CN115196978A - Ceramic preparation method based on LTCC substrate isostatic pressing lamination - Google Patents
Ceramic preparation method based on LTCC substrate isostatic pressing lamination Download PDFInfo
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- CN115196978A CN115196978A CN202210954678.8A CN202210954678A CN115196978A CN 115196978 A CN115196978 A CN 115196978A CN 202210954678 A CN202210954678 A CN 202210954678A CN 115196978 A CN115196978 A CN 115196978A
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
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- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
Abstract
The invention provides a preparation method of ceramic based on LTCC substrate isostatic pressing lamination. The preparation method of the ceramic based on the LTCC substrate isostatic pressing lamination comprises the following steps: isostatic lamination: two or more layers of green porcelain tapes are stacked, a layer of lamination adhesive is coated between two adjacent green porcelain tapes, then isostatic lamination is carried out, the lamination temperature is 20-50 ℃, the pressure is 5-20 MPa, and the pressure maintaining time is 5-20 min; and (3) sintering: room temperature-first temperature stage: controlling the heating rate to be 0.3 ℃/min-0.6 ℃/min, and keeping the temperature at the first temperature for 2-4 hours; first temperature-maximum temperature stage: the heating rate is 4 ℃/min-7 ℃/min, the highest temperature range is 830-860 ℃, and the highest temperature is kept for 10-30 min.
Description
Technical Field
The invention belongs to the technical field of electronic ceramics, and particularly relates to a preparation method of ceramics based on LTCC substrate isostatic pressing lamination.
Background
LTCC is a passive integration and hybrid circuit packaging technology widely used at present, integrates capacitors, resistors and inductors into a multilayer substrate, can be directly used as a packaging substrate of an IC, has the outstanding advantages of high reliability, high integration level and high performance, and provides a solution for the high-speed development of radio frequency and microwave systems.
The lamination of the casting substrate is one of the key steps for manufacturing the multilayer ceramic device and the ceramic packaging substrate, and the quality of the lamination not only influences the fusion of the interfaces between the layers of the product, but also influences the product performance. At present, a hot isostatic pressing process and a cold isostatic pressing process are adopted, and hot-pressing lamination has the defects that the hot-pressing lamination is easily influenced by factors such as the proportion of a binder in a substrate, the porosity and the powder performance, the flowing of substances in a casting substrate is difficult to control under higher temperature and pressure, the pressure balance is difficult to ensure, and the defects such as deformation of the laminated substrate, sedimentation and collapse of local positions are easily caused; the cold isostatic pressing method can laminate the casting substrate at room temperature, is simple, can realize the lamination of multilayer ceramic blanks, but has the defects that the lamination requires higher pressure, the pressure is easily distributed unevenly, and the sample can deform due to the unbalanced pressure after sintering.
Disclosure of Invention
The invention mainly aims to solve the defects in the prior art and provide a method for preparing ceramics based on LTCC substrate isostatic pressing lamination.
A preparation method of ceramics based on LTCC substrate isostatic pressing lamination comprises the following steps:
isostatic lamination: two or more layers of green porcelain tapes are stacked, a layer of lamination adhesive is coated between two adjacent green porcelain tapes, then isostatic lamination is carried out, the lamination temperature is 20-50 ℃, the pressure is 5-20 MPa, and the pressure maintaining time is 5-20 min;
and (3) sintering: room temperature-first temperature stage: controlling the heating rate to be 0.3-0.6 ℃/min, and keeping the temperature at the first temperature for 2-4 hours; first temperature-maximum temperature stage: the heating rate is 4 ℃/min-7 ℃/min, the highest temperature range is 830-860 ℃, and the highest temperature is kept for 10-30 min.
Preferably, before the step of isostatic laminating, the method further comprises:
material mixing and grinding: mixing and grinding the ingredients, the solvent, the dispersant and the plasticizer until the D50 is within the range of 0.5-0.8 um, adding the ingredient binder, and then mixing and grinding for more than 10 hours;
casting: and casting the ground slurry into a raw porcelain tape.
Preferably, the ingredients of the ingredient include the following: 40-55% of alumina component and 45-60% of KBS component;
wherein the KBS component comprises: k 2 1-3% of O and B 2 O 3 And SiO 2 The weight ratio is 97-99 percent, and the ratio of B to Si is 1/4-3/4.
Preferably, the solvent is formed by mixing ester and alcohol, wherein the ester is one or a mixture of any more of ethyl acetate, methyl acetate, propyl acetate and butyl acetate, and the alcohol is one or a mixture of any more of ethanol, propanol, isopropanol, ethylene glycol, n-butanol and isobutanol.
Preferably, the dispersant is glyceryl trioleate, the plasticizer is one or a mixture of dibutyl phthalate and polyethylene glycol, and the ingredient binder is polyvinyl butyral.
Preferably, the lamination adhesive is PVA, PVB, acrylate, polyurethane, or a mixture of two or more thereof.
A ceramic prepared by the method for preparing the ceramic based on the LTCC substrate isostatic pressing lamination, wherein the dielectric constant of the ceramic is 4.6-5.3, and the dielectric loss is less than 3x10 -4 (ii) a Bending strength is more than 160MPa, flatness is less than 0.1% of side length, and tolerance of each dimension is less than 0.01mm.
The invention has the beneficial effects that:
the method for preparing the ceramic based on the LTCC substrate isostatic pressing lamination can prepare the ceramic with excellent electromechanical properties and dielectric propertyConstant of 4.6-5.3, dielectric loss less than 3X10 -4 The density is more than 2.6g/cm < 3 >, the bending strength is more than 160MPa, the flatness is less than 0.1 percent of side length, the dimensional tolerance of each direction is less than 0.01mm, the bonding performance between interfaces is excellent through an interface coating adhesive, the bonding strength of the interfaces reaches 350MPa, the bonding surface is complete, and the defects of layering, air holes, microcracks and the like are avoided; the isostatic pressing temperature and pressure are effectively reduced, and the problems that the pressure on the product is unbalanced, the shrinkage is not uniform after sintering and the deformation is large due to viscous flow of organic matters in the product caused by overhigh isostatic pressing temperature are avoided.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiment of the invention provides a method for preparing ceramic based on LTCC substrate isostatic pressing lamination, which comprises the following steps:
material mixing and grinding: mixing and grinding the ingredients, the solvent, the dispersant and the plasticizer until the D50 is within the range of 0.5-0.8 um, adding the ingredient binder, and then mixing and grinding for more than 10 hours;
casting: casting the ground slurry into a raw porcelain band;
isostatic lamination: two or more layers of green porcelain tapes are stacked, a layer of lamination adhesive is coated between two adjacent green porcelain tapes, isostatic lamination is carried out after vacuumizing treatment, the lamination temperature is 20-50 ℃, the pressure is 5-20 MPa, and the pressure maintaining time is 5-20 min;
and (3) sintering: room temperature-first temperature stage: controlling the heating rate to be 0.3-0.6 ℃/min, and keeping the temperature at the first temperature for 2-4 hours; first temperature-maximum temperature stage: the heating rate is 4 ℃/min to 7 ℃/min, the highest temperature range is 830 ℃ to 860 ℃, and the temperature is kept for 10min to 30min at the highest temperature.
In the ingredient grinding step, ingredients are composed of, for example: 500g of alumina powder, K 2 O 10g， B 2 O 3 122.5g，SiO 2 367.5g. Of course, the actual weight of each component of the ingredient can be selected according to actual needs, and is not limited in the embodiment of the invention.
The solvent is formed by mixing ester and alcohol, wherein the ester is one or any mixture of ethyl acetate, methyl acetate, propyl acetate and butyl acetate, and the alcohol is one or any mixture of ethanol, propanol, isopropanol, glycol, n-butanol and isobutanol. The dispersing agent is triolein, the plasticizer is one or a mixture of dibutyl phthalate and polyethylene glycol, and the ingredient binder is polyvinyl butyral.
In the casting step, the slurry after grinding is cast into a green tape with the thickness of 100mm × 100mm × 40 um. Of course, the actual size of the green tape may be selected according to actual needs, which is not limited in the embodiment of the present invention.
In the isostatic laminating step, the laminating adhesive is PVA, PVB, acrylate, polyurethane, or a mixture of two or more thereof. The action mechanism of the lamination adhesive is as follows: the action mechanism is that the ceramic green sheets can be laminated at a lower temperature, the flowing of substances is avoided during lamination, the precision of laminated products is improved, the capillary force generated by the binder along with the rise of the temperature in the sintering process promotes the rearrangement of particles, the interface fusion reaction between layers is promoted, the binding force between the layers of the products is stronger, the binding force continues to rise along with the temperature, and the binder is completely volatilized.
In the sintering step, the first temperature is controlled to be 400 ℃, and the temperature is kept at 400 ℃ for 2-4 hours, so that the slow volatilization rate and complete volatilization of the binder and the coating binder in the product are ensured. The parameter control in the sintering step can ensure that the sintered product has good compactness, small flatness, high dimensional precision, excellent electromechanical performance, high bonding strength between layers of the product, complete bonding surface and no defects of layering, pores, microcrack deformation and the like.
The ceramic prepared by the preparation method based on the LTCC substrate isostatic pressing lamination has the following characteristics: dielectric constant of4.6-5.3, and dielectric loss less than 3 × 10 -4 (ii) a Bending strength is more than 160MPa, flatness is less than 0.1% of side length, and dimensional tolerance of each direction is less than 0.01mm.
In addition, it should be noted that the preparation method provided in the embodiment of the present invention may be used for laminating the same material or different materials, and the obtained ceramic product has the characteristics of complete bonding surface between layers after lamination and sintering, no defects such as delamination, pores, microcrack deformation, etc., and 350MPa interface bonding strength.
The preparation method of the ceramic based on the LTCC substrate isostatic pressing lamination provided by the embodiment of the invention can prepare the ceramic with excellent electromechanical properties, the dielectric constant is 4.6-5.3, and the dielectric loss is less than 3 multiplied by 10 -4 The density is more than 2.6g/cm < 3 >, the bending strength is more than 160MPa, the planeness is less than 0.1 percent of side length, the dimensional tolerance of each direction is less than 0.01mm, the bonding performance between interfaces is excellent through an interface coating adhesive, the bonding strength of the interfaces reaches 350MPa, the bonding surface is complete, and the defects of layering, air holes, microcracks and the like are avoided; the isostatic pressing temperature and pressure are effectively reduced, and the problems that the pressure applied to the product is unbalanced, the shrinkage after sintering is uneven and the deformation is large due to viscous flow of organic matters in the product caused by overhigh isostatic pressing temperature are avoided.
The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (8)
1. A preparation method of ceramic based on LTCC substrate isostatic pressing lamination is characterized by comprising the following steps:
isostatic lamination: stacking two or more layers of green porcelain tapes, coating a layer of lamination adhesive between two adjacent green porcelain tapes, performing isostatic lamination after vacuumizing treatment, wherein the lamination temperature is 20-50 ℃, the pressure is 5-20 MPa, and the pressure maintaining time is 5-20 min;
and (3) sintering: room temperature-first temperature stage: controlling the heating rate to be 0.3-0.6 ℃/min, and keeping the temperature at the first temperature for 2-4 hours; first temperature-maximum temperature stage: the heating rate is 4 ℃/min-7 ℃/min, the highest temperature range is 830-860 ℃, and the highest temperature is kept for 10-30 min.
2. The method of making a ceramic based on an isostatic laminated LTCC substrate of claim 1, further comprising, prior to the step of isostatic laminating:
material mixing and grinding: mixing and grinding the ingredients, the solvent, the dispersant and the plasticizer until the D50 is within the range of 0.5-0.8 um, adding the ingredient binder, and then mixing and grinding for more than 10 hours;
casting: and casting the ground slurry into a raw porcelain tape.
3. The method of making a ceramic based on an isostatic laminated LTCC substrate of claim 1, wherein said formulation comprises the following: 40-55% of alumina component and 45-60% of KBS component;
wherein the KBS component comprises: k 2 1-3% of O and B 2 O 3 And SiO 2 The weight ratio is 97-99 percent, and the ratio of B/Si is 1/4-3/4.
4. The method for preparing a ceramic based on isostatic pressing lamination of LTCC substrates as claimed in claim 2, wherein said solvent is a mixture of ester and alcohol, wherein said ester is one or any mixture of ethyl acetate, methyl acetate, propyl acetate and butyl acetate, and said alcohol is one or any mixture of ethanol, propanol, isopropanol, ethylene glycol, n-butanol and isobutanol.
5. The method for preparing a ceramic based on an isostatic laminated LTCC substrate of claim 2, wherein said dispersant is glycerol trioleate, said plasticizer is one or a mixture of dibutyl phthalate and polyethylene glycol, and said formulation binder is polyvinyl butyral.
6. The method of claim 1, wherein the laminating binder is PVA, PVB, acrylate, polyurethane, or a mixture of two or more thereof.
7. The method of making a ceramic based on an isostatic laminate of LTCC substrates of claim 1, wherein said first temperature is 400 ℃.
8. A ceramic prepared by a method of preparing a ceramic based on an isostatic laminated LTCC substrate as claimed in any of claims 1-7, wherein said ceramic has a dielectric constant of 4.6-5.3 and a dielectric loss of less than 3x10 -4 (ii) a Bending strength is more than 160MPa, flatness is less than 0.1% of side length, and tolerance of each dimension is less than 0.01mm.
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000290077A (en) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | Production of multilayer ceramic electronic component |
| CN1452226A (en) * | 2002-04-15 | 2003-10-29 | 哈里公司 | Forming of embedded seal cavity in low-temp. co-sintered ceramic |
| CN1757272A (en) * | 2003-10-17 | 2006-04-05 | 日立金属株式会社 | Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same |
| CN101010758A (en) * | 2004-06-28 | 2007-08-01 | Tdk株式会社 | Method for manufacturing multilayer electronic component |
| CN101010757A (en) * | 2004-06-28 | 2007-08-01 | Tdk株式会社 | Method for manufacturing multilayer electronic component |
| CN103342550A (en) * | 2013-06-28 | 2013-10-09 | 沈阳大学 | Bonding method based lamination process of cordierite ceramic blank piece |
| CN104609866A (en) * | 2015-01-08 | 2015-05-13 | 深圳顺络电子股份有限公司 | Layered electronic element and manufacturing method thereof |
| CN106653356A (en) * | 2016-11-30 | 2017-05-10 | 广东风华邦科电子有限公司 | Preparation method of laminated magnetic bead |
| CN107046779A (en) * | 2017-06-22 | 2017-08-15 | 中国电子科技集团公司第二十九研究所 | The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit |
| CN110862260A (en) * | 2018-08-28 | 2020-03-06 | 比亚迪股份有限公司 | Electronic product shell, preparation method thereof and mobile phone rear cover |
| CN112028615A (en) * | 2020-09-18 | 2020-12-04 | 深圳振华富电子有限公司 | Low-temperature co-fired ceramic material, laminated chip inductor and preparation method thereof |
| CN113103415A (en) * | 2021-04-16 | 2021-07-13 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of large-size embedded cavity structure LTCC substrate |
| CN114656899A (en) * | 2022-03-24 | 2022-06-24 | 瓷金科技(河南)有限公司 | Glue for laminating and laminating ceramic green sheets and preparation method of ceramic packaging base |
-
2022
- 2022-08-09 CN CN202210954678.8A patent/CN115196978A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000290077A (en) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | Production of multilayer ceramic electronic component |
| CN1452226A (en) * | 2002-04-15 | 2003-10-29 | 哈里公司 | Forming of embedded seal cavity in low-temp. co-sintered ceramic |
| CN1757272A (en) * | 2003-10-17 | 2006-04-05 | 日立金属株式会社 | Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same |
| CN101010758A (en) * | 2004-06-28 | 2007-08-01 | Tdk株式会社 | Method for manufacturing multilayer electronic component |
| CN101010757A (en) * | 2004-06-28 | 2007-08-01 | Tdk株式会社 | Method for manufacturing multilayer electronic component |
| CN103342550A (en) * | 2013-06-28 | 2013-10-09 | 沈阳大学 | Bonding method based lamination process of cordierite ceramic blank piece |
| CN104609866A (en) * | 2015-01-08 | 2015-05-13 | 深圳顺络电子股份有限公司 | Layered electronic element and manufacturing method thereof |
| CN106653356A (en) * | 2016-11-30 | 2017-05-10 | 广东风华邦科电子有限公司 | Preparation method of laminated magnetic bead |
| CN107046779A (en) * | 2017-06-22 | 2017-08-15 | 中国电子科技集团公司第二十九研究所 | The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit |
| CN110862260A (en) * | 2018-08-28 | 2020-03-06 | 比亚迪股份有限公司 | Electronic product shell, preparation method thereof and mobile phone rear cover |
| CN112028615A (en) * | 2020-09-18 | 2020-12-04 | 深圳振华富电子有限公司 | Low-temperature co-fired ceramic material, laminated chip inductor and preparation method thereof |
| CN113103415A (en) * | 2021-04-16 | 2021-07-13 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of large-size embedded cavity structure LTCC substrate |
| CN114656899A (en) * | 2022-03-24 | 2022-06-24 | 瓷金科技(河南)有限公司 | Glue for laminating and laminating ceramic green sheets and preparation method of ceramic packaging base |
Non-Patent Citations (1)
| Title |
|---|
| 吴兆华等人: "《表面组装技术基础》", 北京：国防工业出版社, pages: 27 * |
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