CN103606450A - Laminated-coil-type device manufacturing method - Google Patents
Laminated-coil-type device manufacturing method Download PDFInfo
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- CN103606450A CN103606450A CN201310616066.9A CN201310616066A CN103606450A CN 103606450 A CN103606450 A CN 103606450A CN 201310616066 A CN201310616066 A CN 201310616066A CN 103606450 A CN103606450 A CN 103606450A
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Abstract
Disclosed is a laminated-coil-type device manufacturing method. The method includes: 1), making a ceramic insulating layer sheet; 2), making part of the ceramic insulating layer sheet into a ceramic insulating layer sheet with an electroconductive through hole; 3), arranging a coil conductor on the ceramic insulating layer sheet to form a coil layer sheet with the coil conductor; 4), sequentially cutting off the ceramic insulating layer sheet and the coil layer sheet in a laminated manner to be in unit size so as to form a laminated body. In the step 3), a photoetching method is adopted to form a coil-shaped groove at a position where the ceramic insulating layer sheet is arranged, electroconductive colloid is filled in the coil-shaped groove to form an internal electrode, and thickness of the electroconductive colloid is equal to or slightly larger than depth of the groove. By the method, the shape of the groove of the formed electrode can be improved, and manufacturing efficiency can be improved substantially.
Description
Technical field
The present invention relates to a kind of manufacture method of stack coil device.
Background technology
Laminated power coil type device comprises the large electric current magnetic bead of lamination, lamination power inductance and lamination power-type transformer etc.Due to laminated power coil type device have reliability high, be easy to produce in enormous quantities, be easy to the advantages such as miniaturization and slimming, be widely used in the power circuit of various portable product.To laminated power coil type device, while requiring it to adopt certain ceramic material, at reduced size, especially, compared with realizing larger impedance or inductance value in the product space of minimal thickness, special requirement product has extremely low D.C. resistance can bear large electric current.Making coil electrode cross section not only narrow but also thick is to make laminated power coil type device reach the most effectual way of above-mentioned target.In order to make lamination power-type coil component, Chinese patent application 102592817A has introduced the coil electrode method that realizes of two kinds of trench technique, and the one, the method for employing silk screen printing, the 2nd, the method for employing laser ablation.Method for adopting silk screen printing, is limited to silk-screen printing technique, and the shape of groove is difficult to be guaranteed, and the degree of depth of groove and width range narrower.For the method that adopts laser ablation, because needing pattern one by one, laser ablation carries out, and efficiency is affected.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of manufacture method of stack coil device is provided, improve the degree of depth and the width of the groove that forms electrode and improve make efficiency.
For achieving the above object, the present invention is by the following technical solutions:
A manufacture method for stack coil device, comprises the following steps:
1) make ceramic insulating layer thin slice;
2) part ceramic insulating layer thin slice is made to the ceramic insulating layer thin slice with conductive through hole;
3) on described ceramics insulator thin slice, coil-conductor is set, forms the coil layer thin slice of belt coil conductor;
4) by the coil layer thin slice of described ceramic insulating layer thin slice and described belt coil conductor in order lamination cut off and to make to form unit sizes, thereby obtain laminated body;
Step 3) comprises the following steps:
3.1) in step 2) on the ceramics insulator thin slice with conductive through hole that obtains, adopt photoetching process at described ceramics insulator thin slice desired location, to form the groove of coil shape;
3.2) conductive rubber is filled in to the groove place of described coil shape, and the thickness of conductive rubber equals or is slightly larger than the degree of depth of described groove, formation internal electrode.
Preferably:
Step 3.1) comprise the following steps:
3.1.1) in gold-tinted space, in step 2) on the ceramics insulator thin slice with conductive through hole that obtains, coating one deck photoceram slurry, is photoceram substrate after drying;
3.1.2), in gold-tinted space, adopt the mask plate of specific pattern to expose to photoceram substrate;
3.1.3) in gold-tinted space, to the tablet after exposure develop, clean and dry after obtain the groove at coil layer desired location formation coil shape.
Step 3.1.1), in, the thickness of the photoceram slurry of coating is 20 μ m～100 μ m, preferred 50 μ m, and the ceramics insulator thin slice that has been coated with photoceram slurry is put into 90 degree baking ovens, insulation 120s; Step 3.1.2) in, exposure energy 140mJ～160mJ/(cm2*min), time 3～10s; Step 3.1.3), in, to the tablet after exposure, with removing the place as electrode pattern after developer solution immersion 50～100s, the temperature with 100 ℃～120 ℃ after cleaning is toasted 20min.
Described photoceram pulp bales is containing 40%～85% ferrite powder, 15%～45% photoresist and 5%～20% solvent.
Step 3.2), in, described conductive rubber is printed on the groove place of described coil shape by the method for silk screen printing.
Described conductive rubber is for take the conductive rubber that Ag is main component.
Further comprising the steps of after step 4):
5) by cut laminated body in air, at approximately 400 ℃, heat 2 hours, remove cementitious matter composition; Again, by this laminated body, in air, at 850～910 ℃, sintering is 2～6 hours;
6) on the both ends of laminated body, use the coatings such as infusion process to take the conductive rubber that Ag is principal component, and in air at 550～850 ℃ sintering 1 hour, form thus outer electrode.
The thickness of described ceramic insulating layer thin slice is 10 μ m～60 μ m.
The described ceramic insulating layer thin slice with conductive through hole, the diameter of conductive through hole is 50 μ m～200 μ m.
Photoetching process is the conventional process during large scale integrated circuit is made before this, photoetching process is to adopt ultraviolet light as image information carrier, the unshielded single-crystal wafer of resist thin layer (mask) (mainly referring to silicon chip) surface or dielectric layer are removed, thereby on wafer surface or dielectric layer, obtain and the corresponding consistent line pattern of resist thin layer figure, as each functional layer of integrated circuit.The present invention uses the photoetching process in microelectronics manufacturing technology in the making of internal electrode of ceramic laminated coil class device (as inductor), and not directly to form electrode circuit, but by photoetching process, on ceramic insulating layer thin slice, form the groove of coil shape, recharge conducting resinl and form electrode.Compare with laser ablation and screen printing mode and form groove, adopt the photoetching process that the present invention proposes to make groove, on the one hand due to the accurate transfer of photoetching process to pattern, groove shape effectively guaranteed, the degree of depth of groove and the scope of width also can cover very large; On the other hand, because the time of photolithographic exposure is very short, only have several seconds, the area of single exposure also can as required from small to large, improve the efficiency of producing in enormous quantities greatly.Generally speaking, adopt method of the present invention, can accurately make quickly needed groove, and then produce efficiently both narrow and thick coil electrode, be therefore applicable to very much the laminated power coil type device of the big inductance quantity of the extremely low D.C. resistance of batch making or the low cost of impedance, small size, low thickness.
Accompanying drawing explanation
The lamination schematic diagram of Fig. 1 stack coil device;
Fig. 2 is Fig. 1 middle section 101 schematic diagrames, for groove legal system is made the schematic cross-section at electrode place;
Fig. 3 represents by photoetching legal system, to do in the embodiment of the present invention process schematic diagram of groove.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are elaborated.Should be emphasized that, following explanation is only exemplary, rather than in order to limit the scope of the invention and to apply.
In some embodiments, the manufacture method of stack coil device comprises the following steps:
Step 1, make ceramic insulating layer thin slice;
Step 2, part ceramic insulating layer thin slice is made to the ceramic insulating layer thin slice with conductive through hole;
Step 3, on ceramic sheet, first by photoetching process, at desired location, form the groove of coil shape, then adopt the method for for example silk screen printing that coil-conductor slurry is filled in groove, form internal electrode;
Step 4, by the coil layer thin slice of ceramic insulating layer thin slice and belt coil conductor in order lamination cut off and to make to form unit sizes, thereby obtain laminated body.
In a preferred embodiment, in step 3, the step that forms the groove of coil shape by photoetching process comprises:
In gold-tinted space, on the ceramics insulator thin slice with conductive through hole obtaining in step 2, coating one deck photoceram slurry, is photoceram substrate after drying;
In gold-tinted space, adopt the mask plate of specific pattern to expose to photoceram substrate;
In gold-tinted space, the tablet after exposure is developed, after cleaning and drying, obtain forming at coil layer desired location the groove of coil shape.
Take below and manufacture lamination power-type inductors and be specifically described as example.
The ceramic material that is used to form lamination power inductance is ferrite, and this ferritic component is that present industry is manufactured the component that the products such as lamination power inductance adopt.At this, sketch typical ferrite manufacture method: amount takes Fe first in accordance with regulations
2o
3, CuO, ZnO, NiO powder, coordinate, such as utilizing ball mill etc. to carry out wet mixed, be then dried, calcine subsequently and obtain Ferrite Material, wherein calcining is carried out 2～8 hours with 700～1300 ℃ conventionally.The micro-Bi that then can add as required to reduce sintering temperature and regulate material property
2o
3, Co
2o
3deng, with sand mill etc., be crushed to regulation particle diameter, obtain required ferrite attritive powder.
On the basis of obtaining ferrite attritive powder, make ferrite colloid.It is identical that the making of ferrite colloid and present industry are manufactured the method that the products such as lamination power inductance adopt.In above-mentioned ferrite attritive powder, add organic solvent as ethyl acetate, ethanol, isopropyl alcohol, terpinol etc. with organic bond as polyvinyl butyral resin, ethyl cellulose, acrylic resin etc., also can add plasticizer, dispersant etc. as required.After being mixed, these obtain ferrite colloid.
To make thickness be the thin slice that do not wait of 10～60 μ m and cut into appropriate size by scraping blade method to adopt above-mentioned ferrite colloid, thereby obtain ferrite insulating barrier thin slice.
Getting above-mentioned thickness is for example ferrite insulating barrier thin slices of 25 μ m of 10～40 μ m, and by the method for laser beam drilling, outputing diameter in precalculated position is for example through holes of 150 μ m of 50～200 μ m, makes the ferrite ceramics insulating barrier thin slice with conductive through hole.
In a preferred embodiment, the coil shape groove that completes ferrite ceramics insulating barrier thin slice in gold-tinted workshop is made, and adopts following technique.Consult Fig. 2 and Fig. 3, getting the above-mentioned insulating barrier thin slice 202 with conductive through hole, is for example photoceram slurries of 50 μ m thickness of 20 μ m～100 μ m thickness by method coating a layer thickness of silk screen printing, and substrate is put into 90 degree baking ovens, insulation 100s～140s, for example 120s.Take out after cool to room temperature, with exposure machine exposure, exposure energy 140mJ～160mJ/(cm2*min), as 150mJ/(cm
2* min), time 3～10s, the mask of exposure adopts the pattern of preset lines loop-shaped.The wavelength of exposure machine is I line (365nm)～G line (436nm).During exposure, the place of electrode pattern does not have light to pass through, and the photoresist in other local slurries under effect of light, monomer polymerization cross-linking reaction occurs and solidifies, and completes exposure.With developer solution, soak after 50～100s, the place of electrode pattern is washed off, forms groove 203.Then to the clean unnecessary developer solution post-drying of tablet washing, bake out temperature is 100 ℃～120 ℃, and as 105 ℃, drying time is 20min left and right.Develop and preferably to adopt developing machine automatic spray to develop, can guarantee that like this temperature, flow velocity, pressure and the time etc. of the developer solution that each position of tablet is received are all consistent, groove shape and consistency are best.
In a preferred embodiment, above-mentioned photoceram pulp bales is containing 40%～85% ferrite powder, 15%～45% photoresist, 5%～20% solvent, and preferably, ferrite powder is identical with ferrite insulating barrier thin slice powder.Obviously, this gash depth equals the thickness of be coated with photoceram slurry, and the thickness of the slurry in preferred embodiment is 50 μ m.
Consult Fig. 3, after forming the groove 203 of coil shape, can adopt the method for silk screen printing, by take the conductive rubber 204 that Ag is main component, be printed in groove 203, form coil electrode.The thickness that conductive rubber 204 is filled generally equals or is slightly larger than the degree of depth of groove 203, and being slightly larger than is also to surpass in the scope of the degree of depth 5 μ m of groove 203.In preferred embodiment, filling thickness equals gash depth, is 50 μ m.And due to the existence of through hole, conductive rubber also can be filled in through hole, to realize the connection of different layers coil-conductor after whole lamination.
After making electrode, next, by ferrite insulating barrier thin slice and coil layer thin slice lamination cut into unit sizes in order, obtain laminated body.
In preferred embodiment, described manufacture method also can further comprise following treatment step:
Cut laminated body, in air, is heated 2 hours at approximately 400 ℃, remove cementitious matter composition; Again, by this laminated body in air, laminated body after sintering obtains sintering in 2～6 hours at 850 ℃～910 ℃.
Finally, after sintering on the both ends of laminated body, use the coatings such as infusion process to take the conductive rubber that Ag is principal component, and in air at 550～850 ℃ sintering 1 hour, form thus outer electrode, and externally electroless nickel layer and tin layer on electrode as requested.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. a manufacture method for stack coil device, comprises the following steps:
1) make ceramic insulating layer thin slice;
2) part ceramic insulating layer thin slice is made to the ceramic insulating layer thin slice with conductive through hole;
3) on described ceramics insulator thin slice, coil-conductor is set, forms the coil layer thin slice of belt coil conductor;
4) by the coil layer thin slice of described ceramic insulating layer thin slice and described belt coil conductor in order lamination cut off and to make to form unit sizes, thereby obtain laminated body;
It is characterized in that,
Step 3) comprises the following steps:
3.1) in step 2) on the ceramics insulator thin slice with conductive through hole that obtains, adopt photoetching process at described ceramics insulator thin slice desired location, to form the groove of coil shape;
3.2) conductive rubber is filled in to the groove place of described coil shape, and the thickness of conductive rubber equals or is slightly larger than the degree of depth of described groove, formation internal electrode.
2. the manufacture method of stack coil device as claimed in claim 1, is characterized in that step 3.1) comprise the following steps:
3.1.1) in gold-tinted space, in step 2) on the ceramics insulator thin slice with conductive through hole that obtains, coating one deck photoceram slurry, is photoceram substrate after drying;
3.1.2), in gold-tinted space, adopt the mask plate of specific pattern to expose to photoceram substrate;
3.1.3) in gold-tinted space, to the tablet after exposure develop, clean and dry after obtain the groove at coil layer desired location formation coil shape.
3. the manufacture method of stack coil device as claimed in claim 2, it is characterized in that, step 3.1.1) in, the thickness of the photoceram slurry of coating is 20 μ m～100 μ m, preferred 50 μ m, the ceramics insulator thin slice that has been coated with photoceram slurry is put into 90 degree baking ovens, insulation 100s-140s; Step 3.1.2) in, exposure energy 140mJ～160mJ/(cm2*min), time 3～10s; Step 3.1.3), in, the tablet after exposure, with removing the place as electrode pattern after developer solution immersion 50～100s, is toasted to 20min left and right with the temperature of 100 ℃～120 ℃ after cleaning.
4. the manufacture method of stack coil device as claimed in claim 2, is characterized in that, described photoceram pulp bales is containing 40%～85% ferrite powder, 15%～45% photoresist and 5%～20% solvent.
5. the manufacture method of the stack coil device as described in claim 1 to 4 any one, is characterized in that step 3.2) in, described conductive rubber is printed on the groove place of described coil shape by the method for silk screen printing.
6. the manufacture method of the stack coil device as described in claim 1 to 4 any one, is characterized in that, described conductive rubber is for take the conductive rubber that Ag is main component.
7. the manufacture method of the stack coil device as described in claim 1 to 4 any one, is characterized in that, further comprising the steps of after step 4):
5) by cut laminated body in air, at approximately 400 ℃, heat 2 hours, remove cementitious matter composition; Again, by this laminated body, in air, at 850～910 ℃, sintering is 2～6 hours;
6) on the both ends of laminated body, use the coatings such as infusion process to take the conductive rubber that Ag is principal component, and in air at 550～850 ℃ sintering 1 hour, form thus outer electrode.
8. the manufacture method of the stack coil device as described in claim 1 to 4 any one, is characterized in that, the thickness of described ceramic insulating layer thin slice is 10 μ m～60 μ m.
9. the manufacture method of the stack coil device as described in claim 1 to 4 any one, is characterized in that, the described ceramic insulating layer thin slice with conductive through hole, and the diameter of conductive through hole is 50 μ m～200 μ m.
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| CN201310616066.9A CN103606450B (en) | 2013-11-26 | 2013-11-26 | A kind of manufacture method of stack coil device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448467A (en) * | 2015-12-21 | 2016-03-30 | 深圳顺络电子股份有限公司 | Manufacturing method of electronic part and component electrode |
| CN107993820A (en) * | 2017-12-26 | 2018-05-04 | 广东工业大学 | A kind of embedded inductor coil and preparation method thereof |
| CN108232398A (en) * | 2017-12-25 | 2018-06-29 | 深圳顺络电子股份有限公司 | A kind of lamination component and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251893A (en) * | 2004-03-03 | 2005-09-15 | Tdk Corp | Multilayer ceramic electronic part, circuit substrate, etc., and corresponding parts, circuit substrate, etc., and method of manufacturing ceramic green sheet provided to manufacture corresponding parts, substrate, etc. |
| US20070222549A1 (en) * | 2006-02-21 | 2007-09-27 | Lim Michele H | Co-fired ceramic inductors with variable inductance, and voltage regulator having same |
| CN102592817A (en) * | 2012-03-14 | 2012-07-18 | 深圳顺络电子股份有限公司 | Method for manufacturing stack coil device |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
| CN103395307A (en) * | 2013-07-29 | 2013-11-20 | 电子科技大学 | Preparation method of internal electrode of chip-type electronic component |
-
2013
- 2013-11-26 CN CN201310616066.9A patent/CN103606450B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251893A (en) * | 2004-03-03 | 2005-09-15 | Tdk Corp | Multilayer ceramic electronic part, circuit substrate, etc., and corresponding parts, circuit substrate, etc., and method of manufacturing ceramic green sheet provided to manufacture corresponding parts, substrate, etc. |
| US20070222549A1 (en) * | 2006-02-21 | 2007-09-27 | Lim Michele H | Co-fired ceramic inductors with variable inductance, and voltage regulator having same |
| CN102592817A (en) * | 2012-03-14 | 2012-07-18 | 深圳顺络电子股份有限公司 | Method for manufacturing stack coil device |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
| CN103395307A (en) * | 2013-07-29 | 2013-11-20 | 电子科技大学 | Preparation method of internal electrode of chip-type electronic component |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448467A (en) * | 2015-12-21 | 2016-03-30 | 深圳顺络电子股份有限公司 | Manufacturing method of electronic part and component electrode |
| CN108232398A (en) * | 2017-12-25 | 2018-06-29 | 深圳顺络电子股份有限公司 | A kind of lamination component and preparation method thereof |
| CN108232398B (en) * | 2017-12-25 | 2020-06-23 | 深圳顺络电子股份有限公司 | Laminated component and manufacturing method thereof |
| CN107993820A (en) * | 2017-12-26 | 2018-05-04 | 广东工业大学 | A kind of embedded inductor coil and preparation method thereof |
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| CN103606450B (en) | 2016-03-09 |
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