CN107046779B - The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit - Google Patents
The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit Download PDFInfo
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- CN107046779B CN107046779B CN201710479712.XA CN201710479712A CN107046779B CN 107046779 B CN107046779 B CN 107046779B CN 201710479712 A CN201710479712 A CN 201710479712A CN 107046779 B CN107046779 B CN 107046779B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a kind of processes that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit, including coating adhesive coating step before inhibiting green deforming step and lamination, green is carried out demoulding, aging in advance by the former, again to the secondary pad pasting of green after aging, the residual stress between film and green is eliminated, deformation quantity is reduced to 0.03% or less by traditional 0.06% or more；The latter is before green lamination, on 35 DEG C~50 DEG C hot plates, one layer of adhesive coating is applied on green, adjacent layer green bonding is realized after lamination, so that each layer of green is obtained whole fixation, enter back into subsequent handling, which can decompose in 400~600 DEG C of temperature ranges, be discharged, circuit substrate performance is not interfered, and there is favorable compatibility.Process of the invention is at low cost, applied widely, easy to use, can effectively improve circuit substrate interlayer aligning accuracy, aligning accuracy is at 30 μm or less.
Description
Technical field
The invention belongs to multilayer co-firing ceramic circuit manufacture fields, and in particular to a kind of to process in multilayer co-firing ceramic circuit
The middle process for improving interlayer alignment precision, this method can effectively guarantee the interlayer alignment of multilayer co-firing ceramic circuit board
Precision.
Background technique
With LTCC(low-temperature co-fired ceramics) be Typical Representative multilayer co-firing ceramic circuit, have integration density is high, microwave/
The multi-functional hybrid integrated of number/control, outstanding advantages of high frequency performance is excellent, be increasingly becoming miniaturization, high-performance T/R component,
The preferred realization rate of the circuit substrates such as frequency source, phased array antenna obtains extensive in the fields such as Aeronautics and Astronautics, missile-borne, carrier-borne
Using.
The conventional fabrication process of multilayer co-firing ceramic circuit board are as follows: green cuts → and green punching → green filling perforation → leads
Body printing → cavity production → green demoulding/lamination → vacuum packaging → green lamination → green cutting → cofiring → substrate scribing
→ test/inspection.In the processing of multilayer co-firing ceramic circuit board, green deformation and lamination/laminating technology process can all influence
Final interlayer alignment precision, and the technic index is most important for microwave property, more function that current multilayer common burning porcelain is realized
Can the interlayer alignment precision representative value of circuit substrate be 30 μm ~ 50 μm, the level is for being internally integrated the base of high-frequency microwave device
For plate, it is easy to produce the fluctuation and lower yield rate of performance.
Green shape control and lamination are the key links realizing interlayer and precisely aligning, and the present inventor is preceding
Effective control is carried out to green deformation by preparatory aging and secondary pad pasting in the research of phase, but the prior art is folded to reducing
Sliding local between green dislocation, deformation still lack reliable fixing means after layer.There are two types of conventional lamination fixing means: right
It can express certain viscosity at high temperature such as 951 systems of Dupont company, the U.S. in the preferable green system of high temperature viscometrics,
It is done if the edge after lamination by the way of high temperature spot welding in green is fixed；The green system poor for high temperature viscometrics, such as
The A6M system of Ferro company, the U.S., even if at high temperature, green viscosity is still poor, using glue part spot gluing after lamination
If mode fix and do at the edge of green, both modes are to be realized up and down at green edge by limited several points
Position between layer is fixed.
Complicated, the higher circuit substrate of through-hole/wiring density firstly, for cavity body structure, due to green part Multicarity/
Porous zone structural strength is poor, can occur local deformation easily after lamination only with several solid point constant volumes, and product transfer,
It is in rarefaction between each layer in the technical process such as vacuum packaging, is also easy to appear local sliding dislocation, these all will lead to
Product entirety or the decline of the interlayer alignment precision of regional area.Secondly, the preferable green system of high temperature viscometrics, although having high temperature
The advantage of viscosity, but the function depends on effective allotment of green formula, does not have broad applicability, and existing commercialization is folded
Layer equipment is a Functional Design for heating, if spot welding is changed to face weldering, it is meant that higher to improve green interlayer stationarity
Scrap build cost；And the green system poor for high temperature viscometrics, if simply glue part spot gluing is changed to whole
The glue in a face is bonded, and will not only greatly increase originally just relatively complicated stack process amount, but also the face coating of glue is difficult
The problems such as guaranteeing that thickness is precisely controlled the uniformity with whole region, being easy to cause such as absciss layer of substrate sintering, distortion, or
Glue and green are sintered incompatible, will lead to the electrical property deviation of substrate again.
Summary of the invention
In view of the problems of the existing technology, the present invention is intended to provide a kind of well compatible with other process procedures, cost
It is low, applied widely, easy to use, and the process of circuit substrate interlayer aligning accuracy can be effectively improved, to meet interlayer
The production requirement of the demanding circuit substrate of aligning accuracy.
The process that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit of the invention, comprising:
Before green lamination, it is covered with one layer of adhesive coating in green front or/and the back side, the adhesive coating is in green lamination
Adjacent layer green bonding is realized afterwards, to realize that the entirety between each layer of green is fixed, enters back into subsequent conventional machining process.
As a kind of perferred technical scheme, adhesive coating of the present invention is inviscid at low temperature, high temperature appropriate
There is down good viscosity, such characteristic in the processing of multilayer co-firing ceramic circuit more suitable for applying.It is according to the present invention
Some preferred embodiments, the adhesive coating include 80% ~ 90% bonding agent and 10% ~ 20% plasticizer, according to the formula, it can be achieved that
30 DEG C or less inviscid, 35 DEG C ~ 50 DEG C performance excellent adherings, and can be under air or nitrogen environment, 400 DEG C ~ 600 DEG C temperature
Section is decomposed in a manner of thermal cracking, is discharged, and does not interfere the performance of circuit substrate.
In order to facilitate the operation of and avoid directly coat adhesive coating difference in thickness influence product quality, present invention offer be provided
The adhesive coating is coated in organic film on piece and again shifted by a preferred technical solution.Therefore, above-mentioned technique side
It is covered with one layer of adhesive coating in green front or/and the back side described in method, particular by the organic film for being coated with adhesive coating
Piece is attached to green front or/and the back side, then adhesive coating is shifted and is retained in green surface by organic diaphragm of tearing before lamination.
In above-mentioned process, the bonding agent of the adhesive coating is selected from polyvinyl alcohol, polyvinyl butyral, methylol
At least one of cellulose, sodium hydroxyethyl cellulose, the plasticizer are selected from dibutyl phthalate, phthalic acid two
At least one of monooctyl ester, polyethylene glycol.
Organic diaphragm of the present invention primarily serves load and shifts the effect of adhesive coating, furthermore without specifically limited.
The adhesive coating is as a preferred technical solution, with a thickness of 2 μm ~ 6 μm, organic diaphragm with a thickness of 50 μm ~ 100
μm。
In order to guarantee adhesive coating and organic diaphragm can good separation, need to coat between adhesive coating and organic diaphragm micro-
Measure mould release, make organic diaphragm have it is good can extraction, the mould release is usually silicone oil or equivalent product.Off-shape agent exists
The coating of organic film on piece is usually completed by the supplier of diaphragm, and user directly purchases use.
In above-mentioned process, one layer of green is often folded, green is heated, makes up to 35 DEG C ~ 50 DEG C, and in table
Face gently applies pressure, makes to be adhesively fixed between adjacent layer green by adhesive coating realization.
If green to be processed has cavity domain structure, it is bonded diaphragm and is also fabricated to corresponding shape.
The above-mentioned method that the fixed each layer green of adhesive coating is coated before lamination of the present invention, with art methods phase
Than having the advantage that the face bonding realized between adjacent green, considerably increasing layer stability；Match suitable for various
The green of side has good compatibility；It is at low cost, easy to operate, fabrication error is small, high yield rate.
Based on foregoing invention content, the present invention also provides a kind of adhesive film, the adhesive film includes organic diaphragm and painting
Overlay on the adhesive coating of the organic film on piece.Organic diaphragm and adhesive coating are as described in the above method.
In order to further increase the interlayer alignment precision of circuit substrate, method of the invention, which may also include, inhibits green deformation
The step of: green is subjected to demoulding, aging in advance, then to the secondary pad pasting of green after aging, then carry out again subsequent include
It is stacked in interior conventional machining process.
There is curtain coating residual stress between green and included Mylar film, green is de- in ceramic multilayer circuit process
Deformation occurs after film, and each layer deformation quantity and deformation region are different, causes interlayer alignment precision when lamination to be deteriorated, largely effects on
The quality of finished product.The present inventor it has been investigated that, first the included film of green is torn, then to the green without film into
Row aging allows green to deform in place to eliminate the residual stress of curtain coating, then carrying out following process after secondary pad pasting can be fine
Solve the problems, such as this, green deformation ratio effectively can be reduced to 0.03% from 0.06% or more using process of the invention
Hereinafter, easy to operate, save the cost.
Aging described in above method be by green at a temperature of 40 ~ 80 DEG C dry 20 ~ 40min, or in dry environment
Naturally 8h or more is placed.
The secondary pad pasting refers to that the green after aging is sticked one layer of single side again has less viscous organic diaphragm, with
Green is set to obtain the support of subsequent technique process.A specific embodiment according to the present invention, the secondary pad pasting have
Machine diaphragm thickness is 30 μm ~ 100 μm, the low viscous coating that single side applied thickness is 0.5 μm ~ 3 μm.
A specific embodiment according to the present invention, the low viscous coating main ingredient include 60% ~ 79% bonding agent,
20% ~ 39% plasticizer, 1% ~ 5% mould release.
The bonding agent is in polyvinyl alcohol, polyvinyl butyral, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
One or more, the plasticizer be selected from one of dibutyl phthalate, dioctyl phthalate, polyethylene glycol or
Several, the mould release is silicone oil or its equivalent product.
Secondary pad pasting has good dimensional stability, and the green of aging can be prevented to be again deformed in process.Institute
It states low viscous coating and is able to satisfy and paste needs, and do not react with organic additive intrinsic in green and (to prevent change green
Laminating properties), sticky overlay noresidue (preventing from changing the sintering characteristic of green) on green after demoulding again.
Added after secondary pad pasting using ceramic multilayer circuits techniques such as conventional punching, filling perforation, printing, demoulding, laminations
Work, the process are conventional method well known to those skilled in the art.
Low viscous coating used in secondary pad pasting is slightly different with adhesive coating formula used in lamination, the former is viscous to meet
The low stickiness needs being detached from after patch, the latter need to realize 30 DEG C or less inviscid, 35 DEG C ~ 50 DEG C performance excellent adherings, and with life
Porcelain sintering process is compatible.
The conventional fabrication process of multilayer co-firing ceramic circuit board are as follows: green cuts → and green punching → green filling perforation → leads
Body printing → cavity production → green demoulding/lamination → vacuum packaging → green lamination → green cutting → cofiring → substrate scribing
→ test/inspection.It is of the present invention green to be subjected to demoulding, aging, then the step to the secondary pad pasting of green after aging in advance
Suddenly usually after green is cut, before punching；It is described before green lamination, green front or/and the back side be covered with one layer it is viscous
The step of connecing coating is usually before lamination or after green is cut, before punching, as long as can play in lamination and lamination steady
Determine bonding effect, process sequence can regard concrete condition in the case where not influencing the effect and carry out adjustment appropriate, and
Not as limitation of the present invention.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, by inhibiting green
Deforming step --- green is subjected to demoulding, aging in advance, then to the secondary pad pasting of green after aging, is eliminated between film and green
Residual stress, control green deformation quantity, eliminate interlayer difference, then secondary pad pasting reduces green deformation quantity by 0.06% or more
To 0.03% hereinafter, to ensure that higher interlayer alignment precision when lamination；Using with the organic of adhesive coating before lamination
Each layer green is adhesively fixed by diaphragm, and application range is not by green formula or cavity body structure, through-hole/wiring density
Limitation, it is applied widely, there is versatility；Compared with the prior art is by the fixed lamination of several points, fixed performance is more preferable, can
30 μm of stabilization realization is hereinafter, more preferably, 25 μm of interlayer alignment precisions below of realization apply daub with high temperature hot weld or craft
Water is compared, and only need to simply be pasted, be torn two steps and can be completed, easy to operate, stationary plane is big；More importantly bonding of the invention applies
Layer is after realizing lamination fixed function, and 400 DEG C ~ 600 DEG C temperature ranges are divided in a manner of thermal cracking in subsequent process steps
Solution, discharge, do not interfere circuit substrate performance, have favorable compatibility.
Detailed description of the invention
Fig. 1 is the step of the method for the present invention carries out demoulding to green；
Fig. 2 is the step of the method for the present invention carries out aging to green；
Fig. 3 is that the method for the present invention carries out secondary step of membrane sticking to the green of aging；
Fig. 4 is that the method for the present invention carries out the effect picture after secondary pad pasting to the green of aging；
Fig. 5 is the green structure chart of included Mylar film；
Fig. 6 is organic diaphragm structure figure that the present invention is coated with viscous coating；
Fig. 7 is the structure chart that adhesive film of the present invention is attached to the green back side；
Fig. 8 is the schematic diagram to the processing of the 1st layer of green；
Fig. 9 is the schematic diagram to the processing of the 2nd layer of green；
Figure 10 is the schematic diagram to the processing of n-th layer green；
Figure 11 is the schematic diagram to the processing of the last layer green；
Figure 12 is green lamination process schematic diagram；
Figure 13 is the fixed overall schematic of green lamination.
Specific embodiment
Below it is only some preferable embodiments of the present invention, this should not be interpreted as to the range of the above-mentioned theme of the present invention
It is only limitted to example below, each feature of the invention can be combined arbitrarily in the case of no contradiction, these belong to
In the scope of protection of the invention.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, wherein inhibiting green
The step of deformation, is specific as follows, reference can be made to Fig. 1-4:
Embodiment 1
1) after green cuts into standard technology size, green is carried into Mylar film 2 from green 1 and is torn, as shown in Figure 1.
2) green 1 without film is dried, drying time 30min at a temperature of 60 DEG C, obtains deformation in place
Green 3, as shown in Figure 2.
3) organic diaphragm 4 that single side is coated with 1 μm of low viscous coating is attached on the green 3 of deformation in place, as shown in Figure 3.
Organic diaphragm 4 with a thickness of 50 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic diaphragm 4 are preferably bonded, in multilayer co-firing ceramics
Green can be made to keep low deflection in the technique processing of circuit.
5) processing is completed using ceramic multilayer circuits techniques such as conventional punching, filling perforation, printing, demoulding, laminations.
Embodiment 2
1) after green cuts into standard technology size, green is carried into Mylar film 2 from green 1 and is torn, as shown in Figure 1.
2) 8h is placed to the green 1 without film naturally in 100,000 grades of environment purifications, obtains the green 3 of deformation in place, such as
Shown in Fig. 2.
3) organic diaphragm 4 that single side is coated with 2.5 μm of low viscous coatings is attached on the green 3 of deformation in place, such as Fig. 3 institute
Show.Organic diaphragm 4 with a thickness of 75 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic diaphragm 4 are preferably bonded, in multilayer co-firing ceramics
Green can be made to keep low deflection in the technique processing of circuit.
5) it is made pottery using the multilayer of conventional punching, filling perforation, printing, demoulding, lamination, pressurized layer, sintering, fragment, test/inspection
Porcelain circuit technology completes processing.
The low viscous coating of above-mentioned organic diaphragm, ingredient include 62% polyvinyl butyral, 37% phthalic acid two
Monooctyl ester, 1% silicone oil.
Conventional method is that the green for being covered with included Mylar film is directlyed adopt to conventional punching, filling perforation, printing, demoulding, is folded
Layer, pressurized layer, sintering, the ceramic multilayer circuit technique completion processing of fragment, test/inspection.
Green deformation ratio can be reduced to 0.03% hereinafter, effect by traditional 0.06% or more using the above method of the invention
Fruit is significant, and easy to operate.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, passes through following two
Embodiment illustrates the concrete mode that the fixed each layer green of adhesive coating is coated before lamination, reference can be made to Fig. 5 ~ 13.
First method, which is that green punching is preceding, tears the secondary pad pasting of embodiment 1 or 2, will be with the organic of adhesive coating
Diaphragm is attached to the green back side, but product the last layer green does not do this processing, keeps original green state.Green is carried out to green
The processes processing such as punching → green filling perforation → conductor printing → cavity production.When lamination upward by the green back side, from the 1st of product the
Layer starts lamination, often folds one layer, and the adhesive coating for passing through the preceding layer green back side is real with preceding layer green in a heated state
Now be adhesively fixed, then tear organic diaphragm at this layer of green back side, leave adhesive coating at the green back side, realize with it is next
The bonding of layer laminate green, and so on, to the last one layer of green completes lamination and bonding.The green block that lamination is fixed
Be vacuum-packed → normal process steps the processing such as green lamination → green cutting → cofiring → substrate scribing → test/inspection.
Second method is to carry out cutting → green punching → green filling perforation → conductor printing to green according to common process
Organic diaphragm with adhesive coating is just attached to green front (if green has before lamination by the processes processing such as → cavity production
Cavity, then adhesive film need to make corresponding cavity), then organic diaphragm is torn, adhesive coating is retained in green front,
The 1st layer of product is not done this processing, keeps reset condition.When lamination upward by the green back side, the lamination since the 1st layer of product,
One layer is often folded, is adhesively fixed in a heated state with the realization of preceding layer green by the positive adhesive coating of this layer of green, so
The secondary pad pasting of the included Mylar film at this layer of green back side or embodiment 1 or 2 is torn afterwards, to the last one layer of green is completed
Lamination and bonding.Then again the green block that lamination fixes be vacuum-packed → green lamination → green cutting → cofiring →
The processing of the normal process steps such as substrate scribing → test/inspection.
Both the above method is illustrated by embodiment 3 and 4 control attached drawings of implementation.
Adhesive film used in embodiment 3 and 4 is made of adhesive coating, organic diaphragm and mould release positioned there between.
Adhesive coating is made of bonding agent and plasticizer, bonding agent be selected from polyvinyl alcohol, polyvinyl butyral, hydroxymethyl cellulose,
At least one of sodium hydroxyethyl cellulose, plasticizer are selected from dibutyl phthalate, dioctyl phthalate, poly- second two
At least one of alcohol, adhesive coating is with a thickness of 2 μm ~ 6 μm.Organic diaphragm with a thickness of 50 μm ~ 100 μm.Mould release is silicone oil.
Embodiment 3
1) the included Mylar film A-2 of original green A is torn from green A-1, is then coated with adhesive coating B-1
Organic diaphragm B, be attached to the green back side in 40 DEG C of thermal station, adhesive coating and green rear-face contact form new structure C.Ginseng
See Fig. 5-7.
2) system of the 1st layer of through-hole 1-1 of product, conductor fig 1-2, cavity 1-3 are carried out on structure C using common process
Make.J-1 is optical registration through-hole, and J-2 is pin lamination registration holes, as shown in Figure 8.
3) according to mode in 2), the processing of each layer green in addition to the last layer, such as Fig. 9-10 are completed on new construction C respectively
It is shown.
4) through-hole L-1, conductor fig L-2, optical registration on the last layer green are completed on green A using common process
With through-hole J-1, the processing of pin lamination registration holes J-2 etc., as shown in figure 11.
5) when lamination by the 1st layer of green back side upward, with laminated structure contraposition it is fixed after, by organic diaphragm B- at the back side
2 tear, and leave adhesive coating B-1 at the back side of first layer green 1 '；
6) lamination upward by the 2nd layer of green back side, is aligned with the 1st layer of green 1 ', then by 40 DEG C of heating, is pressurizeed simultaneously
Mode, realize bonding with the 1st layer of green 1 ', then tear organic diaphragm B-2 at the 2nd layer of green back side, leave bonding painting
Layer B-1 is at the back side of the 2nd layer of green 2 '；
7) same lamination and fixing process successively are carried out to other n-layer greens, to the last one layer of green L complete lamination and
It is adhesively fixed, as shown in figure 12.The green block K of successively lamination, fixation is eventually formed from 1 ' to L ', as shown in figure 13.
8) the green block K that lamination fixes be vacuum-packed using common process → green lamination → green cutting →
The processing of the processes such as cofiring → substrate scribing → test/inspection.
After tested, interlayer alignment precision is 10 ~ 25 μm.
Embodiment 4
The present embodiment first carries out original green to inhibit green deforming step, and furthermore only processing sequence slightly has with embodiment 3
It is different.
1) the green A of the inhibition green deformation process by embodiment 1 or 2, including green A-1(are equivalent to embodiment 1,2
In green 3) and secondary pad pasting A-2(be equivalent to organic diaphragm 4 in embodiment 1,2), with reference to Fig. 5.
2) system of the 1st layer of through-hole 1-1 of product, conductor fig 1-2, cavity 1-3 are carried out on green A using common process
Make.J-1 is optical registration through-hole, and J-2 is pin lamination registration holes, with reference to Fig. 8.
3) processing for completing other each layer elements on each layer green A respectively, with reference to Fig. 9-11.
4) the organic diaphragm B for being coated with adhesive coating B-1 is respectively adhered on the 2nd layer of green to last one layer of green just
Face tears B-2 with reference to Fig. 7, and before lamination, leaves adhesive film B-1 in each layer green front.
5) when lamination by the 1st layer of green back side upward, with laminated structure contraposition it is fixed after, the film A-2 at the back side is torn,
Form 1 '.Upward by the 2nd layer of green back side, lamination is aligned with the 1st layer of green 1 ', then by 40 DEG C of heating, while pressurizeing
Mode, is realized bonding with the 1st layer of green 1 ' by the positive adhesive coating B-1 of the 2nd layer of green, then tears the 2nd layer of green
The film A-2 at the 2 ' back sides.
6) same lamination and fixing process successively are carried out to other n-layer greens, to the last one layer of green L complete lamination and
It is adhesively fixed, adjusts with reference to Figure 12 and by its adhesive film to the front of each layer green.Eventually form from 1 ' to L ' successively lamination, solid
Fixed green block K, with reference to Figure 13.
7) the green block K that lamination fixes be vacuum-packed using common process → green lamination → green cutting →
The processing of the processes such as cofiring → substrate scribing → test/inspection.
After tested, interlayer alignment precision is 10 ~ 15 μm.
Claims (4)
1. a kind of process for improving interlayer alignment precision in the processing of multilayer co-firing ceramic circuit characterized by comprising
Green is subjected to de- included Mylar film, aging in advance, then to the secondary pad pasting of green after aging, the secondary pad pasting is
Organic diaphragm that single side has low viscous coating is pasted, is then processed according to common process, and before green lamination, in life
Porcelain front or/and the back side are covered with one layer of adhesive coating, which realizes that adjacent layer green is bonded after green lamination, thus
It realizes that the entirety between each layer of green is fixed, enters back into subsequent conventional machining process；The aging is dry 20 at 40 ~ 80 DEG C
~ 40min, or place 8h or more naturally in dry environment；Organic diaphragm of low viscous coating is single with a thickness of 30 μm ~ 100 μm
It is 0.5um ~ 3um that face, which applies low adhesive coating thickness,；The composition of the low viscous coating is increased by 60% ~ 79% bonding agent, 20% ~ 39%
Agent, 1% ~ 5% mould release composition are moulded, the adhesive coating is made of 80% ~ 90% bonding agent and 10% ~ 20% plasticizer, the bonding
Agent is selected from one or more of polyvinyl alcohol, polyvinyl butyral, hydroxymethyl cellulose, sodium hydroxyethyl cellulose, described
Plasticizer is selected from one or more of dibutyl phthalate, dioctyl phthalate, polyethylene glycol, the mould release
For silicone oil or its equivalent product.
2. the process according to claim 1 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
It is characterized in that, described be covered with one layer of adhesive coating in green front or/and the back side, particular by being coated with adhesive coating
Organic diaphragm be attached to green front or/and the back side, then adhesive coating is shifted and is retained in by organic diaphragm of tearing before lamination
Green surface.
3. the process according to claim 2 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
It is characterized in that, organic diaphragm coated with adhesive coating, with a thickness of 2 μm ~ 6 μm, adhesive coating has adhesive coating
Machine diaphragm with a thickness of 50 μm ~ 100 μm, and between adhesive coating and organic diaphragm of adhesive coating be coated with mould release.
4. improving interlayer alignment precision in the processing of multilayer co-firing ceramic circuit described in any one according to claim 1 ~ 3
Process, which is characterized in that often fold one layer of green, one layer of adhesive coating is covered in green front or/and the back side, to green
It is heated, makes up to 35 DEG C ~ 50 DEG C, and gently apply pressure on surface, make to pass through adhesive coating between adjacent layer green
Realization is adhesively fixed.
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| CN116041046B (en) * | 2023-01-31 | 2024-03-26 | 中国电子科技集团公司第五十四研究所 | Lamination method of high-thickness LTCC substrate |
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