CN201246695Y - Ceramic heat radiation substrate for chip LED encapsulation - Google Patents
Ceramic heat radiation substrate for chip LED encapsulation Download PDFInfo
- Publication number
- CN201246695Y CN201246695Y CNU2008200937809U CN200820093780U CN201246695Y CN 201246695 Y CN201246695 Y CN 201246695Y CN U2008200937809 U CNU2008200937809 U CN U2008200937809U CN 200820093780 U CN200820093780 U CN 200820093780U CN 201246695 Y CN201246695 Y CN 201246695Y
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- Prior art keywords
- substrate
- baseboard
- heat radiation
- led
- heating column
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The utility model relates to a ceramic heat radiation baseboard for LED packages, in particular to a ceramic heat radiation baseboard for sheet LED, wherein the upper side of the baseboard is provided with a patch area and a wire bond area, the lower side of the baseboard is provided with a bottom pad for connecting two electrodes of a chip via baseboard metallization wiring graphic, the baseboard is provided with an electric conduction hole for connecting the upper and lower metallization wiring graphics to electrically conduct the upper and lower layers, the baseboard is made from ceramic materials as alumina, aluminum nitride or LTCC and the like, for improving the mechanical strength of the whole baseboard, the metallization wiring graphics and the electric conduction holes are made from tungsten, molybdenum, silver or copper and the like, and the electric conduction holes are arranged on the edge of the baseboard or in the baseboard. The utility model has the advantages that the ceramic heat radiation baseboard can improve the heat radiation of SMD sheet LED package baseboard, resolve large luminous decay and reduced service life problem of LED chips caused by temperature increase, improve the resistance of LED products to high and low temperature impacts, and improve the reliability and stability of the product.
Description
Technical field
The utility model relates to a kind of LED encapsulation and uses ceramic heat-dissipating substrate, refers more particularly to a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation.
Background technology
LED is as a kind of new type light source, owing to have energy-saving and environmental protection, the life-span is long, toggle speed is fast, can control luminescent spectrum and forbid making the more high conventional light source incomparable advantage of chroma obtain developing on an unprecedented scale with the size of the width of cloth.Be accompanied by the increase of LED current strength and luminous quantity, the caloric value of led chip also rises thereupon, and for high-capacity LED, 80% of the input energy all consumes with the form of heat.If these heats can not in time be discharged the external world, cause the temperature-rise effect of chip, the life-span of LED and light output all can be had a greatly reduced quality; The pyroconductivity of the pcb board encapsulation base that tradition is used only is about 0.36W/mK, can not satisfy the heat radiation requirement of high-power LED far away.And thermal coefficient of expansion and led chip are widely different, and it is crooked that very big or packaging operation does not very easily produce heat at that time when variations in temperature, can cause chip flaw and luminous efficiency and reduce.The ceramic package substrate becomes the particularly desirable heat-radiating substrate material of high-capacity LED of LED because of having thermal conductivity height, thermal coefficient of expansion and LED crystal coupling, high can effectively the addressing these problems of electric simulation strength.
The LED packing substrate structure of prior art as shown in Figure 1 to Figure 3, matrix material is a pcb board, with copper as metallization material.Wherein Chip Area 1 is used to install chip; Routing district 2 connects an electrode of chip by welding lead; Bottom land 3 is by pedestal metallization wiring, and realization is connected with two electrodes of chip; Conduct hole 4 and connect double-layer metallization wiring up and down, realize the power-on and power-off conducting.
1), the pcb board thermal conductivity is low, causes the substrate thermal diffusivity poor the shortcoming and the reason of above-mentioned packaging substrate structure are as follows:.2), pcb board thermal coefficient of expansion and led chip differ too big, when variations in temperature is big, causes chip flaw and luminous efficiency easily and reduce, and causes luminous efficiency and life-span to be had a greatly reduced quality, and fails to reach high power, long-life specification requirement.
Based on the weak point of existing LED base plate for packaging, the inventor has designed " a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation ".
The utility model content
The utility model at above-mentioned the deficiencies in the prior art technical problem to be solved is: provide a kind of SMD of raising high-capacity LED encapsulation base heat dispersion, improvement to reach problem, enhancing LED product high-low temperature resistant degree impact property that the life-span descends greatly because of temperature rise causes the led chip light decay, and improve the ceramic heat radiation substrate for sheet-shaped LED encapsulation of product reliability and stability.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation, the upside of this substrate is provided with the routing district that is used to that the Chip Area of chip is installed and passes through welding lead connection-core plate electrode, the downside of substrate is provided with the bottom land that is connected with two electrodes of chip by the realization of pedestal metallization wiring figure, double-layer metallization wiring figure was to realize the hole that conducts of power-on and power-off conducting about substrate also was provided with and is used to connect, described substrate is made by aluminium oxide or aluminium nitride or LTCC pottery (LTCC) material, be used to improve the mechanical strength and the heat dispersion of substrate integral body, metallization wiring figure is tungsten or metals such as silver or copper with the metallization material that conducts the hole, conduct the hole and be positioned at substrate edges or inside, it can be single conducting the hole, also can be a plurality of, can be circular or other shape, can be one or more.
Described substrate can be provided with continuous high heating column and heat radiation pad, high heating column is located at substrate inside, the upside of high heating column is connected with the Chip Area, high heating column is used for the thermal conductance that chip produces is gone out, the heat radiation pad is located at the downside of substrate, be used for the heat dissipation that high heating column is derived is come out, the downside of high heating column is connected with the heat radiation pad.
Described high heating column is used to strengthen the heat-transfer effect of substrate by metal filled forming such as silver, tungsten, molybdenum or copper.
The single ceramic heat-radiating substrate can be installed single-chip or multicore sheet, the bottom internal wiring figure and the design number of plies can be according to number of chips and kind be installed respective change.
1. or 2. the concrete technological process of production of the present utility model is as follows:
1. raw material dispersion → curtain coating → section → punching (chamber) → embedding (seal hole) → planographic → (cutting) → binder removal/sintering → plating.
2. raw material dispersion → curtain coating → section → punching (chamber) → cutting → binder removal/sintering → embedding (seal hole) → planographic → metallization sintering → plating.
The beneficial effect of a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation of the utility model is: improved the heat dispersion of SMD sheet-shaped LED base plate for packaging, improved because of temperature rise causes the led chip light decay reaching the problem that the life-span descends greatly; Strengthen LED product high-low temperature resistant degree impact property, improve reliability of products, stability.Compared with prior art, the utility model possesses following characteristics is arranged:
(1) thermal diffusivity is good, and baseplate material of the present utility model is aluminium oxide or aluminium nitride or LTCC ceramic materials such as (LTCCs), and the thermal conductivity height can also be provided with in the pedestal Chip Area with the metal filled heating column of high thermal conductivity.Well solved the key issue of pedestal heat radiation.
(2) ceramic material thermal coefficient of expansion and led chip are approaching, and high-low temperature resistant degree impact property is strong, improve LED reliability of products, stability.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the overall structure vertical view of prior art LED packing substrate structure;
Fig. 2 is the overall structure upward view of prior art LED packing substrate structure;
Fig. 3 is the overall structure cutaway view of prior art LED packing substrate structure;
Fig. 4 is the overall structure vertical view of the utility model embodiment one;
Fig. 5 is the overall structure upward view of the utility model embodiment one;
Fig. 6 is the overall structure cutaway view of the utility model embodiment one;
Fig. 7 is the overall structure vertical view of the utility model embodiment two;
Fig. 8 is the overall structure upward view of the utility model embodiment two;
Fig. 9 is the overall structure cutaway view of the utility model embodiment two;
Figure 10 is the overall structure vertical view of the utility model embodiment three;
Figure 11 is the overall structure upward view of the utility model embodiment three;
Figure 12 is the overall structure cutaway view of the utility model embodiment three.
The specific embodiment
With reference to Fig. 4 and Figure 12, the utility model is to implement like this:
A kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation, the upside of this substrate (10) is provided with Chip Area (1) that is used to install chip and the routing district (2) that passes through welding lead connection-core plate electrode, the downside of substrate is provided with the bottom land (3) that is connected with two electrodes of chip by the realization of pedestal metallization wiring figure, substrate also is provided with and is used to connect double-layer metallization wiring figure up and down and conducts hole (4) with what realize the power-on and power-off conducting, substrate (10) is made by ceramic materials such as aluminium oxide or aluminium nitride or LTCC, be used to improve the mechanical strength and the heat dispersion of substrate integral body, metallization wiring figure is tungsten or metals such as silver or copper with the metallization material that conducts hole (4), conduct hole (4) and be positioned at substrate (10) edge or inside, can be circular or other shape, can be single or multiple.
In the present embodiment, substrate (10) is provided with continuous high heating column (5) and heat radiation pad (6), high heating column (5) is located at substrate (10) inside, the upside of high heating column (5) is connected with Chip Area (1), high heating column (5) is used for the thermal conductance that chip produces is gone out, heat radiation pad (6) is located at the downside of substrate (10), is used for the heat dissipation that high heating column (5) is derived is come out, and the downside of high heating column (5) is connected with heat radiation pad (6).High heating column (5) is used to strengthen the heat-transfer effect of substrate (10) by metal filled forming such as silver, tungsten, molybdenum or copper.
The above, it only is the preferred embodiment of a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation of the utility model, be not that technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model all still belongs in the scope of the utility model technology contents any trickle modification, equivalent variations and modification that top embodiment did.
Claims (3)
1, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation, the upside of this substrate (10) is provided with Chip Area (1) that is used to install chip and the routing district (2) that passes through welding lead connection-core plate electrode, the downside of substrate is provided with the bottom land (3) that is connected with two electrodes of chip by the realization of pedestal metallization wiring figure, substrate also is provided with and is used to connect double-layer metallization wiring figure up and down and conducts hole (4) with what realize the power-on and power-off conducting, it is characterized in that: described substrate (10) is made by ceramic materials such as aluminium oxide or aluminium nitride or LTCC, metallization wiring figure and conduct hole (4) and make by tungsten or silver or copper metal, conduct hole (4) and be positioned at substrate (10) edge or inside, conduct hole (4) for circular, the quantity that conducts hole (4) be single or single more than.
2, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation according to claim 1, it is characterized in that described substrate (10) is provided with the heat radiation pad (6) that is used for the high heating column (5) that chip heat is derived and is used for the dissipation of high heating column (5) derivation heat is come out, high heating column (5) is located at substrate (10) inside, the upside of high heating column (5) is connected with Chip Area (1), heat radiation pad (6) is located at the downside of substrate (10), and the downside of high heating column (5) is connected with heat radiation pad (6).
3, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation according to claim 2 is characterized in that described high heating column (5) forms by silver, tungsten, molybdenum or copper are metal filled, is used to strengthen the heat-transfer effect of substrate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200937809U CN201246695Y (en) | 2008-05-04 | 2008-05-04 | Ceramic heat radiation substrate for chip LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200937809U CN201246695Y (en) | 2008-05-04 | 2008-05-04 | Ceramic heat radiation substrate for chip LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201246695Y true CN201246695Y (en) | 2009-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2008200937809U Expired - Lifetime CN201246695Y (en) | 2008-05-04 | 2008-05-04 | Ceramic heat radiation substrate for chip LED encapsulation |
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| CN (1) | CN201246695Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148081A (en) * | 2010-11-11 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing method of laminated type ceramic electronic element |
| CN102637815A (en) * | 2012-04-16 | 2012-08-15 | 深圳市安培盛科技有限公司 | High-heat-conduction LTCC (low temperature co-fired ceramic) substrate |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
| CN103688598A (en) * | 2011-07-22 | 2014-03-26 | 京瓷株式会社 | Wiring board and electronic device |
| TWI459486B (en) * | 2012-06-21 | 2014-11-01 | 位速科技股份有限公司 | Manufacturing method of conductive column for ceramic package substrate |
| CN107834989A (en) * | 2017-11-08 | 2018-03-23 | 中国电子科技集团公司第二十六研究所 | High-heat-dissipation ceramic shell structure applied to film bulk acoustic wave device |
| WO2018121219A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat dissipation substrate, preparation method and application thereof, and electronic component |
| CN106129014B (en) * | 2016-07-25 | 2018-09-28 | 深圳天珑无线科技有限公司 | A kind of PCB core chip architecture |
| CN109320255A (en) * | 2018-11-09 | 2019-02-12 | 厦门钜瓷科技有限公司 | The preparation method of chip high heat-conducting ceramic radiator |
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
-
2008
- 2008-05-04 CN CNU2008200937809U patent/CN201246695Y/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148081A (en) * | 2010-11-11 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing method of laminated type ceramic electronic element |
| CN103688598B (en) * | 2011-07-22 | 2017-06-09 | 京瓷株式会社 | Circuit board and electronic installation |
| CN103688598A (en) * | 2011-07-22 | 2014-03-26 | 京瓷株式会社 | Wiring board and electronic device |
| CN102637815B (en) * | 2012-04-16 | 2015-03-11 | 深圳市安培盛科技有限公司 | High-heat-conduction LTCC (low temperature co-fired ceramic) substrate |
| CN102637815A (en) * | 2012-04-16 | 2012-08-15 | 深圳市安培盛科技有限公司 | High-heat-conduction LTCC (low temperature co-fired ceramic) substrate |
| TWI459486B (en) * | 2012-06-21 | 2014-11-01 | 位速科技股份有限公司 | Manufacturing method of conductive column for ceramic package substrate |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
| CN106129014B (en) * | 2016-07-25 | 2018-09-28 | 深圳天珑无线科技有限公司 | A kind of PCB core chip architecture |
| WO2018121219A1 (en) * | 2016-12-29 | 2018-07-05 | 比亚迪股份有限公司 | Heat dissipation substrate, preparation method and application thereof, and electronic component |
| CN108257929A (en) * | 2016-12-29 | 2018-07-06 | 比亚迪股份有限公司 | A kind of heat-radiating substrate and its preparation method and application and electronic component |
| CN107834989A (en) * | 2017-11-08 | 2018-03-23 | 中国电子科技集团公司第二十六研究所 | High-heat-dissipation ceramic shell structure applied to film bulk acoustic wave device |
| CN110557878A (en) * | 2018-05-31 | 2019-12-10 | 南昌欧菲生物识别技术有限公司 | Circuit board assembly, photoelectric module, depth camera and electronic device |
| CN109320255A (en) * | 2018-11-09 | 2019-02-12 | 厦门钜瓷科技有限公司 | The preparation method of chip high heat-conducting ceramic radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHAOZHOU SANHUAN ( GROUP ) CO., LTD. Free format text: FORMER OWNER: CHAOZHOU CITY SANJIANG ELECTRONICS CO. Effective date: 20090522 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Xie Cansheng Inventor before: Chen Shaohong |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: CHEN SHAOHONG TO: XIE CANSHENG |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20090522 Address after: Comprehensive building of three ring industrial city, Feng Tang, Guangdong, Chaozhou Province, China: 515646 Patentee after: Chaozhou Three-Circle (Group) Co., Ltd. Address before: Comprehensive building of three ring industrial city, Feng Tang, Guangdong, Chaozhou Province, China: 521000 Patentee before: Chaozhou Sanjiang Electronics Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20090527 |
|
| CX01 | Expiry of patent term |