CN115732230A - Preparation process of chip multilayer ceramic capacitor - Google Patents
Preparation process of chip multilayer ceramic capacitor Download PDFInfo
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- CN115732230A CN115732230A CN202211472943.5A CN202211472943A CN115732230A CN 115732230 A CN115732230 A CN 115732230A CN 202211472943 A CN202211472943 A CN 202211472943A CN 115732230 A CN115732230 A CN 115732230A
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Abstract
The invention discloses a preparation process of a chip type multilayer ceramic capacitor, which comprises the following steps: preparing ceramic slurry; coating the base material in a slit lip-pasting coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blows to obtain a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10um; printing the internal electrode slurry on the ceramic membrane through a screen printing plate, and carrying out staggered lamination on the ceramic membrane printed with the internal electrode to obtain a block; and (3) performing cover making, laminating, cutting, glue discharging, sintering, chamfering, end connecting, end burning and end head processing on the blocks to obtain the multilayer ceramic capacitor. According to the method, the ceramic diaphragm is formed at high quality by combining two modes of slit lip coating and three-section drying, blowing and drying, the uniform thickness of the obtained ceramic diaphragm is 1-10 mu m, the film is thin, the quality is high, and the development of the multilayer chip ceramic capacitor towards the direction of ultrathin film and high lamination is facilitated.
Description
Technical Field
The invention relates to the technical field of chip multilayer ceramic capacitor production, in particular to a preparation process of a chip multilayer ceramic capacitor.
Background
The multilayer chip ceramic capacitor, abbreviated as MLCC, is one of the most globally used passive components at present, and basically all consumer electronics must use the component, which is called "electronic industry rice". With the smaller and smaller size and more functions of electronic products such as notebook computers, smart phones and cameras, new requirements are provided for the multilayer chip ceramic capacitor, so that the multilayer chip ceramic capacitor is developed towards the direction of ultrathin films and high lamination.
The production process of the multilayer chip ceramic capacitor generally comprises the procedures of batching, casting, printing, laminating, cover making, laminating, cutting, glue discharging, sintering, chamfering, end connecting, end burning, end processing and the like, wherein the casting procedure is to coat slurry on a PET film and obtain a ceramic membrane after drying, and the thickness and the uniformity of casting coating and the drying quality can directly influence the thickness and the quality of the ceramic membrane. In the prior art, the thickness of the coated ceramic diaphragm is about 20um, which is not beneficial to the development of a multilayer chip ceramic capacitor towards an ultrathin film and a high lamination direction, and the existing drying effect is not ideal, and the quality of the obtained ceramic diaphragm is also directly influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a preparation process of a chip type multilayer ceramic capacitor.
The invention discloses a preparation process of a chip type multilayer ceramic capacitor, which comprises the following steps:
preparing ceramic slurry;
coating the base material in a slit lip-pasting coating mode to form a layer of slurry film, drying the slurry film through three sections of drying air blows to obtain a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10um;
printing the internal electrode slurry on the ceramic membrane through a screen printing plate, and carrying out staggered lamination on the ceramic membrane printed with the internal electrode to obtain a block;
and (3) performing cover making, laminating, cutting, glue discharging, sintering, chamfering, end connecting, end burning and end head processing on the blocks to obtain the multilayer ceramic capacitor.
According to one embodiment of the invention, the coating of the substrate by slot lip coating to form a slurry film comprises the following substeps:
the slit discharge port of the coating die head is contacted with the moving substrate; the coating die head comprises an upper die lip, a lower die lip and a slit adhesive tape, the slit adhesive tape is positioned between the upper die lip and the lower die lip, after the upper die lip and the lower die lip are closed, a slit discharge port is reserved on the upper die lip and the lower die lip through the slit adhesive tape, and the width between the slit discharge ports is equal to the thickness of the slit adhesive tape;
and (3) the ceramic slurry is subjected to flow coating through a slit discharge port of the coating die head and is attached to a moving substrate to obtain a slurry film.
According to one embodiment of the invention, the outer surface of the discharge opening of the upper die lip is a circular arc surface.
According to one embodiment of the invention, the outer surface of the lower die lip at the discharge opening is a bevel.
According to one embodiment of the present invention, the position where the substrate contacts the slot outlet of the coating die has a movement arc.
According to one embodiment of the invention, the slurry film is dried by three stages of drying and blowing to obtain the ceramic membrane, and the method comprises the following substeps:
drying the slurry film by dispersing air;
drying the slurry film by sectional air;
the slurry film is dried by concentrated wind.
According to one embodiment of the present invention, the slurry film is dried by a dispersion wind, comprising: the upper surface of the slurry film is blown through the uniform air box, so that the upper surface of the slurry film is uniformly blown, and the lower surface of the slurry film is blown through a plurality of outer splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened and blown.
According to one embodiment of the invention, the slurry film is dried by segmented air, comprising: blowing air to the upper surface of the slurry film through a plurality of inner splayed air port boxes which are sequentially arranged at intervals to enable the upper surface of the slurry film to obtain segmented air blowing, and blowing air to the lower surface of the slurry film through a plurality of outer splayed air port boxes which are sequentially arranged at intervals to enable the lower surface of the slurry film to obtain flattened air blowing; wherein, a plurality of interior eight characters wind gap casees that are located the top and a plurality of outer eight characters wind gap casees that are located the below are crisscross setting in proper order.
According to one embodiment of the present invention, the slurry film is dried by concentrated wind, comprising: the upper surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, the lower surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, and the plurality of inner splayed air port boxes positioned above and the plurality of inner splayed air port boxes positioned below are matched to intensively blow the upper surface and the lower surface of the slurry film; wherein, the interior eight characters wind gap case that is located the top and a plurality of interior eight characters wind gap cases that are located the below are crisscross setting in proper order.
According to an embodiment of the present invention, it further comprises the steps of:
the multilayer ceramic capacitor was subjected to appearance selection, test and taping.
The beneficial effect of this application lies in: through the combination of two modes of slit lip coating and three-section drying, blowing and drying, the ceramic diaphragm is formed with high quality, the uniform thickness of the obtained ceramic diaphragm is 1-10um, the film is thin, the quality is high, and the development of the multilayer chip ceramic capacitor towards the direction of ultrathin film and high lamination is facilitated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a flowchart of a process for producing a chip type multilayer ceramic capacitor in the example;
FIG. 2 is a schematic structural diagram of an MLCC casting machine in the embodiment;
FIG. 3 is a schematic view of the coating mechanism in the embodiment;
FIG. 4 is a schematic structural view of a coating die in the examples;
FIG. 5 is an enlarged view of the portion A of FIG. 4 in the example;
FIG. 6 is an exploded view of the coating die of the example;
FIG. 7 is a schematic structural diagram of a drying mechanism in an embodiment;
FIG. 8 is an enlarged view of the portion B of FIG. 7 in the example;
FIG. 9 is an enlarged view of the portion C of FIG. 7 in the example;
FIG. 10 is an enlarged view of the D portion of FIG. 7 in the example;
FIG. 11 is a schematic structural view of an outer splayed tuyere box in the embodiment;
FIG. 12 is a schematic structural diagram of an inner splayed tuyere box in the embodiment.
Detailed Description
In the following description, for purposes of explanation, numerous implementation details are set forth in order to provide a thorough understanding of various embodiments of the present invention. It should be understood, however, that these implementation details should not be taken to limit the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the purpose of simplifying the drawings, certain well-known and conventional structures and components are shown in the drawings in a simplified schematic manner.
It should be noted that all the directional indicators in the embodiment of the present invention, such as up, down, left, right, front, and back … …, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawing, if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not particularly refer to order or sequence, and do not limit the present invention, but only distinguish the elements or operations described in the same technical terms, and are not understood to indicate or imply relative importance or implicitly indicate the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings:
referring to fig. 1, fig. 1 is a flowchart of a manufacturing process of a chip type multilayer ceramic capacitor in an embodiment. The preparation process of the chip multilayer ceramic capacitor in the embodiment comprises the following steps:
s1, preparing ceramic slurry;
s2, coating the base material in a slit lip-pasting coating mode to form a layer of slurry film, and drying the slurry film through three sections of drying air blows to obtain a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10 microns;
s3, printing the internal electrode slurry on the ceramic membrane through a screen printing plate, and obtaining a block after the ceramic membrane printed with the internal electrode is staggered and laminated;
and S4, performing cover making, laminating, cutting, glue discharging, sintering, chamfering, end connecting, end burning and end head processing on the blocks to obtain the multilayer ceramic capacitor.
Through the combination of two modes of slit lip coating and three-section drying, blowing and drying, the ceramic diaphragm is formed with high quality, the uniform thickness of the obtained ceramic diaphragm is 1-10um, the film is thin, the quality is high, and the development of the multilayer chip ceramic capacitor towards the direction of ultrathin film and high lamination is facilitated.
In step S1, the prepared ceramic slurry may adopt a component formula and a preparation method of an existing ceramic slurry, for example, ceramic powder, a binder and a solvent are mixed and then ball-milled to form the ceramic slurry, and specific component proportions and ball-milling time may refer to the existing ceramic slurry preparation, and are not described herein again.
In order to further understand the coating and drying process in step S2 in the manufacturing process of the chip multilayer ceramic capacitor of the present invention, an MLCC casting machine is introduced, which is used to perform the casting step in step S2, that is, the process of coating the ceramic slurry on the substrate and drying, so as to further describe the functions and effects of the two innovation points of the slit lip coating and the three-stage drying and blowing drying in the casting process of the chip multilayer ceramic capacitor in the present application.
Referring to fig. 2 to 6 together, fig. 2 is a schematic structural diagram of an MLCC casting machine in the embodiment, fig. 3 is a schematic structural diagram of a coating mechanism in the embodiment, fig. 4 is a schematic structural diagram of a coating die in the embodiment, fig. 5 is an enlarged view of a part a of fig. 4 in the embodiment, and fig. 6 is an exploded structural view of the coating die in the embodiment. The MLCC casting machine in this embodiment includes feed mechanism 1, die head mechanism 2, stoving mechanism 3, mechanism 4 and the winding mechanism 5 of rectifying. Drying mechanism 3 in this embodiment has feed end and discharge end both ends, wherein die head mechanism 2 and drying mechanism 3's the adjacent setting of feed end, drying mechanism 3's lower part is located to feed mechanism 1, so can reduce feed position of feed mechanism 1, so that the change of material book, the material of book promptly for the substrate, and feed mechanism 1 is close to in die head mechanism 2, so that the substrate of release extends to in die head mechanism 2, it is adjacent with drying mechanism 3's discharge end to rectify mechanism 4, winding mechanism 5 is located the one side of rectifying mechanism 4 and keeping away from drying mechanism 3, the whole linear arrangement that is of MLCC casting machine. The feeding mechanism 1 is used for feeding a base material, and the base material in the embodiment is a PET film; the die head mechanism 2 is used for feeding ceramic slurry and coating the ceramic slurry on a substrate to form a slurry film; the drying mechanism 3 is used for receiving the slurry film and drying the slurry film in three sections to obtain a ceramic membrane; the deviation correcting mechanism 4 receives the dried ceramic membrane for correcting deviation so as to facilitate subsequent winding and avoid winding deviation; and the winding mechanism 5 receives the corrected ceramic membrane for winding. And die-cutting the rolled ceramic membrane into pieces on other devices to obtain the ceramic membrane. In this embodiment, the feeding mechanism 1, the deviation correcting mechanism 4 and the winding mechanism 5 can all adopt the existing structure, and in the die head mechanism 2 and the drying mechanism 3, for example, the ceramic slurry feeding, the belt running of the PET film, the heating, purifying and filtering structure of the drying air, etc. can all refer to the prior art, and are not described herein again. The structure of the die head mechanism 2 for realizing the slit lip coating and the drying mechanism 3 for realizing the three-section drying, blowing and drying will be described in detail later, so that the improved coating and drying process of the invention is further described.
The die head mechanism 2 includes a die head frame 21, two back rollers 22, a coating die head 23, and a driving roller 24. Two backing rolls 22 are arranged on the die head rack 21 along the height direction at intervals, the two backing rolls 22 are arranged up and down in a right-to-right mode, an interval is formed between the two backing rolls, the coating die head 23 is arranged on the die head rack 21 and is positioned on one side, far away from the drying mechanism 3, of the backing roll 22, a slit discharge port of the coating die head 23 is right opposite to an interval space between the two backing rolls 22, the driving roll 24 is arranged on the die head rack 21 (not shown in the figure) and is arranged on one side, far away from the coating die head 23, of the backing roll 22, and the driving roll 24 is positioned above the backing roll 22 in the embodiment, so that the coated slurry film enters the drying mechanism 3 from the top. After the coiled substrate 100 is released and loaded by the loading mechanism 1, the strip-shaped substrate 100 sequentially winds around the two backing rollers 22 and the driving roller 24 from the same side position adjacent to the coating die head 23 from bottom to top, and then extends into the drying mechanism 3, so that the substrate 100 passes through the slit discharge port 200 of the coating die head 23 along the height direction, and the substrate 100 is in contact with the slit discharge port 200 of the coating die head 23. The driving roller 24 is rotated as a driving source to move the substrate 100, so that the substrate 100 passes through the slit outlet 200 of the coating die 23 in contact therewith in a moving state.
In step S2, a substrate is coated by slot lip coating to form a slurry film, which includes the following substeps:
s21, the slit discharge port 200 of the coating die head 23 is in contact with the moving substrate 100; the coating die head 23 includes an upper die lip 231, a lower die lip 232 and a slit adhesive tape 233, the slit adhesive tape 233 is located between the upper die lip 231 and the lower die lip 232, after the upper die lip 231 and the lower die lip 232 are closed, the slit adhesive tape 233 enables the upper die lip 231 and the lower die lip 232 to reserve a slit discharge port 200, and the width between the slit discharge port 200 is equal to the thickness of the slit adhesive tape 233. In this embodiment, the slit tape 233 is firstly attached to one surface of the lower die lip 232 facing the upper die lip 231, and specifically may be attached to the edge position of the lower die lip 232, which is not close to both sides of the die cavity 2321, and then the upper die lip 231 and the lower die lip 232 are clamped, because of the existence of the slit tape 233, the slit discharge port 200 is formed between the upper die lip 231 and the lower die lip 232, the width of the slit discharge port 200 is the same as the thickness of the slit tape 233, and the slit tape 233 with a large thickness is selected to form the slit discharge port 200 with a large width, so when ceramic slurry flows out from the slit discharge port 200, the ceramic slurry can only flow out from the slit with the same thickness as the slit tape 233, and the thickness of the flowing ceramic slurry is weak tape, compared with the conventional method that a steel belt gasket is used as a barrier between the upper die lip 231 and the lower die lip 232 to form a discharge port, a narrower slit discharge port can be formed clearly, which is not only a barrier material conversion, but a break. Compared with the traditional arrangement of the gap between the discharge port and the base material, the slurry is sprayed from the discharge port to the base material, so the thickness of the slurry on the base material cannot be very thin, the slit discharge port 200 is contacted with the moving base material 100, after the ceramic slurry enters the die cavity 2321 through the pipeline, the ceramic slurry with the particle size smaller than 1um can flow out from the slit discharge port 200 to the base material 100 due to the fact that the internal pressure of the die cavity 2321 is larger than the external pressure, so that the flowing ceramic slurry can be directly attached to the moving base material 100 to form a slurry film, and the thinnest thickness of the ceramic membrane can reach 1um after drying. The slit tape 233 in this embodiment may be an acid-resistant tape, and the specific thickness of the slit tape 233 may be actually selected and set according to the requirement, for example, the slit tape 233 with a thickness of 1-10um, which is not described herein.
And S22, the ceramic slurry flows through the slit discharge port 200 of the coating die head 23 and is attached to the moving substrate 100, and a slurry film is obtained. Through the arrangement that the slit discharge port 200 of the coating die head 23 is in contact with the moving base material 100, and the width of the slit discharge port 200 is limited through the slit adhesive tape 233, the formation of an ultrathin slurry film becomes possible, so that a ceramic film with the uniform thickness of 1-10um can be obtained subsequently, and the ceramic film with the thickness of 1um can be obtained through actual measurement after coating and drying are carried out for multiple times by using the MLCC casting machine in the embodiment. The coating speed in this example was 120m/min.
Preferably, in order to better achieve the contact between the slit discharging port 200 and the moving substrate 100, the outer surface of the discharging port of the upper die lip 231 in the present invention is an arc surface b, and the outer surface of the discharging port of the lower die lip 232 is an inclined surface c. It can be understood that the slot discharging port 200 is contacted with the moving substrate 100 and moves from the outer surface of the discharging port of the lower die lip 232 to the outer surface of the discharging port of the upper die lip 231, so that the outer surface of the discharging port of the lower die lip 232 is set to be an inclined surface, so that the moving substrate 100 can smoothly enter in the moving process, the outer surface of the discharging port of the die lip 231 is set to be an arc surface, so that the moving substrate 100 can smoothly move out, and compared with the traditional right-angle discharging port, the moving smoothness of the moving substrate 100 is not affected by the arrangement of the lower inclined surface and the upper arc surface of the slot discharging port 200 when the slot discharging port is contacted with the moving substrate 100, and the substrate 100 cannot be damaged.
Preferably, the position where the substrate 100 contacts the slot outlet 200 of the coating die 23 has a moving arc. It can be understood that the substrate 100 is flexible, and in order to maintain the stability of the contact between the substrate 100 and the slot 200 of the coating die, the position of the contact between the substrate 100 and the slot 200 of the coating die is slightly curved, and the contact stability of the substrate 100 and the slot 200 of the coating die 23 is ensured while the movement of the substrate 100 is not affected. For example, in this embodiment, if the angle in the height direction of the connecting line of the center points of the two opposite back rollers 22 is defined as 180 degrees, the angle in the height direction of the substrate 100 between the two back rollers 22 is 179.5 to 179.8 degrees, so that the substrate 100 forms a movement arc of 0.2 to 0.5 degrees to maintain the connection state between the slit discharging port 200 and the moving substrate 100, and ensure that the ceramic slurry flowing out from the slit discharging port 200 can be directly attached to the substrate 100.
Referring to fig. 7 to 12 together, fig. 7 is a schematic structural diagram of a drying mechanism in the embodiment, fig. 8 is an enlarged view of a portion B of fig. 7 in the embodiment, fig. 9 is an enlarged view of a portion C of fig. 7 in the embodiment, fig. 10 is an enlarged view of a portion D of fig. 7 in the embodiment, fig. 11 is a schematic structural diagram of an outer splayed tuyere box in the embodiment, and fig. 12 is a schematic structural diagram of an inner splayed tuyere box in the embodiment. The drying mechanism 3 comprises a first drying section 31, a second drying section 32 and a third drying section 33 which are sequentially and adjacently arranged, the slurry film 101 sequentially passes through the first drying section 31, the second drying section 32 and the third drying section 33, and the slurry film 101 is dried by three sections of drying and blowing through the first drying section 31, the second drying section 32 and the third drying section 33, so that the ceramic membrane is obtained.
In step S2, the slurry film 101 is dried by three-stage drying and blowing to obtain a ceramic membrane, including the following substeps:
s23, drying the slurry film 101 through dispersing air;
s24, drying the slurry film 101 through sectional air;
and S25, drying the slurry film 101 by concentrated air.
The steps S23 to S25 are realized by respectively performing three-stage drying, namely, dispersing air drying, sectional air drying and concentrated air drying on the slurry film through a first drying section 31, a second drying section 32 and a third drying section 33 in the drying mechanism 3, wherein the dispersing air drying in the first stage enables the slurry film to obtain dispersed soft air drying, the wind power is soft, the ceramic slurry which is not dried and solidified on the substrate is prevented from being blown away, the uniformity of the ceramic slurry is ensured, the second sectional wind is further dried through the sectional strong wind, the slurry film obtains sectional concentrated wind power at this moment, the ceramic slurry which is preliminarily shaped on the substrate is solidified, the concentrated wind drying in the third stage is performed, the slurry film obtains full-section concentrated wind drying at this moment, the ceramic slurry on the substrate is completely and rapidly solidified, and the drying time is prevented from being long.
Wherein, in step S23, the slurry film is dried by the dispersing wind, including: the upper surface of the slurry film 101 is blown through the uniform air box 311, so that the upper surface of the slurry film 101 is uniformly blown, and the lower surface of the slurry film 101 is blown through a plurality of outer splayed air port boxes 312 which are sequentially arranged at intervals, so that the lower surface of the slurry film 101 is flattened and blown.
Specifically, in the first drying section 31, the slurry film 101 passes through the middle of the first drying section 31, the uniform wind box 311 is located above the slurry film 101, and the plurality of outer splay wind box 312 are sequentially arranged at intervals below the slurry film 101. Wherein even bellows 311 is the box structure of cuboid form, its one side evenly distributed towards thick liquids film 101 has the micropore, after the hot-blast entering even bellows 311 after purifying, earlier after the reposition of redundant personnel blow the thick liquids film 101 of below by evenly distributed micropore, because even bellows 311 is a big bellows structure, its whole is in the top of thick liquids film 101, consequently the wind-force after entering even bellows 311 has formed the gentle breeze after the dispersion, can not cause the thick liquids on the substrate to be blown away, guaranteed the homogeneity of thick liquids film 101 thick liquids. The specific flow dividing structure of the uniform air box 311 may adopt the existing uniform air structure, which is not described herein again. The outer splayed air outlet box 312 comprises an outer splayed box main body 3121, an air passing box 3122, a splayed outlet box 3123 and a roller 3124. The air passing box 3122 is located at the lower portion of the outer splayed box main body 3121, hot air after filtering and purifying enters from the air passing box 3123, the splayed outlet box 3123 is located at the upper portion of the outer splayed box main body 3121, the overall splayed air outlet is formed, the air passing box 3122 is provided with an outer splayed air outlet, the air passing roller 3124 is located at the middle position of the splayed outlet box 3123, the slurry film 101 passes through the air passing roller 3124, the hot air of the air passing box 3122 is blown out from the splayed outlet box 3123 with the outer splayed air outlet in an outer splayed air flow channel, the slurry film 101 on two opposite sides of the air passing roller 3124 is flattened, wrinkles of the slurry film 101 are avoided, drying quality is affected, and the air blown out from the outer splayed air flow channel is not directly opposite to the slurry film 101, and is not concentrated and is softer, and the slurry film 101 is not blown out, uniformity of the slurry on the substrate is ensured, and the air outlet is not concentrated, so suspension of the slurry film 101 cannot be caused, therefore, the roller 3124 is required to support the slurry film 101. The direction of the arrow in fig. 11 is the blowing flow path direction of the outward splayed tuyere box 312.
In step S24, the slurry film 101 is dried by segmented air, which includes: blowing air to the upper surface of the slurry film 101 through a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals to enable the upper surface of the slurry film 101 to obtain segmented air blowing, and blowing air to the lower surface of the slurry film 101 through a plurality of outer splayed air port boxes 312 which are sequentially arranged at intervals to enable the lower surface of the slurry film 101 to obtain flattened air blowing; wherein, a plurality of inner splayed air port boxes 313 positioned at the upper part and a plurality of outer splayed air port boxes 312 positioned at the lower part are arranged in a staggered way in sequence.
Specifically, in the second drying section 32, the slurry film 101 passes through the middle of the second drying section 32, the plurality of inner splayed air opening boxes 313 above the slurry film 101 are sequentially arranged at intervals along the conveying direction of the slurry film 101, the plurality of outer splayed air opening boxes 312 below the slurry film 101 are sequentially arranged at intervals, and the plurality of inner splayed air opening boxes 313 and the plurality of outer splayed air opening boxes 312 are sequentially arranged in a staggered manner along the extending direction of the slurry film 101. For the specific structure and function of the out-splayed air outlet box 312, reference is made to the description in step S23, and details are not repeated here. As shown in fig. 12, the inner eight-character tuyere box 313 includes an inner eight-character box body 3131, a wind filter box body 3132 and an inner eight-character outlet box body 3133, the wind filter box body 3132 is located at the lower part of the inner eight-character box body 3131, the inner eight-character outlet box body 3133 is located at the upper part of the inner eight-character box body 3131, when in use, the inner eight-character tuyere box 313 is arranged in an inverted manner, the inner eight-character outlet box body 3133 faces the slurry film 101, the filtered and purified hot wind enters from the wind filter box body 3132, and then passes through the inner eight-character outlet box body 3133 to form an inner eight-character wind flow channel, so that the hot wind coming out from the inner eight-character wind outlet is relatively concentrated and then blows to the slurry film 101, so that the slurry film 101 obtains concentrated wind, because a plurality of inner eight-character tuyere boxes 313 are arranged at intervals, and the wind of the outer eight-character tuyere box 312 below is relatively dispersed and soft, so that the slurry film 101 obtains segmented wind drying, so that the ceramic slurry primarily shaped on the substrate is primarily solidified. The direction of the arrow in fig. 12 is the flow path direction of the inward splayed blowing gas of the inward splayed tuyere box 313.
In step S25, the slurry film is dried by concentrated air, including: the upper surface of the slurry film 101 is blown by a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals, then the lower surface of the slurry film 101 is blown by a plurality of inner splayed air port boxes 313 which are sequentially arranged at intervals, and the plurality of inner splayed air port boxes 313 positioned above and the plurality of inner splayed air port boxes 313 positioned below are matched to intensively blow the upper surface and the lower surface of the slurry film 101; wherein, the inner splayed air port box 313 positioned at the upper part and the plurality of inner splayed air port boxes 313 positioned at the lower part are arranged in a staggered way in sequence.
Specifically, in the third drying section 33, it is different from the second drying section 32 in that: the outer splayed air port box 312 positioned below is replaced by the inner splayed air port box 313, and because the wind power of the inner splayed air port box 313 is concentrated and strong, the slurry film 101 can be blown up in the blowing process and cannot be contacted with the splayed air port box 313 positioned below, so that the movement of the slurry film 101 cannot be influenced without passing a roller, and the slurry film 101 is matched with the inner splayed air port box 313 positioned above, so that the upper surface and the lower surface of the slurry film 101 are concentrated and dried by hot wind, and the slurry of the primarily cured slurry film 101 is rapidly and completely cured. After three-stage drying and blowing solidification, the thickness of the finally obtained ceramic diaphragm can reach 1um, and the error of the surface density is less than 2%.
In step S3, the internal electrode paste is printed on the ceramic membrane by the screen printing plate, and the ceramic membrane printed with the internal electrodes is subjected to staggered lamination to obtain a bar block. Step S3 can be performed according to the prior art, for example, according to the process requirements, the internal electrode paste is printed on the ceramic film by the screen printing plate, and then the ceramic film printed with the internal electrode is laminated together according to the designed dislocation requirement, so as to form the MLCC block.
In step S4, the multilayer ceramic capacitor is obtained after the bar block is subjected to capping, laminating, cutting, binder removal, sintering, chamfering, end connection, end burning and end terminal treatment. The execution of step S4 can be seen in the prior art, for example: the cover is made up by using upper and lower protective plates of capacitor and then adding ceramic protective plates on bottom and top surfaces to increase mechanical strength and insulating property. The subsequent lamination is to laminate the blocks, pack the blocks with the laminated bag, after vacuuming and sealing, pressurize in isostatic pressing way to make the layer in the blocks combine more closely and tightly. The subsequent cutting is to cut the laminated bar into individual green capacitors. And then carrying out glue discharging, wherein the glue discharging is carried out to place the capacitor green body on a burning plate, baking is carried out at a high temperature of about 400 ℃, and organic substances of a binder in the capacitor green body are discharged, so that the product is prevented from being layered and cracked due to rapid volatilization of the organic substances during burning, a perfect ceramic piece with a required shape is guaranteed to be burnt, and the reduction effect of the binder during burning is eliminated. Then sintering is carried out, high-temperature treatment is carried out after glue discharging is finished, and the sintering temperature is generally between 1140 ℃ and 1340 ℃, so that the ceramic body with high mechanical strength and excellent electrical performance is formed. The subsequent chamfering is to install the sintered ceramic capacitor, water and grinding medium in a chamfering tank and to form smooth surface through ball milling, planetary milling and other motion to ensure the full exposure of the inner electrode and the connection between the inner and outer electrodes. And then, the end connection is to coat end slurry on two ends of the exposed internal electrodes of the chamfered chip, and connect the internal electrodes on the same side to form external electrodes. The end firing is to ensure the connection of the inner and outer electrodes after the end-connected product is sintered at low temperature, and to ensure that the end head and the porcelain body have certain bonding strength. The final end treatment is a surface treatment process, which is an electrodeposition process, and the metal ions or complex ions in the electrolyte are reduced into metal or alloy on the surface of the cathode under the action of direct current.
Preferably, the process for manufacturing a chip multilayer ceramic capacitor in the embodiment further includes the following steps: and S5, selecting the appearance of the multilayer ceramic capacitor, testing and braiding. NG products were excluded by appearance picking and testing. The execution of step S5 can be seen in the prior art, for example: the appearance selection is to select the product with surface defects by using an appearance screening device or an appearance screening tool. And then testing, mainly selecting the electrical property of the capacitor product, measuring the capacity, the loss, the insulation, the resistance and the voltage resistance by 100% and grading, and removing defective products. Finally, braiding, and packaging the capacitors in paper tapes or plastic bags according to the requirements of size and quantity.
To sum up: through the combination of two modes of slit lip coating and three-section drying, blowing and drying, the ceramic diaphragm is formed with high quality, the uniform thickness of the obtained ceramic diaphragm is 1-10um, the film is thin, the quality is high, and the development of the multilayer chip ceramic capacitor towards the direction of ultrathin film and high lamination is facilitated.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A process for producing a chip multilayer ceramic capacitor, comprising:
preparing ceramic slurry;
coating a substrate in a slit lip-pasting coating mode to form a layer of slurry film, and drying the slurry film through three sections of drying air blows to obtain a ceramic membrane, wherein the thickness of the ceramic membrane is 1-10 microns;
printing the internal electrode slurry on the ceramic membrane through a screen printing plate, and carrying out staggered lamination on the ceramic membrane printed with the internal electrode to obtain a block;
and (3) performing cover making, laminating, cutting, glue discharging, sintering, chamfering, end connecting, end burning and end head processing on the blocks to obtain the multilayer ceramic capacitor.
2. The process for manufacturing a chip multilayer ceramic capacitor according to claim 1, wherein the substrate is coated by slot lip coating to form a slurry film, comprising the substeps of:
the slit discharge port of the coating die head is contacted with the moving substrate; the coating die head comprises an upper die lip, a lower die lip and a slit adhesive tape, the slit adhesive tape is positioned between the upper die lip and the lower die lip, after the upper die lip and the lower die lip are assembled, a slit discharge port is reserved on the upper die lip and the lower die lip through the slit adhesive tape, and the width between the slit discharge ports is equal to the thickness of the slit adhesive tape;
and (3) the ceramic slurry is subjected to flow coating through a slit discharge port of the coating die head and is attached to a moving substrate to obtain a slurry film.
3. The process for preparing a chip multilayer ceramic capacitor according to claim 2, wherein the outer surface of the discharge port of the upper die lip is a circular arc surface.
4. The process for producing a chip multilayer ceramic capacitor according to claim 3, wherein the outer surface at the discharge port of the lower die lip is a slope.
5. The process for producing a chip multilayer ceramic capacitor according to claim 2, wherein the position where the substrate is in contact with the slot outlet of the coating die has a moving arc.
6. The process for manufacturing a chip multilayer ceramic capacitor according to any one of claims 1 to 5, wherein the slurry film is dried by three stages of drying blows to obtain a ceramic sheet, comprising the substeps of:
drying the slurry film by dispersing air;
drying the slurry film by sectional air;
the slurry film is dried by concentrated wind.
7. The process for preparing a chip multilayer ceramic capacitor according to claim 6, wherein the slurry film is dried by a dispersion wind, comprising: the upper surface of the slurry film is blown through the uniform air box, so that the upper surface of the slurry film is uniformly blown, and the lower surface of the slurry film is blown through a plurality of outer splayed air port boxes which are sequentially arranged at intervals, so that the lower surface of the slurry film is flattened and blown.
8. The process for preparing a chip multilayer ceramic capacitor according to claim 6, wherein the slurry film is dried by sectional wind, comprising: blowing air to the upper surface of the slurry film through a plurality of inner splayed air port boxes which are sequentially arranged at intervals to enable the upper surface of the slurry film to obtain segmented air blowing, and blowing air to the lower surface of the slurry film through a plurality of outer splayed air port boxes which are sequentially arranged at intervals to enable the lower surface of the slurry film to obtain flattened air blowing; wherein, a plurality of interior eight characters wind gap casees that are located the top and a plurality of outer eight characters wind gap casees that are located the below are crisscross setting in proper order.
9. The process for preparing a chip multilayer ceramic capacitor according to claim 6, wherein the slurry film is dried by concentrated wind, comprising: the upper surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, the lower surface of the slurry film is blown by a plurality of inner splayed air port boxes which are sequentially arranged at intervals, and the plurality of inner splayed air port boxes positioned above and the plurality of inner splayed air port boxes positioned below are matched to intensively blow the upper surface and the lower surface of the slurry film; wherein, the interior eight characters wind gap case that is located the top and be located a plurality of interior eight characters wind gap cases of below crisscross setting in proper order.
10. The manufacturing process of the chip multilayer ceramic capacitor according to claim 1, further comprising the steps of:
the multilayer ceramic capacitor was subjected to appearance selection, test and taping.
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| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108597869A (en) * | 2018-04-28 | 2018-09-28 | 深圳市宇阳科技发展有限公司 | A kind of multiple-layer sheet ceramic capacitor and preparation method thereof |
| CN110517889A (en) * | 2019-08-28 | 2019-11-29 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor and preparation method thereof |
| CN215141546U (en) * | 2020-12-30 | 2021-12-14 | 安脉时代智能制造(宁德)有限公司 | Intermittent thin layer coating device based on cut-off device and backflow valve |
| CN217368995U (en) * | 2021-06-23 | 2022-09-06 | 宁德中能电子设备有限公司 | Coating die head with embedded ceramic lip |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281283A (en) * | 2017-12-28 | 2018-07-13 | 山东迪电子科技有限公司 | The manufacturing process and its capacitor packages of vertical type ceramic patch capacitor |
| CN108597869A (en) * | 2018-04-28 | 2018-09-28 | 深圳市宇阳科技发展有限公司 | A kind of multiple-layer sheet ceramic capacitor and preparation method thereof |
| CN110517889A (en) * | 2019-08-28 | 2019-11-29 | 广东风华高新科技股份有限公司 | A kind of multilayer ceramic capacitor and preparation method thereof |
| CN215141546U (en) * | 2020-12-30 | 2021-12-14 | 安脉时代智能制造(宁德)有限公司 | Intermittent thin layer coating device based on cut-off device and backflow valve |
| CN217368995U (en) * | 2021-06-23 | 2022-09-06 | 宁德中能电子设备有限公司 | Coating die head with embedded ceramic lip |
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