CN115732230B - Preparation process of chip type multilayer ceramic capacitor - Google Patents
Preparation process of chip type multilayer ceramic capacitor Download PDFInfo
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- CN115732230B CN115732230B CN202211472943.5A CN202211472943A CN115732230B CN 115732230 B CN115732230 B CN 115732230B CN 202211472943 A CN202211472943 A CN 202211472943A CN 115732230 B CN115732230 B CN 115732230B
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Abstract
The invention discloses a preparation process of a chip type multilayer ceramic capacitor, which comprises the following steps: preparing ceramic slurry; coating the substrate in a slit lip coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blowing, and obtaining a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10 mu m; printing the inner electrode slurry on the ceramic membrane by a screen printing plate, and obtaining a bar block after the ceramic membrane printed with the inner electrode is overlapped in a staggered way; and (3) covering the bar block, laminating, cutting, discharging glue, sintering, chamfering, terminating, burning the end and processing the end to obtain the multilayer ceramic capacitor. The application combines the two modes of slit lip coating and three-section drying and blowing, so that the ceramic membrane is formed with high quality, the thickness of the ceramic membrane is 1-10um, the membrane is thin and high in quality, and the multilayer chip ceramic capacitor is beneficial to developing towards the ultra-thin membrane and the high lamination direction.
Description
Technical Field
The invention relates to the technical field of chip multilayer ceramic capacitor production, in particular to a preparation process of a chip multilayer ceramic capacitor.
Background
Multilayer chip ceramic capacitors, abbreviated as MLCCs, are among the most widely used passive components today, and all consumer electronics basically have to use this component, which is known as "electronics industry rice". Along with the smaller and smaller volumes of electronic products such as notebook computers, smart phones and cameras, the functions are more and more, and new requirements are also put forward for the multilayer chip ceramic capacitor, so that the multilayer chip ceramic capacitor is also developed towards the directions of ultra-thin films and high lamination.
The production process of the multilayer chip ceramic capacitor generally comprises the steps of proportioning, casting, printing, laminating, capping, laminating, cutting, glue discharging, sintering, chamfering, terminating, firing end, end treatment and the like, wherein the casting step is to coat slurry on a PET film, and then obtain a ceramic film after drying, and the thickness and uniformity of the casting coating and the quality of drying can directly influence the thickness and quality of the ceramic film. In the prior art, the thickness of the ceramic membrane after coating is about 20um, which is unfavorable for the development of the multilayer chip ceramic capacitor in the ultra-thin film and high lamination direction, and the existing drying effect is not ideal, and the quality of the obtained ceramic membrane is directly influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a preparation process of a chip type multilayer ceramic capacitor.
The invention discloses a preparation process of a chip type multilayer ceramic capacitor, which comprises the following steps:
preparing ceramic slurry;
coating the substrate in a slit lip coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blowing, and obtaining a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10 mu m;
printing the inner electrode slurry on the ceramic membrane by a screen printing plate, and obtaining a bar block after the ceramic membrane printed with the inner electrode is overlapped in a staggered way;
and (3) covering the bar block, laminating, cutting, discharging glue, sintering, chamfering, terminating, burning the end and processing the end to obtain the multilayer ceramic capacitor.
According to one embodiment of the present invention, a substrate is coated by means of slot die coating to form a slurry film, comprising the sub-steps of:
the slit discharge port of the coating die head is contacted with the moving substrate; the coating die head comprises an upper die lip, a lower die lip and a slit adhesive tape, wherein the slit adhesive tape is positioned between the upper die lip and the lower die lip, and after the upper die lip and the lower die lip are clamped, the slit adhesive tape enables the upper die lip and the lower die lip to reserve a slit discharge port, and the width of the slit discharge port is equal to the thickness of the slit adhesive tape;
the ceramic slurry is flow coated through a slit discharge port of a coating die head and attached to a moving substrate to obtain a slurry film.
According to one embodiment of the invention, the outer surface of the upper die lip at the discharge port is an arc surface.
According to one embodiment of the invention, the outer surface of the lower die lip at the discharge port is beveled.
According to one embodiment of the invention, the substrate has a curvature of movement at a location where it contacts the slot exit of the coating die.
According to an embodiment of the invention, the slurry film is dried by three sections of drying blowers, and then a ceramic membrane is obtained, comprising the following sub-steps:
drying the slurry film by using dispersed air;
drying the slurry film by sectional wind;
and drying the slurry film by concentrated air.
According to one embodiment of the present invention, the slurry film is dried by dispersing wind, comprising: the upper surface of the slurry film is blown through the uniform bellows, so that the upper surface of the slurry film is uniformly blown, and the lower surface of the slurry film is blown through a plurality of splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened and blown.
According to one embodiment of the invention, the slurry film is dried by sectional wind, comprising: the upper surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, so that the upper surface of the slurry film is blown in a segmented manner, and the lower surface of the slurry film is blown by a plurality of outer splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened; wherein, a plurality of interior splayed wind gap casees that are located the top and a plurality of outer splayed wind gap casees that are located the below are crisscross setting in proper order.
According to one embodiment of the present invention, the slurry film is dried by concentrated wind, comprising: the upper surface of the slurry film is blown through a plurality of inner splayed air port boxes which are sequentially arranged at intervals, the lower surface of the slurry film is blown through a plurality of inner splayed air port boxes which are sequentially arranged at intervals, and the upper surface and the lower surface of the slurry film are intensively blown through the cooperation of the plurality of inner splayed air port boxes which are positioned above and the plurality of inner splayed air port boxes which are positioned below; wherein, the splayed wind gap case in being located the top and the splayed wind gap case in a plurality of in being located the below set up alternately in proper order.
According to an embodiment of the invention, it further comprises the steps of:
the multilayer ceramic capacitor is subjected to appearance selection, testing and taping.
The beneficial effects of this application lie in: the ceramic membrane is formed with high quality through the combination of the slit lip coating and three-stage drying and blowing drying, the thickness of the ceramic membrane is 1-10um, the membrane is thin and has high quality, and the multilayer chip ceramic capacitor is beneficial to developing towards the ultra-thin membrane and high lamination direction.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a flowchart of a process for manufacturing a chip multilayer ceramic capacitor in an embodiment;
fig. 2 is a schematic structural diagram of an MLCC casting machine in an embodiment;
FIG. 3 is a schematic view of a coating mechanism according to an embodiment;
FIG. 4 is a schematic view showing the structure of a coating die in the embodiment;
FIG. 5 is an enlarged view of portion A of FIG. 4 in an embodiment;
FIG. 6 is an exploded view of the coating die in an embodiment;
fig. 7 is a schematic structural view of a drying mechanism in the embodiment;
FIG. 8 is an enlarged view of portion B of FIG. 7 in an embodiment;
FIG. 9 is an enlarged view of portion C of FIG. 7 in an embodiment;
FIG. 10 is an enlarged view of portion D of FIG. 7 in an embodiment;
FIG. 11 is a schematic diagram of the structure of the out-splayed tuyere box in the embodiment;
fig. 12 is a schematic structural view of a box with a splayed tuyere in the embodiment.
Detailed Description
Various embodiments of the invention are disclosed in the following drawings, in which details of the practice are set forth in the following description for the purpose of clarity. However, it should be understood that these practical details are not to be taken as limiting the invention. That is, in some embodiments of the invention, these practical details are unnecessary. Moreover, for the sake of simplicity of the drawing, some well-known and conventional structures and elements are shown in the drawings in a simplified schematic manner.
It should be noted that all directional indications such as up, down, left, right, front, and rear … … in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture such as that shown in the drawings, and if the particular posture is changed, the directional indication is changed accordingly.
In addition, the descriptions of the "first", "second", etc. in this application are for descriptive purposes only and are not intended to specifically indicate a sequential or a cis-position, nor are they intended to limit the invention, but are merely intended to distinguish between components or operations described in the same technical term, and are not to be construed as indicating or implying a relative importance or implying that the number of technical features indicated is not necessarily limited. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
For a further understanding of the invention, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings in which:
referring to fig. 1, fig. 1 is a flowchart of a process for manufacturing a chip multi-layer ceramic capacitor in an embodiment. The preparation process of the chip multilayer ceramic capacitor in this embodiment includes the steps of:
s1, preparing ceramic slurry;
s2, coating a substrate in a slit lip coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blowing, and obtaining a ceramic film, wherein the thickness of the ceramic film is 1-10 mu m;
s3, printing the inner electrode slurry on the ceramic membrane through a screen printing plate, and obtaining a bar block after the ceramic membrane printed with the inner electrode is overlapped in a staggered manner;
s4, covering, laminating, cutting, discharging glue, sintering, chamfering, terminating and processing the bar block to obtain the multilayer ceramic capacitor.
The ceramic membrane is formed with high quality through the combination of the slit lip coating and three-stage drying and blowing drying, the thickness of the ceramic membrane is 1-10um, the membrane is thin and has high quality, and the multilayer chip ceramic capacitor is beneficial to developing towards the ultra-thin membrane and high lamination direction.
In step S1, the prepared ceramic slurry may be prepared by adopting the component formulation and preparation method of the existing ceramic slurry, for example, mixing ceramic powder, binder and solvent, and then ball milling to form ceramic slurry, wherein specific component proportioning and ball milling time can be referred to in the existing ceramic slurry preparation, and will not be described herein.
In order to further understand the coating and drying process of step S2 in the preparation process of the chip multilayer ceramic capacitor of the present invention, an MLCC casting machine is now introduced, which is used to perform the casting step in step S2, that is, the process of coating ceramic slurry onto a substrate and drying, so as to further illustrate the functions and effects of two innovative points of slit lip coating and three-stage drying and blowing drying in the casting process in the preparation process of the chip multilayer ceramic capacitor.
Referring again to fig. 2 to 6, fig. 2 is a schematic structural view of the MLCC casting machine according to the embodiment, fig. 3 is a schematic structural view of the coating mechanism according to the embodiment, fig. 4 is a schematic structural view of the coating die according to the embodiment, fig. 5 is an enlarged view of a portion a of fig. 4 according to the embodiment, and fig. 6 is an exploded structural view of the coating die according to the embodiment. The MLCC casting machine in the embodiment comprises a feeding mechanism 1, a die head mechanism 2, a drying mechanism 3, a deviation correcting mechanism 4 and a winding mechanism 5. The drying mechanism 3 in this embodiment has feed end and discharge end both ends, wherein die head mechanism 2 and the adjacent setting of feed end of drying mechanism 3, feed mechanism 1 locates the lower part of drying mechanism 3, so can reduce feed mechanism 1's material loading position, be convenient for change that the material was rolled up, the material is rolled up promptly and is rolled up for the material of substrate, and feed mechanism 1 is close to die head mechanism 2, in order to the substrate of release extend to die head mechanism 2, mechanism 4 is adjacent with the discharge end of drying mechanism 3, winding mechanism 5 is located the one side that mechanism 4 kept away from drying mechanism 3 of rectifying, the MLCC casting machine is whole to be the linear arrangement. The feeding mechanism 1 is used for feeding a base material, and the base material in the embodiment is a PET film; the die head mechanism 2 is used for feeding ceramic slurry, and coating the ceramic slurry on a substrate to form a slurry film; the drying mechanism 3 is used for receiving the slurry film and performing three-section drying to obtain a ceramic film; the deviation rectifying mechanism 4 receives the dried ceramic membrane to rectify the deviation so as to facilitate the subsequent rolling and avoid rolling deviation; and the winding mechanism 5 receives the ceramic film subjected to deviation correction for winding. And (3) die-cutting the rolled ceramic membrane on other devices to form a sheet, so that the ceramic membrane is obtained. In this embodiment, the feeding mechanism 1, the deviation rectifying mechanism 4 and the winding mechanism 5 may all adopt existing structures, and in addition, in the die head mechanism 2 and the drying mechanism 3, for example, ceramic slurry feeding, feeding of the PET film, heating, purifying and filtering structures of the drying wind, etc. may all refer to the prior art, and no further description is provided herein. The structure of the drying mechanism 3 for realizing three-stage drying by drying and blowing is described in detail by realizing slit lip coating in the die mechanism 2, so that the improved coating and drying process of the present invention will be further described.
The die mechanism 2 includes a die frame 21, two back rollers 22, a coating die 23, and a driving roller 24. The two back rollers 22 are arranged on the die frame 21 at intervals along the height direction, the two back rollers 22 are arranged vertically opposite to each other, a space is reserved between the two back rollers, the coating die 23 is arranged on the die frame 21 and is positioned on one side of the back rollers 22 away from the drying mechanism 3, a slit discharge port of the coating die 23 is opposite to a space between the two back rollers 22, a driving roller 24 is arranged on the die frame 21 (not shown in the figure) and is arranged on one side of the back rollers 22 away from the coating die 23, and the driving roller 24 in the embodiment is positioned above the back rollers 22 so that a coated slurry film enters the drying mechanism 3 from above. After the coiled substrate 100 is released and fed by the feeding mechanism 1, the strip-shaped substrate 100 sequentially winds around the two back rollers 22 and the driving roller 24 from the same side direction adjacent to the coating die head 23 from bottom to top, and then extends into the drying mechanism 3, so that the substrate 100 passes through the slit discharge port 200 of the coating die head 23 along the height direction, and the substrate 100 contacts with the slit discharge port 200 of the coating die head 23. The driving roller 24 is used as a driving source to rotate, so that the substrate 100 is driven to move, and the substrate 100 passes through the slit discharge opening 200 of the coating die 23 contacted with the substrate in a moving state.
In step S2, the substrate is coated by means of slot die coating to form a slurry film, which comprises the following sub-steps:
s21, a slit discharge port 200 of the coating die 23 is contacted with the moving substrate 100; the coating die 23 includes an upper die lip 231, a lower die lip 232, and a slit tape 233, the slit tape 233 is located between the upper die lip 231 and the lower die lip 232, after the upper die lip 231 and the lower die lip 232 are clamped, the slit tape 233 makes the upper die lip 231 and the lower die lip 232 reserve a slit discharge port 200, and the width of the slit discharge port 200 is equal to the thickness of the slit tape 233. In this embodiment, the slit adhesive tape 233 is attached to the surface of the lower die lip 232 facing the upper die lip 231, specifically, the slit adhesive tape 233 can be attached to the edge of the lower die lip 232, which is not close to the two sides of the die cavity 2321, and then the upper die lip 231 and the lower die lip 232 are clamped, because the slit adhesive tape 233 forms the slit outlet 200 between the upper die lip 231 and the lower die lip 232, the width of the slit outlet 200 is consistent with the thickness of the slit adhesive tape 233, and the slit outlet 200 can be formed by selecting a plurality of thick slit adhesive tapes 233, so that the ceramic slurry can only flow out from the slit with the same thickness as the slit adhesive tape 233 when flowing out from the slit outlet 200, and the thickness of the flowing ceramic slurry is weak, compared with the conventional method that the adhesive tape can form a narrower slit outlet by taking a steel strip gasket as a lattice baffle between the upper die lip 231 and the lower die lip 232, the slit outlet can be formed without fail. Compared with the traditional interval arrangement between the discharge hole and the base material, the slurry is sprayed onto the base material from the discharge hole, so that the thickness of the slurry on the base material cannot be made very thin, the slit discharge hole 200 is contacted with the moving base material 100, after the ceramic slurry enters the die cavity 2321 through the pipeline, the ceramic slurry with particles smaller than 1um can flow out from the slit discharge hole 200 and flow onto the base material 100 because the internal pressure of the die cavity 2321 is higher than the external pressure, and the flowing ceramic slurry can be directly attached onto the moving base material 100 to form a slurry film, and the thickness of the ceramic film can be up to 1um at the thinnest after drying. In this embodiment, the slit adhesive tape 233 may be an acid-resistant adhesive tape, and the specific thickness thereof may be selected according to the requirement, for example, the slit adhesive tape 233 with a thickness of 1-10um is not described herein.
S22, the ceramic slurry is flow-coated through the slit outlet 200 of the coating die 23 and attached to the moving substrate 100, to obtain a slurry film. The slit discharge port 200 of the coating die 23 is arranged in contact with the moving substrate 100, and the width of the slit discharge port 200 is limited by the slit adhesive tape 233, so that an ultrathin slurry film can be formed, a ceramic film with the thickness of 1-10um can be obtained later, and the ceramic film with the thickness of 1um can be obtained by actual measurement after the MLCC tape casting machine in the embodiment is used for coating and drying for many times. The coating speed in this example was 120m/min.
Preferably, in order to better achieve the contact between the slit outlet 200 and the moving substrate 100, the outer surface of the outlet of the upper die lip 231 in the present invention is an arc surface b, and the outer surface of the outlet of the lower die lip 232 is an inclined surface c. It will be appreciated that the slot discharge port 200 is in contact with the moving substrate 100, and is moved from the outer surface of the discharge port of the lower die lip 232 toward the outer surface of the discharge port of the upper die lip 231, so that the moving substrate 100 smoothly enters by setting the outer surface of the discharge port of the lower die lip 232 as an inclined surface, and the moving substrate 100 smoothly moves out by setting the outer surface of the discharge port of the die lip 231 as an arc surface.
Preferably, the substrate 100 has a curvature of movement at the point of contact with the slot die 200 of the coating die 23. It will be appreciated that the substrate 100 is flexible in order to maintain the stability of the substrate 100 in contact with the slot exit 200 of the coating die such that the contact between the substrate 100 and the slot exit 200 of the coating die forms a slight arc, while not affecting the movement of the substrate 100, and while ensuring the contact stability of the substrate 100 with the slot exit 200 of the coating die 23. For example, in the embodiment, if the angle in the height direction of the line defining the center point of the two opposite back rollers 22 is 180 degrees, the angle in the height direction of the substrate 100 between the two back rollers 22 is 179.5-179.8 degrees, so that the substrate 100 forms a movement arc of 0.2-0.5 degrees to maintain the connection state of the slit discharge port 200 and the moving substrate 100, and ensure that the ceramic slurry flowing out of the slit discharge port 200 can be directly adhered to the substrate 100.
Referring to fig. 7 to 12, fig. 7 is a schematic structural view of the drying mechanism in the embodiment, fig. 8 is an enlarged view of a portion B of fig. 7 in the embodiment, fig. 9 is an enlarged view of a portion C of fig. 7 in the embodiment, fig. 10 is an enlarged view of a portion D of fig. 7 in the embodiment, fig. 11 is a schematic structural view of the out-splayed tuyere box in the embodiment, and fig. 12 is a schematic structural view of the in-splayed tuyere box in the embodiment. The drying mechanism 3 comprises a first drying section 31, a second drying section 32 and a third drying section 33 which are sequentially and adjacently arranged, the slurry film 101 sequentially passes through the first drying section 31, the second drying section 32 and the third drying section 33, and three sections of drying, blowing and drying are carried out on the slurry film 101 by the first drying section 31, the second drying section 32 and the third drying section 33, so that the ceramic membrane is obtained.
In step S2, the slurry film 101 is dried by three-stage drying and blowing, and then a ceramic membrane is obtained, including the following sub-steps:
s23, drying the slurry film 101 by dispersed air;
s24, drying the slurry film 101 by sectional wind;
s25, the slurry film 101 is dried by concentrated air.
The above steps S23 to S25 are specifically implemented by performing three sections of drying and blowing drying on the slurry film by using the first drying section 31, the second drying section 32 and the third drying section 33 in the drying mechanism 3, where the dispersing wind drying of the first section enables the slurry film to obtain dispersed soft wind drying, the wind force is soft, the ceramic slurry which is not yet dried on the substrate is prevented from being blown away, the uniformity of the ceramic slurry is ensured, then the second section of sectional wind is subjected to strong wind drying by sectioning, the slurry film is subjected to sectional concentrated wind force at this moment, the initially shaped ceramic slurry on the substrate is cured, and then the concentrated wind drying of the third section is performed, and the concentrated wind drying is performed on the slurry film at this moment, so that the ceramic slurry on the substrate is quickly cured completely, thereby avoiding longer drying time.
Wherein, in step S23, the slurry film is dried by the dispersed wind, including: the upper surface of the slurry film 101 is blown through the uniform bellows 311, so that the upper surface of the slurry film 101 is uniformly blown, and the lower surface of the slurry film 101 is blown through a plurality of splayed air port boxes 312 which are sequentially arranged at intervals, so that the lower surface of the slurry film 101 is flattened.
Specifically, in the first drying section 31, the slurry film 101 passes through the middle of the first drying section 31, and a uniform bellows 311 above the slurry film 101 is located below the slurry film 101, and a plurality of splayed tuyere boxes 312 are sequentially and alternately arranged. Wherein even bellows 311 is cuboid form box structure, and its one side towards thick liquids film 101 evenly distributed has the micropore, and after the hot-blast entering into even bellows 311 after the purification, blow the thick liquids film 101 of below by evenly distributed micropore after the reposition of redundant personnel earlier because even bellows 311 is a big bellows structure, and its whole top that is in thick liquids film 101, consequently the wind-force after entering into even bellows 311 has formed gentle breeze after the dispersion, can not cause the substrate thick liquids to be blown away on the substrate, has guaranteed the homogeneity of thick liquids film 101 thick liquids. The specific flow dividing structure of the uniform air box 311 can adopt the existing air homogenizing structure, and will not be described here again. The out-splayed tuyere box 312 includes an out-splayed box body 3121, a cross box body 3122, a splayed outlet box body 3123, and a cross roller 3124. The air passing box 3122 is located at the lower part of the splayed box main body 3121, the filtered and purified hot air enters the splayed outlet box 3123 and is located at the upper part of the splayed box main body 3121, the overall splayed box is provided with an outer splayed air outlet, the air passing roller 3124 is located at the middle position of the splayed outlet box 3123, the slurry film 101 passes through the air passing roller 3124, the hot air passing the air passing box 3122 is blown out from the splayed air flow channel of the splayed outlet box 3123 with the outer splayed air outlet, the slurry film 101 on two opposite sides of the air passing roller 3124 is flattened, the phenomenon that the slurry film 101 is wrinkled and the drying quality is affected is avoided, the air blown out by the outer splayed air flow channel is not just blowing towards the slurry film 101, the wind is not concentrated, the wind is softer, the slurry film 101 is not blown out, the uniformity of the slurry film 101 on the substrate is ensured, and the slurry film 101 cannot be suspended due to the fact that the outer splayed air outlet is not concentrated, and therefore the air passing roller 3124 is required to be arranged to support the slurry film 101. The arrow direction in fig. 11 is the direction of the blowing flow path of the out-splayed tuyere box 312.
In step S24, the slurry film 101 is dried by a sectional wind, including: the upper surface of the slurry film 101 is blown by a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals, so that the upper surface of the slurry film 101 is blown in a segmented manner, and the lower surface of the slurry film 101 is blown by a plurality of outer splayed air port boxes 312 which are sequentially arranged at intervals, so that the lower surface of the slurry film 101 is flattened; wherein, a plurality of inner splayed tuyere boxes 313 positioned above and a plurality of outer splayed tuyere boxes 312 positioned below are sequentially staggered.
Specifically, in the second drying section 32, the slurry film 101 passes through the middle of the second drying section 32, the plurality of in-splayed air boxes 313 above the slurry film 101 are sequentially arranged at intervals along the conveying direction of the slurry film 101, the plurality of out-splayed air boxes 312 below the slurry film 101 are sequentially arranged at intervals, and the plurality of in-splayed air boxes 313 and the plurality of out-splayed air boxes 312 are sequentially staggered along the extending direction of the slurry film 101. The specific structure and function of the out-splayed tuyere box 312 are described in step S23, and will not be repeated here. As shown in fig. 12, the inner splayed air outlet box 313 includes an inner splayed box main body 3131, an air filtering box body 3132 and an inner splayed outlet box 3133, the air filtering box body 3132 is located at the lower part of the inner splayed box main body 3131, the inner splayed outlet box 3133 is located at the upper part of the inner splayed box main body 3131, when the inner splayed air outlet box 313 is in inverted suspension arrangement, the inner splayed outlet box 3133 faces the slurry film 101, filtered and purified hot air enters from the air filtering box body 3132, and then passes through the inner splayed outlet box 3133 to form an inner splayed air blowing channel, so that the hot air coming out from the inner splayed air outlet is relatively concentrated and then blown to the slurry film 101, and the slurry film 101 is concentrated, because the inner splayed air blowing boxes 313 are arranged at intervals, and the lower outer splayed air blowing boxes 312 are dispersed and soft, so that the slurry film 101 is obtained to be dried in a sectional manner, and the preliminary ceramic slurry on the substrate is primarily solidified. The arrow direction in fig. 12 is the direction of the in-splayed blowing gas flow path of the in-splayed tuyere box 313.
In step S25, the slurry film is dried by concentrated wind, including: the upper surface of the slurry film 101 is blown through a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals, the lower surface of the slurry film 101 is blown through a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals, and the upper inner splayed air port boxes 313 and the lower inner splayed air port boxes 313 which are positioned above are matched to intensively blow the upper surface and the lower surface of the slurry film 101; wherein, the upper splayed tuyere box 313 and the lower splayed tuyere boxes 313 are staggered in turn.
Specifically, in the third drying section 33, it is different from that in the second drying section 32 in that: the lower outer splayed air port box 312 is replaced by the inner splayed air port box 313, and because the inner splayed air port box 313 is concentrated and strong in wind power, the slurry film 101 can be blown up in the blowing process, cannot be contacted with the lower inner splayed air port box 313, therefore, the movement of the slurry film 101 is not influenced without passing rollers, and is matched with the upper inner splayed air port box 313, so that concentrated hot air drying is achieved on the upper surface and the lower surface of the slurry film 101, and the slurry of the primarily cured slurry film 101 is rapidly and completely cured. After three sections of drying and blowing solidification, the thickness of the finally obtained ceramic membrane can reach 1um, and the surface density error is below 2%.
In step S3, the internal electrode paste is printed on the ceramic membrane by the screen plate, and the ceramic membrane printed with the internal electrode is stacked in a staggered manner, thereby obtaining a bar. The step S3 may be performed according to the prior art, for example, by printing the internal electrode paste onto the ceramic membrane by means of a screen printing plate according to the process requirements, and then laminating the ceramic membrane printed with the internal electrodes together according to the designed dislocation requirements, so as to form the bar of the MLCC.
In step S4, the bar is subjected to capping, laminating, cutting, adhesive discharging, sintering, chamfering, terminating, firing and end treatment to obtain the multilayer ceramic capacitor. The execution of step S4 can be seen in the prior art, for example: the cover is made by making upper and lower protective sheets of capacitor, and then adding ceramic protective sheets on the bottom and top surfaces during lamination to increase mechanical strength and improve insulation performance. The laminated block is packed by a laminated bag, and after vacuum encapsulation, the bonding between layers in the block is more compact by pressurizing in an isostatic manner. The subsequent dicing is to dice the laminated bar into individual capacitor green bodies. And then discharging the adhesive, namely placing the green capacitor body on a firing plate, baking at a high temperature of about 400 ℃ to remove adhesive organic substances in the green capacitor body, so as to avoid delamination and cracking of products caused by rapid volatilization of the organic substances in firing, ensure that the ceramic parts with required shapes are fired, and eliminate the reduction effect of the adhesive in firing. Then sintering, and discharging glue, and performing high-temperature treatment, wherein the sintering temperature is between 1140 ℃ and 1340 ℃ generally, so that the ceramic body with high mechanical strength and excellent electrical performance is formed. The chamfering is to mount the sintered ceramic capacitor, water and grinding medium in a chamfering tank, and make the capacitor move in ball milling, planetary milling and other modes to form a smooth surface so as to ensure that the inner electrode of the product is fully exposed and ensure the connection of the inner electrode and the outer electrode. And then the termination is to coat end paste on two ends of the exposed internal electrode of the chip subjected to chamfering treatment, and connect the internal electrodes on the same side to form an external electrode. The later firing end ensures the connection of the inner electrode and the outer electrode after the product is sintered at low temperature, and ensures that the end head and the porcelain body have certain bonding strength. The final end treatment is a surface treatment process, which is an electrodeposition process in which metal ions or complex ions in an electrolyte are reduced to metal or alloy at the cathode surface under the action of direct current.
Preferably, the process for manufacturing the chip multilayer ceramic capacitor in this embodiment further includes the steps of: s5, carrying out appearance selection, testing and taping on the multilayer ceramic capacitor. NG was excluded by appearance pick and test. The execution of step S5 can be seen in the prior art, for example: appearance selection is to select products with surface defects by means of an appearance screening device or an appearance screening tool. Then testing, mainly sorting the electric performance of the capacitor products, measuring and grading the capacity, loss, insulation, resistance and withstand voltage by 100%, and eliminating defective products. Finally braiding, and packaging the capacitor in paper tape or plastic bag according to the size and number.
To sum up: the ceramic membrane is formed with high quality through the combination of the slit lip coating and three-stage drying and blowing drying, the thickness of the ceramic membrane is 1-10um, the membrane is thin and has high quality, and the multilayer chip ceramic capacitor is beneficial to developing towards the ultra-thin membrane and high lamination direction.
The foregoing description is only illustrative of the invention and is not to be construed as limiting the invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, or the like, which is within the spirit and principles of the present invention, should be included in the scope of the claims of the present invention.
Claims (6)
1. A process for manufacturing a chip multilayer ceramic capacitor, comprising:
preparing ceramic slurry;
coating a substrate in a slit lip coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blowing, and obtaining a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10um;
printing the inner electrode slurry on the ceramic membrane by a screen printing plate, and obtaining a bar block after the ceramic membrane printed with the inner electrode is overlapped in a staggered way;
the bar block is subjected to cover making, lamination, cutting, glue discharging, sintering, chamfering, end connection, end burning and end treatment to obtain the multilayer ceramic capacitor;
wherein, dry the said thick liquids film through three sections of stoving bloies, then obtain the ceramic diaphragm, including the following substeps:
drying the slurry film by using dispersed air; the thick liquids film is dried through dispersed wind, includes: the upper surface of the slurry film is blown through a uniform bellows, so that the upper surface of the slurry film is uniformly blown, and the lower surface of the slurry film is blown through a plurality of splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened;
drying the slurry film by sectional wind; drying the slurry film by sectional wind, and comprising: the upper surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, so that the upper surface of the slurry film is blown in a segmented manner, and the lower surface of the slurry film is blown by a plurality of outer splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened; wherein, a plurality of inner splayed air port boxes positioned above and a plurality of outer splayed air port boxes positioned below are sequentially staggered;
drying the slurry film by concentrated air; the upper surface of the slurry film is blown through a plurality of inner splayed air port boxes which are sequentially arranged at intervals, the lower surface of the slurry film is blown through a plurality of inner splayed air port boxes which are sequentially arranged at intervals, and the upper surface and the lower surface of the slurry film are intensively blown through the cooperation of the plurality of inner splayed air port boxes which are positioned above and the plurality of inner splayed air port boxes which are positioned below; wherein, the splayed wind gap case in being located the top and the splayed wind gap case in a plurality of in being located the below set up alternately in proper order.
2. The process for producing a chip multi-layer ceramic capacitor as claimed in claim 1, wherein the substrate is coated by means of slot die coating to form a paste film, comprising the sub-steps of:
the slit discharge port of the coating die head is contacted with the moving substrate; the coating die head comprises an upper die lip, a lower die lip and a slit adhesive tape, wherein the slit adhesive tape is positioned between the upper die lip and the lower die lip, after the upper die lip and the lower die lip are clamped, the slit adhesive tape enables the upper die lip and the lower die lip to reserve a slit discharge port, and the interval width of the slit discharge port is equal to the thickness of the slit adhesive tape;
the ceramic slurry is flow coated through a slit discharge port of a coating die head and attached to a moving substrate to obtain a slurry film.
3. The process for manufacturing a chip multi-layer ceramic capacitor according to claim 2, wherein the outer surface of the upper die lip at the discharge port is an arc surface.
4. A process for producing a chip multi-layer ceramic capacitor as defined in claim 3, wherein the outer surface of said lower die lip at the discharge port is an inclined surface.
5. The process for producing a chip multi-layer ceramic capacitor as claimed in claim 2, wherein the substrate has a movement curvature at a position contacting with a slot discharge port of the coating die.
6. The process for manufacturing a chip multi-layer ceramic capacitor according to claim 1, further comprising the steps of:
the multilayer ceramic capacitor is subjected to appearance selection, testing and taping.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108597869A (en) * | 2018-04-28 | 2018-09-28 | 深圳市宇阳科技发展有限公司 | A kind of multiple-layer sheet ceramic capacitor and preparation method thereof |
| CN110517889A (en) * | 2019-08-28 | 2019-11-29 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor and preparation method thereof |
| CN215141546U (en) * | 2020-12-30 | 2021-12-14 | 安脉时代智能制造(宁德)有限公司 | Intermittent thin layer coating device based on cut-off device and backflow valve |
| CN217368995U (en) * | 2021-06-23 | 2022-09-06 | 宁德中能电子设备有限公司 | Coating die head with embedded ceramic lip |
-
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- 2022-11-17 CN CN202211472943.5A patent/CN115732230B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108597869A (en) * | 2018-04-28 | 2018-09-28 | 深圳市宇阳科技发展有限公司 | A kind of multiple-layer sheet ceramic capacitor and preparation method thereof |
| CN110517889A (en) * | 2019-08-28 | 2019-11-29 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor and preparation method thereof |
| CN215141546U (en) * | 2020-12-30 | 2021-12-14 | 安脉时代智能制造(宁德)有限公司 | Intermittent thin layer coating device based on cut-off device and backflow valve |
| CN217368995U (en) * | 2021-06-23 | 2022-09-06 | 宁德中能电子设备有限公司 | Coating die head with embedded ceramic lip |
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