CN112185706B - Method for manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor - Google Patents
Method for manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor Download PDFInfo
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- CN112185706B CN112185706B CN202010939743.0A CN202010939743A CN112185706B CN 112185706 B CN112185706 B CN 112185706B CN 202010939743 A CN202010939743 A CN 202010939743A CN 112185706 B CN112185706 B CN 112185706B
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 295
- 239000012535 impurity Substances 0.000 claims abstract description 70
- 239000000203 mixture Substances 0.000 claims abstract description 35
- 238000005498 polishing Methods 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 76
- 229910052759 nickel Inorganic materials 0.000 claims description 38
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 23
- 239000002002 slurry Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 238000010030 laminating Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 15
- 239000010408 film Substances 0.000 claims description 14
- 239000011267 electrode slurry Substances 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 9
- 238000000227 grinding Methods 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 7
- 230000001680 brushing effect Effects 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 239000012298 atmosphere Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000006004 Quartz sand Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- VAWSWDPVUFTPQO-UHFFFAOYSA-N calcium strontium Chemical group [Ca].[Sr] VAWSWDPVUFTPQO-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
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- 230000002349 favourable effect Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000007885 magnetic separation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
- B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention discloses a method for manufacturing a multilayer ceramic capacitor and the multilayer ceramic capacitor. The method for manufacturing the multilayer ceramic capacitor includes: preparing a ceramic body; carrying out chamfering and polishing treatment on the ceramic body; primarily sorting the chamfered ceramic bodies by using a screen to obtain a mixture; the mixture comprising the ceramic body and impurities corresponding to the volume of the ceramic body; carrying out secondary sorting on the mixture by adopting a ceramic body sorting device to obtain a ceramic body; and respectively attaching external electrodes to two end faces of the ceramic body to obtain the multilayer ceramic capacitor. The invention can effectively separate impurities in the chamfered ceramic body, thereby providing the multilayer ceramic capacitor with small size and reliable electrical property.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a preparation method of a multilayer ceramic capacitor and the multilayer ceramic capacitor.
Background
The copper inner electrode multilayer ceramic capacitor adopts high-conductivity copper as an inner electrode material, has extremely low equivalent series resistance, and is suitable for high-frequency application occasions. With the demand for miniaturization and high frequency applications, the miniaturization of copper inner electrode multilayer ceramic capacitors has become the mainstream.
In the manufacturing process of the multilayer ceramic capacitor, the ceramic body obtained after sintering needs to be chamfered and ground to smooth the corners of the ceramic body, so as to attach an external electrode on the ceramic body and be beneficial to better connecting the copper internal electrode with the external electrode. The chamfered ceramic body often contains zirconia chips detached from the zirconia coating of the setter plate, alumina ball chips as a grinding medium, and impurities such as quartz sand. After chamfering, impurities in the ceramic body are separated, when the size of the ceramic body is different from that of the impurities greatly, the separation can be completed by using screens with different meshes, but when the size of the ceramic body is smaller (such as 0402 specification, 0201 specification and 01005 specification defined by EIA standard), the size of the ceramic body is close to that of the impurities, and the separation cannot be performed by using the screens. The shape of the impurities is irregular, the impurities cannot roll with the ceramic body when placed on the inclined plane, and copper cannot be attracted by the magnet and cannot be sorted by adopting a magnetic separation method for the copper inner electrode multilayer ceramic capacitor. Therefore, in the case of a copper internal electrode multilayer ceramic capacitor, sorting of the chamfered ceramic bodies is very difficult.
At present, impurities such as quartz sand and the like with a large density difference from the ceramic body in the ceramic body are mainly separated by using a density difference, but when the impurities such as zirconia chips and the like with a density close to that of the ceramic body are contained, the impurities such as zirconia chips and the like in the ceramic body are difficult to be effectively separated, so that the impurities are easy to be attached to an outer electrode of a multilayer ceramic capacitor in a subsequent end-sealing process, and the small size and the electrical property of the multilayer ceramic capacitor are influenced.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the preparation method of the multilayer ceramic capacitor and the multilayer ceramic capacitor, which can effectively separate impurities in a chamfered ceramic body, thereby providing the multilayer ceramic capacitor with small size and reliable electrical property.
In order to solve the above technical problem, in a first aspect, an embodiment of the present invention provides a method for manufacturing a multilayer ceramic capacitor, including:
preparing a ceramic body;
carrying out chamfering and polishing treatment on the ceramic body;
primarily sorting the chamfered ceramic bodies by using a screen to obtain a mixture; the mixture comprising the ceramic body and impurities corresponding to the volume of the ceramic body;
carrying out secondary sorting on the mixture by adopting a ceramic body sorting device to obtain a ceramic body;
and respectively attaching external electrodes to two end faces of the ceramic body to obtain the multilayer ceramic capacitor.
Further, the preparing the ceramic body specifically includes:
mixing ceramic powder, an organic adhesive and an organic solvent to obtain ceramic slurry, and preparing a ceramic film by taking the ceramic slurry as a raw material;
printing inner electrode slurry on the ceramic film and drying to obtain the ceramic film printed with the inner electrode pattern;
laminating a plurality of ceramic thin films on which the internal electrode patterns are printed to obtain a laminated unit, and laminating a plurality of ceramic thin films on two surfaces of the laminated unit, which are opposite to each other, to obtain a laminated substrate;
after the laminated substrate is pressed, cutting the laminated substrate according to a preset size to obtain a laminated body;
and performing adhesive removal and sintering on the laminated body to obtain the ceramic body.
Further, the laminating a plurality of the ceramic thin films printed with the internal electrode patterns to obtain a laminated unit, and laminating a plurality of the ceramic thin films on two opposite surfaces of the laminated unit, respectively, to obtain a laminated substrate specifically includes:
laminating a plurality of ceramic thin films printed with the internal electrode patterns in a reciprocating dislocation manner to obtain a laminated unit;
and laminating a plurality of the ceramic thin films on two surfaces of the lamination unit, which are opposite to each other, to obtain the laminated substrate.
Further, the chamfering and polishing treatment of the ceramic body is specifically as follows:
and carrying out chamfering and polishing treatment on the ceramic body by using a grinding and polishing medium.
Further, the grinding and polishing medium comprises alumina balls, zirconia balls, alumina powder and zirconia powder.
Further, the ceramic body sorting device comprises a guide plate and a bearing plate;
the upper surface of the guide plate is provided with a plurality of grooves, and the lower surface of the guide plate is a flat surface;
the lower surface of the bearing plate is paved with temperature sensing gummed paper, and the upper surface of the bearing plate is a flat surface.
Further, the groove is cylindrical; the diameter of the groove is larger than the length of a diagonal line of the end face of the ceramic body and is less than or equal to 1.5 times of the length of the diagonal line of the end face of the ceramic body, and the depth of the groove is greater than or equal to 0.8 time of the length of the ceramic body and is less than or equal to 1.5 times of the length of the ceramic body.
Further, the secondary sorting of the mixture by using a ceramic body sorting device to obtain the ceramic body specifically comprises:
placing the mixture on the upper surface of the guide plate, enabling ceramic bodies and part of impurities in the mixture to fall into the grooves, and removing redundant mixture on the guide plate;
transferring the ceramic body and the impurities in the groove to the bearing plate, so that one end face of the ceramic body is attached to the temperature sensing adhesive tape;
brushing the ceramic body and impurities on the bearing plate, coating nickel slurry on the other end face of the ceramic body, and drying to obtain a ceramic body attached with nickel paste;
separating the ceramic body and the impurities attached with the nickel paste from the temperature sensing adhesive tape, and adsorbing the ceramic body attached with the nickel paste by using a magnet;
and removing the nickel paste on the ceramic body attached with the nickel paste to obtain the ceramic body.
Further, attaching external electrodes to two end faces of the ceramic body, respectively, to obtain a multilayer ceramic capacitor, specifically:
and respectively coating external electrode slurry on two end faces of the ceramic body and sintering to form two external electrodes, thereby obtaining the multilayer ceramic capacitor.
In a second aspect, an embodiment of the present invention provides a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor as described above.
The embodiment of the invention has the following beneficial effects:
after the prepared ceramic body is subjected to chamfering and polishing treatment, the chamfered ceramic body is primarily sorted by adopting a screen to obtain a mixture containing the ceramic body and impurities with the same volume as the ceramic body, and the mixture is secondarily sorted by adopting a ceramic body sorting device to obtain the ceramic body, so that outer electrodes are attached to two end faces of the ceramic body respectively to obtain the multilayer ceramic capacitor. Compared with the prior art, the embodiment of the invention firstly adopts the screen to separate the impurities with larger volume difference with the ceramic body in the chamfered ceramic body, and then adopts the ceramic body separating device to separate the impurities with volume similar to the ceramic body in the chamfered ceramic body, so that the impurities in the chamfered ceramic body can be effectively separated, and the multilayer ceramic capacitor with small size and reliable electrical property is provided.
Drawings
FIG. 1 is a schematic flow chart showing a method for manufacturing a multilayer ceramic capacitor according to a first embodiment of the present invention;
FIG. 2 is a schematic external view of a ceramic body according to a first embodiment of the present invention;
FIG. 3 is a top view of a guide plate in a first embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along line I-I of a guide plate according to a first embodiment of the present invention;
FIG. 5 is a schematic view showing a state where a mixture is introduced into a groove of a guide plate when secondary sorting is performed by using a ceramic body sorting apparatus according to the first embodiment of the present invention;
FIG. 6 is a schematic view showing a state where ceramic bodies and impurities in the grooves are transferred from the guide plates to the carrying plate when the ceramic body sorting apparatus is used for secondary sorting according to the first embodiment of the present invention;
FIG. 7 is a schematic view showing a state where the ceramic bodies and impurities in the grooves are transferred to the carrier plate when the ceramic body sorting apparatus is used for secondary sorting according to the first embodiment of the present invention;
FIG. 8 is a schematic view showing a state after brushing off the long impurities on the carrier plate in the second sorting by the ceramer sorting apparatus according to the first embodiment of the present invention;
FIG. 9 is a schematic view showing a state where a ceramic body is stained with nickel slurry when secondary sorting is performed by using the ceramic body sorting apparatus according to the first embodiment of the present invention.
Wherein the reference numbers in the drawings of the specification are as follows:
10: impurities; 20: a ceramic body; 30: a guide plate; 40: temperature-sensitive gummed paper; 50: a carrier plate.
Detailed Description
The technical solutions in the present invention will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, the step numbers in the text are only for convenience of explanation of the specific embodiments, and do not serve to limit the execution sequence of the steps.
The first embodiment:
as shown in fig. 1, the first embodiment provides a method of manufacturing a multilayer ceramic capacitor, including steps S1 to S5:
s1, preparing a ceramic body;
s2, chamfering and polishing the ceramic body;
s3, carrying out primary sorting on the chamfered ceramic bodies by adopting a screen to obtain a mixture; the mixture includes a ceramic body and impurities corresponding to the volume of the ceramic body;
s4, carrying out secondary sorting on the mixture by adopting a ceramic body sorting device to obtain a ceramic body;
and S5, attaching external electrodes to the two end faces of the ceramic body respectively to obtain the multilayer ceramic capacitor.
Illustratively, in step S1, a ceramic body in a rectangular parallelepiped shape is prepared, the ceramic body having a length l (mm), a width w (mm), a thickness t (mm), and a diagonal length S (mm) of an end face of the ceramic body. The schematic appearance of the ceramic body is shown in FIG. 2.
In a preferred embodiment, the preparation of the ceramic body specifically comprises: mixing ceramic powder, an organic adhesive and an organic solvent to obtain ceramic slurry, and preparing a ceramic film by taking the ceramic slurry as a raw material; printing inner electrode slurry on the ceramic film and drying to obtain the ceramic film printed with the inner electrode pattern; laminating a plurality of ceramic thin films on which the internal electrode patterns are printed to obtain a laminated unit, and laminating a plurality of ceramic thin films on two surfaces of the laminated unit, which are opposite to each other, to obtain a laminated substrate; laminating the laminated substrates, and cutting the laminated substrates according to a preset size to obtain a laminated body; and (5) performing adhesive removal and sintering on the laminated body to obtain the ceramic body.
The operation of mixing the ceramic powder, the organic binder and the organic solvent is as follows: the ceramic powder, the organic adhesive and the organic solvent are uniformly mixed by adopting a ball milling method, and the ball milling time is preferably 12-16 h. In the ceramic slurry, the mass ratio of the ceramic powder to the organic binder to the organic solvent is 10: 3-5: 4-9, the main component of the ceramic powder is strontium calcium zirconate titanate ceramic, the organic adhesive is polyvinyl butyral, and the organic solvent is a mixed solvent of toluene and ethanol with the mass ratio of 1: 1-2: 1. In the operation of preparing the ceramic thin film using the ceramic slurry as a raw material, the ceramic slurry may be formed into the ceramic thin film by a tape casting method, and the thickness of the ceramic thin film is preferably 10 μm to 30 μm.
And printing the inner electrode slurry on the ceramic film to form an inner electrode pattern, drying to obtain the ceramic film printed with the inner electrode pattern, wherein the inner electrode slurry is copper metal slurry, and the printing selects a screen printing process.
In a preferred embodiment of this embodiment, a laminated unit is obtained by laminating a plurality of ceramic thin films on which internal electrode patterns are printed, and a plurality of ceramic thin films are laminated on two opposite surfaces of the laminated unit, respectively, to obtain a laminated substrate, which specifically includes: laminating a plurality of ceramic thin films printed with the inner electrode patterns in a reciprocating dislocation mode to obtain a laminated unit; a plurality of ceramic thin films are laminated on the two surfaces of the lamination unit, which are opposite to each other, to obtain a laminated substrate.
A plurality of ceramic films on which internal electrode patterns are printed are laminated in a predetermined number so as to be displaced in a reciprocating manner to obtain a laminated unit, and then a plurality of ceramic films are laminated on each of opposite surfaces of the laminated unit to form two protective layers respectively covering the opposite surfaces of the laminated unit, thereby obtaining a laminated substrate in which the protective layers, the laminated unit, and the protective layers are laminated in this order.
In general, the lamination unit may be formed by laminating 2 to 30 ceramic thin films on which the internal electrode patterns are printed, and each of two protective layers covering the opposite surfaces of the lamination unit may be formed by laminating 1 to 20 ceramic thin films.
And pressing the laminated substrate by an isostatic pressing method to tightly adhere the film layers in the laminated substrate, and then cutting the laminated substrate according to a preset size to obtain a plurality of cuboid laminated bodies.
The operation of removing the adhesive and sintering the laminated body comprises the following steps: binder removal and sintering were performed using an alumina setter plate loading laminate with a zirconia coating. The zirconia coating is high temperature resistant and has good chemical stability, which is beneficial to obtaining a ceramic body with good sintering effect.
The adhesive can be removed by heating the laminate to 400-600 ℃ and holding the temperature for 3-8 hours in a protective gas atmosphere. The protective gas atmosphere may be a nitrogen atmosphere, an argon atmosphere, or a helium atmosphere.
The laminate from which the binder has been removed may be sintered in a reducing gas atmosphere, and the laminate from which the binder has been removed may be heated to 980 to 1050 ℃ and then held for 1.5 to 3 hours to sinter the laminate at a temperature below the melting point of copper, and a ceramic body may be obtained after sintering. The reducing gas atmosphere can be a mixed gas atmosphere of nitrogen and hydrogen, wherein the volume ratio of the hydrogen to the nitrogen is 0.05-3: 100.
for example, in step S2, the ceramic body is subjected to a chamfering and polishing process to appropriately round the edges and corners of the ceramic body and sufficiently draw out the internal electrodes in the ceramic body on both end surfaces of the ceramic body.
In a preferred embodiment, the ceramic body is subjected to chamfering and polishing treatment, specifically: and (5) adopting a grinding and polishing medium to perform chamfering and polishing treatment on the ceramic body.
In a preferred embodiment of this embodiment, the grinding and polishing medium includes alumina balls, zirconia balls, alumina powder, and zirconia powder.
The operation of chamfering and polishing the ceramic body is as follows: a horizontal polishing machine is selected to chamfer and polish the ceramic body, and alumina balls, zirconia balls, alumina powder, zirconia powder and the like can be selected as grinding and polishing media to chamfer and polish the ceramic body.
Illustratively, in step S3, the chamfered ceramic body is preliminarily sorted by using a screen, and the grinding and polishing media such as alumina balls and impurities having a large difference from the volume of the ceramic body are sorted, while the remaining ceramic body still contains impurities having a volume equivalent to the volume of the ceramic body.
In a preferred embodiment, the ceramer sorting apparatus comprises a guide plate and a carrying plate; the upper surface of the guide plate is provided with a plurality of grooves, and the lower surface of the guide plate is a flat surface; the lower surface of the bearing plate is paved with temperature sensing gummed paper, and the upper surface of the bearing plate is a flat surface.
In a preferred embodiment of this embodiment, the recess is cylindrical; the diameter of the groove is larger than the length of the diagonal line of the end face of the ceramic body and is less than or equal to 1.5 times of the length of the diagonal line of the end face of the ceramic body, and the depth of the groove is greater than or equal to 0.8 times of the length of the ceramic body and is less than or equal to 1.5 times of the length of the ceramic body.
That is, the diameter D of the groove satisfies S < D ≦ 1.5S, and the depth H of the groove satisfies 0.8L ≦ H ≦ 1.5L. The guide plate is shown in a top view in fig. 3 and in a cross-sectional view taken along the direction i-i in fig. 4.
Illustratively, in step S4, the mixture is secondarily sorted using a ceramic body sorting apparatus to separate impurities having a volume similar to that of the ceramic body from the mixture, thereby obtaining the ceramic body.
In a preferred embodiment, the ceramic body sorting device is used for secondary sorting of the mixture to obtain the ceramic body, and the method specifically comprises the following steps: placing the mixture on the upper surface of the guide plate, so that the ceramic bodies and part of impurities in the mixture fall into the grooves, and removing the redundant mixture on the guide plate; transferring the ceramic body and the impurities in the groove to the bearing plate, so that one end face of the ceramic body is attached to the temperature sensing adhesive paper; brushing the ceramic body and impurities on the bearing plate, coating nickel slurry on the other end face of the ceramic body, and drying to obtain a ceramic body attached with nickel paste; separating the ceramic body attached with the nickel paste and impurities from the temperature sensing adhesive tape, and adsorbing the ceramic body attached with the nickel paste by using a magnet; and removing the nickel paste from the ceramic body with the nickel paste attached to the ceramic body to obtain the ceramic body.
As shown in fig. 5, a mixture containing impurities (10) and a ceramic body (20) is placed on one side surface (upper surface) of a groove opening of a guide plate (30), the ceramic body is made to jump by applying a vibration force to the guide plate so as to easily fall into the groove with an end surface as a front end, impurities having a size close to the ceramic body easily enter the groove, and then an excessive mixture on the guide plate which does not fall into the groove is removed so as not to interfere with a subsequent operation.
It can be understood that when the diameter D of the groove satisfies that S is more than D and is less than or equal to 1.5S, the ceramic body can easily enter the groove by taking the end face as the front end, but can not enter the groove by taking other faces which are not the end face as the front ends, and the situation that two ceramic bodies enter the same groove side by side can not occur; the depth H of the groove satisfies 0.8L ≤ H ≤ 1.5L, H is too small to be conveniently introduced into the ceramic body, and if H is too large, it is easy to occur that two ceramic bodies are accommodated in one groove and overlapped up and down or impurities and ceramic bodies are overlapped up and down, which may interfere with the sorting.
Preferably, the ceramic body sorting apparatus further comprises a driving device connected to the guide plate, the driving device driving the guide plate to vibrate to promote the ceramic bodies to fall into the grooves.
As shown in fig. 6-7, a bearing plate (50) is placed above a guide plate (30), one surface (lower surface) of the bearing plate, which is paved with temperature sensing adhesive tape (40), is opposite to a ceramic body, when H is more than or equal to 0.8L and less than L, the ceramic body partially protrudes out of the upper surface of the guide plate, the bearing plate can be lightly covered on the ceramic body, then the guide plate and the bearing plate are turned upside down together, and the ceramic body falls onto the bearing plate under the action of gravity and is stuck by the temperature sensing adhesive tape; when L is more than H and less than or equal to 1.5L, the ceramic body does not protrude out of the upper surface of the guide plate, the temperature sensing adhesive paper can be kept parallel to the upper surface of the guide plate through a proper gap (the gap can be generally 0.5L-L, the guide plate with too small gap is easily stuck by the temperature sensing adhesive paper, the ceramic body with too large gap is easily inclined rather than vertical when falling onto the bearing plate), and then the guide plate and the bearing plate are turned upside down together, so that the ceramic body falls onto the bearing plate under the action of gravity and is stuck by the temperature sensing adhesive paper. At this time, the ceramic body is vertically arranged on the bearing plate by contacting the end face with the temperature sensing adhesive tape, and impurities are also adhered on the bearing plate. The height of the ceramic body protruding from the surface of the bearing plate is the length L of the ceramic body. After transferring the ceramic body and the impurity in the recess to the loading board, can keep the loading board to place horizontally, lift up the baffle steadily vertically upwards and withdraw.
Brushing the ceramic body and impurities by using a brush, then dipping the nickel paste on the other end face of the ceramic body, namely the end face far away from the bearing plate, wherein the impurities are not dipped in the nickel paste, and drying to obtain the ceramic body attached with the nickel paste.
It has been found, by practice, that after preliminary sorting, a large proportion of the impurities, which correspond to the volume of the ceramic body, are shorter than the ceramic body, so that the height at which the impurities stick to the carrier plate is generally significantly less than the height at which the ceramic body protrudes. There are of course also individual, elongated impurities, the maximum length of which is close to the length of the ceramic body and which may remain upright when glued to the carrier plate. For such impurities, it is necessary to turn them over to reduce their protruding height.
As shown in FIG. 8, the ceramic body (20) and the foreign matter (10) are brushed in multiple directions with a brush. The ceramic body is a cuboid, and is not easy to sweep down by a brush when vertically adhered on the bearing plate (50), and the impurities are irregular in shape and are easy to sweep down by the brush and adhere to the side of the bearing plate by the temperature sensing adhesive paper (40), so that the ceramic body vertically adhered on the bearing plate is more prominent than all the impurities.
As shown in FIG. 9, the impregnation method can be used by inverting the carrier plate (50) with the ceramic body (20) facing down and partially immersing the ceramic body in a flat nickel slurry. The immersion depth is controlled such that at least the end face of the ceramic body facing away from the carrier plate is coated with nickel paste, while the impurities (10) cannot be coated with nickel paste.
It can be understood that, because the ceramic body erected on the bearing plate protrudes out of all impurities, on the premise that the impurities are not stained with the nickel slurry, the nickel slurry can be covered on the end face of the ceramic body, and the nickel slurry can be properly and partially covered on four faces of the ceramic body adjacent to the end face, so that the amount of nickel attached to the ceramic body is larger, and the subsequent use of the magnet to attract the ceramic body is easier.
In other embodiments, the end surface of the ceramic body facing away from the carrier plate can also be coated with nickel paste by roller coating, transfer printing, or the like.
The drying temperature of the nickel slurry is lower than the degumming temperature of the temperature sensing adhesive paper, and generally can be 70-90 ℃. If the drying temperature is higher than the degumming temperature of the temperature sensitive adhesive paper, the ceramic body and the impurities fall off from the temperature sensitive adhesive paper in advance when the nickel slurry is not dried, and then the ceramic body and the impurities are possibly adhered together by the undried nickel slurry, which is not beneficial to sorting.
Separating the ceramic body and the impurities from the temperature sensing adhesive tape, and sucking the ceramic body attached with the nickel paste by using a magnet to complete the separation of the ceramic body and the impurities.
The temperature sensing adhesive paper is heated to lose viscosity, so that the ceramic body and the impurities are separated from the temperature sensing adhesive paper, the ceramic body attached with the nickel paste is attracted by the magnet, and the impurities are not attracted, so that the ceramic body and the impurities can be separated.
The temperature of the heating temperature-sensitive adhesive paper can be 120-140 ℃ generally, and when the temperature is higher than 140 ℃, the tendency of oxidation of internal electrodes, particularly copper internal electrodes in the ceramic body is increased, which is not favorable for the electrical property of the multilayer ceramic capacitor.
The nickel paste on the ceramic body is washed clean using a solvent such as ethanol that can dissolve the nickel paste, or the ceramic body may be put into a horizontal polishing machine and polished with water to remove the nickel paste on the ceramic body.
Illustratively, in step S5, external electrodes are attached to both end faces of the ceramic body, respectively, to obtain a multilayer ceramic capacitor.
In a preferred embodiment, external electrodes are attached to both end faces of the ceramic body, respectively, to obtain a multilayer ceramic capacitor, specifically: and respectively coating external electrode slurry on two end faces of the ceramic body and sintering to form two external electrodes so as to obtain the multilayer ceramic capacitor.
Respectively coating external electrode slurry on two end faces of the ceramic body, heating the ceramic body coated with the external electrode slurry to 740-890 ℃ in a protective gas atmosphere, preserving the heat for 8-12 min to sinter the external electrode slurry, and forming two external electrodes which are respectively and tightly attached to the two end faces of the ceramic body after sintering, thereby obtaining the multilayer ceramic capacitor. Wherein, the outer electrode slurry is copper metal slurry.
In the embodiment, after the prepared ceramic body is subjected to chamfering and polishing treatment, the chamfered ceramic body is primarily sorted by adopting the screen to obtain a mixture containing the ceramic body and impurities with the volume equivalent to that of the ceramic body, and the mixture is secondarily sorted by adopting the ceramic body sorting device to obtain the ceramic body, so that the outer electrodes are attached to the two end faces of the ceramic body respectively to obtain the multilayer ceramic capacitor. The embodiment adopts the screen cloth to separate the impurity with larger volume difference from the ceramic body in the ceramic body after chamfering earlier, adopts the impurity similar to the ceramic body volume in the ceramic body after the ceramic body separator separation chamfer again, can effectively separate the impurity in the ceramic body after the chamfer to provide a small-size, the reliable multilayer ceramic capacitor of electrical property.
A second embodiment provides a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor as described in the first embodiment.
The multilayer ceramic capacitor in the embodiment has small size and reliable electrical property.
In summary, the embodiment of the present invention has the following advantages:
after the prepared ceramic body is subjected to chamfering and polishing treatment, the chamfered ceramic body is primarily sorted by adopting a screen to obtain a mixture containing the ceramic body and impurities with the same volume as the ceramic body, and the mixture is secondarily sorted by adopting a ceramic body sorting device to obtain the ceramic body, so that outer electrodes are attached to two end faces of the ceramic body respectively to obtain the multilayer ceramic capacitor. According to the embodiment of the invention, the screen is adopted to separate the impurities with larger volume difference from the ceramic body in the chamfered ceramic body, and then the ceramic body separating device is adopted to separate the impurities with volume similar to the ceramic body in the chamfered ceramic body, so that the impurities in the chamfered ceramic body can be effectively separated, and the multilayer ceramic capacitor with small size and reliable electrical property is provided.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (8)
1. A method of manufacturing a multilayer ceramic capacitor, comprising:
preparing a ceramic body;
carrying out chamfering and polishing treatment on the ceramic body;
primarily sorting the chamfered ceramic bodies by using a screen to obtain a mixture; the mixture comprising the ceramic body and impurities corresponding to the volume of the ceramic body;
carrying out secondary sorting on the mixture by adopting a ceramic body sorting device to obtain a ceramic body; the ceramic body sorting device comprises a guide plate and a bearing plate; the upper surface of the guide plate is provided with a plurality of grooves, and the lower surface of the guide plate is a flat surface; the lower surface of the bearing plate is paved with temperature sensing gummed paper, and the upper surface of the bearing plate is a flat surface;
the ceramic body sorting device is used for carrying out secondary sorting on the mixture to obtain the ceramic body, and the ceramic body sorting device specifically comprises:
placing the mixture on the upper surface of the guide plate, enabling ceramic bodies and part of impurities in the mixture to fall into the grooves, and removing redundant mixture on the guide plate;
transferring the ceramic body and the impurities in the groove to the bearing plate, so that one end face of the ceramic body is attached to the temperature sensing adhesive tape;
brushing the ceramic body and impurities on the bearing plate, coating nickel slurry on the other end face of the ceramic body, and drying to obtain a ceramic body attached with nickel paste;
separating the ceramic body and the impurities attached with the nickel paste from the temperature sensing adhesive tape, and adsorbing the ceramic body attached with the nickel paste by using a magnet;
removing the nickel paste on the ceramic body attached with the nickel paste to obtain the ceramic body;
and respectively attaching external electrodes to two end faces of the ceramic body to obtain the multilayer ceramic capacitor.
2. The method of manufacturing a multilayer ceramic capacitor according to claim 1, wherein the preparing of the ceramic body specifically comprises:
mixing ceramic powder, an organic adhesive and an organic solvent to obtain ceramic slurry, and preparing a ceramic film by taking the ceramic slurry as a raw material;
printing inner electrode slurry on the ceramic film and drying to obtain the ceramic film printed with the inner electrode pattern;
laminating a plurality of ceramic thin films on which the internal electrode patterns are printed to obtain a laminated unit, and laminating a plurality of ceramic thin films on two surfaces of the laminated unit, which are opposite to each other, to obtain a laminated substrate;
after the laminated substrate is pressed, cutting the laminated substrate according to a preset size to obtain a laminated body;
and performing adhesive removal and sintering on the laminated body to obtain the ceramic body.
3. The method of manufacturing a multilayer ceramic capacitor according to claim 2, wherein the step of laminating a plurality of the ceramic thin films on which the internal electrode patterns are printed to obtain a laminated unit and laminating a plurality of the ceramic thin films on both surfaces of the laminated unit opposite to each other to obtain a laminated substrate comprises:
laminating a plurality of ceramic thin films printed with the internal electrode patterns in a reciprocating dislocation manner to obtain a laminated unit;
and laminating a plurality of the ceramic thin films on two surfaces of the lamination unit, which are opposite to each other, to obtain the laminated substrate.
4. The method for manufacturing a multilayer ceramic capacitor as claimed in claim 1, wherein said chamfering and polishing treatment is performed on said ceramic body by:
and carrying out chamfering and polishing treatment on the ceramic body by using a grinding and polishing medium.
5. The method of manufacturing a multilayer ceramic capacitor as claimed in claim 4, wherein the grinding and polishing medium comprises alumina balls, zirconia balls, alumina powder, zirconia powder.
6. The method of manufacturing a multilayer ceramic capacitor as claimed in claim 1, wherein the recess has a cylindrical shape; the diameter of the groove is larger than the length of a diagonal line of the end face of the ceramic body and is less than or equal to 1.5 times of the length of the diagonal line of the end face of the ceramic body, and the depth of the groove is greater than or equal to 0.8 time of the length of the ceramic body and is less than or equal to 1.5 times of the length of the ceramic body.
7. The method for manufacturing a multilayer ceramic capacitor as claimed in claim 1, wherein external electrodes are attached to both end faces of the ceramic body, respectively, to obtain a multilayer ceramic capacitor, specifically:
and respectively coating external electrode slurry on two end faces of the ceramic body and sintering to form two external electrodes, thereby obtaining the multilayer ceramic capacitor.
8. A multilayer ceramic capacitor produced by the method for producing a multilayer ceramic capacitor according to any one of claims 1 to 7.
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| JP2014130999A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method therefor |
| CN105161301A (en) * | 2015-09-22 | 2015-12-16 | 广东风华高新科技股份有限公司 | Method for manufacturing multilayer ceramic capacitor |
| CN105185588A (en) * | 2015-09-22 | 2015-12-23 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
| CN105304327A (en) * | 2015-11-20 | 2016-02-03 | 广东风华高新科技股份有限公司 | Preparation method of multi-layer ceramic capacitor |
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| JP2014130999A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and manufacturing method therefor |
| CN105161301A (en) * | 2015-09-22 | 2015-12-16 | 广东风华高新科技股份有限公司 | Method for manufacturing multilayer ceramic capacitor |
| CN105185588A (en) * | 2015-09-22 | 2015-12-23 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
| CN105304327A (en) * | 2015-11-20 | 2016-02-03 | 广东风华高新科技股份有限公司 | Preparation method of multi-layer ceramic capacitor |
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