CN110517889A - A kind of multilayer ceramic capacitor and preparation method thereof - Google Patents
A kind of multilayer ceramic capacitor and preparation method thereof Download PDFInfo
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- CN110517889A CN110517889A CN201910804926.9A CN201910804926A CN110517889A CN 110517889 A CN110517889 A CN 110517889A CN 201910804926 A CN201910804926 A CN 201910804926A CN 110517889 A CN110517889 A CN 110517889A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 93
- 238000000576 coating method Methods 0.000 claims abstract description 46
- 239000011248 coating agent Substances 0.000 claims abstract description 44
- 239000012528 membrane Substances 0.000 claims abstract description 37
- 230000002950 deficient Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 27
- 239000012298 atmosphere Substances 0.000 claims description 26
- 238000005520 cutting process Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 21
- 238000005245 sintering Methods 0.000 claims description 19
- 238000003475 lamination Methods 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 11
- 238000000462 isostatic pressing Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000000049 pigment Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 239000004484 Briquette Substances 0.000 claims description 2
- 238000003491 array Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 6
- 230000000007 visual effect Effects 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 239000012300 argon atmosphere Substances 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910000792 Monel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention discloses a kind of preparation methods of multilayer ceramic capacitor.The preparation-obtained multilayer ceramic capacitor of the present invention, the difference in height formed using electrode interior on ceramic membrane, visual coating is transferred on the indent and convex green sheet in surface after laminating, judges to cut inclined degree according to grooving position between the coatings after green sheet is cut.Without laminated body is splitted be convenient to examine two cut direction cut inclined degree, it is cut partially convenient for examining, it improves the checkability to capacitor cut quality and cuts the efficiency of separation of inclined defective products, the quality level of multilayer ceramic capacitor especially small size high capacity multilayer ceramic capacitor can be improved.
Description
Technical field
The present invention relates to field of electrical components more particularly to a kind of multilayer ceramic capacitor and preparation method thereof.
Background technique
Usually in the processing procedure of multilayer ceramic capacitor, multiple ceramic diaphragms for being printed with interior electrode are laminated to form green compact
Then green sheet is compacted by being laminated, then is cut into the laminated body of cuboid one by one by substrate, multi-layer ceramics can be completed
The green compact of capacitor form.In cutting, due to cutting accuracy etc., can exist and cut inclined phenomenon.It is appropriate due to being provided with
Process allowance, slight cutting will not generally adversely affect partially；But with the miniaturization of multilayer ceramic capacitor and high capacity
To change, process allowance becomes smaller, and cutting offset is easy to exceed technique allowed band, capacitor reliability is adversely affected,
The unacceptable defective products of inclined degree will be cut in time to sort out.
Generally, that laminated body is examined by observing four sections of laminated body cuts inclined degree.But due to laminated body
It is arranged closely in the substrate for fixing green sheet, other than the laminated body of marginal position, remaining most laminated body
Section can not observe directly, but needing to separate laminated body from substrate just can test and sort, this
Sample is very inconvenient.Worse situation is that the inclined defective products of cutting being not fixed on substrate is easy to be mixed into entire block,
And it is difficult to sort completely, brings hidden danger of quality.
Summary of the invention
Based on this, a kind of multi-layer ceramics electricity is provided it is an object of the invention to overcome above-mentioned the deficiencies in the prior art place
The preparation method of container.The multilayer ceramic capacitor that this method is prepared, that laminated body is examined in cutting processing procedure cuts inclined journey
It is more convenient that inclined defective products is cut in degree and sorting, and multilayer ceramic capacitor especially small size high capacity multi-layer ceramics can be improved
The quality level of capacitor.
To achieve the above object, the technical solution used in the present invention are as follows: a kind of preparation method of multilayer ceramic capacitor,
Include the following steps:
(1) ceramic membrane is prepared by raw material of ceramic slurry；
(2) electrode size is dried using electrode pattern in formation is screen printed on the ceramic membrane that step (1) obtains
It is dry, obtain the ceramic membrane for being printed with interior electrode pattern；
(3) multiple steps (2) are printed with to the ceramic membrane of interior electrode pattern, are laminated with back and forth misplacing by fixed distance,
Obtain lamination unit；In the ceramic membrane that opposite two sides difference Stacking steps (1) of lamination unit obtains, covering stacking is obtained
Two protective layers of two opposite sides of unit form protective layer, the structure that lamination unit and protective layer stack gradually, obtain
Green sheet；
(4) green sheet obtained by step (3) is fixed on smooth substrate and carries out isostatic pressing, then in green compact base
The surface of plate is enclosed coating and is dried, and the coating and green sheet surface have color difference；
(5) the attached cated green sheet in surface is cut in length and breadth, obtains close-packed arrays multiple laminated bodies on base material,
After examining and sorting and cut inclined defective products, remaining laminated body is separated from substrate；
(6) laminated body is carried out arranging viscous and sintering, obtains ceramic body；
(7) by after ceramic body chamfering, two external electrodes are enclosed in two end faces of the ceramic body after chamfering respectively, can obtain
To multilayer ceramic capacitor of the present invention.
Preferably, in the step (1), the ceramic slurry includes doped with the ceramic powder of sintering aid, adhesive, has
Solvent, the weight ratio doped with the ceramic powder of sintering aid, adhesive, organic solvent are as follows: doped with sintering aid
Ceramic powder: adhesive: organic solvent=10:(3~5): (6~9).
It is highly preferred that the ceramic powder is at least one of barium titanate ceramics, magnesium titanate ceramics, calcium zirconate ceramics；Institute
Stating adhesive is polyvinyl butyral；The organic solvent is the mixed solvent of toluene and ethyl alcohol, the toluene and ethyl alcohol
Weight ratio is (1~2): 1.
Preferably, it will be uniformly mixed doped with the ceramic powder, adhesive, organic solvent of sintering aid using ball-milling method, ball
Time consuming is 10~18h.
Preferably, in the step (1), ceramic slurry is formed by ceramic membrane, the thickness of the ceramic membrane using the tape casting
It is 1~40 μm.Such range is selected, so that the static capacity range that can be prepared is larger, while the preparation of ceramic membrane is also compared
It is easy.
Preferably, in the step (2), interior electrode with a thickness of 1~3 μm.Less than 1 μm, then interior electrode continuities are easy to dislike
Change, the miniaturization for being then unfavorable for multilayer ceramic capacitor greater than 3 μm and high capacity.
Preferably, the metal in electrode size is at least one in nickel, copper, monel, silver, palladium or silver palladium alloy
Kind.
It is highly preferred that the metal in electrode size is nickel.
Preferably, in the step (2), the interior electrode of silk-screen printing is rectangle, has cutting line on silk screen, interior electrode and
Cutting line is printed on ceramic membrane simultaneously, and cutting line is located at around interior electrode.
Preferably, in the step (3), lamination unit is 80~1000 ceramic membrane stackings for being printed with interior electrode pattern
It obtains.To obtain higher capacitance, and correspond respectively to green sheet in difference between the position of electrode overlapping quantity
With biggish thickness difference.For example, the multilayer ceramic capacitors such as 01005 specification small for size, 0201 specification, it can layer
Folded 80~160 are printed with the ceramic membrane of interior electrode pattern；For multi-layer ceramics such as larger-size 1206 specification, 1210 specifications
700~1000 ceramic membranes for being printed with interior electrode pattern can be laminated in capacitor.
Preferably, two protective layers of two opposite sides of covering lamination unit are that 1~20 ceramic membrane is laminated to obtain.
Preferably, in the step (4), substrate is smooth stainless steel plate, at the interval of green sheet and stainless steel plate
One smooth PET film or silica gel piece.
Preferably, correspond in difference in the step (3), on the green sheet between the position of electrode overlapping quantity
With thickness difference.
Preferably, in the step (4), ink is printed on smooth intermediate support plate using silk screen, formation uniformly connects
Continuous coating, then when coating is unseasoned, by the cated one side of intermediate support plate and the green sheet layer after isostatic pressing
It is folded, so that coating is completely covered on the surface of green sheet, then by pressurization by the surface of coating transfer to green sheet, finally
Intermediate support plate is removed, and at once by the coated and dried on green sheet.
Since green sheet surface has difference in height, coating cannot contact its pocket, therefore on the surface of green sheet
The upper rectangle coating for forming multiple alignments in length and breadth.Coating should have color difference with green sheet surface.Preferably, institute
It states in step (4), the total color difference Δ E on coating and green sheet surface is greater than 1.2.In order to visual detection equipment identification.
It is highly preferred that the pressure applied when transfer is 0.02~0.1Mpa.The coating printed on intermediate support plate is guaranteeing
Should be thin as far as possible under the premise of clear patterns are complete, coating wheel caused by the lateral magnification of ink when being transferred to green sheet to reduce
Exterior feature deformation.
It is highly preferred that the colorant in the ink is pigment.Pigment is attached to the surface of green sheet and is not easy to seep
It will not influence the appearance of ceramic body to easily remove in follow-up process to the inside of green sheet thoroughly.
Preferably, in the step (6), viscous detailed process is arranged are as follows: under air atmosphere, laminated body is heated to 260
DEG C~450 DEG C and keep the temperature 2~4 hours to exclude adhesive；Or under protective gas atmosphere, green briquette is heated to 400
DEG C~600 DEG C and keep the temperature 3~6 hours to exclude adhesive；
The detailed process of sintering are as follows: under air atmosphere or reducibility gas atmosphere, laminated body of the row after viscous is heated to
It 900 DEG C~1350 DEG C and keeps the temperature and is sintered for 1~4 hour, ceramic body is obtained after the completion of sintering.
Preferably, the protective gas atmosphere is nitrogen atmosphere, argon atmosphere or helium atmosphere.
Preferably, the reducibility gas atmosphere is the mixed gas atmosphere of nitrogen and hydrogen, wherein hydrogen and nitrogen
Volume ratio is (0.5~3): 100.
Preferably, in the step (7), the concrete operations of two external electrodes are enclosed in two end faces of ceramic body after chamfering
Are as follows: two end faces of the ceramic body after chamfering coat metal paste respectively, then under protective gas atmosphere or in sky
Atmosphere encloses lower sintering metal slurry, and sintering temperature is 700 DEG C~900 DEG C, and soaking time is 9min~13min, is formed after sintering
It is adhering closely to two external electrodes of two end faces of ceramic body respectively.
Meanwhile the present invention also provides a kind of multilayer ceramic capacitors that the preparation method is prepared.
Compared with the existing technology, the invention has the benefit that
The preparation-obtained multilayer ceramic capacitor of the present invention, the difference in height formed using electrode interior on ceramic membrane, in layer
Visual coating is transferred on pressure rear surface indent and convex green sheet, after green sheet is cut between the coatings according to grooving
Position judges to cut inclined degree.Convenient for examining point for cutting and improving the checkability to capacitor cut quality partially and cutting inclined defective products
Efficiency is selected, the quality level of multilayer ceramic capacitor especially small size high capacity multilayer ceramic capacitor can be improved.
Detailed description of the invention
Fig. 1 is the preparation method flow chart of multilayer ceramic capacitor of the invention；
Fig. 2 is the pattern schematic diagram of silk-screen printing in the preparation method of multilayer ceramic capacitor of the invention；
Fig. 3 is the sectional view for enclosing the green sheet of coating；
Fig. 4 is another sectional view for enclosing the green sheet of coating；
Fig. 5 is the top view for enclosing the green sheet of coating；
Fig. 6 is the top view of the green sheet after cutting；
Wherein, 1, interior electrode；2, cutting line；10, green sheet；20, substrate；30, rectangle coating；40, grooving.
Specific embodiment
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with the drawings and specific embodiments pair
The present invention is described further.
A kind of embodiment of multilayer ceramic capacitor of the present invention, in conjunction with Fig. 1, multi-layer ceramic capacitance described in the present embodiment
Device is prepared by the following method gained:
Ceramic powder, adhesive, organic solvent are obtained ceramic slurry by step 1 after mixing, are then with ceramic slurry
Ceramic membrane is prepared in raw material.
By the uniformly mixed operation of ceramic powder, adhesive, organic solvent are as follows: using ball-milling method by ceramic powder, adhesive, have
Solvent is uniformly mixed, and Ball-milling Time can be 10~18h.
In ceramic slurry, doped with the ceramic powder of sintering aid, adhesive and organic solvent mass ratio be 10:(3~
5): (6~9).
Ceramic powder can be barium titanate ceramics, magnesium titanate ceramics, calcium zirconate ceramics, but not limited to this.Adhesive is poly- second
Enol butyral, organic solvent are that mass ratio is (1~2): 1 toluene and the mixed solvent of ethyl alcohol.
It is prepared in the operation of ceramic membrane by raw material of ceramic slurry, ceramic slurry can be formed using the tape casting and be made pottery
Porcelain film, the thickness of obtained ceramic membrane can be 1~40 μm.
Metal paste use is screen printed on the ceramic membrane that step 1 obtains electrode pattern in formation, drying by step 2
The ceramic membrane for being printed with interior electrode pattern is obtained afterwards.
The interior thickness of electrode printed is 1~3 μm, and less than 1 μm, then interior electrode continuities are easy to deteriorate, then unfavorable greater than 3 μm
Miniaturization and high capacity in multilayer ceramic capacitor.
Metal in metal paste can be nickel, copper, monel, silver, palladium or silver palladium alloy etc., but preferably nickel.Silk
The interior electrode 1 of wire mark brush is preferably rectangle, as shown in Fig. 2, and it is preferred, there is the pattern of cutting line simultaneously on silk screen, with
Just interior electrode 1 and cutting line 2 are printed on ceramic membrane simultaneously.Cutting line 2 is located at around interior electrode 1.
Multiple ceramic film poststacks for being printed with interior electrode pattern are obtained lamination unit by step 3, then in lamination unit
Multiple ceramic membranes are laminated in two opposite sides respectively, obtain green sheet.
Multiple ceramic membranes for being printed with interior electrode pattern are laminated with back and forth misplacing by fixed distance, it is single to obtain stacking
Member.It is layered in Z-direction and carries out, dislocation then only carries out in the X direction, and the interior electrode inside such lamination unit is formed in the side X
The arrangement for misplacing and being aligned in the Y direction upwards.Multiple ceramic membranes are laminated respectively with shape in two opposite sides of lamination unit
Two protective layers that two opposite sides of unit are folded at coating respectively, form protective layer, lamination unit and protective layer successively
The structure of stacking, obtains green sheet.
Preferably, lamination unit can be laminated to obtain for 80~1000 ceramic membranes for being printed with interior electrode pattern, to obtain
Higher capacitance is obtained, and so that green sheet is corresponded respectively to electrode in difference and is overlapped between the position of quantity with biggish
Thickness difference.For example, the multilayer ceramic capacitors such as 01005 specification small for size, 0201 specification, can be laminated 80~160
A ceramic membrane for being printed with interior electrode pattern；It, can for multilayer ceramic capacitors such as larger-size 1206 specification, 1210 specifications
700~1000 ceramic membranes for being printed with interior electrode pattern are laminated.
Two protective layers for being covered each by two opposite sides of lamination unit can be laminated for 1~20 ceramic membrane
It arrives.
Green sheet is fixed on smooth substrate and carries out isostatic pressing by step 4, then on the surface of green sheet
It encloses coating and dries.
Green sheet is fixed on smooth substrate and carries out isostatic pressing, glues each film layer in green sheet closely
It connects, guarantees not stratified when each film layer is cut off.Preferably, substrate uses smooth stainless steel plate, it is furthermore preferred that in green sheet
Smooth PET film (or silica gel piece), green sheet is fixed on substrate with one, the interval of stainless steel plate, in this way can be with
Prevent green sheet and substrate adhesion.
In conjunction with Fig. 3 and Fig. 4, due to being printed with the position of interior electrode 1 on ceramic membrane and there is thickness without the position of interior electrode
It is poor to spend, therefore the thickness of green sheet 10 and unequal.After green sheet isostatic pressing, because substrate 20 is smooth, institute
As soon as the side surface with green sheet towards substrate be also it is smooth, the difference in thickness of green sheet shows it backwards to substrate
Difference in height on one side surface.As shown in figure 3, interior electrode adjacent in Z-direction misplaces in the X direction, then different location
Interior electrode overlapping quantity is there are twice of difference to which the corresponding position on green sheet surface forms significant difference in height.Again
As shown in figure 4, interior electrode adjacent in Z-direction is perfectly aligned in the Y direction, then there is the position of interior electrode and without interior electrode
Position form significant thickness difference, so that the corresponding position on green sheet surface also forms significant difference in height.It is worth
Illustrate, the pocket on green sheet surface, exactly the position for the preparation setting process allowance of multilayer ceramic capacitor.
Ink is printed on smooth intermediate support plate using silk screen, forms the coating of uniformly continuous, then coating not
When dry, the cated one side of intermediate support plate and the green sheet after isostatic pressing are laminated, make coating that green compact be completely covered
The surface of substrate, then intermediate support plate on the surface of coating transfer to green sheet, will finally be removed by pressurization and will be given birth at once
Coated and dried on base substrate.Since green sheet surface has difference in height, coating cannot contact its pocket, therefore in green compact
The rectangle coating 30 of multiple alignments in length and breadth is formed on the surface of substrate, as shown in Figure 5.Coating should be with green sheet surface
With color difference, it is preferred that coating and the total color difference Δ E on green sheet surface are greater than 1.2.In order to visual detection equipment knowledge
Not.
Colorant in ink is preferably pigment.Green compact base is arrived without readily permeable in the surface that pigment is attached to green sheet
The inside of plate will not influence the appearance of ceramic body to easily remove in follow-up process.Such as step 2 can be used in ink
Metal paste, carbon slurry for using etc..Ink can be water-soluble or water-insoluble, can select according to the actual situation.Such as
If subsequent cutting is needed to be cooled down and cleaned with water spray green sheet, at this moment can be used non-using hobboing cutter mode
Water-soluble ink is to prevent coating from dissolving.Intermediate support plate can be stainless steel plate, be also possible to the ceramic membrane that step 1 obtains,
It is also possible to printing paper, etc., as long as the surfacing that intermediate support plate is contacted with green sheet.
Should be thin as far as possible under the premise of guaranteeing that clear patterns are complete in the coating printed on intermediate support plate, it is transferred to reducing
Coating profile caused by the lateral magnification of ink deforms when green sheet.The pressure applied when transfer is 0.02~0.1Mpa.
Step 5 cuts the attached cated green sheet in surface, examine and sort cut inclined defective products after by remaining laminated body
It is separated from substrate.
The attached cated green sheet in surface is cut in length and breadth by cutting line, obtains the laminated body of multiple cuboids, and
Laminated body is arranged closely on substrate, and the minim gap between laminated body is grooving.At this moment it is not necessarily to laminated body from substrate
Separating can carry out cutting inclined inspection, can lean on naked eyes or observe the green sheet after cutting by optical microscopy
The surface on surface, the green sheet after cutting is as shown in Figure 6, it can be seen that rectangle coating 30 and grooving 40.Phase on direction in length and breadth
The distance between adjacent rectangle coating is equal to process allowance set by the preparation of multilayer ceramic capacitor.In this way, if cutting
Center position of the slot position between adjacent rectangle coating then illustrates not cutting at this partially, otherwise can survey by image analyzers
Amount cutting offset, so as to know the distribution of whole laminated bodies cut inclined degree and cut inclined defective products.Sorting is cut partially not
Laminated body is fixed on substrate when non-defective unit, therefore is cut inclined defective products and will not be mixed into entire block.Cut inspection and defective products partially
Laminated body can be separated from substrate after the completion of sorting.
Laminated body row is glued and is sintered by step 6, obtains ceramic body.
The viscous detailed process of row are as follows: under air atmosphere, be heated to the laminated body 260 DEG C~450 DEG C and to keep the temperature 2 hours~
4 hours to exclude adhesive；Or under protective gas atmosphere, laminated body is heated to 400 DEG C~600 DEG C and heat preservation 3 is small
When~6 hours to exclude adhesive.Coating on laminated body may be removed by row is viscous.
Protective gas atmosphere can be nitrogen atmosphere, argon atmosphere or helium atmosphere.
The detailed process of sintering are as follows: under air atmosphere or under reducibility gas atmosphere, by laminated body of the row after viscous
It is heated to 900 DEG C~1350 DEG C and heat preservation is sintered for 1 hour~4 hours, ceramic body is obtained after the completion of sintering.On laminated body
Coating may be removed through oversintering.
Reducibility gas atmosphere can be the mixed gas atmosphere of nitrogen and hydrogen, wherein the volume ratio of hydrogen and nitrogen
For (0.5~3): 100.
Step 7, by after ceramic body chamfering, two external electrodes are enclosed in two end faces of the ceramic body after chamfering respectively, obtain
To multilayer ceramic capacitor.
By ceramic body with planetary mills or the method chamfering of barreling, its corner is made to become round and smooth.When ink uses metal paste
Whens equal, on the surface of ceramic body that laminated body obtains after arranging viscous and sintering still can adhesion metal layer, then ceramic body passes through chamfering
Afterwards, metal layer is completely removed, and will not influence the appearance of ceramic body.
The operation of two external electrodes is enclosed in two end faces of the ceramic body after chamfering respectively specifically: respectively after chamfering
Two end faces of ceramic body coat metal paste, the then sintering metal under protective gas atmosphere or under air atmosphere
Slurry, sintering temperature can be 700 DEG C~900 DEG C, and soaking time can be 9min~13min, be formed after sintering close respectively
It is attached to two external electrodes of two end faces of ceramic body.
In the operation of two end faces of ceramic body coating metal paste, the metal in metal paste can be copper, nickel, nickel
Copper alloy, silver or silver palladium alloy etc., preferably copper.
Protective gas atmosphere can be nitrogen atmosphere, argon atmosphere or helium atmosphere.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than protects to the present invention
The limitation of range is protected, although the invention is described in detail with reference to the preferred embodiments, those skilled in the art should
Understand, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the essence of technical solution of the present invention
And range.
Claims (10)
1. a kind of preparation method of multilayer ceramic capacitor, which comprises the steps of:
(1) ceramic membrane is prepared by raw material of ceramic slurry；
(2) electrode size is obtained using electrode pattern in formation, drying is screen printed on the ceramic membrane that step (1) obtains
To the ceramic membrane for being printed with interior electrode pattern；
(3) multiple steps (2) are printed with to the ceramic membrane of interior electrode pattern, is laminated with back and forth misplacing, obtains by fixed distance
Lamination unit；In the ceramic membrane that opposite two sides difference Stacking steps (1) of lamination unit obtains, covering lamination unit is obtained
Two protective layers of two opposite sides form protective layer, the structure that lamination unit and protective layer stack gradually, obtain green compact
Substrate；
(4) green sheet obtained by step (3) is fixed on smooth substrate and carries out isostatic pressing, then in green sheet
Surface is enclosed coating and is dried, and the coating and green sheet surface have color difference；
(5) the attached cated green sheet in surface is cut in length and breadth, obtains close-packed arrays multiple laminated bodies on base material, examined
And after inclined defective products is cut in sorting, remaining laminated body is separated from substrate；
(6) laminated body is carried out arranging viscous and sintering, obtains ceramic body；
(7) by after ceramic body chamfering, two external electrodes are enclosed in two end faces of the ceramic body after chamfering respectively, this can be obtained
Invent the multilayer ceramic capacitor.
2. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (2), interior electricity
Pole with a thickness of 1~3 μm.
3. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (2), silk screen
The interior electrode of printing is rectangle, has cutting line on silk screen, and interior electrode and cutting line are printed on ceramic membrane simultaneously, cutting line position
Around interior electrode.
4. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (3), stacking
Unit is that 80~1000 ceramic membranes for being printed with interior electrode pattern are laminated to obtain.
5. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (4), coating
It is greater than 1.2 with the total color difference Δ E on green sheet surface.
6. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that described in the step (3)
Corresponding in difference on green sheet has thickness difference between the position of electrode overlapping quantity.
7. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (4), use
Ink is printed on smooth intermediate support plate by silk screen, forms the coating of uniformly continuous, will be intermediate then when coating is unseasoned
The cated one side of support plate is laminated with the green sheet after isostatic pressing, and coating is made to be completely covered on the surface of green sheet,
Intermediate support plate on the surface of coating transfer to green sheet, will finally be removed by pressurization again, and at once will be on green sheet
Coated and dried.
8. the preparation method of multilayer ceramic capacitor as claimed in claim 7, which is characterized in that the colorant in the ink
For pigment.
9. the preparation method of multilayer ceramic capacitor as described in claim 1, which is characterized in that in the step (6), row is viscous
Detailed process are as follows: under air atmosphere, by laminated body be heated to 260 DEG C~450 DEG C and keep the temperature 2~4 hours with excludes bond
Agent；Or under protective gas atmosphere, green briquette is heated to 400 DEG C~600 DEG C and keeps the temperature 3~6 hours to exclude bonding
Agent；
The detailed process of sintering are as follows: under air atmosphere or reducibility gas atmosphere, laminated body of the row after viscous is heated to 900 DEG C
It~1350 DEG C and keeps the temperature and is sintered for 1~4 hour.
10. a kind of multilayer ceramic capacitor being prepared by any one of claim 1~9 preparation method.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
| CN112277493A (en) * | 2020-10-28 | 2021-01-29 | 中科传感技术(青岛)研究院 | Transfer printing method for bottom electrode of multilayer piezoelectric ceramic piece |
| CN115274319A (en) * | 2022-07-18 | 2022-11-01 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
| CN115732230A (en) * | 2022-11-17 | 2023-03-03 | 惠州市鸿通晟自动化设备有限公司 | Preparation process of chip multilayer ceramic capacitor |
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| CN111446079A (en) * | 2020-04-10 | 2020-07-24 | 肇庆市安捷电子有限公司 | Internal electrode slurry and internal electrode layer for preparing multilayer ceramic capacitor |
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| CN115732230B (en) * | 2022-11-17 | 2024-02-20 | 惠州市鸿通晟自动化设备有限公司 | Preparation process of chip type multilayer ceramic capacitor |
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