosensitive layer, then placing it in baking oven by the silk-screen plate of system.Through photic anti-
After losing agent protection, the image of exposure can be made to be more clear and accurately, the size that etching can also be made to obtain more meets expection.Compared with
Goodly, silk-screen plate generally uses 300 mesh, baking condition: 130 DEG C, 25min.
Preferably, baking is further included the steps that in the pretreated step of the S24, is placed it in after the completion of sublayer is rinsed
It is toasted in oven to strengthen between the membrane body (general names of photoresists and/or photoresist) and the plate of sublayer of coating
It is bonded effect.Preferably, baking condition are as follows: 150 DEG C, 25min.
A kind of automation equipment Standard pallet, the Standard pallet are prepared by method described in any of the above embodiments.
Automation equipment Standard pallet processing method of the invention can reduce whole processing cost, and for processing
The machining deformation amount of part can also have good reducing effect in the process, thus be more suitable for large-scale production and actual make
With；Especially in the process of precision component, production efficiency and yields is can be improved in the pallet of size more standard.
Detailed description of the invention
Fig. 1 is the process flow chart of a preferred embodiment of the invention.
Specific embodiment
In order to make those skilled in the art that the present invention may be better understood, to be made clearly to protection scope of the present invention
It limits to Chu, embodiments of the present invention is described in detail with reference to the accompanying drawing.
A kind of automation equipment Standard pallet processing method, the method are divided into product layering, sublayer processing, integral solder
And four steps of product shaping:
The step of product is layered includes: to be divided into several layers according to the structure of final Standard pallet product, and can be because
This determines every layer of corresponding specific structure parameter；It is convenient for statement, every layer after segmentation is known as sublayer；It can be with when dividing sublayer
It is average to divide, it is also possible to be divided into several sublayers of different-thickness according to the architectural characteristic of product；Specific partitioning scheme takes
Certainly in the structure of product, in general, average segmentation is conducive to unified material purchases, without average segmentation primarily directed to production
Raw architectural characteristic is targetedly split, so as to so that the processing of each sublayer is more convenient, when avoiding average segmentation
It might have biggish re-shaping exercise amount in the later period；For example, it is assumed that the size of integral product in the vertical direction is to be uniformly distributed
(including size identical or linear gradient), it can be averagely divided into the identical sublayer of several thickness；And work as integral product
It can be different thickness according to its segmentation of structures when size in the vertical direction is non-uniform (non-equal or linear gradient)
The sublayer of degree, for example, total height be 4cm product, from bottom to top the aperture of through-hole somewhere be 0-1cm height be 4mm,
1-3cm height is that 3mm, 3-4cm height are 2mm, can be divided into three layers (0-1cm, 1-3cm, 3-4cm) at this time；Certainly,
It can not also consider that product structure is directly averagely divided.Integral product is divided into several parameter (shapes, knot after the completion of segmentation
Structure, thickness etc.) identical or different sublayer, it is subsequent according to each sublayer corresponding construction (structure of each sublayer segmentation with
After be clearly, can be obtained according to the parameter and dividing method of integral product) be processed respectively.
For convenience of statement, below to subsequent by taking stainless steel materials make stainless steel pallet for the plate of sublayer processing as an example
Process is illustrated；SUS304 stainless steel, size 320mm*160mm*0.5mm are used in lower example；
Sublayer processing the following steps are included:
S21 coats photoresists: bat printing coats photoresists on the stainless steel materials of each sublayer, can be with by spraying or being coated with
Higher program uniformity is obtained, should preferentially be used；
S22 exposure: being exposed with printer fitting egative film, by ready egative film (the step of being layered according to product point
The structural parameters production for each sublayer cut) the photosensitive glue surface of stainless steel materials is attached at position at a proper angle,
Conditions of exposure is set, such as: 2000W high-pressure sodium lamp, lamp is away from 75cm, and the time for exposure 30 seconds；To the stainless steel after the coating of S21 step
Plate is exposed processing；
S23 development: the stainless steel materials for forming sub-image are placed in the developing water that development water depth is more than its thickness and are carried out
Development can be developed when development using positive photoresist or be developed using negtive photoresist；But for above-mentioned technique, positive photoresist development effect
More preferably, positive photoresist is developed by the uncured photoresists of developing water dissolution, until stainless steel materials surface can be clearly seen that shadow
Picture；In general developing time about needs 1 minute；
S24 pretreatment: carrying out sufficiently cleaning for the stainless steel materials after development to remove developer solution, and when cleaning uses clear
Washing lotion can be water, ethyl alcohol or other liquid compatible with developer solution；
S25 etching: the stainless steel materials after cleaning being immersed in etching solution and are etched, and is taken out after the completion of to be etched stainless
Steel board；Using ferric trichloride as etching solution when etching, etchant concentration 2g/cm3,40 DEG C of etch temperature, etching speed 80
μ/min, etching period about 4 minutes；
S26 demoulding: the stainless steel materials after etching are impregnated in dedicated liquid parting to slough the sense being attached on laminate
In general optical cement impregnates about 3 minutes under room temperature, stainless steel materials is dried after demoulding；
The integral solder the following steps are included:
S31 positioning: each sublayer after segmentation is laminated according to its belonging positions and is placed, and adjusts the relative position between each sublayer
Relationship, structure is identical as the integral product before segmentation after keeping it stacked；It is convenient for statement, a set of sublayer that positioning is placed
(from being split by the same integral product) is known as welding unit；More preferably, after positioning into or positioning, in each sublayer side
(surface that contacts with each other when non-each sublayer combines) (such as 8, be arranged 2 on each side with several anchor points of laser welding
It is a) so that positioning more prepares, while can also be to avoid each sublayer relative position in carrying in the subsequent process or welding process
It changes and leads to final products dimensional error；
S32 vacuum diffusion welding: welding unit being placed in vacuum diffusion bonding furnace and is welded, the condition of welding are as follows: 900
DEG C, 20Mpa, 0.015pa, 24 hours, taken out after cooling to room temperature with the furnace；After the completion of welding, each welding unit becomes product
Blank, inside be welded together to form one piece of complete stainless steel plate with corresponding construction securely and (completely referred to before this
Each sublayer between completely combine rather than refer to and do not have hole or other structures on the stainless steel plate)；
The product shaping includes:
S41 milling: the product blank being welded is placed in machining center to certain sizes (such as critical size) of blank
Carry out milling shaping；Milling can be carried out for entire infrastructure size, be also possible to specifically take only for key position progress
Certainly other correlative factors such as requirement in etch effect and/or product to size；
S42 pickling: milling treated product is subjected to pickling to remove the burr that processing generates, obtains final products.
Above-mentioned processing method is to be used uniformly the stainless steel materials of 0.5mm thickness to carry out as raw material, the plate of the thickness
Material in general has preferable overall performance, has both considered purchase cost and plate process operation early period, has also taken into account above-mentioned
Workload when processing method middle and later periods Shape correction；It is all in all a kind of preferable specification.
In certain some preferred embodiment, the step of step S21 coating photoresists further includes S211 wire mark (i.e. silk screen
Printing) photoresist the step of, prepare shine throwing halftone, be subsequently placed in baking oven and toasted；Silk-screen plate generally uses 300
Mesh, baking condition: 130 DEG C, 25min；After photoresist is protected, image can be made to be more clear and prepare, can also made
It etches obtained size and more meets expection.
In other preferred embodiments, the S24 pre-treatment step further includes the steps that baking, and baking condition is preferred
Are as follows: 150 DEG C, 25min；Stainless steel plate is placed in oven after the completion of flushing and is toasted to strengthen photoresists and/or photic
Being bonded between resist and laminate, to avoid causing in etching process since photoresists are bonded loosely with stainless steel surface
There is etching solution to generate adverse effect to the structure of final products along the faying face infiltration of the two.
In other preferred embodiments, the S31 position the step of in further include the steps that S311 dusts: for improve produce
Amount is welded appropriate to the occasion use and is in high volume welded simultaneously, that is, have several welding units to line up several layers when welding, if also having in every layer
Dry welding unit；At this point, in layer each welding unit due to can be set certain interval, and interlayer up and down welding unit it
Between since it is desired that pressurization and when needing to contact, to prevent from accidentally being welded between different welding units in welding, in each welding unit
Upper and lower surfaces (upper surface of top layer's sublayer of i.e. same welding unit and the lower surface of lowest level sublayer) on spray
High temperature resistant powder (it stablizes under conditions of vacuum welding, will not occur to melt or react) is applied so that (welding unit is isolated
Be between internal each sublayer do not have to be also cannot ceramic coated powder), avoid the sublayer for belonging to different welding units by mistake
Ground welds together；High temperature resistant powder used can be any stable material under the conditions of vacuum welding in the prior art
Powder, such as ceramic powder.
Embodiment
Make the product of same size respectively by above-mentioned technique of the invention and processing technology traditional in the prior art, respectively
Time needed for process and expense are respectively as follows:
1 prior art of table and contrast table of the present invention
It should be noted that the above-mentioned statement for the specific embodiment of the invention is merely illustrative, using other
Material, other are regular but should also fall within the scope of the present invention by the method that present inventive concept makes；Art technology
Routinely replacement and accommodation should also be as belonging to the scope of protection of the present invention personnel made by the basis of present inventive concept.
Claims (8)
1. a kind of processing method of automation equipment Standard pallet, which is characterized in that the method includes product layering, sublayers to add
The step of work, integral solder and product shaping:
The product layering includes: to be divided into several sublayers according to the structure of final Standard pallet product and determine every
The specific structure parameter of a sublayer；
Sublayer processing the following steps are included:
S21 coats photoresists: coating photoresists in each sublayer；
S22 exposure: processing is exposed to each sublayer by printer and egative film, the egative film is the step being layered according to product
The specific structure parameter for each sublayer being divided into rapid and make；Conditions of exposure are as follows: 2000W high-pressure sodium lamp, lamp away from 75cm,
Time for exposure 30 seconds；
S23 development: the sublayer after exposure-processed is placed in the developing water that development water depth is more than its thickness and carries out development treatment；
Developing time 1 minute；
S24 pretreatment: the sublayer after development is sufficiently cleaned to remove developer solution；
S25 etching: the sublayer after cleaning being immersed in etching solution and is etched, and is taken out after the completion of to be etched；
S26 demoulding: the sublayer after etching is impregnated in liquid parting to slough the photoresists for being attached to sub-layer surface attachment；Room temperature
Lower dipping 3 minutes；
The integral solder the following steps are included:
S31 positioning: each sublayer after segmentation being laminated according to its belonging positions and is placed, and adjusts the pass of the relative position between each sublayer
System, the structure after keeping it stacked are identical as the integral product structure before segmentation；It further include the step dusted in the step of S31 is positioned
Suddenly, in spraying high temperature resistant powder in the upper and lower surfaces of the welding unit after stacked positioning to be isolated in welding；
S32 vacuum diffusion welding: the welding unit obtained after positioning is placed in vacuum diffusion bonding furnace and carries out vacuum diffusion bonding
To produce product blank；Welding condition are as follows: 900 DEG C, 20Mpa, 0.015 pa, 24 hours take out after cooling to room temperature with the furnace；
The product shaping includes:
S41 milling: milling shaping is carried out by least part size of the machining center to product blank, it is made more to meet structure
Design requirement；
S42 pickling: milling treated product blank is subjected to pickling to remove the burr that processing generates, obtains final standard
Pallet product.
2. processing method according to claim 1, which is characterized in that dividing each sublayer in the step of product is layered is
What average segmentation or inequality were divided；Average split plot design selected for stainless steel materials, every sublayer with a thickness of 0.5mm；With
Take into account plate preliminary treatment and subsequent machining technology.
3. processing method according to claim 1, which is characterized in that it is to pass through that the S21, which was coated in the step of photoresists,
Spraying is coated with and coats photoresists.
4. processing method according to claim 1, which is characterized in that the S23 develop the step of using positive photoresist development or
Negtive photoresist development.
5. processing method according to claim 1, which is characterized in that use ferric trichloride in the step of S25 is etched
As etching solution, etching condition are as follows: ferric trichloride concentration 2g/cm3, 40 DEG C of etch temperature, 80 μ of etching speed/min, when etching
Between 4 minutes.
6. processing method according to claim 1, which is characterized in that further include in each son in the step of S31 is positioned
The step of several anchor points are welded in layer side.
7. processing method according to claim 1, which is characterized in that the step S21 is coated in the step of photoresists also
Include the steps that wire mark photoresist, by the silk-screen plate for the system of shining then photoresist wire mark will on photosensitive layer
It is placed in baking oven and carries out baking processing；Silk-screen plate uses 300 mesh, baking condition: 130 DEG C, 25min.
8. processing method according to claim 1, which is characterized in that further include baking in the pretreated step of S24
The step of, it places it in oven and is toasted to strengthen the patch between the membrane body and sublayer plate of coating after the completion of sublayer is rinsed
Close effect；Baking condition are as follows: 150 DEG C, 25min.
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| CN201710471589.7A CN107160108B (en) | 2017-06-20 | 2017-06-20 | A kind of processing method and Standard pallet of automation equipment Standard pallet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5046350B2 (en) * | 2001-03-29 | 2012-10-10 | 大日本印刷株式会社 | Manufacturing method of electronic parts adopting wet etching, electronic parts and hard disk suspension |
| CN101410323B (en) * | 2006-01-24 | 2012-11-07 | 迈克罗拉布诊断有限公司 | Stamping methods and devices |
| CN102220583A (en) * | 2011-05-13 | 2011-10-19 | 葛成镇 | Etching process of metal marking plate |
| JP2014189333A (en) * | 2013-03-28 | 2014-10-06 | Jx Nippon Oil & Energy Corp | Sheet pallet |
| CN103397329B (en) * | 2013-07-08 | 2015-11-25 | 浙江工业职业技术学院 | A kind of production technique of stainless steel dot matrix friction plate |
| CN103727706B (en) * | 2013-12-26 | 2015-11-18 | 武汉微冷科技有限公司 | With the integrated micro heat exchanger assembly of dry filter and throttling function |
| CN103759560A (en) * | 2014-02-09 | 2014-04-30 | 武汉微冷科技有限公司 | Micro heat exchanger with small hole throttling function |
| CN103817426A (en) * | 2014-03-13 | 2014-05-28 | 沈阳和世泰通用钛业有限公司 | Production method for titanium steel titanium composite board diffusion welding |
| CN104142087B (en) * | 2014-08-04 | 2015-12-09 | 杨文举 | A kind of manufacturing method of heat sink improving radiator heat efficiency |
| CN105506630B (en) * | 2016-02-06 | 2017-10-24 | 温州佳凯实业有限公司 | A kind of engraving method of stainless steel pallet |
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