CN108232398A - A kind of lamination component and preparation method thereof - Google Patents
A kind of lamination component and preparation method thereof Download PDFInfo
- Publication number
- CN108232398A CN108232398A CN201711420206.XA CN201711420206A CN108232398A CN 108232398 A CN108232398 A CN 108232398A CN 201711420206 A CN201711420206 A CN 201711420206A CN 108232398 A CN108232398 A CN 108232398A
- Authority
- CN
- China
- Prior art keywords
- electrode
- ceramic chips
- lamination
- interior
- interior electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003475 lamination Methods 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000000919 ceramic Substances 0.000 claims abstract description 52
- 239000002002 slurry Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 21
- 238000005245 sintering Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 230000005672 electromagnetic field Effects 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a kind of lamination component and preparation method thereof, production method include making in electrode the step of, it is characterised in that：Include the step of electrode in the making：1) electrode pattern makes：In being cut into interior electrode pattern through-hole on the first ceramic chips；2) lamination：Not cut second ceramic chips are taken, lamination is carried out under a predetermined with first ceramic chips, obtain the laminated body with interior electrode pattern groove；3) electrode print in：Using electrocondution slurry, contraposition printing is carried out to the interior electrode pattern groove in the laminated body, to print out interior electrode；Wherein, electrocondution slurry at least fills up the interior electrode pattern groove.Lamination component has the interior electrode made through above-mentioned steps, and thickness is 20~100 μm.
Description
Technical field
The present invention relates to a kind of lamination components and preparation method thereof.
Background technology
With the development of electronics industry, industry has the more electrical and unfailing performance of lamination component such as radio-frequency devices
For harsh requirement, and properties of product can be substantially improved in thick electrode technology and reduce loss, as realization high-performance member device
The preferred embodiment of part, has been a concern.Traditional lamination component manufacturing process, is limited to the influence of printing condition, made
For the interior thickness of electrode made substantially at 10 μm or so, maximum is no more than 20 μm；And the thickness of electrode the thick, is protected on electrode width
Shape is poor, reduces making precision；Even if having produced thick electrode, also torn in lamination process or bubbling equivalent risk may
Lead to critical defect.
The disclosure of background above technology contents is only used for inventive concept and the technical solution that auxiliary understands the present invention, not
The prior art of present patent application is necessarily belonged to, shows the applying date of the above in present patent application in no tangible proof
Before have disclosed in the case of, above-mentioned background technology should not be taken to evaluation the application novelty and creativeness.
Invention content
The present invention proposes a kind of production method of lamination component, passes through internally electricity for overcome the deficiencies in the prior art
The processing technology of pole is improved, and can make to obtain the lamination component with electrode in super thick, so as to improve lamination member device
The performance of part.
The technical solution that the present invention is proposed for the above-mentioned purpose is as follows：
A kind of production method of lamination component, including the step of electrode, being wrapped the step of electrode in the making in making
It includes：
1) electrode pattern makes：In being cut into interior electrode pattern through-hole on the first ceramic chips；
2) lamination：Not cut second ceramic chips are taken, lamination is carried out under a predetermined with first ceramic chips, obtains
To the laminated body with interior electrode pattern groove；
3) electrode print in：Using electrocondution slurry, contraposition printing is carried out to the interior electrode pattern groove in the laminated body,
To print out interior electrode；Wherein, electrocondution slurry at least fills up the interior electrode pattern groove.
Above-mentioned technical proposal provided by the invention by carrying out trepanning on the ceramic chips of pre- lamination, outputs electrode pattern
Electrocondution slurry is printed in groove (through-hole is rendered as groove after lamination) during interior electrode print, then by through-hole, then carry out lamination
Ensure that electrocondution slurry at least fills up groove (usually slightly above little by little).It thus can be thick with on-demand customization thick electrode
Degree can make thickness and be up to 100 μm much larger than electrode in the super thick of thickness of electrode in traditional laminated component.
Lead to it is highly preferred that being cut using laser opening machine to first ceramic chips and obtaining the interior electrode pattern
Hole.
It is highly preferred that also utilize the laser opening machine register guide required when being cut into interior electrode print on the first ceramic chips
Know.
It is highly preferred that the first and second ceramic chips are made by casting technique.It is accurately controlled using the technique of curtain coating
The thickness of ceramic chips, and in the present invention, the thickness of the first ceramic chips has with final required interior thickness of electrode directly to close
Connection, therefore, control ceramic chips thickness are most important.
It is highly preferred that predetermined pressure when carrying out lamination is no more than 30MPa.
It is highly preferred that obtain required interior thickness of electrode, then based on the first ceramic chips using electromagnetic field simulation software simulation
Sintering shrinkage, the thickness of the first ceramic chips is conversed using the interior thickness of electrode.
The present invention separately also proposed a kind of lamination component, which has electrode in a super thick, the super thick
It is 20 μm~100 μm to refer to thickness；Wherein, electrode makes to obtain by the following method in the super thick：In on the first ceramic chips
It is cut into interior electrode pattern through-hole；Not cut second ceramic chips are taken, are carried out under a predetermined with first ceramic chips
Lamination obtains the laminated body with interior electrode pattern groove；It is recessed to the interior electrode pattern in the laminated body using electrocondution slurry
Slot carries out contraposition printing, to print out interior electrode；Wherein, electrocondution slurry at least fills up the interior electrode pattern groove.
The above-mentioned lamination component with electrode in super thick of the present invention, the component of the same race with electrode in conventional method making
It compares, there is more preferably electric property.
Description of the drawings
Fig. 1 is to cut out the vertical view of the first ceramic chips of interior electrode pattern through-hole；
Fig. 2 is the overlapping schematic diagram of the first ceramic chips and the second ceramic chips；
Fig. 3 is interior electrode print schematic diagram；
Fig. 4 is the electrode schematic diagram that interior electrode print is not up to print request in the process；
Fig. 5 is the electrode schematic diagram that interior electrode print reaches print request in the process；
Fig. 6 is the DPA surface charts of the lamination component made by the thick electrode processing method of the present invention；
Fig. 7 is the DPA surface charts of the lamination component of electrode in existing method makes；
Fig. 8 is the insertion loss comparison diagram of bandpass filter and existing bandpass filter that the method for the present invention makes.
Specific embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
The specific embodiment of the present invention provides to make and processes thick electrode during lamination component (thickness is larger
Interior electrode) method, including following three steps：
1) electrode pattern makes：In being cut into interior electrode pattern through-hole on the first ceramic chips；This step may be used laser and open
Hole machine is cut, the contraposition required during electrode print also while in the follow-up progress of cutting when being cut into interior electrode pattern through-hole
Mark；
2) lamination：Not cut second ceramic chips are taken, lamination is carried out under a predetermined with first ceramic chips, obtains
To the laminated body with interior electrode pattern groove；
3) electrode print in：Using electrocondution slurry, contraposition printing is carried out to the interior electrode pattern groove in the laminated body,
To print out interior electrode；Wherein, electrocondution slurry at least fills up the interior electrode pattern groove.
The above-mentioned thick electrode processing method that the specific embodiment of the invention provides, can be in the manufacturing process of lamination component
Interior electrode of the thickness at 20 μm~100 μm is processed, the thickness than traditional lamination component inner electrode is much larger, and traditional is interior
General 10 μm or so of electrode is most thick to be also no more than 20 μm.And the process of entire thick electrode does not need to too high cost
And complex device.
To carry out technical scheme of the present invention in further detail and sufficient explanation below by a specific embodiment.
The present embodiment is drawn up 95 ± 0.8 μm of the lamination component inner electrode thickness of work, and lamination component is specifically a band logical
Wave filter, the detailed process of interior electrode are as follows：
With reference to figure 1, the interior electrode pattern 11 of pre- making is first cut on the first ceramic chips 10 using laser-beam drilling machine, it should
Interior electrode pattern is through-hole, i.e., through the two sides of the first ceramic chips 10.In addition, also it is cut into printing contraposition mark (in figure not
Show).Before trepanning, first the interior electrode pattern document made in advance is passed in laser opening machine, then, laser opening machine can be according to text
Shelves are cut by laser along electrode pattern profile, and the ceramic chips of area of the pattern are hollowed out, while output to print positioning
Contraposition mark.
The second ceramic chips that one is not cut through again (do not surpass with the first above-mentioned ceramic chips 10 in a scheduled stack pressure
Cross 30MPa) under overlapped, a laminated body 20 is obtained, as shown in Fig. 2, so as to, the interior electrode pattern on the first ceramic chips 10
Through-hole 11 formed in laminated body 20 in electrode pattern groove 11 '.In lamination, appropriate dwell time and dwell pressure are set
(being no more than 30Mpa), two layers of ceramic chips close adhesion can be kept in this way, recess region will not be collapsed again.
The thickness of first ceramic chips and the second ceramic chips can be identical, also can be different.But the thickness of the first ceramic chips with it is required
Interior thickness of electrode have direct correlation, in particular to：When the lamination component that given one makes in advance, according to the whole thick of component
Degree obtains the best interior thickness of electrode for the component, then based on best interior electricity by electromagnetic field simulation software simulation
Pole thickness (being given herein above 95 ± 0.8 μm in the present embodiment), according to the sintering shrinkage of the first ceramic chips, converses first
The thickness of ceramic chips, the thickness of the first ceramic chips that is, before sintering interior electrode thickness, and interior thickness of electrode (phase before being sintered
When the electrocondution slurry thickness filled when printing) it can be according to required interior thickness of electrode (in this example 95 ± 0.8 μm) and electrode slurry
Material shrinking percentage is calculated.
Preferably, the first ceramic chips and the second ceramic chips are made using the tape casting, accurately control ceramic chips thickness in this way
Degree.For example, being cast using dry type, porcelain powder, solvent, adhesive, dispersant and plasticizer etc. particular viscosity and stream have been made into
The slurry of kinetic force is transported to slurry in one fixed hopper, and slurry flows out hopper below hopper under the effect of gravity, directly
Trickling is connect in the base band of responsible carrying, while base band level moves, and does with slurry and at the uniform velocity moves together, base band and hopper it
Between, by being cast scraper control distance therebetween, so as to achieve the purpose that control base band spreading mass thickness, stream is controlled in the present embodiment
Prolong thickness at 118 ± 1 μm, that is, need the ceramic chips of 118 ± 1 μm of thickness.
After the aforementioned laminated body 20 with interior electrode pattern groove is obtained, you can electrode print in progress, such as Fig. 3 institutes
Show, being aligned and being printed using screen process press, the first ceramic chips being cut by laser are printing face, ink-covered area domain and interior electrode under silk screen
Pattern coincide, and printing process scraper 40 rolls forward with electrocondution slurry 30, and the ink-covered area domain under silk screen of electrocondution slurry 30, which is fallen on, holds
Fill groove 11 ' in print face.Micro- Microscopic observation recess region fills pattern, and measures fill part conductive paste with laser thickness gauge
Material height, if electrocondution slurry height needs to print filling again, until filling not as good as depth of groove (situation shown in Fig. 4)
Point, it is advisable with being slightly above groove, i.e. printing situation in Fig. 5 meets the requirements.
Final bandpass filter is subsequently formed through techniques such as oversinterings, by DPA (Destructive Physical Analysis) and is carried out
Interior thickness of electrode is surveyed, and thickness of electrode is d1=96 μm in obtained reality, as shown in Figure 6.For similary product, using tradition
The interior electrode of method processing, as shown in fig. 7,2=11 μm of thickness d, the manufacturing conditions of traditional handicraft determine that thickness of electrode can not
It can be made especially thick, if being made too thick, a variety of severe consequences can be brought to product.
By in above-described embodiment, the bandpass filter of electrode using conventional method with being added in method processing using the present invention
The bandpass filter of the same race of electrode is compared in work, mainly compares insertion loss, obtained correlation curve as shown in figure 8,
Wherein, the curve with black circle is the insertion loss of the bandpass filter of electrode in the method processing of the present invention, with small triangle
Curve be using the insertion loss of the bandpass filter of the same race of electrode in conventional method processing, abscissa is frequency, ordinate
That is insertion loss (more up closer to 0).As can be seen from Figure 8, on passband, the product that the present invention processes is compared to conventional method
Product, insertion loss reduce 0.7dB.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, it is impossible to assert
The specific implementation of the present invention is confined to these explanations.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all should
When being considered as belonging to protection scope of the present invention.
Claims (7)
1. a kind of production method of lamination component, including in making the step of electrode, it is characterised in that：Electrode in the making
The step of include：
1) electrode pattern makes：In being cut into interior electrode pattern through-hole on the first ceramic chips；
2) lamination：Not cut second ceramic chips are taken, lamination is carried out under a predetermined with first ceramic chips, obtains band
There is the laminated body of interior electrode pattern groove；
3) electrode print in：Using electrocondution slurry, contraposition printing is carried out to the interior electrode pattern groove in the laminated body, with print
Brush out interior electrode；Wherein, electrocondution slurry at least fills up the interior electrode pattern groove.
2. production method as described in claim 1, it is characterised in that：First ceramic chips are carried out using laser opening machine
It cuts and obtains the interior electrode pattern through-hole.
3. production method as claimed in claim 2, it is characterised in that：Also cut on the first ceramic chips using laser opening machine
Go out contraposition mark required during interior electrode print.
4. production method as described in claim 1, it is characterised in that：First and second ceramic chips are by casting technique system
.
5. production method as described in claim 1, it is characterised in that：Predetermined pressure when carrying out lamination is no more than 30MPa.
6. production method as described in claim 1, it is characterised in that：It is obtained in required using electromagnetic field simulation software simulation
Thickness of electrode, then the sintering shrinkage based on the first ceramic chips converse the thickness of the first ceramic chips using the interior thickness of electrode
Degree.
7. a kind of lamination component, it is characterised in that：With electrode in a super thick, the super thick refers to that thickness is 20 μm~100 μ
m；Wherein, electrode makes to obtain by the following method in the super thick：
In being cut into interior electrode pattern through-hole on the first ceramic chips；Not cut second ceramic chips are taken, with first green
Piece carries out lamination under a predetermined, obtains the laminated body with interior electrode pattern groove；Using electrocondution slurry, to the lamination
Interior electrode pattern groove on body carries out contraposition printing, to print out interior electrode；Wherein, electrocondution slurry at least fills up the interior electricity
Pole pattern groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711420206.XA CN108232398B (en) | 2017-12-25 | 2017-12-25 | Laminated component and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711420206.XA CN108232398B (en) | 2017-12-25 | 2017-12-25 | Laminated component and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108232398A true CN108232398A (en) | 2018-06-29 |
| CN108232398B CN108232398B (en) | 2020-06-23 |
Family
ID=62647894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711420206.XA Active CN108232398B (en) | 2017-12-25 | 2017-12-25 | Laminated component and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108232398B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020058002A1 (en) * | 2018-09-20 | 2020-03-26 | International Business Machines Corporation | Dc-capable cryogenic microwave filter with reduced kapitza resistance |
| WO2020069883A1 (en) * | 2018-10-02 | 2020-04-09 | International Business Machines Corporation | Reduced kapitza resistance microwave filter for cryogenic environments |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148081A (en) * | 2010-11-11 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing method of laminated type ceramic electronic element |
| CN103021657A (en) * | 2012-12-31 | 2013-04-03 | 广东风华高新科技股份有限公司 | Method for printing inner electrode patterns of surface-mounted type multi-layer ceramic capacitor |
| CN103606450A (en) * | 2013-11-26 | 2014-02-26 | 深圳顺络电子股份有限公司 | Laminated-coil-type device manufacturing method |
| CN103632785A (en) * | 2013-12-12 | 2014-03-12 | 深圳顺络电子股份有限公司 | Manufacturing method for inner electrode of chip component |
-
2017
- 2017-12-25 CN CN201711420206.XA patent/CN108232398B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148081A (en) * | 2010-11-11 | 2011-08-10 | 深圳顺络电子股份有限公司 | Manufacturing method of laminated type ceramic electronic element |
| CN103021657A (en) * | 2012-12-31 | 2013-04-03 | 广东风华高新科技股份有限公司 | Method for printing inner electrode patterns of surface-mounted type multi-layer ceramic capacitor |
| CN103606450A (en) * | 2013-11-26 | 2014-02-26 | 深圳顺络电子股份有限公司 | Laminated-coil-type device manufacturing method |
| CN103632785A (en) * | 2013-12-12 | 2014-03-12 | 深圳顺络电子股份有限公司 | Manufacturing method for inner electrode of chip component |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020058002A1 (en) * | 2018-09-20 | 2020-03-26 | International Business Machines Corporation | Dc-capable cryogenic microwave filter with reduced kapitza resistance |
| US10886585B2 (en) | 2018-09-20 | 2021-01-05 | International Business Machines Corporation | DC-capable cryogenic microwave filter with reduced Kapitza resistance |
| CN112640200A (en) * | 2018-09-20 | 2021-04-09 | 国际商业机器公司 | Low temperature microwave filter with reduced DC capability of the Peking resistance |
| US11108120B2 (en) | 2018-09-20 | 2021-08-31 | International Business Machines Corporation | DC-capable cryogenic microwave filter with reduced Kapitza resistance |
| WO2020069883A1 (en) * | 2018-10-02 | 2020-04-09 | International Business Machines Corporation | Reduced kapitza resistance microwave filter for cryogenic environments |
| US10897069B2 (en) | 2018-10-02 | 2021-01-19 | International Business Machines Corporation | Reduced kapitza resistance microwave filter for cryogenic environments |
| CN112771717A (en) * | 2018-10-02 | 2021-05-07 | 国际商业机器公司 | Reduced impedance microwave filter for low temperature environments |
| JP2022502836A (en) * | 2018-10-02 | 2022-01-11 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | Reduced Kapitsa resistance microwave filter for cryogenic environments |
| CN112771717B (en) * | 2018-10-02 | 2022-08-09 | 国际商业机器公司 | Thermal decoupling device and implementation method thereof |
| US11552380B2 (en) | 2018-10-02 | 2023-01-10 | Iniernational Business Machines Corporation | Reduced Kapitza resistance microwave filter for cryogenic environments |
| US11757169B2 (en) | 2018-10-02 | 2023-09-12 | International Business Machines Corporation | Reduced kapitza resistance microwave filter for cryogenic environments |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108232398B (en) | 2020-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8105453B2 (en) | Method for producing multilayer ceramic substrate | |
| CN103179812B (en) | The preparation method of high multistage HDI printed circuit board (PCB) | |
| CN103687347B (en) | A kind of manufacture method of partial hybrid printed circuit board | |
| TWI601468B (en) | Method for filling conductive paste and method for manufacturing multilayer printed wiring board | |
| CN103601501B (en) | Low temperature co-fired ceramic method by mixed conductor structure | |
| CN108232398A (en) | A kind of lamination component and preparation method thereof | |
| CN108040428A (en) | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole | |
| CN104735924B (en) | Technique of uncapping for multi-step shape Rigid Flex | |
| CN106132089B (en) | A kind of printed wiring board buries copper billet method | |
| CN105810591A (en) | Method for manufacturing ceramic part with closed cavity structure for high-frequency high-speed ceramic package shell | |
| CN108419383A (en) | Method for manufacturing printed circuit board | |
| CN102811567A (en) | Flexible and rigid combined plate process and uncapping method | |
| CN105101623B (en) | The circuit board and its manufacture craft of ultra-thin medium layer | |
| CN106793587A (en) | A kind of rigid-flex combined board with blind slot and preparation method thereof | |
| CN105934094B (en) | A kind of built-in capacity wiring board and preparation method thereof | |
| CN106271424B (en) | Strain ga(u)ge sealant forming method | |
| WO2010109985A1 (en) | Method for manufacturing electronic component | |
| CN106465536A (en) | Mother ceramic substrate, ceramic substrate, mother module component, module component, and manufacturing method for mother ceramic substrate | |
| CN204014250U (en) | For the production of the semi-finished product of the connected system of electronic component | |
| CN108990273A (en) | Bury T-type copper billet PCB plate production method | |
| CN108174532A (en) | Improving rigid-flex combined board, repeatedly lamination forms bevel edge laminating method | |
| CN208462128U (en) | A kind of pcb board convenient for pressing harmomegathus identification | |
| CN104981114B (en) | The processing method and circuit board of hanging golden finger | |
| CN103207227B (en) | Manufacturing method for oxygen sensor chips | |
| CN105792528A (en) | Replaced blind hole plate resin hole plugging process method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231120 Address after: Building A, Building 101, Building 16, Dafu Industrial Zone, Dafu Community, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Shunluo Layered Electronics Co.,Ltd. Address before: Shenzhen City, Guangdong province Baoan District 518110 sightseeing road s Fuyuan sunlord Industrial Park Patentee before: SHENZHEN SUNLORD ELECTRONICS Co.,Ltd. |