CN102148081A - Manufacturing method of laminated type ceramic electronic element - Google Patents
Manufacturing method of laminated type ceramic electronic element Download PDFInfo
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- CN102148081A CN102148081A CN 201010540509 CN201010540509A CN102148081A CN 102148081 A CN102148081 A CN 102148081A CN 201010540509 CN201010540509 CN 201010540509 CN 201010540509 A CN201010540509 A CN 201010540509A CN 102148081 A CN102148081 A CN 102148081A
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Abstract
The invention relates to a manufacturing method of a laminated type ceramic electronic element, sequentially comprising the following steps at an integral forming stage: (1) carrying out tape casting to form ceramic raw sheets; (2) arranging through holes; (3) filling slurry into the through holes; (4) printing electrodes; (5) laminating and pressing; and (6) carrying out isostatic pressing processing. The manufacturing method of the laminated type ceramic electronic element is characterized in that the step (3) of filling the slurry into the through holes is to fill conductive slurry into the through holes of the ceramic raw sheets in a screen printing manner and a reverse hole-filing manner; and the reverse hole-filing manner is to fill the conductive slurry into the through holes along a printing scraper downwards to be processed by a silk screen, a load-bearing sheet, the ceramic raw sheets and a printing supporting table plate sequentially. By adopting the reverse hole-filing manner in the manufacturing method, the stray capacitance brought about by the redundant electrodes can be effectively eliminated; and besides, the short circuit among the through holes cannot be caused when the through holes have a large number and small intervals on a same layer of the ceramic raw sheets. The manufacturing method provided by the invention can be widely used for manufacturing the laminated type ceramic electronic element made of ferrite ceramics, alumina glass ceramics, manganese-cobalt-nickel ceramics and zinc oxide ceramics.
Description
Technical field
The present invention relates to the lamination sheet type ceramic electronic component, particularly relate to a kind of manufacture method of lamination sheet type ceramic electronic component.
Background technology
The manufacture method of existing lamination sheet type ceramic electronic component is by at ceramic green sheet surface printing electrocondution slurry mostly, forms the electrode structure of components and parts inside, and the connecting through hole by raw cook inside between the different ceramic green sheet electrodes interconnects; Inner extraction electrode is realized being connected by the raw cook interior bone with external connecting electrode equally.The reliability of lamination sheet type ceramic electronic component is the reliability decision that is connected by through hole basically.In actual manufacture process, ceramic green sheet just enters printing process after by laser beam drilling; When the printing conductive slurry forms internal electrode, just adopt positive filling perforation mode that through hole is in the milk, if desired pattern directly is printed on ceramic green sheet main schedule surface forming electrode, corresponding printing screen figure just need be bigger than clear size of opening, to guarantee perfusion fully to through hole, but, can be at the unnecessary electrode (as shown in Figure 1) of the residual on every side circle of ceramic green sheet through hole.For the relatively large product of size, above-mentioned drawback is also not obvious, and for size is relatively very little and the electrode number of plies is a lot of product, residual electrode can form plane-parallel capacitor, increase stray capacitance (as shown in Figure 2), deterioration properties of product, in addition, more and spacing is less with the perforate of one deck ceramic green sheet, electrode residual around the through hole is overlapped, causes the short circuit (as shown in Figure 3) between the through hole easily.
Summary of the invention
Technical problem to be solved by this invention is the defective that remedies above-mentioned prior art, and a kind of manufacture method of lamination sheet type ceramic electronic component is provided.
Technical problem of the present invention is solved by the following technical programs.
The manufacture method of this lamination sheet type ceramic electronic component has following steps successively in the global formation stage:
1) curtain coating forms ceramic green sheet; 2) offer through hole; 3) slurry filling perforation; 4) print electrode; 5) lamination pressing; 6) etc. static pressure is handled.
The characteristics of the manufacture method of this lamination sheet type ceramic electronic component are:
The filling perforation of described step 3) slurry is the reverse side filling perforation, adopt screen printing mode that electrocondution slurry is inserted the through hole of ceramic green sheet in reverse side filling perforation mode, described reverse side filling perforation mode is to be followed successively by silk screen, carrying tablet, ceramic green sheet and printing downwards along printing scraper to support platen electrocondution slurry is inserted through hole.
Technical problem of the present invention is solved by following further technical scheme.
Described step 1) curtain coating forms ceramic green sheet and comprises step by step following:
11) surface coated
Adopt ceramic size to form ceramic green sheet in the carrying tablet surface coated;
12) oven dry coating
The carrying tablet surface coating drying is made ceramic green sheet to the ceramic size solvent evaporates.
Described step 2) offering through hole is to adopt laser beam drilling machine or mechanical tapping machine to leave the through hole of given size at the predeterminated position of ceramic green sheet.
Described step 4) prints electrode, and is that the ceramic green sheet that will need to print electrode after the reverse side filling perforation overturns up over against silk screen, adopts screen printing mode to print electrode at the ceramic green sheet front surface again, and the ceramic green sheet that does not need to print electrode omits step 4).
The pressing of described step 5) lamination is that filling perforation and the ceramic green sheet electrode pattern laminated layer sequence as requested that prints electrode lamination successively are pressed into ceramic body, and carrying tablet is peeled off from ceramic green sheet together with unnecessary electrode around the through hole.
Static pressure such as described step 6) are handled, and are to place isostatic pressing machine to carry out hip moulding ceramic body, and the water temperature in the isostatic pressing machine is 50～80 ℃.Make ceramic body become dense green, avoid the interlayer cracking occurring after the cutting.
Technical problem of the present invention is solved by following further again technical scheme.
Described carrying tablet be material soft and when laser penetration the indiffusible carrying tablet in edge, comprise PETG diaphragm (Polyethylene terephathalate, initialism are PET, are called for short polyester).
The ceramic size component and the percentage by weight thereof of described surface coated are as follows:
Ferrite NiCuZn powder 80%;
Adhesive: polyvinyl butyral resin (PVB) resin 15%;
Dispersant: BYK110 3%;
Plasticizer: dibutyl phthalate (DBP) 2%.
Described adhesive is that (Acrylic or the transliteration of ACRYL Chinese: resin acrylic) is used to cohere ceramic green sheet and carrying tablet to acrylic-type.
The temperature of described oven dry coating is 80～100 ℃.
The beneficial effect that the present invention is compared with the prior art is:
Manufacture method of the present invention adopts reverse side filling perforation mode, it is to remain on the carrying tablet that through hole pours into back unnecessary electrode of a circle of formation around through hole fully, peel off from ceramic green sheet together with carrying tablet when being pressed into ceramic body through lamination, can effectively eliminate the stray capacitance that unnecessary thus electrode is introduced, in addition, ceramic green sheet with one deck number of openings many and spacing hour, can not cause the short circuit between the through hole.Manufacture method of the present invention can be widely used in making ferrite ceramics, alumina glass pottery, manganese cobalt nickel pottery, zinc oxide ceramics lamination sheet type ceramic electronic component.
Description of drawings
Fig. 1 is the ceramic green sheet longitudinal sectional drawing that prior art adopts positive filling perforation mode;
Fig. 2 is the longitudinal sectional drawing after the ceramic green sheet of Fig. 1 laminates;
Fig. 3 is the transverse cross-sectional view after the ceramic green sheet of Fig. 1 laminates;
Fig. 4 is the reverse side filling perforation mode schematic diagram of the specific embodiment of the invention;
Fig. 5 is the ceramic green sheet profile that the specific embodiment of the invention adopts reverse side filling perforation mode;
Fig. 6 is the longitudinal sectional drawing after the ceramic green sheet of Fig. 5 laminates;
Fig. 7 is the transverse cross-sectional view after the ceramic green sheet of Fig. 5 laminates.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention will be described.
A kind of manufacture method of the lamination sheet type ceramic electronic component shown in Fig. 4～7, the lamination sheet type ceramic electronic component is the high frequency magnetic bead of the imitative Bluetooth antenna structure of long 1.0mm, wide 0.5mm, in the global formation stage following steps is arranged:
1) curtain coating forms ceramic green sheet
11) surface coated
Adopt ceramic size to be coated with on PET film carrying tablet 10 surfaces and form ceramic green sheet 11, the ceramic size component and the percentage by weight thereof of coating are as follows:
Ferrite NiCuZn powder 80%;
Adhesive: polyvinyl butyral resin (PVB) resin 15%;
Dispersant: BYK110 3%;
Plasticizer: dibutyl phthalate (DBP) 2%.
12) oven dry coating
Is to dry under 80～100 ℃ to the ceramic size solvent evaporates to make ceramic green sheet 11 with PET film carrying tablet 10 face coats in temperature;
2) offer through hole
Adopt laser beam drilling machine or mechanical tapping machine to leave the through hole 15 of given size at the predeterminated position of ceramic green sheet 11;
3) slurry filling perforation
Adopt screen printing mode that electrocondution slurry is inserted the through hole 15 of ceramic green sheet 11 in reverse side filling perforation mode, reverse side filling perforation mode is to be followed successively by silk screen 3, carrying tablet 10, ceramic green sheet 11 and printing downwards along printing scraper 6 to support platen 20 electrocondution slurry is inserted through hole 15;
4) print electrode
The ceramic green sheet of the bottom and top layer is overturn up over against silk screen, adopt screen printing mode to print electrode 18 again at the ceramic green sheet front surface;
5) lamination pressing
Filling perforation and the ceramic green sheet 11 electrode pattern laminated layer sequence as requested that prints electrode lamination successively are pressed into ceramic body, and carrying tablet 10 is peeled off from ceramic green sheet 11 together with unnecessary electrode 16 around the through hole 15;
6) etc. static pressure is handled
Place isostatic pressing machine to carry out hip moulding ceramic body, the water temperature in the isostatic pressing machine is 65 ℃.Make ceramic body become dense green, avoid the interlayer cracking occurring after the cutting.
After tested, adopt the ceramic green sheet through hole filling perforation situation of reverse side filling perforation mode of the present invention to improve very obvious.Through-hole surfaces noresidue electrode, the short circuit ratio between the through hole is 0, resonance frequency is brought up to more than the 1GHz.In contrast, the short circuit ratio between the ceramic green sheet through hole that adopts existing positive filling perforation mode under other operation the same terms is up to 80%, and resonance frequency is below 800MHz.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention; make some alternative or obvious modification that are equal to without departing from the inventive concept of the premise; and performance or purposes are identical, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (10)
1. the manufacture method of a lamination sheet type ceramic electronic component has following steps successively in the global formation stage: 1) curtain coating formation ceramic green sheet; 2) offer through hole; 3) slurry filling perforation; 4) print electrode; 5) lamination pressing; 6) etc. static pressure is handled, and it is characterized in that:
The filling perforation of described step 3) slurry is the reverse side filling perforation, adopt screen printing mode that electrocondution slurry is inserted the through hole of ceramic green sheet in reverse side filling perforation mode, described reverse side filling perforation mode is to be followed successively by silk screen, carrying tablet, ceramic green sheet and printing downwards along printing scraper to support platen electrocondution slurry is inserted through hole.
2. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 1 is characterized in that:
Described step 1) curtain coating forms ceramic green sheet and comprises step by step following:
11) surface coated
Adopt ceramic size to form ceramic green sheet in the carrying tablet surface coated;
12) oven dry coating
The carrying tablet surface coating drying is made ceramic green sheet to the ceramic size solvent evaporates.
3. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 1 or 2 is characterized in that:
Described step 2) offering through hole is to adopt laser beam drilling machine or mechanical tapping machine to leave the through hole of given size at the predeterminated position of ceramic green sheet.
4. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 3 is characterized in that:
Described step 4) prints electrode, and is that the ceramic green sheet that will need to print electrode after the reverse side filling perforation overturns up over against silk screen, adopts screen printing mode to print electrode at the ceramic green sheet front surface again, and the ceramic green sheet that does not need to print electrode omits step 4).
5. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 4 is characterized in that:
The pressing of described step 5) lamination is that filling perforation and the ceramic green sheet electrode pattern laminated layer sequence as requested that prints electrode lamination successively are pressed into ceramic body, and carrying tablet is peeled off from ceramic green sheet together with unnecessary electrode around the through hole.
6. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 5 is characterized in that:
Static pressure such as described step 6) are handled, and are to place isostatic pressing machine to carry out hip moulding ceramic body, and the water temperature in the isostatic pressing machine is 50～80 ℃.
7. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 6 is characterized in that:
Described carrying tablet be material soft and when laser penetration the indiffusible carrying tablet in edge, comprise PETG diaphragm (Polyethylene terephathalate, initialism are PET, are called for short polyester).
8. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 7 is characterized in that:
The ceramic size component and the percentage by weight thereof of described surface coated are as follows:
Ferrite NiCuZn powder 80%;
Adhesive: polyvinyl butyral resin (PVB) resin 15%;
Dispersant: BYK110 3%;
Plasticizer: dibutyl phthalate (DBP) 2%.
9. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 8 is characterized in that:
Described adhesive is acrylic-type (Acrylic or the transliteration of ACRYL Chinese: resin acrylic).
10. the manufacture method of lamination sheet type ceramic electronic component as claimed in claim 9 is characterized in that:
The temperature of described oven dry coating is 80～100 ℃.
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| CN 201010540509 CN102148081A (en) | 2010-11-11 | 2010-11-11 | Manufacturing method of laminated type ceramic electronic element |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724822A (en) * | 2012-06-25 | 2012-10-10 | 中国航天科工集团第二研究院二十三所 | Control technological method for planeness of surface of LTCC substrate |
| CN103077780A (en) * | 2013-01-11 | 2013-05-01 | 深圳顺络电子股份有限公司 | Production method of a thick-electrode conductor device |
| CN103175883A (en) * | 2013-01-25 | 2013-06-26 | 镇江泛沃汽车零部件有限公司 | Manufacture method of chip type wide-domain automotive oxygen sensor chip |
| CN103442527A (en) * | 2013-09-03 | 2013-12-11 | 中国电子科技集团公司第五十四研究所 | Method for controlling height of slurry in hole in raw LTCC chip |
| CN103632785A (en) * | 2013-12-12 | 2014-03-12 | 深圳顺络电子股份有限公司 | Manufacturing method for inner electrode of chip component |
| CN104538175A (en) * | 2014-12-19 | 2015-04-22 | 深圳顺络电子股份有限公司 | Method for manufacturing laminated electronic chip component |
| CN104553240A (en) * | 2015-01-09 | 2015-04-29 | 深圳顺络电子股份有限公司 | Molding method of laminated chip component and composite material used by molding method |
| CN105590747A (en) * | 2016-02-29 | 2016-05-18 | 深圳顺络电子股份有限公司 | Power-type component and manufacturing method thereof |
| CN106252000A (en) * | 2016-08-03 | 2016-12-21 | 代长华 | A kind of Thermistor and preparation method thereof |
| CN107492519A (en) * | 2017-08-07 | 2017-12-19 | 中国电子科技集团公司第二十九研究所 | A kind of preparation method of multilayer co-firing ceramic substrate high desnity metal through hole |
| CN108002865A (en) * | 2017-11-29 | 2018-05-08 | 歌尔股份有限公司 | Function ceramics element and the method that electrode is formed on function ceramics layer |
| CN108232398A (en) * | 2017-12-25 | 2018-06-29 | 深圳顺络电子股份有限公司 | A kind of lamination component and preparation method thereof |
| CN108629235A (en) * | 2017-03-21 | 2018-10-09 | 南昌欧菲生物识别技术有限公司 | The preparation method of fingerprint Identification sensor |
| CN108735487A (en) * | 2018-04-27 | 2018-11-02 | 广东光驰电子有限公司 | A kind of method and support plate for chip electronic component production |
| CN111465218A (en) * | 2020-03-19 | 2020-07-28 | 国巨电子（中国）有限公司 | Low-temperature co-fired ceramic and hole filling method thereof |
| CN113436829A (en) * | 2021-06-21 | 2021-09-24 | 深圳顺络电子股份有限公司 | Magnetic device, manufacturing method and electronic component |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766555A (en) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JP2002151342A (en) * | 2000-11-09 | 2002-05-24 | Murata Mfg Co Ltd | Laminated ceramic electronic component and its manufacturing method |
| CN1507634A (en) * | 2002-02-28 | 2004-06-23 | 株式会社村田制作所 | Method for manufacturing multilayer ceramic electronic component |
| CN1984757A (en) * | 2004-05-20 | 2007-06-20 | Tdk株式会社 | Green sheet, method for producing green sheet, and method for manufacturing electronic parts |
| KR20080107932A (en) * | 2007-06-08 | 2008-12-11 | 삼성전기주식회사 | Conductive paste composition and low temperature co-fire cerimic |
| CN201246695Y (en) * | 2008-05-04 | 2009-05-27 | 潮州市三江电子有限公司 | Ceramic heat radiation substrate for chip LED encapsulation |
| WO2010055845A1 (en) * | 2008-11-12 | 2010-05-20 | 積水化学工業株式会社 | Metal oxide microparticle dispersed slurry |
-
2010
- 2010-11-11 CN CN 201010540509 patent/CN102148081A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766555A (en) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JP2002151342A (en) * | 2000-11-09 | 2002-05-24 | Murata Mfg Co Ltd | Laminated ceramic electronic component and its manufacturing method |
| CN1507634A (en) * | 2002-02-28 | 2004-06-23 | 株式会社村田制作所 | Method for manufacturing multilayer ceramic electronic component |
| CN1984757A (en) * | 2004-05-20 | 2007-06-20 | Tdk株式会社 | Green sheet, method for producing green sheet, and method for manufacturing electronic parts |
| KR20080107932A (en) * | 2007-06-08 | 2008-12-11 | 삼성전기주식회사 | Conductive paste composition and low temperature co-fire cerimic |
| CN201246695Y (en) * | 2008-05-04 | 2009-05-27 | 潮州市三江电子有限公司 | Ceramic heat radiation substrate for chip LED encapsulation |
| WO2010055845A1 (en) * | 2008-11-12 | 2010-05-20 | 積水化学工業株式会社 | Metal oxide microparticle dispersed slurry |
Non-Patent Citations (5)
| Title |
|---|
| 《国际电子变压器》 20080831 何虹等 高性能低温共烧铁氧体粉料和叠层片式电感器的现状及发展 , 第008期 * |
| 《电子科技大学学报》 20080630 夏红等 LTCC带通滤波器的设计 第37卷, * |
| 《陶瓷》 20050331 唐志阳 有机材料在陶瓷成形中的应用 , 第3期 * |
| 《集成电路通讯》 20051231 王啸等 低温共烧陶瓷(LTCC)的标记、定位、对准系统 第23卷, 第4期 * |
| 《集成电路通讯》 20080630 濮嵩等 陶瓷基片填孔可靠性工艺研究 第26卷, 第2期 * |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724822B (en) * | 2012-06-25 | 2014-06-18 | 中国航天科工集团第二研究院二十三所 | Control technological method for planeness of surface of LTCC substrate |
| CN102724822A (en) * | 2012-06-25 | 2012-10-10 | 中国航天科工集团第二研究院二十三所 | Control technological method for planeness of surface of LTCC substrate |
| CN103077780A (en) * | 2013-01-11 | 2013-05-01 | 深圳顺络电子股份有限公司 | Production method of a thick-electrode conductor device |
| CN103175883A (en) * | 2013-01-25 | 2013-06-26 | 镇江泛沃汽车零部件有限公司 | Manufacture method of chip type wide-domain automotive oxygen sensor chip |
| CN103175883B (en) * | 2013-01-25 | 2015-08-19 | 镇江能斯特汽车科技有限公司 | A kind of method for making of chip type wide-area automobile oxygen sensor chip |
| CN103442527A (en) * | 2013-09-03 | 2013-12-11 | 中国电子科技集团公司第五十四研究所 | Method for controlling height of slurry in hole in raw LTCC chip |
| CN103632785A (en) * | 2013-12-12 | 2014-03-12 | 深圳顺络电子股份有限公司 | Manufacturing method for inner electrode of chip component |
| CN104538175B (en) * | 2014-12-19 | 2017-09-22 | 深圳顺络电子股份有限公司 | A kind of preparation method of laminated sheet type electronic component |
| CN104538175A (en) * | 2014-12-19 | 2015-04-22 | 深圳顺络电子股份有限公司 | Method for manufacturing laminated electronic chip component |
| CN104553240A (en) * | 2015-01-09 | 2015-04-29 | 深圳顺络电子股份有限公司 | Molding method of laminated chip component and composite material used by molding method |
| CN105590747A (en) * | 2016-02-29 | 2016-05-18 | 深圳顺络电子股份有限公司 | Power-type component and manufacturing method thereof |
| CN106252000A (en) * | 2016-08-03 | 2016-12-21 | 代长华 | A kind of Thermistor and preparation method thereof |
| CN108629235A (en) * | 2017-03-21 | 2018-10-09 | 南昌欧菲生物识别技术有限公司 | The preparation method of fingerprint Identification sensor |
| CN107492519A (en) * | 2017-08-07 | 2017-12-19 | 中国电子科技集团公司第二十九研究所 | A kind of preparation method of multilayer co-firing ceramic substrate high desnity metal through hole |
| CN108002865A (en) * | 2017-11-29 | 2018-05-08 | 歌尔股份有限公司 | Function ceramics element and the method that electrode is formed on function ceramics layer |
| CN108002865B (en) * | 2017-11-29 | 2020-05-29 | 歌尔股份有限公司 | Functional ceramic element and method for forming electrode on functional ceramic layer |
| CN108232398A (en) * | 2017-12-25 | 2018-06-29 | 深圳顺络电子股份有限公司 | A kind of lamination component and preparation method thereof |
| CN108232398B (en) * | 2017-12-25 | 2020-06-23 | 深圳顺络电子股份有限公司 | Laminated component and manufacturing method thereof |
| CN108735487A (en) * | 2018-04-27 | 2018-11-02 | 广东光驰电子有限公司 | A kind of method and support plate for chip electronic component production |
| CN108735487B (en) * | 2018-04-27 | 2020-03-31 | 广东光驰电子有限公司 | Method for producing chip electronic component and carrier plate |
| CN111465218A (en) * | 2020-03-19 | 2020-07-28 | 国巨电子（中国）有限公司 | Low-temperature co-fired ceramic and hole filling method thereof |
| CN113436829A (en) * | 2021-06-21 | 2021-09-24 | 深圳顺络电子股份有限公司 | Magnetic device, manufacturing method and electronic component |
| CN113436829B (en) * | 2021-06-21 | 2023-07-28 | 深圳顺络电子股份有限公司 | Magnetic device, preparation method and electronic element |
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Application publication date: 20110810 |