CN106271424B - Strain ga(u)ge sealant forming method - Google Patents

Strain ga(u)ge sealant forming method Download PDF

Info

Publication number
CN106271424B
CN106271424B CN201610753160.2A CN201610753160A CN106271424B CN 106271424 B CN106271424 B CN 106271424B CN 201610753160 A CN201610753160 A CN 201610753160A CN 106271424 B CN106271424 B CN 106271424B
Authority
CN
China
Prior art keywords
strain
pattern
strain gauge
sealant
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610753160.2A
Other languages
Chinese (zh)
Other versions
CN106271424A (en
Inventor
晏志鹏
刘旭
张勋
李永江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhonghang Electronic Measuring Instruments Co Ltd
Original Assignee
Zhonghang Electronic Measuring Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhonghang Electronic Measuring Instruments Co Ltd filed Critical Zhonghang Electronic Measuring Instruments Co Ltd
Priority to CN201610753160.2A priority Critical patent/CN106271424B/en
Publication of CN106271424A publication Critical patent/CN106271424A/en
Application granted granted Critical
Publication of CN106271424B publication Critical patent/CN106271424B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

A kind of strain ga(u)ge sealant forming method of the present invention can realize the making of strain gauge arbitrary graphic sealant, and qualification rate is high, and especially the special product of strain gauge hermetic unit graphics Web publishing, the advantage of this kind of method become apparent.It includes the following steps that step 1, according to strain gauge figure and process design parameter, the shape for being sealed layer pattern to strain gauge using CAD is designed;Step 2, numerically controlled mechanical engraving or laser cutting are carried out using according to design result, alignment cuts out corresponding strain gauge sealing layer pattern on sealing film;Or corresponding diel is made according to design result, using the diel, alignment cuts out and corresponding pattern-seals layer on sealant;Step 3, it will pattern-seal after layer aligns, is bonded, is laminated and cures successively with strain ga(u)ge, complete the molding of strain ga(u)ge sealant.

Description

Strain ga(u)ge sealant forming method
Technical field
The present invention relates to strain ga(u)ge manufacturing fields, specially strain ga(u)ge sealant forming method.
Background technology
Strain ga(u)ge is generally made of substrate, sensitive grid, sealant, lead etc..The main function of sealant is protection Strain gauge sensitive grid reduces external environment to the influence of strain gauge sensitive grid, enhancing strain not by external force mechanical damage, destruction The reliability of meter.Sealant uses the molding of the methods of gluing, adhesive strip film under normal conditions.
Under normal circumstances, the welding disking area of strain gauge is exposed, other regions sealant covering protection.It is close to ensure Sealing paste position, spot area is distinguished with other parts sealant telltale mark, when strain gauge manufactures, according to determining Other positions are protected or will sealant be cut to the item for needing width by hermetic unit width, then at the position that needs seal The alignment of strip gasket layer is fitted to the position that seals is needed to need the area sealed since the type of strain gauge is more by gluing Domain sizes are likely to be conventional rectangle as shown in Fig. 2, square, round, oval or irregular figure, current Method can be sealed the strain ga(u)ge of rule as shown in Figure 1 during manufacture craft, shown in Fig. 2 Sealant sealing after obtain structure as shown in Figure 3;But there is many pattern-seal cannot achieve, as shown in Figure 4 is special The strain ga(u)ge of rule, while the offset of strain gauge sealing station is also be easy to cause in technical process, these increased strains Manufacture difficulty is counted, causes sealant to paste, the decline of molding efficiency, while also bringing along strain gauge qualification rate and declining 20% left side It is right.
Manufacture craft traditionally is improved on strain gauge figure, and sealing area and welding region are increased Gap, but since strain gauge size is natively smaller, while with advances in technology, small size strain gauge becomes development side To, therefore the method by increasing sealing area and welding region gap, it suffers restraints and limits.
Invention content
For problems of the prior art, the present invention provides a kind of strain ga(u)ge sealant forming method, can Realize the making of strain gauge arbitrary graphic sealant, qualification rate is high, the especially special production of strain gauge hermetic unit graphics Web publishing The advantage of product, this kind of method becomes apparent.
The present invention is to be achieved through the following technical solutions:
Strain ga(u)ge sealant forming method, includes the following steps,
Step 1, according to strain gauge figure and process design parameter, using CAD to strain gauge sealant figure The shape of shape is designed;
Step 2, numerically controlled mechanical engraving or laser cutting are carried out using according to design result, is covered on sealing film Cut out corresponding strain gauge sealing layer pattern quarter;Or corresponding diel is made according to design result, using the punching press Mold alignment on sealant, which is cut out, corresponding pattern-seals layer;
Step 3, it will pattern-seal after layer aligns, is bonded, is laminated and cures successively with strain ga(u)ge, complete resistance-strain Count the molding of sealant.
Preferably, it in step 2, when use mechanical engraving, which is sealed a layer alignment, to be cut, is as follows,
The sealing film vacuum carved or electrostatic will be needed to be fixed on smooth table top, carry out CAD Computer and mechanical engraving device talk, drive mechanical engraving equipment operating, engraving tool sharpening depth adjusted by design result Sealing film is needed the cutting of removal part to remove, leaves needs by degree and processing graphic pattern, mechanical engraving equipment with engraving cutter Part.
Further, engraving cutter founds angle of throat tool using trigone.
Preferably, step 3 is as follows,
Layer will be pattern-sealed integrally to fix, in its adhesive surface brushing organic solvent, layer will be pattern-sealed and carried out with strain gauge Figure positions;Then application 1.0~6.0Mpa pressure will pattern-seal layer and will be bonded with strain gauge;It is finally putting into fixture and carries out heat Lamination and solidification are closed, makes to pattern-seal layer and the molding of strain gauge good bond.
Preferably, it in step 2, when use laser cutting, which is sealed a layer alignment, to be cut, is as follows,
The sealing film cut will be needed to be fixed on smooth table top with vacuum, carry out the calculating of CAD Machine and laser cutting device communicate, the operating of driving machine laser cutting device, according to the material of sealing film, adjust laser power and Sealing film is needed to remove partly cutting with laser beam and removed, leaves the part of needs by the burst length.
Further, the laser in laser cutting device is using ultraviolet laser or picosecond ultraviolet laser or picosecond infrared Laser, 3~10W of power, 15~40 μm of spot diameter, and pattern cut accurate dimension control is carried out using three-dimensional movement platform System.
Preferably, the sealing film uses modified phenolic sealing film, polyimide seal film or polyethers ether copper Sealing film.
Compared with prior art, the present invention has technique effect beneficial below:
This method controls Computer Aided Design and computer numerical control technology by ripe computer, is first carried out to pattern-sealing layer It targetedly designs, then directly sealing film can be completed automatically to accurately control processing, it is arbitrary that strain gauge may be implemented The making of layer is pattern-sealed, the especially special product of strain gauge hermetic unit graphics Web publishing, the advantage of this method is more bright It is aobvious;And can solve the problem of it is artificial at present precision is low when cutting sealant that sealant is caused to waste, reach raising production effect Rate, the purpose for improving yields.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of regular strain ga(u)ge in the prior art.
Fig. 2 is the bar shaped sealant of 1 strain ga(u)ge of corresponding diagram in the prior art.
Fig. 3 is Fig. 1 strain ga(u)ges in the prior art by the structural schematic diagram after the sealing of Fig. 2 sealants.
Fig. 4 is a kind of structural schematic diagram of irregular strain ga(u)ge in the prior art.
Fig. 5 is the special graph sealant of the design of 4 strain ga(u)ge of corresponding diagram of the present invention.
Fig. 6 is the structural schematic diagram after Fig. 4 strain ga(u)ges described in present example are sealed by Fig. 5 sealants.
Specific implementation mode
With reference to specific embodiment, the present invention is described in further detail, it is described be explanation of the invention and It is not to limit.
The present invention seals layer pattern according to strain gauge design configuration and technological requirement design strain gauge first, then passes through machine The mode of tool engraving, laser cutting or mould punching, set carves corresponding strain gauge sealing layer pattern on sealant, finally will Sealant aligns with strain gauge, is bonded, is laminated, cures.Sealing layer material has modified phenolic, polyimides, polyethers ether copper etc..Energy It is enough when solving strain gauge well and making sealant, sealant is in irregular shape, artificial cutting sealant when precision is low, it is close to cause Sealing waste, even artificial impossible deficiency, realize strain ga(u)ge sealant and prepare and be molded.
Embodiment one
Step 1, as shown in figure 4, according to strain gauge figure and technique, using CAD strain gauge sealant figure The shape of shape.
Step 2, part extra on sealant is cut using engraving mode.
The sealing film vacuum carved or electrostatic will be needed to be fixed on smooth table top, computer is set with mechanical engraving Standby communication drives the mechanical engraving equipment operation of similar printer, adjusts engraving cutter working depth, and equipment directly will with cutter Sealing film needs to remove part cutting removal, leaves the part of needs.Wherein, engraving cutter founds sword using trigone, rigidity, strong Degree is big, sharp, and the quick overall separation of film can be formed and pattern-seal layer, as shown in Figure 5 by when cutting.
Step 3, the sealant after cutting is aligned with strain gauge, be bonded, be laminated, cured.Layer will be pattern-sealed integrally to release Put, will pattern-seal layer using tooling integrally fixes, sealant adhesive surface brushing organic solvent recruitment dress by sealant with answer Become meter and carry out figure positioning, applies 1.0~6.0Mpa pressure and be bonded sealant with strain gauge.It is finally putting into fixture and carries out height Warm high pressure heat seal lamination, solidification, make sealant be molded with strain gauge good bond, as shown in Figure 6.
Embodiment two
Step 1, as shown in figure 4, according to strain gauge figure, strain gauge is drawn using CAD and seals layer pattern Shape.
Step 2, part extra on sealant is cut by the way of laser cutting.
The sealing film cut will be needed to be fixed on smooth table top with vacuum, computer is logical with laser cutting device News, the operating of driving machine laser cutting device adjust laser power, burst length according to different materials, directly will be close with laser beam Sealing film needs to remove part cutting removal, leaves the part of needs, as shown in Figure 5.Laser uses ultraviolet laser or skin Second ultraviolet laser or picosecond infrared laser, 3~10W of power, 15~40 μm of spot diameter, and using three-dimensional movement platform into Row pattern cut accurate dimension controls.Ensure laser beam only by the quick overall separation of film, shape by adjusting parameter when cutting At layer is pattern-sealed, any influence will not be generated to coating semi-solid preparation epoxy resin on sealant and sealant.
Step 3, the sealant after cutting is aligned with strain gauge, be bonded, be laminated, cured.Using follow-up with embodiment one It is bonded, fixes, be laminated, cures consistent method, layer will be pattern-sealed and be molded with strain gauge good bond, as shown in Figure 6.
Embodiment three
Step 1, as shown in figure 4, drawing corresponding strain gauge according to the figure of strain gauge and technique seals layer pattern.
Step 2, according to strain gauge sealant graphic making mold.Mold uses die cutting die.
Step 3, sealing film is stamped and formed out using punching machine plus mold and pattern-seals layer, as shown in figure 5, the method is crucial It is to fix sealant using tooling attach, position, forms positioning pattern.It is by adjusting the true mold blade of parameter when cutting By the quick overall separation of film, other, the defects of flash, deformation, dislocation will not be generated will not be injured, then with embodiment one Follow-up fitting, fixed, lamination, curing are consistent, will pattern-seal layer and are molded with strain gauge good bond.
Step 4, the sealant after cutting is aligned with strain gauge, be bonded, be laminated, cured, as shown in Figure 6.

Claims (4)

1. strain ga(u)ge sealant forming method, which is characterized in that include the following steps,
Step 1, according to strain gauge figure and process design parameter, layer pattern is sealed to strain gauge using CAD Shape is designed;
Step 2, numerically controlled mechanical engraving or laser cutting are carried out using according to design result, alignment is cut out on sealing film Cut out corresponding strain gauge sealing layer pattern;Or corresponding diel is made according to design result, using the diel Alignment, which is cut out, on sealant corresponding pattern-seals layer;
When use mechanical engraving, which is sealed a layer alignment, to be cut, it is as follows,
The sealing film vacuum carved or electrostatic will be needed to be fixed on smooth table top, carry out the meter of CAD Calculation machine and mechanical engraving device talk drive mechanical engraving equipment operating, by design result adjust engraving cutter working depth with Sealing film is needed to remove partly cutting with engraving cutter and removed by processing graphic pattern, mechanical engraving equipment, leaves the part of needs;
When use laser cutting, which is sealed a layer alignment, to be cut, it is as follows,
The sealing film that cuts will be needed to be fixed on smooth table top with vacuum, carry out the computer of CAD with Laser cutting device communicates, and the operating of driving machine laser cutting device adjusts laser power and pulse according to the material of sealing film Sealing film is needed to remove partly cutting with laser beam and removed, leaves the part of needs by the time;
Step 3, it will pattern-seal after layer aligns, is bonded, is laminated and cures successively with strain ga(u)ge, it is close to complete strain ga(u)ge The molding of sealing;Integrally fixed specifically, layer will be pattern-sealed, in its adhesive surface brushing organic solvent, will pattern-seal layer with Strain gauge carries out figure positioning;Then application 1.0~6.0Mpa pressure will pattern-seal layer and will be bonded with strain gauge;It is finally putting into folder Heat seal lamination and solidification are carried out in tool, make to pattern-seal layer and the molding of strain gauge good bond.
2. strain ga(u)ge sealant forming method according to claim 1, which is characterized in that engraving cutter uses trigone Vertical angle of throat tool.
3. strain ga(u)ge sealant forming method according to claim 1, which is characterized in that in laser cutting device Laser is using ultraviolet laser or picosecond ultraviolet laser or picosecond infrared laser, 3~10W of power, and spot diameter 15~ 40 μm, and pattern cut accurate dimension control is carried out using three-dimensional movement platform.
4. strain ga(u)ge sealant forming method according to claim 1, which is characterized in that the sealing film is adopted With modified phenolic sealing film, polyimide seal film or polyethers ether copper sealing film.
CN201610753160.2A 2016-08-26 2016-08-26 Strain ga(u)ge sealant forming method Active CN106271424B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610753160.2A CN106271424B (en) 2016-08-26 2016-08-26 Strain ga(u)ge sealant forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610753160.2A CN106271424B (en) 2016-08-26 2016-08-26 Strain ga(u)ge sealant forming method

Publications (2)

Publication Number Publication Date
CN106271424A CN106271424A (en) 2017-01-04
CN106271424B true CN106271424B (en) 2018-08-24

Family

ID=57675274

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610753160.2A Active CN106271424B (en) 2016-08-26 2016-08-26 Strain ga(u)ge sealant forming method

Country Status (1)

Country Link
CN (1) CN106271424B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107933003A (en) * 2017-11-14 2018-04-20 中航电测仪器股份有限公司 A kind of strain gauge cap rock diaphragm seal and preparation method thereof and application method
CN112985652B (en) * 2019-12-17 2023-11-28 北京钛方科技有限责任公司 Strain gauge, preparation method thereof and mounting method thereof
CN110895130B (en) * 2019-12-28 2021-07-20 中航电测仪器股份有限公司 Diaphragm type strain gauge and optimization method thereof

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2751282Y (en) * 2004-12-01 2006-01-11 周国玉 Steel plate strain meter
CN201093998Y (en) * 2007-10-16 2008-07-30 中航电测仪器股份有限公司 Polyimide film substrate deformeter
CN201583213U (en) * 2010-01-06 2010-09-15 中航电测仪器股份有限公司 Engineering plastic film substrate strain gauge
JP2011181887A (en) * 2010-02-08 2011-09-15 Fujifilm Corp Metal substrate with insulating layer and manufacturing method thereof, semiconductor device and manufacturing method thereof, solar cell and manufacturing method thereof, electronic circuit and manufacturing method thereof, and light-emitting element and manufacturing method thereof
CN102422730A (en) * 2009-05-13 2012-04-18 莱尔德技术股份有限公司 Conductive films for emi shielding applications
CN202216658U (en) * 2011-09-13 2012-05-09 中航电测仪器股份有限公司 Annular resistance strain gauge
CN102636106A (en) * 2012-04-25 2012-08-15 中航电测仪器股份有限公司 Medium-temperature foil type resistance strain gauge
CN102661752A (en) * 2012-04-25 2012-09-12 中航电测仪器股份有限公司 Foil type strain gauge and manufacturing method thereof
CN103604363A (en) * 2013-11-30 2014-02-26 中航电测仪器股份有限公司 Strain meter for plastic deformation test and manufacturing and calibration method thereof
CN103615967A (en) * 2013-11-30 2014-03-05 中航电测仪器股份有限公司 High-temperature foil strain gauge and method for manufacturing high-temperature foil strain gauge
CN204085435U (en) * 2014-07-10 2015-01-07 中国船舶重工集团公司第七一九研究所 A kind of displacement transducer for deep-sea
CN104359393A (en) * 2014-11-28 2015-02-18 中航电测仪器股份有限公司 Strain gauge and methods for manufacturing and mounting strain gauge

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3633176B1 (en) * 2012-07-25 2024-05-22 Walbro LLC Carburetor with a layered diaphragm

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2751282Y (en) * 2004-12-01 2006-01-11 周国玉 Steel plate strain meter
CN201093998Y (en) * 2007-10-16 2008-07-30 中航电测仪器股份有限公司 Polyimide film substrate deformeter
CN102422730A (en) * 2009-05-13 2012-04-18 莱尔德技术股份有限公司 Conductive films for emi shielding applications
CN201583213U (en) * 2010-01-06 2010-09-15 中航电测仪器股份有限公司 Engineering plastic film substrate strain gauge
JP2011181887A (en) * 2010-02-08 2011-09-15 Fujifilm Corp Metal substrate with insulating layer and manufacturing method thereof, semiconductor device and manufacturing method thereof, solar cell and manufacturing method thereof, electronic circuit and manufacturing method thereof, and light-emitting element and manufacturing method thereof
CN202216658U (en) * 2011-09-13 2012-05-09 中航电测仪器股份有限公司 Annular resistance strain gauge
CN102636106A (en) * 2012-04-25 2012-08-15 中航电测仪器股份有限公司 Medium-temperature foil type resistance strain gauge
CN102661752A (en) * 2012-04-25 2012-09-12 中航电测仪器股份有限公司 Foil type strain gauge and manufacturing method thereof
CN103604363A (en) * 2013-11-30 2014-02-26 中航电测仪器股份有限公司 Strain meter for plastic deformation test and manufacturing and calibration method thereof
CN103615967A (en) * 2013-11-30 2014-03-05 中航电测仪器股份有限公司 High-temperature foil strain gauge and method for manufacturing high-temperature foil strain gauge
CN204085435U (en) * 2014-07-10 2015-01-07 中国船舶重工集团公司第七一九研究所 A kind of displacement transducer for deep-sea
CN104359393A (en) * 2014-11-28 2015-02-18 中航电测仪器股份有限公司 Strain gauge and methods for manufacturing and mounting strain gauge

Also Published As

Publication number Publication date
CN106271424A (en) 2017-01-04

Similar Documents

Publication Publication Date Title
CN106271424B (en) Strain ga(u)ge sealant forming method
CN105273647B (en) A kind of processing method of adhesive article
CN202062460U (en) Position sheathing die-cutting rule
CN103921525B (en) Dielectric film continuous shaping method is covered in radome
CN106793587A (en) A kind of rigid-flex combined board with blind slot and preparation method thereof
CN104228299B (en) A kind of pad pasting work piece production technique
CN210733409U (en) Bidirectional reverse half-cutting die
CN203221130U (en) Die for manufacturing ladder-shaped side of cable bridge
CN204625470U (en) A kind of break-up device for double-deck OLED mother matrix glass
CN102632143A (en) Plate trimming scrap cutter
CN204263620U (en) Be suitable for the steel bed die making hardening of soft package impression
CN105522350B (en) Special-shaped thickness Clip part processing methods
CN206030059U (en) High temperature adhesive tape die -cutting rule mode structure
CN105517326B (en) It is a kind of local without glue reinforcing chip moulding process
CN108555130B (en) Steel sheet punching and deburring machining process
CN205891474U (en) Combined mold cutter that label comes unglued and laminates
CN205928896U (en) Die -cut cutting die device
CN206519492U (en) A kind of thermal sensitive piece pressing equipment
WO2014106500A2 (en) Mold cup trimming device
CN206825583U (en) A kind of die-cutting machine decompressor
CN209273621U (en) Cutter and rubber product producing device
CN201880796U (en) Punching cut die for left and right rear wheel covers of automobile
CN207723401U (en) A kind of small-sized forging part trimming assembling die
CN102825129B (en) Processing method of radial rectangular hole in pin and special die thereof
CN204673817U (en) A kind of special segmenting device of high voltage silicon rectifier stack

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant