CN103606769B - Chip-type multilayer ceramic connector and preparation method thereof - Google Patents
Chip-type multilayer ceramic connector and preparation method thereof Download PDFInfo
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Abstract
The present invention relates to a kind of Chip-type multilayer ceramic connector and preparation method thereof.This Chip-type multilayer ceramic connector includes plate type ceramic dielectric body and is arranged on described plate type ceramic dielectric body and multiple termination electrode spaced apart from each other, in described plate type ceramic dielectric body, portion is formed with conductive pattern, and described conductive pattern at least turns on two described termination electrodes.In the plate type ceramic dielectric body of this Chip-type multilayer ceramic connector, the conductive pattern in portion is capable of the conducting effect of at least two termination electrode, make the conducting that this Chip-type multilayer ceramic connector is applied to is capable of electronic component during circuit board, and owing to using plate type ceramic dielectric body as dielectric structure, small volume, it is possible to meet the requirement of miniaturization of electronic products.
Description
Technical field
The present invention relates to electronic product accessory technical field, particularly relate to a kind of Chip-type multilayer ceramic connector
And preparation method thereof.
Background technology
Along with the intelligent development of society, people are more and more higher, especially to outward appearance and the performance requirement of electronic product
It is to have higher requirement miniaturization of electronic products.
Circuit connector is generally used for connecting the element on circuit board, plays bridge and connects conducting effect.Each electricity
Circuit connector needed for sub-product is a lot, and the structure of circuit connector is diversified.Should ensure that circuit
Connecting and physical connection on circuit boards, the volume of current circuit connector is bigger.
Circuit connector should tend to miniaturization, could meet the requirement of miniaturization of electronic products.
Summary of the invention
Based on this, it is necessary to for the Chip-type multilayer ceramic connector providing a kind of small volume.
Further, it is provided that the preparation method of a kind of Chip-type multilayer ceramic connector.
A kind of Chip-type multilayer ceramic connector, is situated between with being arranged at described chip pottery including plate type ceramic dielectric body
On plastid and multiple termination electrode spaced apart from each other, in described plate type ceramic dielectric body, portion is formed with conductive pattern,
Described conductive pattern at least turns on two described termination electrodes.
Wherein in an embodiment, described plate type ceramic dielectric body includes the multiple ceramic dielectrics stacked gradually
Layer, the surface of described each ceramic dielectric layer is formed with interior electrode pattern, on the plurality of ceramic dielectric layer
Interior electrode pattern constitute described conductive pattern.
Wherein in an embodiment, described termination electrode is 2～10.
Wherein in an embodiment, described termination electrode is 10, and wherein 4 described termination electrodes turn on two-by-two,
Other 4 described termination electrode mutual conduction, remaining 2 described termination electrode mutually insulateds.
The preparation method of a kind of Chip-type multilayer ceramic connector, comprises the steps:
Casting technique curtain coating ceramic size is used to prepare ceramic dielectric films；
Electrode pattern in using silk-screen printing technique to prepare in described ceramic dielectric films, obtains being attached with interior electricity
The ceramic dielectric films of pole pattern；
The ceramic dielectric films being attached with interior electrode pattern described in multiple is carried out lamination and obtains laminated body, and by institute
State laminated body and carry out lamination cutting formation ceramic green sheet；
Described ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric body of conductive pattern；And
Coated end electrode slurry on described plate type ceramic dielectric body, at described plate type ceramic dielectric body after solidification
The multiple termination electrode spaced apart from each other of upper formation, obtains described Chip-type multilayer ceramic connector.
Wherein in an embodiment, it is Ca that described ceramic size comprises formulaxSr1-x(TiyZr1-y)zO3Compound
Oxide, wherein 0 < x < 1,0 < y < 1,0.8 < z < 1.2.
Wherein in an embodiment, in described employing silk-screen printing technique is prepared in described ceramic dielectric films
In the step of electrode pattern, a diameter of 15～16 μm of web lines, the mesh number of silk screen is 500 mesh, and silk screen stretches tight
The moment of net is 22～25N/mm.
Wherein in an embodiment, in described employing silk-screen printing technique is prepared in described ceramic dielectric films
In the step of electrode pattern, the print speed of screen process press is 100～200mm/s, and paving speed is 150～300mm/s,
The angle of scraper plate is 65～75 degree, and silk screen gap is 700～1200mm.
Wherein in an embodiment, in described employing silk-screen printing technique is prepared in described ceramic dielectric films
In the step of electrode pattern, the time for exposure is 20～35 seconds.
Wherein in an embodiment, the described step of coated end electrode slurry on described plate type ceramic dielectric body
Suddenly it is to use transfer printing process to be coated on by terminal electrode paste on described plate type ceramic dielectric body.
In the plate type ceramic dielectric body of above-mentioned Chip-type multilayer ceramic connector, the conductive pattern in portion is capable of at least
The conducting effect of two termination electrodes so that can be real when this Chip-type multilayer ceramic connector is applied to circuit board
The conducting of existing electronic component, and due to use plate type ceramic dielectric body as dielectric structure, small volume,
Disclosure satisfy that the requirement of miniaturization of electronic products.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Chip-type multilayer ceramic connector of an embodiment；
Fig. 2 is the structural representation of the Chip-type multilayer ceramic connector of another embodiment；
Fig. 3 is the flow chart of the preparation method of the Chip-type multilayer ceramic connector of an embodiment.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, the most right
The detailed description of the invention of the present invention is described in detail.Elaborate in the following description a lot of detail with
It is easy to fully understand the present invention.But the present invention can come real to be a lot different from alternate manner described here
Executing, those skilled in the art can do similar improvement in the case of intension of the present invention, therefore this
Bright do not limited by following public being embodied as.
Referring to Fig. 1, the Chip-type multilayer ceramic connector 100 of an embodiment, including plate type ceramic dielectric body
10 and be respectively arranged at two termination electrodes 30 of opposite end of plate type ceramic dielectric body 10.
Plate type ceramic dielectric body 10 includes the multiple ceramic dielectric layers 12 stacked gradually.Each ceramic dielectric layer
Interior electrode pattern 122 it is formed with on the surface of 12.Multiple interior electrode patterns 122 constitute plate type ceramic dielectric body
The conductive pattern of 10.
In present embodiment, interior electrode pattern 122 is the continuous distributed being laminated in ceramic dielectric layer 12 surface
Bus, bus extends to the other end from one end of ceramic dielectric layer 12 so that multiple interior electrode patterns 122
The conductive pattern constituted can turn on two termination electrodes 30.Further, due to electricity interior on each ceramic dielectric layer 12
The shapes and sizes of pole pattern 122 are consistent, and multiple interior electrode patterns 122 are parallel and do not have staggered, make
Obtain plate type ceramic dielectric body 10 inside and do not produce electric capacity.
Being appreciated that in other embodiments, interior electrode pattern 122 is not limited to the bus of continuous distributed,
Interior electrode pattern 122 can be diversified, if the interior electrode figure that ensure that between multiple ceramic dielectric layer 12
Case 122 is formed without electric capacity, and enables conductive pattern to turn on two termination electrodes 30.Each ceramic dielectric
Interior electrode pattern 122 on layer 12 can be identical, it is also possible to differs.
Preferably, the length, width and height of plate type ceramic dielectric body 10 a size of 2.0mm × 1.25mm × 0.8mm.
Termination electrode 30 is nickel electrode, copper electrode or silver electrode.
It is appreciated that the quantity of termination electrode 30 is not limited to 2.Preferably, the quantity of termination electrode 30 is 2～10,
2～10 termination electrodes 30 are spaced from each other.
The conductive pattern within plate type ceramic dielectric body 10 of above-mentioned Chip-type multilayer ceramic connector 100 can be real
The now conducting effect of termination electrode 30, and plate type ceramic dielectric body 10 is internal does not produce electric capacity so that by this sheet
Formula multi-layer ceramics connector 100 is applied to be capable of during circuit board the conducting of electronic component, and owing to adopting
With plate type ceramic dielectric body 10 as dielectric structure, small volume, it is possible to meet wanting of miniaturization of electronic products
Ask.
Further, when using the electronic component that above-mentioned Chip-type multilayer ceramic connector 100 connects on circuit board, can
Use chip mounter to carry out paster production, be conducive to improving generation automation and the efficiency of client.
Referring to Fig. 2, the Chip-type multilayer ceramic connector 200 of another embodiment, including plate type ceramic dielectric
Body 20 and 10 termination electrodes 40 being arranged on plate type ceramic dielectric body 20.
Plate type ceramic dielectric body 20 includes the multiple ceramic dielectric layer (not shown) stacked gradually.Each pottery
Interior electrode pattern it is formed with on the surface of dielectric layer.Multiple interior electrode patterns constitute plate type ceramic dielectric body 20
Conductive pattern.
Conductive pattern includes that first bus the 221, second bus the 222, the 3rd bus the 223, the 4th is led
Electricity article 224 and the 5th bus 225.
First bus 221 and the second bus 222 prolong from one end of plate type ceramic dielectric body 20 in the vertical
Extend the other end, and the first bus 221 is parallel with the second bus 222.5th bus 225 crosses
Plate type ceramic dielectric body 20, and the 5th bus 225 all with the first bus 221 and the second bus 221
Conducting.
3rd bus 223 is parallel with the 4th bus 224.3rd bus 223 and the 4th bus 224
One end from plate type ceramic dielectric body 20 extends to middle part in the vertical, and the 3rd bus 223 and the 4th is led
Electricity article 224 all turns on the 5th bus 225.
First bus the 221, second bus the 222, the 3rd bus the 223, the 4th conduction of above-mentioned setting
Articles 224 and the 5th will not produce electric capacity between bus 225, will not produce the electronic component of circuit board and appoint
What harmful effect.
In present embodiment, the multiple interior electrode pattern on the surface of multiple ceramic dielectric layers, the interior electrode having
Pattern is identical, and the interior electrode pattern having is different, to constitute upper described conductive pattern.
Preferably, the length, width and height of plate type ceramic dielectric body 20 a size of 2.0mm × 1.25mm × 0.8mm.
In 10 termination electrodes 40,4 termination electrodes 40 are arranged at one end of plate type ceramic dielectric body 20, additionally
4 termination electrodes 40 are arranged at the relative other end of plate type ceramic dielectric body 20, remaining 2 termination electrodes
40 to be respectively arranged at two end faces with above-mentioned 8 termination electrode 40 places of plate type ceramic dielectric body 20 parallel
Relative two ends.
In 10 termination electrodes 40,4 termination electrodes 40 are turned on two-by-two by conductive pattern, other 4 end electricity
Pole 40 is by conductive pattern mutual conduction.Remaining 2 termination electrode 40 mutually insulateds, and with above-mentioned 8
Termination electrode 40 all insulate.
4 termination electrodes turned on two-by-two realize two by the first bus 221 and the second bus 222 respectively
Two conductings.4 termination electrodes of mutual conduction are led by the 3rd bus the 223, the 4th bus 224 and the 5th
Electricity bar 225 realizes mutual conduction.
It is to be turned on by the conductive pattern within plate type ceramic dielectric body 20 between termination electrode 40, and at sheet
Formula ceramic dielectric body 20 is outside, is spaced apart from each other between 10 termination electrodes 40.
Preferably, the distance between adjacent two termination electrodes 40 is 0.2 millimeter.
The conductive pattern within plate type ceramic dielectric body 20 of above-mentioned Chip-type multilayer ceramic connector 200 can be real
The now conducting effect of multiple termination electrodes 40, and plate type ceramic dielectric body 20 is internal does not produce electric capacity so that will
This Chip-type multilayer ceramic connector 200 is applied to be capable of during circuit board the conducting of electronic component, and by
In using plate type ceramic dielectric body 20 as dielectric structure, small volume, it is possible to meet miniaturization of electronic products
Requirement.
Being appreciated that in other embodiments, the quantity of termination electrode 40 is not limited to 10.10 end electricity
Set-up mode and the connected mode of pole 40 are also not necessarily limited to this.The set-up mode of conductive pattern is also not necessarily limited to.Multiple
The demand that the set-up mode of termination electrode 40 and connected mode connect according to electronic component in circuit board is arranged, according to
The set-up mode of termination electrode 40 and connected mode layout conductive pattern, with meet at least two termination electrode 40 it
Between connection conducting, and make that plate type ceramic dielectric body 20 is internal does not produce electric capacity.
Refer to Fig. 3, the preparation method of the Chip-type multilayer ceramic connector of an embodiment, comprise the steps:
Step S110: use casting technique curtain coating ceramic size to prepare ceramic dielectric films.
Ceramic size is mixed to get with organic solvent by porcelain, organic bond.Porcelain can be zirconium titanium
Strontium calcium (Ca-Sr-Ti-Zr) system porcelain, barium neodymium titanium (Ba-Nd-Ti) system porcelain or magnesium silicate (MgSiO3)
Etc. system porcelain.
Preferably, porcelain comprises formula is CaxSr1-x(TiyZr1-y)zO3Composite oxides, wherein 0 < x < 1,
0 < y < 1,0.8 < z < 1.2.
Preferably, this porcelain also includes that mass fraction is 0.1～the Mg oxide of 5%, Zn oxide, Si oxygen
At least one in the oxide of compound, Mn oxide and Y.
Above-mentioned porcelain has higher insulating properties and the preferable chip of relatively low electrical loss, beneficially processability
Ceramic dielectric body.
Step S120: electrode pattern in using silk-screen printing technique to prepare in ceramic dielectric films, is adhered to
There is the ceramic dielectric films of interior electrode pattern.
Use silk-screen printing technique, electrode size is printed in ceramic dielectric films, be situated between at pottery after drying
Form default interior electrode pattern on plasma membrane, obtain being attached with the ceramic dielectric films of interior electrode pattern.
Electrode size can be copper electrode paste, silver palladium electrode slurry or nickel electrode slurry.
The parameter of silk-screen printing technique and important, only selects suitable technological parameter, electricity in guarantee
Pole pattern is smooth, regular, it is to avoid figure sawtooth occurs and the problems such as figure burr occurs, to ensure follow-up system
The insulating properties of the standby plate type ceramic dielectric body obtained.
Preferably, in silk-screen printing technique, a diameter of 15～16 μm of web lines, the mesh number of silk screen is 500
Mesh, silk screen stretch tight net moment be 22～25N/mm.
Preferably, the time of exposure is 20～35 seconds.
Preferably, the print speed of screen process press is 100～200mm/s, and paving speed is 150～300mm/s, scraper plate
Angle be 65～75 degree, silk screen gap is 700～1200mm.These technological parameters are according in printing
The integrality of electrode pattern sets, and is interdependence, mutually coordinated relation between them, only simultaneously
Reasonably arranging these technological parameters, guarantee prepares smooth, regular interior electrode pattern.
Step S130: multiple ceramic dielectric films being attached with interior electrode pattern are carried out lamination and obtains duplexer,
And laminated body is carried out lamination cutting formation ceramic green sheet.
Step S120 prepares multiple ceramic dielectric films being attached with interior electrode pattern carry out lamination and folded
Layer body, wherein, the ceramic dielectric films being attached with interior electrode pattern of top is laminated in the interior electrode pattern of lower section
On.
Lamination can be offset laminar or not offset laminar.Wherein, offset laminar has X dislocation method, Y dislocation
The multiple stack-design such as method, double end lay-up method, interlayer lamination.
Due to the complexity of conductive pattern, lamination aligning accuracy requires high, it is impossible to there is displacement, the most right
The insulating properties of product have large effect.
Step S140: ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric of conductive pattern
Body.
Ceramic green sheet is placed in atmosphere, sinters 90 minutes～180 minutes at 1050 DEG C～1280 DEG C, obtain
It is internally formed the plate type ceramic dielectric body of conductive pattern.In this plate type ceramic dielectric body, portion does not produce electric capacity.
Step S150: coated end electrode slurry on plate type ceramic dielectric body, at plate type ceramic dielectric after solidification
Form multiple termination electrode spaced apart from each other on body, obtain Chip-type multilayer ceramic connector.
The size of plate type ceramic dielectric body itself is the least, its length, width and height typically have a size of 2.0mm ×
1.25mm × 0.8mm, when the quantity of termination electrode is the most, and the size of termination electrode is the least.Due to multiple termination electrodes
Between be spaced apart from each other, termination electrode is the most, and the distance between adjacent two termination electrodes is the least.
Generally, the distance between adjacent two termination electrodes is only 0.2mm.Coated end electrode slurry with
The requirement forming multiple termination electrode spaced apart from each other is the highest, it is necessary to assure between two adjacent termination electrodes not
Connect, with the problem avoiding there is conducting electric leakage between adjacent two termination electrode.
Preferably, transfer printing process is used to be coated on plate type ceramic dielectric body by terminal electrode paste.
Specifically, transfer printing process is to carve corresponding groove on rotatable rubber tire, and groove width is
0.1mm～0.5mm, the selection of groove width determines according to the size of termination electrode.Plate type ceramic dielectric body is pressed from both sides
Tool is fixing, and makes rubber tire adhere to a certain amount of terminal electrode paste, after using scraper to scrape off unwanted slurry,
Rubber tire rolls and contacts with the termination electrode site of plate type ceramic dielectric body, it is achieved terminal electrode paste is transferred to sheet
On formula ceramic dielectric body, after baking and curing, plate type ceramic dielectric body forms multiple end spaced apart from each other electricity
Pole.
Preferably, the temperature of baking and curing is 115 DEG C～130 DEG C.
Prepared multiple termination electrodes are situated between at chip pottery to use transfer printing process coated end electrode slurry ensure that
Body exterior is spaced from each other and mutually insulated.
Preferably, after plate type ceramic dielectric body prepares termination electrode, it is additionally included in termination electrode and powers on and plate tin
Step, to plate tin layers on the surface of termination electrode.Tin layers, for helping layer, plates tin layers and makes this chip many
Layer ceramic connector has higher solderability, is conveniently connected with circuit board.
The preparation method using above-mentioned Chip-type multilayer ceramic connector prepares Chip-type multilayer ceramic connector, due to
Use suitable technique, it is possible to ensure higher production yield, prepare the chip multilayer pottery of better performances
Porcelain connector.
It is expanded on further below by way of specific embodiment.
Embodiment 1
Prepare multi-layer ceramics connector
1, titanium strontium calcium (Ca-Sr-Ti-Zr) system porcelain, organic bond and organic solvent are mixed to get pottery
Porcelain slurry, uses casting technique curtain coating ceramic size to prepare ceramic dielectric films.Wherein, organic bond is poly-
Vinyl butyral, organic solvent is toluene and ethanol carries out the mixture that mixes in mass ratio for 1:1.Titanium strontium
The mass ratio of calcium (Ca-Sr-Ti-Zr) system porcelain, organic bond and organic solvent is 50:20:30；
2, electrode pattern in using silk-screen printing technique to prepare in ceramic dielectric films, obtains being attached with interior electrode
The ceramic dielectric films of pattern.Wherein, a diameter of 15 μm of web lines, the mesh number of silk screen is 500 mesh, silk screen
The moment netted that stretches tight is 22N/mm, and the time of exposure is 20 seconds；Print speed 100mm/s of screen process press, paving
Speed is 300mm/s, and the angle of scraper plate is 70 degree, and net is away from for 1000mm；
3, multiple ceramic dielectric films being attached with interior electrode pattern are carried out lamination and obtain laminated body, and by lamination
Body carries out lamination cutting and forms ceramic green sheet；
4, ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric body of conductive pattern, chip
Electric capacity is not produced inside ceramic dielectric body.Wherein, the length, width and height of plate type ceramic dielectric body a size of 2.0mm ×
1.25mm×0.8mm.Conductive pattern includes multiple continuous print, strip, the parallel and electrode strip that do not misplaces.
The temperature of sintering is 1280 DEG C, and the time of sintering is 120 minutes；
5, use transfer printing process coated end electrode slurry on plate type ceramic dielectric body, dry solid at 120 DEG C
After change, the opposite end at plate type ceramic dielectric body forms two termination electrodes respectively, and termination electrode is copper electrode.System
After standby termination electrode, also carry out electroplating formation tin layers on the surface of termination electrode, obtain sheet type multi-layer ceramic and connect
Device.
Using insulation machine to test above-mentioned Chip-type multilayer ceramic connector, it is short-circuit condition.
Embodiment 2
1, will be Ca containing formulaxSr1-x(TiyZr1-y)zO3Being combined of (0 < x < 1,0 < y < 1,0.8 < z < 1.2)
The porcelain of oxide, organic bond and organic solvent are mixed to get ceramic size, use casting technique curtain coating
Ceramic size prepares ceramic dielectric films.Wherein, organic bond is polyvinyl butyral resin, and organic solvent is
Toluene and ethanol carry out the mixture mixed in mass ratio for 1:1.Porcelain, organic bond and organic solvent
Mass ratio is 50:20:30；Formula is CaxSr1-x(TiyZr1-y)zO3(0 < x < 1,0 < y < 1,0.8 < z < 1.2)
The mass percent of composite oxides is 95%, and porcelain is the magnesia of 5% possibly together with mass percent；
2, electrode pattern in using silk-screen printing technique to prepare in ceramic dielectric films, obtains being attached with interior electrode
The ceramic dielectric films of pattern.Wherein, a diameter of 16 μm of web lines, the mesh number of silk screen is 500 mesh, silk screen
The moment netted that stretches tight is 25N/mm, and the time of exposure is 35 seconds；Print speed 200mm/s of screen process press, paving
Speed is 150mm/s, and the angle of scraper plate is 65 degree, and net is away from for 800mm；
3, multiple ceramic dielectric films being attached with interior electrode pattern are carried out lamination and obtain laminated body, and by lamination
Body carries out lamination cutting and forms ceramic green sheet；
4, ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric body of conductive pattern, chip
Electric capacity is not produced inside ceramic dielectric body.Wherein, the length, width and height of plate type ceramic dielectric body a size of 2.0mm ×
1.25mm×0.8mm.Conductive pattern include the first bus, the second bus, the 3rd bus, the 4th
Bus and the 5th bus.First bus and the second bus are in the vertical from plate type ceramic dielectric body
One end extends to the other end, and the first bus and the second bus parallel.5th bus crosses chip pottery
Ceramic dielectric body, and the 5th bus all turns on the first bus and the second bus.3rd bus and
Four bus are parallel, and both extend to middle part, and the 3rd in the vertical from one end of plate type ceramic dielectric body
Bus and the 4th bus all turn on the 5th bus.The temperature of sintering is 1260 DEG C, the time of sintering
It it is 120 minutes；
5, use transfer printing process coated end electrode slurry on plate type ceramic dielectric body, dry solid at 125 DEG C
Forming 10 termination electrodes after change on plate type ceramic dielectric body, termination electrode is copper electrode.After preparing termination electrode,
Also carry out electroplating formation tin layers on the surface of termination electrode, obtain Chip-type multilayer ceramic connector.Wherein,
One bus conducting lays respectively at two termination electrodes at the relative two ends of plate type ceramic dielectric body, the second bus
Conducting lays respectively at two other termination electrode at the relative two ends of plate type ceramic dielectric body, the 3rd bus, the
Four bus and the 5th bus other four termination electrodes of connection, remaining on same end face two
Termination electrode mutually insulated, and insulate with other termination electrode.
Using insulation machine to test above-mentioned Chip-type multilayer ceramic connector, the termination electrode test of conducting is 0
Ohm, non-conduction termination electrode is that state of insulation is (more than 1010Ohm).
Embodiment 3
Prepare multi-layer ceramics connector
1, barium neodymium titanium (Ba-Nd-Ti) system porcelain, organic bond and organic solvent are mixed to get pottery
Slurry, uses casting technique curtain coating ceramic size to prepare ceramic dielectric films.Wherein, organic bond is poly-second
Enol butyral, organic solvent is toluene and ethanol carries out the mixture that mixes in mass ratio for 1:1.Barium neodymium titanium
(Ba-Nd-Ti) mass ratio of system porcelain, organic bond and organic solvent is 50:20:30；
2, electrode pattern in using silk-screen printing technique to prepare in ceramic dielectric films, obtains being attached with interior electrode
The ceramic dielectric films of pattern.Wherein, a diameter of 15 μm of web lines, the mesh number of silk screen is 500 mesh, silk screen
The moment netted that stretches tight is 24N/mm.The time of exposure is 30 seconds.Print speed 150mm/s of screen process press, paving
Speed is 200mm/s, and the angle of scraper plate is 75 degree, and net is away from for 1200mm；
3, multiple ceramic dielectric films being attached with interior electrode pattern are carried out lamination and obtain laminated body, and by lamination
Body carries out lamination cutting and forms ceramic green sheet；
4, ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric body of conductive pattern, chip
Electric capacity is not produced inside ceramic dielectric body.Wherein, the length, width and height of plate type ceramic dielectric body a size of 2.0mm ×
1.25mm×0.8mm.Conductive pattern includes the first bus and the second bus.First bus and second
Second bus extends to the other end in the vertical from one end of plate type ceramic dielectric layer, and the first bus and
Second bus is parallel.The temperature of sintering is 1050 DEG C, and the time of sintering is 180 minutes；
5, use transfer printing process coated end electrode slurry on plate type ceramic dielectric body, dry solid at 120 DEG C
On plate type ceramic dielectric body, form four termination electrodes after change, be formed at the most two-by-two on plate type ceramic dielectric body
Opposite end, and relative two-by-two, two termination electrodes at the first bus conducting plate type ceramic dielectric body two ends,
Two termination electrodes laying respectively at plate type ceramic dielectric body two ends that second bus conducting is other, termination electrode is
Copper electrode.After preparing termination electrode, also carry out electroplating formation tin layers on the surface of termination electrode, obtain chip many
Layer ceramic connector.
Using insulation machine to test above-mentioned Chip-type multilayer ceramic connector, the termination electrode test of conducting is 0
Ohm, non-conduction termination electrode is that state of insulation is (more than 1010Ohm).
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (9)
1. a Chip-type multilayer ceramic connector, it is characterised in that include plate type ceramic dielectric body and be arranged at
On described plate type ceramic dielectric body and multiple termination electrode spaced apart from each other, portion's shape in described plate type ceramic dielectric body
Become to have conductive pattern, described conductive pattern at least to turn on two described termination electrodes；
Described plate type ceramic dielectric body includes the multiple ceramic dielectric layers stacked gradually, each described ceramic dielectric
Being formed with interior electrode pattern on the surface of layer, the interior electrode pattern on the plurality of ceramic dielectric layer constitutes described
Conductive pattern, described ceramic dielectric layer prepared by ceramic size, and described ceramic size is by porcelain, organic
Agent is mixed to get with organic solvent, and described porcelain is zirconium titanium strontium calcium system porcelain, barium neodymium titanium system porcelain
Or magnesium silicate system porcelain；
Described chip ceramic body is formed without electric capacity.
Chip-type multilayer ceramic connector the most according to claim 1, it is characterised in that described termination electrode
It it is 2～10.
Chip-type multilayer ceramic connector the most according to claim 2, it is characterised in that described termination electrode
Being 10, wherein 4 described termination electrodes turn on two-by-two, other 4 described termination electrode mutual conduction, remaining
2 described termination electrode mutually insulateds.
4. the preparation method of a Chip-type multilayer ceramic connector, it is characterised in that comprise the steps:
Casting technique curtain coating ceramic size is used to prepare ceramic dielectric films；
Electrode pattern in using silk-screen printing technique to prepare in described ceramic dielectric films, obtains being attached with interior electricity
The ceramic dielectric films of pole pattern；
The ceramic dielectric films being attached with interior electrode pattern described in multiple is carried out lamination and obtains laminated body, and by institute
State laminated body and carry out lamination cutting formation ceramic green sheet；
Described ceramic green sheet is sintered obtaining being internally formed the plate type ceramic dielectric body of conductive pattern；And
Coated end electrode slurry on described plate type ceramic dielectric body, at described plate type ceramic dielectric body after solidification
The multiple termination electrode spaced apart from each other of upper formation, obtains described Chip-type multilayer ceramic connector；
Described ceramic size is mixed to get with organic solvent by porcelain, organic bond, and porcelain is zirconium titanium
Strontium calcium system porcelain, barium neodymium titanium system porcelain or magnesium silicate system porcelain；
In described plate type ceramic dielectric body, portion is formed without electric capacity.
The preparation method of Chip-type multilayer ceramic connector the most according to claim 4, it is characterised in that
It is Ca that described zirconium titanium strontium calcium system porcelain comprises formulaxSr1-x(TiyZr1-y)zO3Composite oxides, wherein
0 < x < 1,0 < y < 1,0.8 < z < 1.2.
The preparation method of Chip-type multilayer ceramic connector the most according to claim 4, it is characterised in that
Described employing silk-screen printing technique prepare in described ceramic dielectric films in electrode pattern step in, web lines
A diameter of 15～16 μm, the mesh number of silk screen is 500 mesh, silk screen stretch tight net moment be 22～25N/mm.
The preparation method of Chip-type multilayer ceramic connector the most according to claim 4, it is characterised in that
Described employing silk-screen printing technique prepare in described ceramic dielectric films in electrode pattern step in, screen printing
The print speed of brush machine is 100～200mm/s, and paving speed is 150～300mm/s, and the angle of scraper plate is 65～75 degree,
Silk screen gap is 700～1200mm.
The preparation method of Chip-type multilayer ceramic connector the most according to claim 4, it is characterised in that
Described employing silk-screen printing technique prepare in described ceramic dielectric films in electrode pattern step in, during exposure
Between be 20～35 seconds.
The preparation method of Chip-type multilayer ceramic connector the most according to claim 4, it is characterised in that
Described on described plate type ceramic dielectric body the step of coated end electrode slurry be use transfer printing process by termination electrode
Slurry is coated on described plate type ceramic dielectric body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310643700.8A CN103606769B (en) | 2013-12-03 | 2013-12-03 | Chip-type multilayer ceramic connector and preparation method thereof |
Applications Claiming Priority (1)
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