CN112277493A - Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece - Google Patents

Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece Download PDF

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Publication number
CN112277493A
CN112277493A CN202011169894.9A CN202011169894A CN112277493A CN 112277493 A CN112277493 A CN 112277493A CN 202011169894 A CN202011169894 A CN 202011169894A CN 112277493 A CN112277493 A CN 112277493A
Authority
CN
China
Prior art keywords
piezoelectric ceramic
multilayer piezoelectric
hot pressing
electrode
ceramic sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011169894.9A
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Chinese (zh)
Inventor
段连威
彭大松
王晓东
韩帅帅
李文文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chinese Sensor Technology (qingdao) Academy Of Science
Original Assignee
Chinese Sensor Technology (qingdao) Academy Of Science
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chinese Sensor Technology (qingdao) Academy Of Science filed Critical Chinese Sensor Technology (qingdao) Academy Of Science
Priority to CN202011169894.9A priority Critical patent/CN112277493A/en
Publication of CN112277493A publication Critical patent/CN112277493A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/22Metallic printing; Printing with powdered inks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • B41M1/30Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • B41M1/34Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382Contact thermal transfer or sublimation processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention discloses a transfer printing method for a bottom electrode of a multilayer piezoelectric ceramic piece, and relates to a preparation method for multilayer piezoelectric ceramic. The bottom electrode and the surface electrode transferred according to the process are symmetrical and complete.

Description

Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece
Technical Field
The invention relates to the field of preparation of piezoelectric ceramic pieces, in particular to a preparation process of multilayer piezoelectric ceramic.
Background
In the past decades, piezoelectric ceramics have good piezoelectric properties (higher displacement, faster response speed, lower power consumption and higher driving force), and have been widely used in sensors and driving devices, and with the development of MEMS technology, electronic components have been developed toward miniaturization, miniaturization and integration. The piezoelectric sheet with the thickness of 10-100 mu m has the advantages of high driving force, wide working frequency, thin film material, low working voltage and good integration of the block material, and is widely applied to the electronic industry.
When the lamination process is carried out, the back surface of the multi-layer piezoelectric ceramic plate as the last lamination cannot be printed with an electrode in advance by screen printing. For some electrode patterns, printing can be completed through a screen printing mode after lamination is completed, but a hot pressing process is not performed between an electrode and the multilayer piezoelectric ceramic piece in the printing mode, the bonding force between the electrode and the multilayer piezoelectric ceramic piece is small, and the electrode is easy to fall off in glue discharging and sintering processes. For asymmetric electrode patterns, the screen printing plate needs to be manufactured again, and the manufacturing cost is increased.
Technical problem to be solved
This patent is through printing electrode pattern screen print on organic membrane after, recycles hot pressing technology with electrode pattern from organic membrane rendition to multilayer piezoceramics piece bottom surface on, need not make the half tone again and save the cost of manufacture, and this kind of mode bottom surface electrode is good with multilayer piezoceramics piece's cohesion simultaneously, can not produce when arranging to glue and sintering and drop.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a transfer printing method for bottom surface electrodes of a multilayer piezoelectric ceramic sheet specifically comprises the following steps:
step one, screen printing an electrode pattern on an organic film (PET/PEN) with silicone oil, wherein the thickness of the organic film is 50-100 mu m;
step two, drying the organic film printed with the electrode pattern in an oven at the drying temperature of 60-70 ℃ for 5-8 min;
step three, attaching the dried organic film to a multilayer piezoelectric ceramic chip through a laminating machine;
step four, carrying out hot pressing on the attached sample wafer, wherein the hot pressing temperature is 50-60 ℃, the hot pressing pressure is 2000-2500psi, and the hot pressing time is 30-40 s;
step five, removing the organic film after hot pressing;
and sixthly, drying the transferred multilayer piezoelectric ceramic sheet in an oven at the drying temperature of 60-70 ℃ for 8-10 min.
Preferably, the multilayer piezoelectric ceramic sheet is manufactured by laminating 5-100 layers of multilayer piezoelectric ceramic sheets with the thickness of a single layer of 35 μm.
Preferably, the piezoelectric ceramic sheet has a three-electrode structure.
The viscosity of the silver paste used is preferably 5000-.
The wet film thickness of the screen printing silver paste is preferably 5-10 μm.
(III) advantageous effects
This patent is printed electrode pattern screen printing on organic membrane, through hot pressing technology with electrode pattern from organic membrane on rendition to multilayer piezoceramics, the organic membrane of use is for taking off from many piezoceramics piece after the stromatolite, has accomplished the reutilization of material promptly and has saved the cost of preparation half tone again.
Detailed Description
The described embodiments are only some, not all embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides a technical scheme that: a transfer printing method for bottom surface electrodes of a multilayer piezoelectric ceramic sheet specifically comprises the following steps:
step one, screen printing an electrode pattern on a PEN film with silicone oil, wherein the thickness of a film strip is 50 mu m, the thickness of a printed silver paste wet film is 8 mu m, and the viscosity of the silver paste is 5500mpa · s;
step two, drying the printed PEN film in an oven at 60 ℃ for 5 min;
step three, attaching the dried PEN film to a multilayer piezoelectric ceramic chip through a laminating machine;
step four, carrying out hot pressing on the attached sample wafer, wherein the hot pressing temperature is 60 ℃, the hot pressing pressure is 2500psi, and the hot pressing time is 40 s;
step five, tearing off the PEN film after hot pressing;
and sixthly, drying the transferred multilayer piezoelectric ceramic sheet in an oven at the drying temperature of 60 ℃ for 10min, and performing other processes after drying.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The transfer printing method for the bottom electrode of the multilayer piezoelectric ceramic piece is characterized in that an electrode pattern is printed on an organic film with silicone oil, and the electrode pattern is perfectly transferred to the back of the multilayer piezoelectric ceramic piece through a hot pressing process: the preparation method comprises the following steps:
step one, screen printing an electrode pattern on an organic film (PET/PEN) with silicone oil, wherein the thickness of the organic film is 50-100 mu m;
step two, drying the organic film printed with the electrode pattern in an oven at the drying temperature of 60-70 ℃ for 5-8 min;
step three, attaching the dried organic film to a multilayer piezoelectric ceramic chip through a laminating machine;
step four, carrying out hot pressing on the attached sample wafer, wherein the hot pressing temperature is 50-60 ℃, the hot pressing pressure is 2000-2500psi, and the hot pressing time is 30-40 s;
step five, removing the organic film after hot pressing;
and sixthly, drying the transferred multilayer piezoelectric ceramic sheet in an oven at the drying temperature of 60-70 ℃ for 8-10 min.
2. The method of transferring the bottom surface electrode of a multilayer piezoelectric ceramic sheet according to claim 1, wherein: the multilayer piezoelectric ceramic sheet is manufactured by laminating 5-100 layers of multilayer piezoelectric ceramic sheets with the single-layer thickness of 35 mu m.
3. The method of transferring the bottom surface electrode of a multilayer piezoelectric ceramic sheet according to claim 1, wherein: the piezoelectric ceramic sheet is of a three-electrode structure.
4. The method of transferring the bottom surface electrode of a multilayer piezoelectric ceramic sheet according to claim 1, wherein: the viscosity of the silver paste used was 5000-.
5. The method of transferring the bottom surface electrode of a multilayer piezoelectric ceramic sheet according to claim 1, wherein: the wet film thickness of the screen printing silver paste is 5-10 mu m.
CN202011169894.9A 2020-10-28 2020-10-28 Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece Pending CN112277493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011169894.9A CN112277493A (en) 2020-10-28 2020-10-28 Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011169894.9A CN112277493A (en) 2020-10-28 2020-10-28 Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece

Publications (1)

Publication Number Publication Date
CN112277493A true CN112277493A (en) 2021-01-29

Family

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Family Applications (1)

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CN202011169894.9A Pending CN112277493A (en) 2020-10-28 2020-10-28 Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece

Country Status (1)

Country Link
CN (1) CN112277493A (en)

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Publication number Priority date Publication date Assignee Title
JPS6351616A (en) * 1986-08-20 1988-03-04 株式会社村田製作所 Manufacture of laminated capacitor
CN2061698U (en) * 1990-02-27 1990-09-05 赵铁军 Accumulator voltage monitoring alarm
JPH03250612A (en) * 1990-02-28 1991-11-08 Nec Corp Manufacture of laminated ceramic parts
JPH06232000A (en) * 1993-02-08 1994-08-19 Matsushita Electric Ind Co Ltd Method of manufacturing lamination ceramic capacitor
JPH07312326A (en) * 1994-05-18 1995-11-28 Matsushita Electric Ind Co Ltd Manufacture of multilayre electronic component
JP2001110667A (en) * 1999-10-07 2001-04-20 Matsushita Electric Ind Co Ltd Manufacture of ceramic electronic component
CN1500281A (en) * 2001-10-25 2004-05-26 松下电器产业株式会社 Laminated ceramic electronic component and method of mfg. electronic component
CN1716478A (en) * 2004-06-28 2006-01-04 京瓷株式会社 Process for preparing multilayer ceramic capacitor and the multilayer ceramic capacitor
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CN1849278A (en) * 2003-09-12 2006-10-18 Tdk株式会社 Coating material for green sheet, green sheet, process for producing green sheet and process for producing electronic part
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KR20180016266A (en) * 2016-08-05 2018-02-14 장희승 Mlcc manufacturing method of increasing efficiency of mlcc and mlcc produced therefrom
CN107835590A (en) * 2017-10-18 2018-03-23 深圳市景旺电子股份有限公司 A kind of preparation method of buried via hole circuit board
CN108054274A (en) * 2017-11-29 2018-05-18 歌尔股份有限公司 Function ceramics element and the method that electrode is formed on function ceramics layer
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* Cited by examiner, † Cited by third party
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JPS6351616A (en) * 1986-08-20 1988-03-04 株式会社村田製作所 Manufacture of laminated capacitor
CN2061698U (en) * 1990-02-27 1990-09-05 赵铁军 Accumulator voltage monitoring alarm
JPH03250612A (en) * 1990-02-28 1991-11-08 Nec Corp Manufacture of laminated ceramic parts
JPH06232000A (en) * 1993-02-08 1994-08-19 Matsushita Electric Ind Co Ltd Method of manufacturing lamination ceramic capacitor
JPH07312326A (en) * 1994-05-18 1995-11-28 Matsushita Electric Ind Co Ltd Manufacture of multilayre electronic component
JP2001110667A (en) * 1999-10-07 2001-04-20 Matsushita Electric Ind Co Ltd Manufacture of ceramic electronic component
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CN1849278A (en) * 2003-09-12 2006-10-18 Tdk株式会社 Coating material for green sheet, green sheet, process for producing green sheet and process for producing electronic part
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CN103606769A (en) * 2013-12-03 2014-02-26 广东风华高新科技股份有限公司 Chip-type multilayer ceramic connector and manufacturing method thereof
CN109156080A (en) * 2016-05-16 2019-01-04 株式会社村田制作所 Ceramic electronic components
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CN106153718A (en) * 2016-08-18 2016-11-23 中国工程物理研究院总体工程研究所 A kind of piezoelectric crystal gas transducer with double working modes
CN107835590A (en) * 2017-10-18 2018-03-23 深圳市景旺电子股份有限公司 A kind of preparation method of buried via hole circuit board
CN108054274A (en) * 2017-11-29 2018-05-18 歌尔股份有限公司 Function ceramics element and the method that electrode is formed on function ceramics layer
CN207851108U (en) * 2017-12-25 2018-09-11 贵州振华红云电子有限公司 Three electrode piezoelectric ceramics piezo detecting tool improved structures
CN110517889A (en) * 2019-08-28 2019-11-29 广东风华高新科技股份有限公司 A kind of multilayer ceramic capacitor and preparation method thereof

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