CN105448467A - Manufacturing method of electronic part and component electrode - Google Patents
Manufacturing method of electronic part and component electrode Download PDFInfo
- Publication number
- CN105448467A CN105448467A CN201510966886.XA CN201510966886A CN105448467A CN 105448467 A CN105448467 A CN 105448467A CN 201510966886 A CN201510966886 A CN 201510966886A CN 105448467 A CN105448467 A CN 105448467A
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- China
- Prior art keywords
- electrode
- emulsion
- green tape
- electronic devices
- film green
- Prior art date
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000839 emulsion Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000011267 electrode slurry Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 20
- 238000007639 printing Methods 0.000 claims description 19
- 229910000859 α-Fe Inorganic materials 0.000 claims description 17
- 239000003960 organic solvent Substances 0.000 claims description 16
- 239000000243 solution Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 11
- 239000012670 alkaline solution Substances 0.000 claims description 10
- 239000000084 colloidal system Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 238000005266 casting Methods 0.000 abstract 1
- 238000013461 design Methods 0.000 description 5
- 238000007766 curtain coating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 235000011266 Passiflora quadrangularis Nutrition 0.000 description 1
- 244000179684 Passiflora quadrangularis Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
A manufacturing method of an electronic part and component electrode, comprising following steps: 1) casting film raw band; 2), laying sensitive emulsion on the film raw band; 3) exposing the sensitive emulsion by a mask with defined electrode pattern; 4) developing the sensitive emulsion, obtaining the electrode pattern; 5) forming an electrode groove for manufacturing the electrode on the film raw band according to the electrode pattern; 6) removing the sensitive emulsion laid on the film raw band; 7) filling electrode slurry in the electrode groove, manufacturing the electrode. The electrode manufactured by the method is thick, the cross-section shape is square, the edge is flat, and simultaneously the method can manufacture a spiral coil with thick electrode and relatively little distance between centers of lines.
Description
Technical field
The present invention relates to a kind of manufacture method of electronic devices and components electrode.
Background technology
In electronic devices and components design process, sometimes because the demand in properties of product, sometimes need to make the thicker electrode of some thickness, the making of electrode in the past adopts the mode of screen painting to make, due to the restriction by half tone emulsion thickness and various printing condition during printing thick electrode, there is following defect in the making of thick electrode, first disposable print electrode not thick; Secondly adopt repeatedly printing to thicken mode and there is repeated printing contraposition deviation and problem is spread in printing out; Electrode shape affects by half tone and slurry printing characteristic again, spreads out and semicircular in shape after electrode print; Finally cannot make i.e. thick and distance between centers of tracks but also little exciting coil.
Summary of the invention
Main purpose of the present invention is to overcome the deficiencies in the prior art, a kind of manufacture method of electronic devices and components electrode is provided, solve repeated printing contraposition deviation that existing method for making its electrode exists and problem is spread in printing out, and the thick and exciting coil that distance between centers of tracks is less of electrode can also be produced.
For achieving the above object, the present invention is by the following technical solutions:
A manufacture method for electronic devices and components electrode, comprises the following steps:
1) cast film green tape;
2) at described film green tape upper berth emulsion;
3) mask plate defining electrode pattern is adopted to expose described emulsion;
4) described emulsion is developed, obtain electrode pattern;
5) in described film green tape, the electrode trenches for making electrode is formed according to described electrode pattern;
6) the described emulsion be layered in described film green tape is removed;
7) in described electrode trenches, fill electrode slurry, make electrode.
Further:
Step 1) in, described film green tape contains powder and the moulding material for making described powder shaping, described moulding material is the material dissolving in organic solvent, acid solution or alkaline solution, preferably, described powder is pottery, ferrite or iron powder, described moulding material is macromolecular material, and preferably, described film green tape thickness is greater than 50 μm.
Step 2) in, described emulsion is positivity or negative-working photoresist; When described emulsion is negative photoresist, exposed portion colloid solidifies, and ability is not dissolved by the immersion of organic solvent, acidity or weakly alkaline solution or corrodes, and unexposed portion can be removed by described solubilize or corrosion; When described photoresists are positive photoresist, exposed portion colloid decomposes, and can be dissolved by organic solvent, acidity or weakly alkaline solution or corrode and remove, unexposed portion can tolerate the immersion of described solution and do not dissolve or corrode.
Step 3) in, the described electrode pattern of described mask plate is that positivity or negativity select printing opacity or light tight according to emulsion, preferably, the electrode width that described electrode pattern defines is greater than 50 μm, and the optical source wavelength that described exposure machine is launched is 365nm.
Step 4) in developer solution, uncured part emulsion is dissolved and is rinsed well, the pattern of the described film green tape exposed is electrode pattern.
Step 5) mode of middle etching forms electrode trenches for making electrode in described film green tape, preferably, adopt etching liquid can dissolve or corrode the moulding material of described film green tape, but the emulsion after solidification is not dissolved or corrosiveness, preferably, described etching liquid is the organic solvent of the colloid that can dissolve in described film green tape, and preferably, the described electrode trenches degree of depth is greater than 50 μm.
Step 6) in, adopt liquid parting to remove remaining emulsion, preferably, described liquid parting is strong alkali solution.
Step 7) in, adopt half-tone screen printing method to fill described electrode slurry to described electrode trenches, described electrode slurry is the electrode slurry being suitable for screen painting, and preferably, described electrode slurry is silver slurry or copper slurry.
Described electronic devices and components are chip-type laminated electronic devices and components.
The electrode made is that width is greater than 50 μm, and thickness is greater than 50 μm, and cross sectional shape is the electrode of rectangle (comprising rectangle substantially).
Beneficial effect of the present invention:
Adopt method for making its electrode of the present invention, the problem that the repeated printing contraposition deviation effectively can avoiding existing method for making its electrode problem and printing are spread out, both thick and cross sectional shape side can be produced, and the electrode of flush edge, also can produce the thick again and exciting coil that distance between centers of tracks is less of electrode simultaneously, thus meet the requirement of various properties of product to electrode to a greater extent.
In concrete scheme, electrode pattern is drawn by the mode adopting emulsion exposure to develop in film green tape, electrode pattern place emulsion is dissolved by the developing removal because of uncured during exposure, exposed film green tape, follow-up again by this place's film green tape of organic solvent dissolution, etch electrode trenches, then in groove, fill silver slurry by screen painting mode, finally complete the making of electrode.Compare traditional screen printing process and make electrode, especially thick electrode, adopt this manufacture craft, thickness of electrode is determined by film green tape thickness, and film green tape is disposable can the thicker degree of curtain coating, and electrode sections pattern is determined by groove shape, the groove shape formed by etching is basic close to square, while slot wedge also neatly smooth, make the thickness of electrode finally made both thick, cross sectional shape is side again, and electrode edge is neatly smooth.
Embodiment
Below embodiments of the present invention are elaborated.It is emphasized that following explanation is only exemplary, instead of in order to limit the scope of the invention and apply.
In one embodiment, a kind of manufacture method of electronic devices and components electrode, comprises the following steps:
1) cast film green tape;
2) at described film green tape upper berth emulsion;
3) adopt the mask plate defining electrode pattern, use exposure machine to expose described emulsion;
4) described emulsion is developed, obtain electrode pattern;
5) in described film green tape, the electrode trenches for making electrode is formed according to described electrode pattern;
6) the described emulsion be layered in described film green tape is removed;
7) in described electrode trenches, fill electrode slurry, make electrode.
In a preferred embodiment, step 1) in, described film green tape contains powder and the moulding material for making described powder shaping, and described moulding material is the material dissolving in organic solvent, acid solution or alkaline solution.Described powder can be used for for pottery, ferrite or iron powder etc. the powder making film green tape, the colloid that described moulding material can be formed for macromolecular material.More preferably, described film green tape thickness is greater than 50 μm.Specifically also can carry out curtain coating according to making thickness of electrode requirement.
Step 2) in, the mode of spin coating can be adopted at film green tape upper berth emulsion.Spin coating can make emulsion be laid in uniformly in film green tape.The thickness in film green tape can be laid in by adjustment adjustment of rotational speed emulsion.
In certain embodiments, described emulsion can be positivity or negative-working photoresist.When described emulsion is negative photoresist, exposed portion colloid solidifies, and ability is not dissolved by the immersion of organic solvent, acidity or weakly alkaline solution or corrodes, and unexposed portion can by described solubilize or erosion removal.When described photoresists are positive photoresist, exposed portion colloid decomposes, and can be dissolved by organic solvent, acidity or weakly alkaline solution or corrode and remove, unexposed portion can tolerate the immersion of organic solvent, acidity or weakly alkaline solution and do not dissolve or corrode.
In a preferred embodiment, step 3) in, the described electrode pattern of described mask plate is that positivity or negativity select printing opacity or light tight according to emulsion, if be positivity, electrode pattern printing opacity, if be negativity, electrode pattern is light tight.Preferably, the electrode width that described electrode pattern defines is greater than 50 μm, and the optical source wavelength that described exposure machine is launched is 365nm.
In a preferred embodiment, step 4) in the film green tape exposed is positioned in developing machine, dissolve with developer solution uncured part emulsion and rinse well, the pattern of the described film green tape exposed is electrode pattern.
In a preferred embodiment, step 5) mode of middle etching forms electrode trenches for making electrode in described film green tape, preferably, adopt etching liquid can dissolve or corrode the moulding material of described film green tape, but the emulsion after solidification is not dissolved or corrosiveness.Preferably, described etching liquid is the organic solvent of the colloid that can dissolve in described film green tape.
Preferably, the described electrode trenches degree of depth is greater than 50 μm.In addition, the electrode trenches degree of depth also can adjust according to film green tape thickness.
In a preferred embodiment, step 6) in, adopt liquid parting to remove remaining emulsion.Described liquid parting is preferably strong alkali solution.
In a preferred embodiment, step 7) in, traditional half-tone screen printing method can be adopted to fill described electrode slurry to described electrode trenches, and described electrode slurry can be the various electrode slurrys being suitable for screen painting such as such as silver slurry, copper slurry.
Typically, described electronic devices and components are chip-type laminated electronic devices and components.The film green tape completing electrode fabrication can be laminated formation green compact layer by layer, then the operations such as cutting, chamfering, binder removal, sintering are completed successively to described green compact, finally complete the making of electronic devices and components.
Preferably, the electrode that a kind of embodiment is made is that width is greater than 50 μm, and thickness is greater than 50 μm, and cross sectional shape is the electrode of rectangle (comprising rectangle substantially).
The remarkable advantage of this method for making its electrode has: produce thickness both thick, and cross sectional shape is side again, the electrode of flush edge, also can produce electrode thick again, the exciting coil that distance between centers of tracks is less simultaneously.
Be further described below by way of embodiment more specifically.
Embodiment one
The paster ferrite power inductance thick electrode manufacture method that metric system 2016 encapsulates, comprises the following steps: curtain coating ferrite film green tape, at film green tape upper berth emulsion, emulsion is exposed, emulsion is developed, etching electrode trenches, remove emulsion, in electrode trenches, fill electrode slurry, green tape lamination forms green compact, green compact cut, chamfering, binder removal, sintering, is stained with silver, silver ink firing, plating, finally completes the making of device.
This enforcement power inductance electrode pattern live width designs 200 μm, the thick design of line 90 μm.
1, cast film green tape:
11) adopt ferrite powder, resin and organic solvent make slurry and curtain coating ferrite film green tape on a pet film.
12) ferrite film green tape thickness is 90 μm ± 3 μm.
2, at ferrite film green tape upper berth emulsion:
21) be adsorbed on rotatable flat board by ferrite film green tape, film green tape is added negative photosensitive emulsion, this emulsion is water soluble light-sensitive emulsion.
22) adjusting rotary rpm is 2000 turns/min, and rotational time is 0.5min, and emulsion THICKNESS CONTROL is 20 μm ± 1 μm.
3, emulsion is exposed:
31) mask plate electrode pattern live width designs 200 μm, and electrode pattern is light tight.
32) the ferrite film green tape of the emulsion that tiles to be positioned in exposure machine and mask plate is covered on sensitive emulsion layer.
33) exposure light source wavelength 365nm, energy is 150mj/cm2,30 seconds time for exposure.
4, emulsion is developed:
41) the ferrite film green tape after exposure is put into the tank filling water to develop, 30 seconds standing times.
42) emulsion that development is residual is entered to clean up by the film green tape hydraulic giant be immersed in water.
5, electrode trenches etching: organic solvent is vertically rinsed the ferrite film green tape of having developed, treat that electrode pattern place ferrite film green tape is removed completely.
6, emulsion is removed.
61) strong alkali solution is prepared, PH=12.
62) ferrite film green tape is put into solution to soak, soak time 30 seconds.
63) emulsion remained in green tape is cleaned up by the film green tape hydraulic giant soaked.
7, in electrode trenches, electrode slurry is filled.
71) electrode slurry is the silver slurry of 85% solid content.
72) half tone adopts 200 order grenadines to make, emulsion thickness 70 μm.
72) printing machine is adopted to be inserted in electrode trenches by screen painting by silver slurry.
Adopt traditional screen printing process to make present embodiment electrode pattern, the restriction of 60 μm can only be accomplished at most by one-step print thickness, need twice printing, there is contraposition and forbidden in twice printing, printing is easily spread out, and line width variation is large, causes inductance value low precision qualification rate low.Electrode burrs is more simultaneously, and irregular product Q value and other performance of causing of electrode shape is affected.
Adopt Fabrication Technology of Electrode of the present invention, thickness of electrode can disposablely do thick, and electrode edge is neatly smooth, and the thick consistency of live width line is good, and the electrical qualification rate of product is high, and performance is highly improved.
Embodiment two
The paster iron powder power inductance thick electrode manufacture method that metric system 2016 encapsulates, with embodiment one.Difference is: film green tape material becomes iron powder from ferrite, and electrode pattern live width designs 250 μm, thickness 80 μm, and adopt this patent Fabrication Technology of Electrode, product saturation current and rated current have comparatively had obvious lifting than traditional screen printing process.
Embodiment three
The paster big current magnetic bead thick electrode manufacture method that metric system 1608 encapsulates, with embodiment one.Difference is: film green tape material becomes iron powder from ferrite, electrode pattern live width designs 100 μm, thickness 70 μm, adopt this patent Fabrication Technology of Electrode to reduce to spread due to electrode print the product caused out and stay limit to reduce, cut leakage problem, the limit of typography can be broken through simultaneously, 50 μm of thickness cannot be made when printing 100 μm with top electrode, make product while guarantee impedance, D.C. resistance is further reduced.
Above content combines concrete/preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; its execution mode that can also describe these makes some substituting or modification, and these substitute or variant all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a manufacture method for electronic devices and components electrode, is characterized in that, comprises the following steps:
1) cast film green tape;
2) at described film green tape upper berth emulsion;
3) mask plate defining electrode pattern is adopted to expose described emulsion;
4) described emulsion is developed, obtain electrode pattern;
5) in described film green tape, the electrode trenches for making electrode is formed according to described electrode pattern;
6) the described emulsion be layered in described film green tape is removed;
7) in described electrode trenches, fill electrode slurry, make electrode.
2. the manufacture method of electronic devices and components electrode as claimed in claim 1, it is characterized in that, step 1) in, described film green tape contains powder and the moulding material for making described powder shaping, and described moulding material is the material dissolving in organic solvent, acid solution or alkaline solution, preferably, described powder is pottery, ferrite or iron powder, described moulding material is macromolecular material, and preferably, described film green tape thickness is greater than 50 μm.
3. the manufacture method of electronic devices and components electrode as claimed in claim 1 or 2, is characterized in that, step 2) in, described emulsion is positivity or negative-working photoresist; When described emulsion is negative photoresist, exposed portion colloid solidifies, and ability is not dissolved by the immersion of organic solvent, acidity or weakly alkaline solution or corrodes, and unexposed portion can be removed by described solubilize or corrosion; When described photoresists are positive photoresist, exposed portion colloid decomposes, and can be dissolved by organic solvent, acidity or weakly alkaline solution or corrode and remove, unexposed portion can tolerate the immersion of described solution and do not dissolve or corrode.
4. the manufacture method of the electronic devices and components electrode as described in any one of claims 1 to 3, it is characterized in that, step 3) in, the described electrode pattern of described mask plate is that positivity or negativity select printing opacity or light tight according to emulsion, preferably, the electrode width that described electrode pattern defines is greater than 50 μm, and the optical source wavelength that described exposure machine is launched is 365nm.
5. the manufacture method of the electronic devices and components electrode as described in any one of Claims 1-4, it is characterized in that, step 4) in developer solution, uncured part emulsion is dissolved and is rinsed well, the pattern of the described film green tape exposed is electrode pattern.
6. the manufacture method of the electronic devices and components electrode as described in any one of claim 1 to 5, it is characterized in that, step 5) mode of middle etching forms electrode trenches for making electrode in described film green tape, preferably, adopt etching liquid can dissolve or corrode the moulding material of described film green tape, but the emulsion after solidification is not dissolved or corrosiveness, preferably, described etching liquid is the organic solvent of the colloid that can dissolve in described film green tape, preferably, the described electrode trenches degree of depth is greater than 50 μm.
7. the manufacture method of the electronic devices and components electrode as described in any one of claim 1 to 6, is characterized in that, step 6) in, adopt liquid parting to remove remaining emulsion, preferably, described liquid parting is strong alkali solution.
8. the manufacture method of the electronic devices and components electrode as described in any one of claim 1 to 7, it is characterized in that, step 7) in, half-tone screen printing method is adopted to fill described electrode slurry to described electrode trenches, described electrode slurry is the electrode slurry being suitable for screen painting, preferably, described electrode slurry is silver slurry or copper slurry.
9. the manufacture method of the electronic devices and components electrode as described in any one of claim 1 to 8, is characterized in that, described electronic devices and components are chip-type laminated electronic devices and components.
10. the manufacture method of the electronic devices and components electrode as described in any one of claim 1 to 9, is characterized in that, the electrode made is that width is greater than 50 μm, and thickness is greater than 50 μm, and cross sectional shape is the electrode of rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510966886.XA CN105448467B (en) | 2015-12-21 | 2015-12-21 | A kind of preparation method of electronic component electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510966886.XA CN105448467B (en) | 2015-12-21 | 2015-12-21 | A kind of preparation method of electronic component electrode |
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| CN105448467A true CN105448467A (en) | 2016-03-30 |
| CN105448467B CN105448467B (en) | 2017-12-29 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106004074A (en) * | 2016-05-24 | 2016-10-12 | 山东华菱电子股份有限公司 | Manufacturing method of heating substrate for heat-sensitive printing head |
| CN106783120A (en) * | 2016-12-13 | 2017-05-31 | 深圳顺络电子股份有限公司 | The preparation method and electronic component of a kind of electrodes of electronic components |
| CN110859026A (en) * | 2018-08-24 | 2020-03-03 | 绵阳市奇帆科技有限公司 | Manufacturing method for manufacturing LED circuit board electrode by printing process |
| CN112103059A (en) * | 2020-09-15 | 2020-12-18 | 横店集团东磁股份有限公司 | Manufacturing method of thin film power inductor and thin film power inductor |
| CN114388260A (en) * | 2021-12-21 | 2022-04-22 | 广东风华高新科技股份有限公司 | Method for manufacturing electrode of component |
| CN115894083A (en) * | 2022-07-29 | 2023-04-04 | 广东环波新材料有限责任公司 | Preparation method and application of negative photosensitive black electronic device |
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