CN112939612A

CN112939612A - Ceramic part and manufacturing method thereof

Info

Publication number: CN112939612A
Application number: CN202110181918.0A
Authority: CN
Inventors: 符雅丽; 高明圆; 郑友山; 王春; 李东三
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2021-02-09
Filing date: 2021-02-09
Publication date: 2021-06-11

Abstract

The embodiment of the invention provides a ceramic piece and a manufacturing method thereof, wherein the manufacturing method of the ceramic piece comprises the following steps: s1, adding an adhesive into the ceramic powder particles to form a ceramic green body; s2, processing the ceramic green body to obtain the required shape and size; s3, performing brushing treatment on the whole surface to be treated of the ceramic green body to remove defects on the surface to be treated; and S4, sintering the ceramic green body to form the ceramic piece. The ceramic part and the manufacturing method thereof provided by the embodiment of the invention can reduce the number of raised grains and hole defects on the surface of the ceramic part, thereby improving the yield of chips.

Description

Ceramic part and manufacturing method thereof

Technical Field

The invention relates to the technical field of semiconductor processing, in particular to a ceramic piece and a manufacturing method thereof.

Background

In a typical dry etching apparatus, an etching gas is introduced into a reaction chamber, the etching gas generates a plasma under the action of an upper radio frequency system, and the plasma moves towards the surface of a wafer under the action of a lower radio frequency system and performs various physical and chemical reactions with the surface of the wafer, thereby finally completing the etching of the wafer. In the etching process, if the surface layer of the ceramic part exposed in the plasma environment in the reaction chamber has defects (surface layer holes, grains which are not tightly bonded and the like), ceramic particles are often formed under the bombardment effect of plasma, the ceramic particles may fall on the surface of the wafer along with airflow or directly, the etching is blocked, the region graph blocked by the ceramic particles is partially etched or not etched, and therefore, the defects (defects) are formed on the surface of the wafer, and the electrical indexes of the chip and the yield of the chip are directly influenced by the defects. Therefore, the control of ceramic particles is one of the key indicators for mass production of the process.

At present, as shown in fig. 1, the processing flow of the ceramic component includes a green body processing step, that is, a mechanical dimension processing is performed on the ceramic green body, during the processing, a raised defect, such as a local area ceramic powder raised, etc., is formed on the surface of the green body, after the ceramic green body is sintered to form the ceramic component, a raised ceramic powder structure far away from the surface of the ceramic component forms an isolated raised grain (as shown in area a in fig. 2), and a raised ceramic powder structure near the surface of the ceramic component forms a larger grain by combining with each other, so as to form a hole defect (as shown in area B in fig. 2) on the surface of the ceramic component, and these raised grain and hole defect are easy to fall off under the bombardment effect of plasma to form ceramic particles. The ceramic parts manufactured by the prior art have a large number of raised grains and hole defects on the surface, which results in more than dozens of defects (defects) on the wafer, thereby causing a low chip yield.

Disclosure of Invention

The invention aims to at least solve one of the technical problems in the prior art and provides a ceramic piece and a manufacturing method thereof, which can reduce the number of raised grains and hole defects on the surface of the ceramic piece, thereby improving the yield of chips.

In order to achieve the above object, the present invention provides a method for manufacturing a ceramic part, comprising:

s1, adding an adhesive into the ceramic powder particles to form a ceramic green body;

s2, processing the ceramic green blank to obtain the required shape and size;

s3, performing brushing treatment on the whole surface to be treated of the ceramic green body to remove defects on the surface to be treated;

and S4, sintering the ceramic green body to form the ceramic piece.

Optionally, the step S3 includes:

s31, controlling the soft brushing tool to move and rotate at the same time so as to brush and sweep the whole surface to be processed of the ceramic green body;

s32, controlling the soft brushing tool to move in a single direction so as to brush and sweep the whole surface to be processed of the ceramic green body;

and S33, performing one-way purging on the whole surface to be processed of the ceramic green blank by adopting a spraying and purging gas mode.

Optionally, the step S31 includes:

s311, controlling the soft brushing tool to move by a unit displacement amount along a first direction parallel to the surface to be processed;

s312, controlling the soft brushing tool to reciprocate along a second direction which is vertical to the first direction;

and alternately performing the step S311 and the step S312 until the soft brushing tool moves from one side of the surface to be processed to the other side of the surface to be processed along the first direction.

Optionally, in the step S31, the rotation speed of the soft brush tool ranges from 500 to 2000 rpm/min.

Optionally, in the step S31, the moving speed of the soft brushing tool is in a range of 80-200 mm/min.

Optionally, in the step S31, a distance between the soft brushing tool and the surface to be treated ranges from 0.1 mm to 0.5 mm.

Optionally, the step S32 includes:

s321, controlling the soft brushing tool to move by a unit displacement amount along a third direction parallel to the surface to be processed;

s322, controlling the soft brushing tool to move in a single direction along a fourth direction which is vertical to the third direction;

and alternately performing the step S321 and the step S322 until the soft brushing tool moves from one side of the surface to be processed to the other side of the surface to be processed along the third direction.

Optionally, the step S33 includes:

s331, controlling a purging tool for spraying purging gas to move by a unit displacement amount along a fifth direction parallel to the surface to be processed;

s332, controlling the purging tool to move in a single direction along a sixth direction which is perpendicular to the fifth direction;

and alternately performing the step S331 and the step S332 until the purge tool moves from one side of the surface to be processed to the other side of the surface to be processed in the fifth direction.

Optionally, after the step S33, the step S3 further includes:

s34, detecting whether the number of the defects on the surface to be processed meets the requirement, if not, returning to the step S31; if yes, the process ends.

As another technical solution, an embodiment of the present invention further provides a ceramic part, which is applied to semiconductor processing equipment, and the ceramic part is manufactured by using the ceramic manufacturing method provided in the embodiment of the present invention.

The invention has the beneficial effects that:

according to the ceramic part manufacturing method provided by the embodiment of the invention, after the ceramic green body is processed to obtain the required shape and size, the whole surface to be processed of the ceramic green body is brushed to remove the defects (raised particles, suspended particles and the like) on the surface to be processed, so that the defects of the ceramic green body can be effectively removed, the number of raised grains and hole defects on the surface of the ceramic part obtained after sintering can be reduced, and the yield of chips can be further improved.

The ceramic part provided by the embodiment of the invention is manufactured by adopting the manufacturing method of the ceramic part provided by the embodiment of the invention, so that the number of raised crystal grains and hole defects on the surface can be reduced, and the yield of chips can be improved.

Drawings

FIG. 1 is a schematic diagram of defects generated after a green body processing step and a sintering step are completed respectively;

FIG. 2 is an electron microscope scan of surface defects of a sintered ceramic part of the prior art;

FIG. 3 is a block flow diagram of a method for making a ceramic part according to an embodiment of the present invention;

FIG. 4 is a block flow diagram of step S3 employed by the embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating the moving direction of the soft brushing tool in step S31 according to the embodiment of the present invention;

FIG. 6 is a schematic diagram showing the moving direction of the soft brushing tool in steps S32 and S33 according to the embodiment of the present invention;

FIG. 7 is another block flow diagram of step S3, which is used in the embodiments of the present invention;

fig. 8 is an electron microscope scanning image of surface defects of a ceramic part obtained after sintering by using the manufacturing method of the ceramic part provided by the embodiment of the invention.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the ceramic piece and the manufacturing method thereof provided by the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 3, the method for manufacturing a ceramic part according to the present embodiment is applied to manufacture a dielectric window, a liner, or a dielectric cylinder in a semiconductor processing apparatus.

The manufacturing method of the ceramic part comprises the following steps:

s2, processing the ceramic green body to obtain the required shape and size;

the machining is, for example, machining.

after the step S2 is completed, raised defects, such as local ceramic powder bumps, may be formed on the surface of the green body, and these raised grains and hole defects are easily broken off by the bombardment of the plasma to form ceramic particles. Therefore, the step S3 is to perform brushing treatment on the whole surface to be processed of the ceramic green body, so as to remove defects (raised particles, suspended particles, and the like) on the surface to be processed, and effectively remove the defects of the ceramic green body, thereby reducing the number of raised grains and hole defects on the surface of the ceramic part obtained after sintering, and further improving the yield of chips.

And S4, sintering the ceramic green body to form the ceramic piece.

Through sintering, smaller ceramic particles in the ceramic green body can be fused into large ceramic grains in a high-temperature environment, so that the obtained ceramic piece has certain hardness and strength to meet the requirements of the process.

In some embodiments, referring to fig. 4, the step S3 specifically includes:

and S31, controlling the soft brushing tool to move and rotate at the same time so as to brush and sweep the whole surface to be processed of the ceramic green body.

The soft brushing tool is, for example, a brush, and the bristles of the brush are made of soft materials, so that the surface defects can be removed, and the substrate of the ceramic green body can not be damaged. The soft material is Nylon (Nylon, Polyamide, abbreviated as PA), sponge, or thermoplastic polyester material, for example. The thermoplastic polyester material is, for example, polyester resin (PET) or polytetramethylene terephthalate (PBT).

In practical applications, the shape, size, and the like of the brush may be designed according to specific needs, and the embodiment of the present invention is not particularly limited thereto.

In some embodiments, the brush is connected to a driving device capable of driving the brush to rotate and move, for example, so as to realize automatic movement. For example, the brush is connected with a rotating motor, the rotating motor is connected with a linear motor, and the linear single machine is used for driving the rotating motor and the brush to move together in a plane parallel to the surface to be processed of the ceramic green body; meanwhile, the rotating motor is used to drive the brush to rotate.

The moving path of the soft brushing tool brushing the whole surface to be processed of the ceramic green body may be various, for example, as shown in fig. 5, the step S31 specifically includes:

s311, controlling the soft brushing tool to move by a unit displacement along a first direction X1 parallel to the surface to be processed;

s312, controlling the soft brushing tool to reciprocate along a second direction Y1 which is perpendicular to the first direction X2;

and (3) alternately performing the step (S311) and the step (S312) until the soft brushing tool moves from one side of the surface to be processed to the other side of the surface to be processed along the first direction (X1), thereby realizing the brushing of the whole surface to be processed of the ceramic green body.

The unit displacement is a displacement of the soft brush tool in the first direction X1 once per step S311.

The above-mentioned step S311 and step S312, which are performed alternately, refer to that the soft brush tool performs at least one reciprocating motion in the second direction Y1, then performs one step in the first direction X1, and then performs at least one reciprocating motion in the second direction Y1, and so on until the soft brush tool moves to the other side of the surface to be processed, for example, from the left side to the right side of the surface to be processed in fig. 5.

It should be noted that, in practical applications, the step S311 may be performed first and then the step S312 is performed, or the step S312 may be performed first and then the step S311 are performed, and both of these sequences can achieve the brushing of the whole surface to be processed of the ceramic green body.

It should be further noted that the surface to be processed shown in fig. 5 is circular, but in practical applications, the method for removing surface defects of a ceramic green body provided by the embodiment of the present invention may be applied to a surface to be processed with any shape, such as a rectangle.

It should be noted that, in the case where the size of the active surface of the soft brush tool is larger than the size of the surface to be treated, the step S311 may be omitted, and only the step S312 may be performed.

It should be noted that the embodiment of the present invention is not limited to use the above-mentioned moving path to control the movement of the soft brush tool, and in practical applications, the soft brush tool may also be used to control the movement of the soft brush tool by using any other moving path, for example, a spiral moving manner is used to move from the center to the edge of the surface to be processed.

In the above-described step S31, by rotating the soft brushing tool during brushing, defects (raised particles, suspended particles, and the like) existing in any direction of the surface to be treated can be brushed, so that the brushing effect can be improved.

In step S31, in order to ensure that the brushing force satisfies the requirement of removing surface defects and further improve the brushing effect, the rotation speed of the soft brushing tool may be in the range of 500-2000 rpm/min.

In step S31, in order to further improve the brushing effect, the moving speed of the soft brushing tool may be in the range of 80-200 mm/min.

In step S31, in order to ensure that the brushing force satisfies the requirement of removing surface defects, the distance between the soft brushing tool and the surface to be treated is in the range of 0.1-0.5 mm.

And S32, controlling the soft brushing tool to move in a single direction so as to brush and sweep the whole surface to be processed of the ceramic green body.

This step S32 is different from the above step S31 in that: the soft brushing tool in step S32 is a one-way brush, i.e., directionally moving in the same direction to avoid the return of suspended particles to the surface to be treated. Meanwhile, the soft brushing tool does not rotate.

The moving path of the soft brushing tool brushing the whole surface to be processed of the ceramic green body may be various, for example, as shown in fig. 6, the step S32 includes:

s321, controlling the soft brushing tool to move by a unit displacement along a third direction X2 parallel to the surface to be processed;

s322, controlling the soft brushing tool to move in a single direction along a fourth direction Y2 which is perpendicular to the third direction X2;

the steps S321 and S322 are performed alternately until the soft brush tool moves from one side of the surface to be processed to the other side of the surface to be processed along the third direction X2.

The unit displacement amount is a displacement amount of the soft brush tool which advances one step in the third direction X2 every time step S321 is performed.

The alternation of the step S321 and the step S322 means that after the soft brush tool performs a unidirectional movement in the fourth direction Y2 (e.g. from the lower side to the upper side of the surface to be processed in fig. 6), the soft brush tool advances one step in the third direction X2, and then performs a unidirectional movement in the fourth direction Y2 again, and the unidirectional movement directions of different times are the same, and the above-mentioned steps are repeated until the soft brush tool moves to the other side of the surface to be processed, e.g. from the left side to the right side of the surface to be processed in fig. 6.

In practical applications, the step S321 may be performed first, and then the step S322 may be performed, or the step S322 may be performed first, and then the step S321 may be performed, and both of these sequences may implement the brushing of the whole surface to be processed of the ceramic green body.

It should be noted that, in practical applications, after the soft brush tool performs a unidirectional movement in the fourth direction Y2 (for example, moves from the lower side to the upper side of the surface to be processed in fig. 6), the soft brush tool may move away from the surface to be processed, so that the soft brush tool does not brush the surface to be processed, and then returns to the starting point side of each unidirectional movement (for example, the lower side of the surface to be processed in fig. 6), and then the above step S321 is performed.

In the step S32, the soft brushing tool is controlled to brush and sweep the whole surface to be processed of the ceramic green body in one direction, so as to brush and sweep the suspended particles that were not completely removed in the previous step S31, and the one-way brushing can prevent the suspended particles from returning to the surface to be processed.

In some embodiments, the step S32 may be repeated at least twice according to the brushing effect and the actual requirement of each step S32, that is, after the step S32 is continuously performed for a plurality of times, the next step is performed.

In some embodiments, the soft brush tool movement can be controlled manually or automatically.

In addition, in the case where the size of the active surface of the soft brush tool is larger than the size of the surface to be treated, the step S321 may be omitted and only the step S322 may be performed.

And S33, performing one-way purging on the whole surface to be processed of the ceramic green body by adopting a spraying and purging gas mode.

Optionally, the step S33 is to further remove the suspended particles remaining in the previous step.

In step S33, the unidirectional purge means a directional purge in the same direction.

For example, a purge gas may be sprayed onto the surface to be treated using a purge tool comprising, for example, a nozzle and a gas line for connecting the nozzle to a gas source. The purge gas is, for example, compressed air or a high-pressure gas (e.g., nitrogen or the like).

In practical applications, the gas outlet direction of the purge tool for ejecting the purge gas may be perpendicular to the surface to be processed, or may be inclined at a certain angle toward the unidirectional moving direction of the purge tool with respect to the direction perpendicular to the surface to be processed.

The moving path of the purging tool for purging the entire surface to be processed of the ceramic green sheet may be various, and for example, may be the same as the moving path of the soft brush tool in step S21 shown in fig. 6, and specifically, the step S33 includes:

s331, controlling the purging tool to move by a unit displacement amount in a fifth direction (i.e., the third direction X2) parallel to the surface to be processed;

s332, controlling the purging tool to move in a single direction (for example, from the lower side to the upper side of the surface to be treated in FIG. 6) along a sixth direction (i.e., a fourth direction Y2) perpendicular to the fifth direction;

and alternately performing the step 331 and the step 332 until the purge tool moves from one side of the surface to be processed to the other side of the surface to be processed along the fifth direction.

The unit displacement amount is a displacement amount of the purge tool moving further in the fifth direction every time step S331 is performed.

The alternation of the step S331 and the step S332 means that the purging tool moves one way in the sixth direction (e.g., from the lower side to the upper side of the surface to be processed in fig. 6), then moves one way in the fifth direction, and then moves one way in the sixth direction again, and the different one-way moving directions are the same, and the above-mentioned steps are repeated until the purging tool moves to the other side of the surface to be processed, e.g., from the left side to the right side of the surface to be processed in fig. 6.

In practical applications, the step S331 may be performed first, and then the step S332 may be performed, or the step S332 may be performed first, and then the step S331 may be performed, and both of these steps may achieve purging of the entire surface to be processed of the ceramic green body.

It should be noted that, in practical applications, after the purging tool performs one-way movement in the sixth direction (for example, moving from the lower side to the upper side of the surface to be processed in fig. 6), the purging may be stopped, and then returned to the starting point side of each one-way movement (for example, the lower side of the surface to be processed in fig. 6), and the purging may be performed again, and the above step S331 is performed.

In addition, in the case where the size of the action surface of the purge tool is larger than the size of the surface to be processed, the step S331 may be omitted and only the step S332 may be performed.

The ceramic part manufacturing method provided by the embodiment of the invention can effectively remove the defects of the ceramic green body, thereby reducing the number of the raised grains and the hole defects on the surface of the ceramic part and further improving the yield of chips.

As a preferable solution of this embodiment, referring to fig. 7, after the step S33, the step S3 further includes the following steps:

s34, detecting whether the number of defects on the surface to be processed meets the requirement, if not, returning to the step S31; if yes, the process ends.

In the step S34, optionally, a manual visual inspection method may be adopted to detect whether the number of defects existing on the surface to be processed meets the requirement, in which case, after receiving the operation instruction input by the user, the step S31 may be executed again.

Referring to fig. 8, it can be seen from a comparison of an electron microscope scanning image of surface defects of a ceramic part obtained after sintering by using the ceramic part manufacturing method according to the embodiment of the present invention and fig. 2 that after sintering, the number of isolated raised grains shown in the area a and the number of hole defects shown in the area B in fig. 2 are large and obvious, and compared with that in fig. 8, the number of isolated raised grains is obviously reduced and the hole defects are also not obvious, so that the ceramic part manufacturing method according to the embodiment of the present invention can effectively remove the defects of a ceramic green body, thereby reducing the number of raised grains and hole defects existing on the surface of the ceramic part, and further improving the yield of chips.

As another technical solution, an embodiment of the present invention further provides a ceramic part, which is manufactured by the manufacturing method of the ceramic part provided in the embodiment of the present invention.

The ceramic part can be applied to dielectric windows, linings, dielectric cylinders and the like in semiconductor processing equipment.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims

1. A method of making a ceramic part, comprising:

s2, processing the ceramic green blank to obtain the required shape and size;

and S4, sintering the ceramic green body to form the ceramic piece.

2. The method for manufacturing a ceramic part according to claim 1, wherein the step S3 includes:

3. The method for manufacturing a ceramic part according to claim 2, wherein the step S31 includes:

4. The method as claimed in claim 2 or 3, wherein in step S31, the rotation speed of the soft brush tool is in the range of 500-2000 rpm/min.

5. The method for manufacturing a ceramic article according to claim 2 or 3, wherein in the step S31, the moving speed of the soft brushing tool is in the range of 80-200 mm/min.

6. The method for manufacturing a ceramic article according to claim 2 or 3, wherein in the step S31, a distance between the soft brushing tool and the surface to be treated is in a range of 0.1 to 0.5 mm.

7. The method for manufacturing a ceramic part according to claim 2, wherein the step S32 includes:

8. The method for manufacturing a ceramic part according to claim 1, wherein the step S33 includes:

9. The method of manufacturing ceramic articles of claim 2, wherein after the step S33, the step S3 further includes:

10. A ceramic article for use in semiconductor processing equipment, wherein the ceramic article is made by the ceramic manufacturing method of any one of claims 1 to 9.