CN107046779A - The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit - Google Patents
The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit Download PDFInfo
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- CN107046779A CN107046779A CN201710479712.XA CN201710479712A CN107046779A CN 107046779 A CN107046779 A CN 107046779A CN 201710479712 A CN201710479712 A CN 201710479712A CN 107046779 A CN107046779 A CN 107046779A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention discloses a kind of process that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit, including suppressing to coat adhesive coating step before green deforming step and lamination, green is carried out demoulding, aging by the former in advance, again to the secondary pad pasting of green after aging, the residual stress between film and green is eliminated, deformation quantity is reduced to less than 0.03% by traditional more than 0.06%；The latter is before green lamination, on 35 DEG C~50 DEG C hot plates, one layer of adhesive coating is applied on green, realize that adjacent layer green is bonded after lamination, each layer of green is obtained overall fixation, enter back into subsequent handling, the adhesive coating can be decomposed in 400~600 DEG C of temperature ranges, discharge, circuit substrate performance is not disturbed, with favorable compatibility.The process cost of the present invention is low, applied widely, easy to use, can effectively improve circuit substrate interlayer aligning accuracy, aligning accuracy is below 30 μm.
Description
Technical field
The invention belongs to multilayer co-firing ceramic circuit manufacture field, and in particular to a kind of in the processing of multilayer co-firing ceramic circuit
The middle process for improving interlayer alignment precision, this method can effectively ensure the interlayer alignment of multilayer co-firing ceramic circuit board
Precision.
Background technology
With the multilayer co-firing ceramic circuit that LTCC (LTCC) is Typical Representative, with integration density is high, microwave/
The outstanding advantages such as the multi-functional hybrid integrated of numeral/control, high frequency performance be excellent, be increasingly becoming miniaturization, high-performance T/R components,
The preferred realization rate of the circuit substrates such as frequency source, phased array antenna, obtains extensive in the field such as Aeronautics and Astronautics, missile-borne, carrier-borne
Using.
The conventional fabrication process of multilayer co-firing ceramic circuit board is：Green cuts → and green punching → green filling perforation → leads
Body printing → cavity making → green demoulding/lamination → vacuum packaging → green lamination → green cutting → burning → substrate scribing altogether
→ test/inspection.In the processing of multilayer co-firing ceramic circuit board, green deformation and lamination/laminating technology process can all influence
Final interlayer alignment precision, and the technic index is most important for microwave property, many work(that current multilayer common burning porcelain is realized
Can the interlayer alignment precision representative value of circuit substrate be 30 μm~50 μm, the level is for being internally integrated the base of high-frequency microwave device
For plate, the fluctuation of performance and relatively low yield rate are easily produced.
Green shape control and lamination are to realize the key link that interlayer is precisely aligned, and the present inventor is preceding
Effective control has been carried out to green deformation by advance aging and secondary pad pasting in the research of phase, but prior art is folded to reducing
Slip local between green dislocation, deformation still lack reliable fixing means after layer.Conventional lamination fixing means has two kinds：It is right
In the preferable green system of high temperature viscometrics, 951 systems of such as U.S. Dupont companies can show certain viscosity at high temperature,
Done if being fixed by the way of high temperature spot welding after lamination at the edge of green；For the green system that high temperature viscometrics are poor, such as
The A6M systems of Ferro companies of the U.S., even if at high temperature, green viscosity is still poor, using glue part spot gluing after lamination
If mode fix and do at the edge of green, both modes are above and below being realized at green edge by a limited number of point
Position between layer is fixed.
Firstly, for the circuit substrate that cavity body structure is complicated, through hole/wiring density is higher, due to the local Multicarity of green/
Porous zone structural strength is poor, can easily occur local deformation after lamination only with several solid point constant volumes, and product transfer,
It is in rarefaction in the technical process such as vacuum packaging, between each layer, local slip dislocation also easily occurs, these will all cause
Product entirety or the interlayer alignment precision of regional area decline.Secondly, the preferable green system of high temperature viscometrics, although with high temperature
The advantage of viscosity, but the function depends on effective allotment that green is formulated, without broad applicability, and existing commercialization is folded
Layer equipment is a Functional Design for heating, if in order to improve green interlayer stationarity, spot welding is changed into face weldering, it is meant that higher
Scrap build cost；And for the poor green system of high temperature viscometrics, if simply the local spot gluing of glue is changed to whole
The glue bonding in individual face, will not only greatly increase originally just relatively complicated stack process amount, and the face coating of glue is difficult
Ensure that thickness is precisely controlled the uniformity with whole region, be easily caused the problems such as such as absciss layer of substrate sintering, distortion, or
Glue and green sintering are incompatible, and the electrical property of substrate can be caused to deviate again.
The content of the invention
The problem of existing for prior art, the present invention is intended to provide a kind of compatible, cost good with other process procedures
It is low, applied widely, easy to use, the process of circuit substrate interlayer aligning accuracy can be effectively improved again, to meet interlayer
Aligning accuracy requires the production requirement of high circuit substrate.
The process that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit of the present invention, including：
Before green lamination, last layer adhesive coating is covered in green front or/and the back side, the adhesive coating is in green lamination
After realize that adjacent layer green is bonded so that the entirety between realizing each layer of green is fixed, enter back into follow-up conventional machining process.
As a kind of perferred technical scheme, adhesive coating of the present invention is inviscid at low temperature, appropriate high temperature
There is down good viscosity, such characteristic in the processing of multilayer co-firing ceramic circuit more suitable for applying.According to the present invention's
Some preferred embodiments, the adhesive coating includes 80%~90% bonding agent and 10%~20% plasticizer, according to the formula,
Can be achieved less than 30 DEG C it is inviscid, 35 DEG C~50 DEG C show excellent adherings, and can under air or nitrogen environment, 400 DEG C~
600 DEG C of temperature ranges are decomposed in the way of thermal cracking, discharged, and the performance of circuit substrate is not disturbed.
Operating and avoid for convenience directly to coat adhesive coating causes difference in thickness to influence product quality, and the present invention is provided
A kind of preferred technical scheme, the adhesive coating is coated on organic diaphragm is shifted again.Therefore, above-mentioned technique side
Last layer adhesive coating is covered in green front or/and the back side described in method, particular by the organic film for being coated with adhesive coating
Piece is attached to green front or/and the back side, then adhesive coating is shifted and is retained in green surface by organic diaphragm of tearing before lamination.
In above-mentioned process, the bonding agent of the adhesive coating is selected from polyvinyl alcohol, polyvinyl butyral resin, methylol
At least one of cellulose, sodium hydroxyethyl cellulose, the plasticizer are selected from dibutyl phthalate, phthalic acid two
At least one of monooctyl ester, polyethylene glycol.
Organic diaphragm of the present invention primarily serves load and the effect of transfer adhesive coating, in addition without specifically limited.
As preferred technical scheme, the adhesive coating thickness is 2 μm~6 μm, the thickness of organic diaphragm for 50 μm~
100μm。
In order to ensure adhesive coating and organic diaphragm can good separation, need coating micro- between adhesive coating and organic diaphragm
Measure mould release, make organic diaphragm have it is good can extraction, the mould release is usually silicone oil or equivalent product.Off-shape agent exists
Coating on organic diaphragm is generally completed by the supplier of diaphragm, and user directly purchases use.
In above-mentioned process, one layer of green is often folded, green is heated, 35 DEG C~50 DEG C are made up to, and
Surface gently applies pressure, makes to be adhesively fixed by adhesive coating realization between adjacent layer green.
If pending green has cavity domain structure, bonding diaphragm is also fabricated to corresponding shape.
The present invention is above-mentioned to coat the method that adhesive coating fixes each layer green before lamination, with art methods phase
Than having the advantage that：The face bonding between adjacent green is realized, layer stability is considerably increased；Match somebody with somebody suitable for various
The green of side, with good compatibility；Cost is low, easy to operate, fabrication error is small, high yield rate.
Based on foregoing invention content, present invention also offers a kind of adhesive film, the adhesive film includes organic diaphragm and painting
The adhesive coating overlayed on organic diaphragm.Organic diaphragm and adhesive coating are as described in above-mentioned method.
In order to further improve the interlayer alignment precision of circuit substrate, method of the invention may also include suppression green deformation
The step of：Green is subjected to demoulding, aging in advance, then to the secondary pad pasting of green after aging, follow-up include then is carried out again
It is stacked in interior conventional machining process.
There is in curtain coating residual stress, ceramic multilayer circuit process green de- in green and carrying between Mylar films
Film is deformed upon later, and each layer deformation quantity and deformation region differ, and is caused interlayer alignment precision during lamination to be deteriorated, is largely effected on
The quality of finished product.The present inventor it has been investigated that, first the film that carries of green is torn, then the green without film entered
Row aging, so as to eliminate the residual stress of curtain coating, allows green deformation in place, then progress following process can be fine after secondary pad pasting
The solution problem, effectively green deformation ratio can be reduced to from more than 0.06% using the process of the present invention
Less than 0.03%, it is simple to operate, it is cost-effective.
Aging described in above method is that green is dried into 20~40min at a temperature of 40~80 DEG C, or in dry environment
It is middle to place more than 8h naturally.
The secondary pad pasting refers to that the green after aging is pasted into last layer one side again has low-viscosity organic diaphragm, with
Green is set to obtain the support of subsequent technique process.According to specific embodiment of the present invention, the secondary pad pasting has
Machine diaphragm thickness is 30 μm~100 μm, and one side applied thickness is 0.5 μm~3 μm of low viscous coating.
According to the specific embodiment of the present invention, the low viscous coating Main Ingredients and Appearance includes 60%~79% bonding
Agent, 20%~39% plasticizer, 1%~5% mould release.
The bonding agent is in polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
One or more, one kind in dibutyl phthalate, dioctyl phthalate, polyethylene glycol of the plasticizer or
Several, the mould release is silicone oil or its equivalent product.
Secondary pad pasting has good dimensional stability, and the green of aging can be prevented to be again deformed in process.Institute
Stickup needs can be met by stating low viscous coating, and is not reacted with organic additive intrinsic in green and (prevented from changing green
Laminating properties), sticky overlay noresidue (sintering characteristic for preventing from changing green) on green after demoulding again.
Added after secondary pad pasting using ceramic multilayer circuit techniques such as conventional punching, filling perforation, printing, demoulding, laminations
Work, the flow is conventional method well known to those skilled in the art.
Low viscous coating used in secondary pad pasting is slightly different with the adhesive coating formula used in lamination, and the former is viscous to meet
The low stickiness needs departed from after patch, the latter needs to realize less than 30 DEG C inviscid, 35 DEG C~50 DEG C performance excellent adherings, and with life
Porcelain sintering process is compatible.
The conventional fabrication process of multilayer co-firing ceramic circuit board is：Green cuts → and green punching → green filling perforation → leads
Body printing → cavity making → green demoulding/lamination → vacuum packaging → green lamination → green cutting → burning → substrate scribing altogether
→ test/inspection.It is of the present invention green to be subjected to demoulding, aging in advance, then to the step of the secondary pad pasting of green after aging
It is rapid usual after green is cut, before punching；It is described before green lamination, green front or/and the back side cover last layer glue
The step of connecing coating is generally before lamination or after green is cut, before punching, as long as can play steady in lamination and lamination
Determine bonding effect, process sequence can regard concrete condition in the case where not influenceing the effect and carry out appropriate adjustment, and
Not as limitation of the present invention.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, by suppressing green
Deforming step --- green is subjected to demoulding, aging in advance, then to the secondary pad pasting of green after aging, eliminated between film and green
Residual stress, control green deformation quantity, eliminate interlayer difference, then secondary pad pasting makes green deformation quantity by more than 0.06% drop
It is low to less than 0.03% so that interlayer alignment precision higher when ensure that lamination；Used before lamination with adhesive coating
Each layer green is adhesively fixed by organic diaphragm, and application is not close by green formula or cavity body structure, through hole/wiring
The limitation of degree, it is applied widely, with versatility；Compared with prior art is by the fixed lamination of several points, fixed performance is more preferable,
It can stablize and realize less than 30 μm, more preferably, less than 25 μm of interlayer alignment precision of realization, with high temperature hot weld or manual painting
Daub water is compared, and only need to simply be pasted, be torn two steps and can complete, simple to operate, stationary plane is big；More importantly the present invention's is viscous
Coating is connect after lamination fixing function is realized, 400 DEG C~600 DEG C temperature ranges are i.e. with the side of thermal cracking in subsequent process steps
Formula is decomposed, discharge, circuit substrate performance is not disturbed, with favorable compatibility.
Brief description of the drawings
Fig. 1 is the step of the inventive method carries out demoulding to green；
Fig. 2 is the step of the inventive method carries out aging to green；
Fig. 3 is that the inventive method carries out secondary step of membrane sticking to the green of aging；
Fig. 4 is that the inventive method carries out the design sketch after secondary pad pasting to the green of aging；
Fig. 5 is the green structure chart for carrying Mylar films；
Fig. 6 is organic diaphragm structure figure that the present invention is coated with viscous coating；
Fig. 7 is the structure chart that adhesive film of the present invention is attached to the green back side；
Fig. 8 is the schematic diagram to the 1st layer of green processing；
Fig. 9 is the schematic diagram to the 2nd layer of green processing；
Figure 10 is the schematic diagram processed to n-th layer green；
Figure 11 is the schematic diagram to last layer of green processing；
Figure 12 is green lamination process schematic diagram；
Figure 13 is the overall schematic that green lamination is fixed.
Embodiment
It is only some preferably embodiments of the present invention below, this should not be interpreted as to the scope of above-mentioned theme of the invention
Following example is only limitted to, each feature of the invention can be combined arbitrarily in the case of reconcilable, and these belong to
In the scope of protection of the invention.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, wherein suppressing green
The step of deformation, is specific as follows, reference can be made to Fig. 1-4：
Embodiment 1
1) green is cut into after standard technology size, and green is carried into Mylar films 2 tears from green 1, as shown in Figure 1.
2) green 1 without film is dried at a temperature of 60 DEG C, drying time is 30min, obtains deformation in place
Green 3, as shown in Figure 2.
3) organic diaphragm 4 that one side is scribbled into 1 μm of low viscous coating is attached on the green 3 of deformation in place, as shown in Figure 3.
The thickness of organic diaphragm 4 is 50 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic film 4 are preferably fitted, in multilayer co-firing ceramic electrical
In the technique processing on road green can be made to keep low deflection.
5) processing is completed using ceramic multilayer circuit techniques such as conventional punching, filling perforation, printing, demoulding, laminations.
Embodiment 2
1) green is cut into after standard technology size, and green is carried into Mylar films 2 tears from green 1, as shown in Figure 1.
2) place 8h naturally in 100,000 grades of environment purifications to the green 1 without film, obtain the green 3 of deformation in place, such as
Shown in Fig. 2.
3) organic diaphragm 4 that one side is scribbled into 2.5 μm of low viscous coatings is attached on the green 3 of deformation in place, such as Fig. 3 institutes
Show.The thickness of organic diaphragm 4 is 75 μm.
4) green after secondary pad pasting is as shown in figure 4, green 3 and organic film 4 are preferably fitted, in multilayer co-firing ceramic electrical
In the technique processing on road green can be made to keep low deflection.
5) made pottery using the multilayer of conventional punching, filling perforation, printing, demoulding, lamination, laminate layer, sintering, burst, test/inspection
Porcelain circuit technology completes processing.
The low viscous coating of above-mentioned organic diaphragm, its composition includes 62% polyvinyl butyral resin, 37% phthalic acid
Dioctyl ester, 1% silicone oil.
Conventional method is will to be covered with the green for carrying Mylar films directly using conventional punching, filling perforation, printing, demoulding, folded
Layer, laminate layer, sintering, burst, the ceramic multilayer circuit technique of test/inspection complete processing.
Green deformation ratio by traditional more than 0.06% can be reduced to less than 0.03% using the above method of the present invention,
Effect is notable, and simple to operate.
The present invention improves the process of interlayer alignment precision in the processing of multilayer co-firing ceramic circuit, by following two
Embodiment illustrates to coat the concrete mode that adhesive coating fixes each layer green before lamination, reference can be made to Fig. 5~13.
First method is to tear the secondary pad pasting of embodiment 1 or 2 before green is punched, by with the organic of adhesive coating
Diaphragm is attached to the green back side, but last layer of green of product does not do this processing, keeps original green state.Green is carried out to green
The process processing such as punching → green filling perforation → conductor printing → cavity making.During lamination by the green back side upward, from the 1st of product the
Layer starts lamination, often folded one layer, real with preceding layer green in a heated state by the adhesive coating at the preceding layer green back side
Now it is adhesively fixed, then tears the organic film at this layer of green back side, leaves adhesive coating at the green back side, realize and next layer
The bonding of lamination green, the like, to the last one layer of green completes lamination and bonding.The green block fixed to lamination enters
Row vacuum packaging → green lamination → green cutting → the normal process steps such as burning → substrate scribing → test/inspection processing altogether.
Second method is, according to common process, green to be carried out to cut → green punching → green filling perforation → conductor printing
The process processing such as → cavity making, just green front is attached to (if green has before lamination by organic diaphragm with adhesive coating
Cavity, then adhesive film need to make corresponding cavity), then organic film is torn, adhesive coating be retained in green front, production
1 layer of position does not do this processing, keeps reset condition.During lamination by the green back side upward, the lamination since the 1st layer of product, often
It is folded one layer, realized and be adhesively fixed with preceding layer green in a heated state by the positive adhesive coating of this layer of green, then
The secondary pad pasting for carrying Mylar films or embodiment 1 or 2 at this layer of green back side is torn, to the last one layer of green completes folded
Layer and bonding.Then the green block fixed again to lamination carries out that → green lamination → green cutting → common burning → base is vacuum-packed
The normal process steps such as plate scribing → test/inspection are processed.
Both the above method compares accompanying drawings by embodiment 3 and implementation 4 and is illustrated.
Adhesive film used in embodiment 3 and 4 is made up of adhesive coating, organic diaphragm and mould release positioned there between.
Adhesive coating is made up of bonding agent and plasticizer, bonding agent be selected from polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose,
At least one of sodium hydroxyethyl cellulose, plasticizer is selected from dibutyl phthalate, dioctyl phthalate, poly- second two
At least one of alcohol, adhesive coating thickness is 2 μm~6 μm.The thickness of organic diaphragm is 50 μm~100 μm.Mould release is silicon
Oil.
Embodiment 3
1) the original green A Mylar films A-2 that carries is torn from green A-1, is then coated with adhesive coating B-1
Organic diaphragm B, be attached to the green back side in 40 DEG C of thermal station, adhesive coating and green rear-face contact form new structure C.Ginseng
See Fig. 5-7.
2) product the 1st layer of through hole 1-1, conductor fig 1-2, cavity 1-3 system are carried out on structure C using common process
Make.J-1 is optical registration through hole, and J-2 is pin lamination registration holes, as shown in Figure 8.
3) according to mode in 2), the processing of each layer green in addition to last layer, such as Fig. 9-10 are completed on new construction C respectively
It is shown.
4) through hole L-1 on last layer of green, conductor fig L-2, optical registration are completed on green A using common process
Use through hole J-1, pin lamination registration holes J-2 etc. processing, as shown in figure 11.
5) during lamination by the 1st layer of green back side upward, with laminated structure contraposition it is fixed after, by organic diaphragm B- at the back side
2 tear, and leave adhesive coating B-1 at the back side of first layer green 1 '；
6) by the 2nd layer of green back side upward, with the 1st layer of contraposition lamination of green 1 ', then by 40 DEG C of heating, pressurize simultaneously
Mode, realize bonding with the 1st layer of green 1 ', then tear the organic film B-2 at the 2nd layer of green back side, leave adhesive coating
B-1 is at the back side of the 2nd layer of green 2 '；
7) same lamination and fixing process are carried out to other n-layer greens successively, to the last one layer of green L complete lamination and
It is adhesively fixed, as shown in figure 12.Lamination, the green block K of fixation successively are eventually formed from 1 ' to L ', as shown in figure 13.
8) the green block K that is fixed using common process to lamination be vacuum-packed → and green lamination → green cutting →
The process processing such as common burning → substrate scribing → test/inspection.
After tested, interlayer alignment precision is 10~25 μm.
Embodiment 4
The present embodiment first carries out original green to suppress green deforming step, and only processing sequence slightly has with embodiment 3 in addition
It is different.
1) the green A of the suppression green deformation process by embodiment 1 or 2, including green A-1 is (equivalent to embodiment 1,2
In green 3) and secondary pad pasting A-2 (equivalent to the organic film 4 in embodiment 1,2), with reference to Fig. 5.
2) product the 1st layer of through hole 1-1, conductor fig 1-2, cavity 1-3 system are carried out on green A using common process
Make.J-1 is optical registration through hole, and J-2 is pin lamination registration holes, with reference to Fig. 8.
3) processing of other each layer key elements is completed on each layer green A respectively, with reference to Fig. 9-11.
4) the organic diaphragm B for being coated with adhesive coating B-1 is respectively adhered on the 2nd layer of green to last layer of green just
Face, tears B-2 with reference to Fig. 7, and before lamination, leaves adhesive film B-1 in each layer green front.
5) during lamination by the 1st layer of green back side upward, with laminated structure contraposition it is fixed after, the film A-2 at the back side is torn,
Form 1 '.By the 2nd layer of green back side upward, with the 1st layer of contraposition lamination of green 1 ', then by 40 DEG C of heating, while pressurization
Mode, is realized bonding with the 1st layer of green 1 ' by the positive adhesive coating B-1 of the 2nd layer of green, then tears the 2nd layer of green
The film A-2 at the 2 ' back sides.
6) same lamination and fixing process are carried out to other n-layer greens successively, to the last one layer of green L complete lamination and
It is adhesively fixed, is adjusted with reference to Figure 12 and by its adhesive film to the front of each layer green.Eventually form from 1 ' to L ' lamination, solid successively
Fixed green block K, with reference to Figure 13.
7) the green block K that is fixed using common process to lamination be vacuum-packed → and green lamination → green cutting →
The process processing such as common burning → substrate scribing → test/inspection.
After tested, interlayer alignment precision is 10~15 μm.
Claims (10)
1. a kind of process that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit, it is characterised in that including：
Before green lamination, last layer adhesive coating is covered in green front or/and the back side, the adhesive coating is realized adjacent after green lamination
Layer green bonding, so that the entirety between realizing each layer of green is fixed, enters back into follow-up conventional machining process.
2. the process according to claim 1 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
Characterized in that, described cover last layer adhesive coating in green front or/and the back side, particular by being coated with adhesive coating
Organic diaphragm be attached to green front or/and the back side, then adhesive coating is shifted and is retained in by organic diaphragm of tearing before lamination
Green surface.
3. the process according to claim 2 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
Characterized in that, the organic diaphragm for being coated with adhesive coating, its adhesive coating thickness is 2 μm~6 μm, the thickness of organic diaphragm
Spend for 50 μm~be coated with mould release between 100 μm, and adhesive coating and organic diaphragm.
4. the technique side according to claim 1 or 2 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit
Method, it is characterised in that the adhesive coating includes 80%~90% bonding agent and 10%~20% plasticizer.
5. the process according to claim 4 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
Characterized in that, the bonding agent is selected from polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
At least one of, the plasticizer in dibutyl phthalate, dioctyl phthalate, polyethylene glycol at least
It is a kind of.
6. improve interlayer alignment precision in the processing of multilayer co-firing ceramic circuit according to Claims 1 to 5 any one
Process, it is characterised in that often fold one layer of green, green front or/and the back side cover last layer adhesive coating, to life
Porcelain is heated, and makes up to 35 DEG C~50 DEG C, and gently applies pressure on surface, makes to apply by being bonded between adjacent layer green
Layer is realized and is adhesively fixed.
7. improve interlayer alignment precision in the processing of multilayer co-firing ceramic circuit according to Claims 1 to 5 any one
Process, it is characterised in that may also include suppression green the step of deform：Green is subjected to demoulding, aging in advance, then it is right
The secondary pad pasting of green after aging, then carries out follow-up including being stacked in interior conventional machining process again.
8. the process according to claim 7 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
Characterized in that, the aging is that 20~40min is dried at 40~80 DEG C, or place naturally in dry environment 8h with
On；The secondary pad pasting has organic diaphragm of low viscous coating to paste one side, and organic diaphragm thickness is 30 μm~100 μm,
It is 0.5um~3um that one side, which applies low adhesive coating thickness,.
9. the process according to claim 8 that interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit,
Characterized in that, the composition of the low viscous coating includes 60%~79% bonding agent, 20%~39% plasticizer, 1%~5%
Mould release, the bonding agent is in polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose
One or more, one kind in dibutyl phthalate, dioctyl phthalate, polyethylene glycol of the plasticizer or
Several, the mould release is silicone oil or its derived product.
10. a kind of adhesive film for process described in claim 1~9 any one, including adhesive coating and organic film
Piece, the adhesive coating thickness is 2 μm~6 μm, including 80%~90% bonding agent and 10%~20% plasticizer, the bonding
Agent is selected from least one of polyvinyl alcohol, polyvinyl butyral resin, hydroxymethyl cellulose, sodium hydroxyethyl cellulose, described to increase
Mould agent and be selected from least one of dibutyl phthalate, dioctyl phthalate, polyethylene glycol；Organic diaphragm is thick
Spend for 50 μm~100 μm, mould release is also coated between preferably described adhesive coating and organic diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710479712.XA CN107046779B (en) | 2017-06-22 | 2017-06-22 | The process of interlayer alignment precision is improved in the processing of multilayer co-firing ceramic circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115196978A (en) * | 2022-08-09 | 2022-10-18 | 广东环波新材料有限责任公司 | Ceramic preparation method based on LTCC substrate isostatic pressing lamination |
| CN116041046A (en) * | 2023-01-31 | 2023-05-02 | 中国电子科技集团公司第五十四研究所 | Lamination method of high-thickness LTCC substrate |
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| CN101047064A (en) * | 2006-03-31 | 2007-10-03 | Tdk株式会社 | Internal electrode paste, multilayer ceramic electronic device and the production method |
| CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
| CN106653700A (en) * | 2016-11-16 | 2017-05-10 | 中国电子科技集团公司第四十研究所 | LTCC (Low Temperature Co-fired Ceramic) substrate with novel laminated structure |
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| CN101047064A (en) * | 2006-03-31 | 2007-10-03 | Tdk株式会社 | Internal electrode paste, multilayer ceramic electronic device and the production method |
| CN102361023A (en) * | 2011-10-20 | 2012-02-22 | 中国电子科技集团公司第十三研究所 | Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
| CN106653700A (en) * | 2016-11-16 | 2017-05-10 | 中国电子科技集团公司第四十研究所 | LTCC (Low Temperature Co-fired Ceramic) substrate with novel laminated structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115196978A (en) * | 2022-08-09 | 2022-10-18 | 广东环波新材料有限责任公司 | Ceramic preparation method based on LTCC substrate isostatic pressing lamination |
| CN116041046A (en) * | 2023-01-31 | 2023-05-02 | 中国电子科技集团公司第五十四研究所 | Lamination method of high-thickness LTCC substrate |
| CN116041046B (en) * | 2023-01-31 | 2024-03-26 | 中国电子科技集团公司第五十四研究所 | Lamination method of high-thickness LTCC substrate |
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