CN105448467B - A kind of preparation method of electronic component electrode - Google Patents
A kind of preparation method of electronic component electrode Download PDFInfo
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- CN105448467B CN105448467B CN201510966886.XA CN201510966886A CN105448467B CN 105448467 B CN105448467 B CN 105448467B CN 201510966886 A CN201510966886 A CN 201510966886A CN 105448467 B CN105448467 B CN 105448467B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000839 emulsion Substances 0.000 claims abstract description 55
- 239000011267 electrode slurry Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000007639 printing Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- 229910000859 α-Fe Inorganic materials 0.000 claims description 17
- 239000003960 organic solvent Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 11
- 239000000084 colloidal system Substances 0.000 claims description 10
- 239000012670 alkaline solution Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 210000000481 breast Anatomy 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 49
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003513 alkali Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 235000011266 Passiflora quadrangularis Nutrition 0.000 description 1
- 244000179684 Passiflora quadrangularis Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A kind of preparation method of electronic component electrode, comprises the following steps：1) cast film green tape；2) in the film green tape upper berth emulsion；3) emulsion is exposed using the mask plate for defining electrode pattern；4) emulsion is developed, obtains electrode pattern；5) electrode trenches for making electrode are formed in the film green tape according to the electrode pattern；6) emulsion being layered in the film green tape is removed；7) electrode slurry is filled in the electrode trenches, makes electrode.This method can produce both thick and cross sectional shape side, and the electrode of flush edge, while can also produce electrode thickness and the less exciting coil of line spacing again.
Description
Technical field
The present invention relates to a kind of preparation method of electronic component electrode.
Background technology
In electronic component design process, sometimes because demand in properties of product, need to make sometimes some thickness compared with
Thick electrode, the making of conventional electrode are made by the way of screen painting, due to by half tone latex when printing thick electrode
Be present following defect in the limitation of thickness and various printing conditions, the making of thick electrode, disposably print electrode first not thick；
Secondly mode is thickened using repeatedly printing and that repeated printing contraposition deviation and printing are spread out is present；Again electrode shape by
Half tone and slurry printing characteristic influence, and are spread out after electrode print and semicircular in shape；It can not finally make between i.e. thickness and line
Away from again small exciting coil.
The content of the invention
It is a primary object of the present invention to overcome the deficiencies in the prior art, there is provided a kind of making side of electronic component electrode
Method, solves repeated printing contraposition deviation existing for existing method for making its electrode and problem is spread in printing out, and can also make
Go out electrode thickness and the less exciting coil of line spacing.
To achieve the above object, the present invention uses following technical scheme：
A kind of preparation method of electronic component electrode, comprises the following steps：
1) cast film green tape；
2) in the film green tape upper berth emulsion；
3) emulsion is exposed using the mask plate for defining electrode pattern；
4) emulsion is developed, obtains electrode pattern；
5) electrode trenches for making electrode are formed in the film green tape according to the electrode pattern；
6) emulsion being layered in the film green tape is removed；
7) electrode slurry is filled in the electrode trenches, makes electrode.
Further：
In step 1), the film green tape contains powder and the moulding material for making the powder shaping, the shaping
Material is soluble in the material of organic solvent, acid solution or alkaline solution, it is preferable that the powder for ceramics, ferrite or
Iron powder, the moulding material are high polymer material, it is preferable that the film green tape thickness is more than 50 μm.
In step 2), the emulsion is positivity or negative-working photoresist；When the emulsion is negative photoresist, exposure
Part colloid solidification, is resistant to the immersion of organic solvent, acidity or weakly alkaline solution and does not dissolve or corrode, unexposed portion can
To be dissolved by the solution or be corroded and remove；When the photoresists are positive photoresist, exposed portion colloid decomposes, can be organic
Solvent, acidity or weakly alkaline solution dissolving or corrosion and remove, unexposed portion can be resistant to the immersion of the solution and insoluble
Solution or corrosion.
In step 3), the electrode pattern of the mask plate selects printing opacity according to emulsion for positivity or negativity
It is or light tight, it is preferable that electrode width defined in the electrode pattern is more than 50 μm, the light source ripple of the exposure machine transmitting
A length of 365nm.
Uncured part emulsion is dissolved and rinsed well with developer solution in step 4), the institute exposed
The pattern for stating film green tape is electrode pattern.
The electrode trenches for making electrode are formed in the film green tape with the mode of etching in step 5), preferably
Ground, the moulding material of the film green tape can be dissolved or corroded using etching liquid, but it is not molten to the emulsion after solidification
Solution or corrosiveness, it is preferable that the etching liquid is the organic solvent that can dissolve the colloid in the film green tape, preferably
Ground, the electrode trenches depth are more than 50 μm.
In step 6), remaining emulsion is removed using liquid parting, it is preferable that the liquid parting is strong alkali solution.
In step 7), the electrode slurry, the electrode slurry are filled to the electrode trenches using half-tone screen printing method
For the electrode slurry suitable for screen painting, it is preferable that the electrode slurry is that silver paste or copper are starched.
The electronic component is chip-type laminated electronic component.
The electrode made is that width is more than 50 μm, and thickness is more than 50 μm, and cross sectional shape is rectangle (including square generally
Shape) electrode.
Beneficial effects of the present invention：
Using the method for making its electrode of the present invention, it is possible to prevente effectively from repeatability printing existing for existing method for making its electrode
Contraposition deviation and printing the problem of spreading out, both thick and cross sectional shape side, and the electrode of flush edge can be produced, simultaneously
Also it can produce that electrode is again thick and the less exciting coil of line spacing, so as to meet various products performance to a greater extent
Requirement to electrode.
In concrete scheme, electrode pattern is drawn by way of emulsion exposure development is used in film green tape, electricity
It is uncured when emulsion is because of exposure at pole figure case to be dissolved by the developing removal, exposed film green tape, organic solvent is subsequently used again
Film green tape at this is dissolved, etches electrode trenches, then electricity is finally completed toward silver paste is filled in groove by screen painting mode
The making of pole.Electrode, especially thick electrode are made compared to traditional screen printing process, using this manufacture craft, thickness of electrode is by thin
Film green tape thickness determines that film green tape can disposably be cast thicker degree, and electrode sections pattern is determined by groove shape, pass through
The groove shape formed is etched substantially close to square, while slot wedge is also neat smooth so that the thickness of electrode finally made
Both thick, side, electrode edge are neatly smooth again for cross sectional shape.
Embodiment
Embodiments of the present invention are elaborated below.It is emphasized that what the description below was merely exemplary,
The scope being not intended to be limiting of the invention and its application.
In one embodiment, a kind of preparation method of electronic component electrode, comprises the following steps：
1) cast film green tape；
2) in the film green tape upper berth emulsion；
3) using the mask plate for defining electrode pattern, the emulsion is exposed using exposure machine；
4) emulsion is developed, obtains electrode pattern；
5) electrode trenches for making electrode are formed in the film green tape according to the electrode pattern；
6) emulsion being layered in the film green tape is removed；
7) electrode slurry is filled in the electrode trenches, makes electrode.
In a preferred embodiment, in step 1), the film green tape contains powder and for making the powder shaping
Moulding material, the moulding material are soluble in the material of organic solvent, acid solution or alkaline solution.The powder can be
Ceramics, ferrite or iron powder etc. can be used for the powder for making film green tape, and the moulding material can be formed for high polymer material
Colloid.It is highly preferred that the film green tape thickness is more than 50 μm.Specifically it can also be carried out according to be made thickness of electrode requirement
Curtain coating.
, can be by the way of spin coating in film green tape upper berth emulsion in step 2).Spin coating can make emulsion equal
Even is laid in film green tape.The thickness that can be laid in by adjusting adjustment of rotational speed emulsion in film green tape.
In certain embodiments, the emulsion can be positivity or negative-working photoresist.The emulsion is negative
Property glue when, the solidification of exposed portion colloid, be resistant to organic solvent, acidity or weakly alkaline solution immersion and insoluble or corrosion,
Unexposed portion can be dissolved by the solution or erosion removal.When the photoresists are positive photoresist, exposed portion colloid decomposes,
It can be dissolved by organic solvent, acidity or weakly alkaline solution or corrode and remove, unexposed portion can be resistant to organic solvent, acid
Property or weakly alkaline solution immersion and insoluble or corrosion.
In a preferred embodiment, in step 3), the electrode pattern of the mask plate is positivity according to emulsion
Either negativity and select printing opacity or light tight, if positivity then electrode pattern printing opacity, if negativity, then electrode pattern is not
Printing opacity.It is preferred that electrode width defined in the electrode pattern is more than 50 μm, the optical source wavelength of the exposure machine transmitting is
365nm。
In a preferred embodiment, exposed good film green tape is positioned in developing machine in step 4), with development
Liquid is dissolved and rinsed well to uncured part emulsion, and the pattern of the film green tape exposed is electricity
Pole figure case.
In a preferred embodiment, formed in step 5) with the mode of etching in the film green tape for making electrode
Electrode trenches, it is preferable that can dissolve or corrode the moulding material of the film green tape using etching liquid, but to solidification after
Emulsion does not dissolve or corrosiveness.Preferably, the etching liquid is that can dissolve the colloid in the film green tape
Organic solvent.
Preferably, the electrode trenches depth is more than 50 μm.In addition, electrode trenches depth also can be according to film green tape thickness
It is adjusted.
In a preferred embodiment, in step 6), remaining emulsion is removed using liquid parting.The liquid parting is preferred
For strong alkali solution.
In a preferred embodiment, in step 7), the electrode trenches can be filled using traditional half-tone screen printing method
The electrode slurry, the electrode slurry can be the various electrode slurrys suitable for screen painting such as silver paste, copper slurry.
Typically, the electronic component is chip-type laminated electronic component.The film for completing electrode fabrication can be given birth to
Band layer stackup swaging is sequentially completed the processes such as cutting, chamfering, dumping, sintering into green compact, then to the green compact, is finally completed electronics
The making of component.
It is preferred that the electrode that a kind of embodiment is made, which is width, is more than 50 μm, thickness is more than 50 μm, and cross sectional shape is rectangle
The electrode of (including rectangle generally).
The remarkable advantage of this method for making its electrode has：It is both thick to produce thickness, cross sectional shape and side, the electricity of flush edge
Pole, while electrode thickness again, the less exciting coil of line spacing can also be produced.
It is further described below by way of more specifically embodiment.
Embodiment one
The paster ferrite power inductance thick electrode preparation method that a kind of metric system 2016 encapsulates, comprises the following steps：Curtain coating
Ferrite film green tape, in film green tape upper berth emulsion, emulsion is exposed, emulsion is developed,
Electrode trenches are etched, remove emulsion, electrode slurry is filled in electrode trenches, green tape lamination forms green compact, and green compact are carried out
Cutting, chamfering, dumping, sintering, silver is stained with, silver ink firing, plating, is finally completed the making of device.
This implementation power inductance electrode pattern line width designs 200 μm, thick 90 μm of the design of line.
1st, cast film green tape：
11) ferrite powder is used, resin and organic solvent make slurry and be cast ferrite film on a pet film
Green tape.
12) ferrite film green tape thickness is 90 μm ± 3 μm.
2nd, in ferrite film green tape upper berth emulsion：
21) absorption of ferrite film green tape is added into negative photosensitive emulsion on rotatable flat board in film green tape,
The emulsion is water soluble light-sensitive emulsion.
22) adjustment rotary rpm is 2000 turns/min, and rotational time 0.5min, emulsion thickness control is 20 μm
±1μm。
3rd, emulsion is exposed：
31) mask plate electrode pattern line width designs 200 μm, and electrode pattern is light tight.
32) the ferrite film green tape for the emulsion that tiled is positioned in exposure machine and mask plate is covered in sense
On X-ray emulsion X layer.
33) exposure light source wavelength 365nm, energy 150mj/cm2,30 seconds time for exposure.
4th, emulsion is developed：
41) the ferrite film green tape after exposure is put into the tank for fill water and developed, 30 seconds standing times.
42) emulsion for residual of developing is entered to clean up by the film green tape hydraulic giant being immersed in water.
5th, electrode trenches etch：Organic solvent is vertically rinsed to the ferrite film green tape developed, treated at electrode pattern
Ferrite film green tape removes completely.
6th, emulsion is removed.
61) strong alkali solution, PH=12 are prepared.
62) ferrite film green tape is put into solution to be soaked, soak time 30 seconds.
63) the film green tape hydraulic giant soaked is cleaned up the emulsion remained in green tape.
7th, electrode slurry is filled in electrode trenches.
71) electrode slurry is the silver paste of 85% solid content.
72) half tone is made using 200 mesh grenadines, 70 μm of emulsion thickness.
72) silver paste is inserted in electrode trenches by screen painting using printing machine.
Present embodiment electrode pattern is made using traditional screen printing process, can only at most be accomplished by one-step print thickness
60 μm of limitation, it is necessary to print twice, and printing twice has contraposition and forbidden, and printing is easily spread out, and line width variation is big, causes inductance
Accuracy of measurement difference qualification rate is low.Electrode burrs are more simultaneously, and electrode shape irregularly causes product Q values and other performance by shadow
Ring.
Using Fabrication Technology of Electrode of the present invention, thickness of electrode can disposably do thickness, and electrode edge is smooth neat, line
The wide line thickness uniformity is good, and the electrical qualification rate of product is high, and performance is highly improved.
Embodiment two
The paster iron powder power inductance thick electrode preparation method that a kind of metric system 2016 encapsulates, with embodiment one.Area
It is not：Film green tape material is changed into iron powder from ferrite, and electrode pattern line width designs 250 μm, 80 μm of thickness, using this patent
Fabrication Technology of Electrode, product saturation current and rated current are obviously improved compared with having than traditional screen printing process.
Embodiment three
The paster high current magnetic bead thick electrode preparation method that a kind of metric system 1608 encapsulates, with embodiment one.Difference
It is：Film green tape material is changed into iron powder from ferrite, and electrode pattern line width designs 100 μm, 70 μm of thickness, using this patent electricity
Pole manufacture craft can reduce the product caused by electrode print is spread out and stay side to reduce, and cut leakage problem, while can dash forward
The limit of broken typography, 50 μ m thicks can not be made with Top electrode when printing 100 μm so that product is ensureing the same of impedance
When, D.C. resistance is further reduced.
Above content is to combine specific/preferred embodiment further description made for the present invention, it is impossible to is recognized
The specific implementation of the fixed present invention is confined to these explanations.For general technical staff of the technical field of the invention,
Without departing from the inventive concept of the premise, it can also make some replacements or modification to the embodiment that these have been described,
And these are substituted or variant should all be considered as belonging to protection scope of the present invention.
Claims (11)
1. a kind of preparation method of electronic component electrode, it is characterised in that comprise the following steps：
1) cast film green tape, the film green tape contain powder and the moulding material for making the powder shaping, the powder
Expect to be soluble in the material of organic solvent, acid solution or alkaline solution for ceramics, ferrite or iron powder, the moulding material；
2) in the film green tape upper berth emulsion；
3) emulsion is exposed using the mask plate for defining electrode pattern；
4) emulsion is developed, obtains electrode pattern, wherein with developer solution to the uncured photosensitive breast of part
Agent is dissolved and rinsed well, and the pattern of the film green tape exposed is electrode pattern；
5) electrode trenches for making electrode are formed in the film green tape according to the electrode pattern, wherein with etching
Mode forms the electrode trenches for making electrode in the film green tape, can be dissolved or corroded described thin using etching liquid
The moulding material of film green tape, but there is no dissolving or corrosiveness to the emulsion after solidification；
6) emulsion being layered in the film green tape is removed；
7) electrode slurry is filled in the electrode trenches, makes the electrode that Cross Section Morphology is determined by the electrode trenches shape.
2. the preparation method of electronic component electrode as claimed in claim 1, it is characterised in that the moulding material is high score
Sub- material.
3. the preparation method of electronic component electrode as claimed in claim 2, it is characterised in that the film green tape thickness is big
In 50 μm.
4. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that in step 2),
The emulsion is positivity or negative-working photoresist；When the emulsion is negative photoresist, the solidification of exposed portion colloid, it is resistant to
By the immersion of organic solvent, acidity or weakly alkaline solution, insoluble or corrosion, unexposed portion can be dissolved by the solution
Or corrode and remove；When the photoresists are positive photoresist, exposed portion colloid decomposes, can be by organic solvent, acidity or weak base
Property solution dissolving or corrosion and removes, unexposed portion can be resistant to the immersion of the solution and insoluble or corrode.
5. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that in step 3),
According to emulsion, for positivity, either negativity selects printing opacity or light tight to the electrode pattern of the mask plate.
6. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that the etching
Liquid is the organic solvent that can dissolve the colloid in the film green tape.
7. the preparation method of electronic component electrode as claimed in claim 6, it is characterised in that the electrode trenches depth is big
In 50 μm.
8. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that in step 6),
Remaining emulsion is removed using liquid parting.
9. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that in step 7),
The electrode slurry is filled to the electrode trenches using half-tone screen printing method, the electrode slurry is the electricity suitable for screen painting
Pole slurry.
10. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that the electronics
Component is chip-type laminated electronic component.
11. the preparation method of the electronic component electrode as described in any one of claims 1 to 3, it is characterised in that the electricity made
Pole is that width is more than 50 μm, and thickness is more than 50 μm, and cross sectional shape is the electrode of rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510966886.XA CN105448467B (en) | 2015-12-21 | 2015-12-21 | A kind of preparation method of electronic component electrode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510966886.XA CN105448467B (en) | 2015-12-21 | 2015-12-21 | A kind of preparation method of electronic component electrode |
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| CN105448467A CN105448467A (en) | 2016-03-30 |
| CN105448467B true CN105448467B (en) | 2017-12-29 |
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| CN106004074B (en) * | 2016-05-24 | 2017-08-29 | 山东华菱电子股份有限公司 | A kind of manufacture method of thermal printing head heating base plate |
| CN106783120B (en) * | 2016-12-13 | 2018-03-27 | 深圳顺络电子股份有限公司 | The preparation method and electronic component of a kind of electrodes of electronic components |
| CN110859026A (en) * | 2018-08-24 | 2020-03-03 | 绵阳市奇帆科技有限公司 | Manufacturing method for manufacturing LED circuit board electrode by printing process |
| CN112103059B (en) | 2020-09-15 | 2022-02-22 | 横店集团东磁股份有限公司 | Manufacturing method of thin film power inductor and thin film power inductor |
| CN114388260A (en) * | 2021-12-21 | 2022-04-22 | 广东风华高新科技股份有限公司 | Method for manufacturing electrode of component |
| CN115894083B (en) * | 2022-07-29 | 2024-04-09 | 广东环波新材料有限责任公司 | Preparation method and application of negative photosensitive type black electronic device |
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| JPH056832A (en) * | 1991-06-28 | 1993-01-14 | Toshiba Corp | Manufacture of flat coil |
| JP4577479B2 (en) * | 2003-04-15 | 2010-11-10 | Ｔｄｋ株式会社 | Sheet forming method having different material parts and sheet having different material parts used for multilayer wiring board formation |
| CN101640174B (en) * | 2008-07-31 | 2011-08-24 | 中芯国际集成电路制造(北京)有限公司 | Method for etching semiconductor structure and method for forming metal interconnection layer |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
| CN103395307B (en) * | 2013-07-29 | 2015-09-09 | 电子科技大学 | A kind of preparation method of internal electrode of chip-type electronic component |
| CN103606450B (en) * | 2013-11-26 | 2016-03-09 | 深圳顺络电子股份有限公司 | A kind of manufacture method of stack coil device |
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